MR27T802F-XXXMA [OKI]
512k-Word x 16-Bit or 1M-Word x 8-Bit; 512K字×16位或1M字×8位
| 型号： | MR27T802F-XXXMA |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | 512k-Word x 16-Bit or 1M-Word x 8-Bit |
| 文件： | 总10页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FEDR27T802F-02-05
Issue Date: Dec. 28, 2004
OKI Semiconductor
MR27T802F
512k–Word × 16–Bit or 1M–Word × 8–Bit P2ROM
FEATURES
PIN CONFIGURATION (TOP VIEW)
·512k-word × 16-bit / 1M-word × 8-bit electrically switchable
configuration
· +2.7 V to 3.6 V power supply
1
2
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
A18
A17
A7
NC
NC
3
A8
· Access time
· Operating current 18 mA MAX(5MHz)
· Standby current 5 µA MAX
80 ns MAX
4
A9
5
A6
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
6
A5
7
A4
· Input/Output TTL compatible
· Three-state output
8
A3
9
A2
10
11
12
13
14
15
16
17
18
19
20
21
22
A1
A0
CE#
VSS
OE#
D0
PACKAGES
D15/A–1
D7
· MR27T802F-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
· MR27T802F-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27T802F-xxxTP
D8
D14
D6
D1
D9
D13
D5
D2
D10
D3
D12
D4
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
D11
VCC
44SOP,
44TSOP(Type-II)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
1
2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
D15/A–1
D7
A15
A14
A13
A12
A11
A10
A9
3
4
5
6
D14
D6
· Short lead time, since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
· No additional programming charge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the factory
with minimal effect on the production throughput. The cost
is included in the unit price.
7
8
D13
D5
A8
9
NC
NC
NC
NC
NC
NC
NC
A18
A17
A7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
A6
D0
A5
OE#
VSS
CE#
A0
A4
A3
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask ROM and some FLASH
products.
A2
A1
48TSOP(Type-I)
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
CE#
CE
OE#
OE
BYTE#
A0
A1
A2
Memory Cell Matrix
A3
A4
A5
A6
512k × 16-Bit or 1M × 8-Bit
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
Multiplexer
Output Buffer
D0
D2
D4
D6
D8 D10 D12 D14
D1
D3
D5
D7
D9 D11 D13 D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
D15 / A–1
A0 to A18
D0 to D14
CE#
Functions
Data output / Address input
Address inputs
Data outputs
Chip enable input
Output enable input
Word / Byte select input
Power supply voltage
Ground
OE#
BYTE#
VCC
VSS
NC
No connect
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
CE#
L
OE#
BYTE#
VCC
D0 to D7
DOUT
D8 to D14
DOUT
D15/A–1
L
L
H
L
L
Hi–Z
L/H
∗
H
L
Output disable
Standby
L
H
3.0V
Hi–Z
Hi–Z
H
L
H
∗
∗
∗: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Symbol
Condition
Value
0 to 70
Unit
°C
°C
V
Ta
Tstg
VI
—
–55 to 125
–0.5 to VCC+0.5
–0.5 to VCC+0.5
–0.5 to 5
Input voltage
relative to VSS
Output voltage
VO
V
Power supply voltage
Power dissipation per package
Output short circuit current
VCC
PD
V
Ta = 25°C
—
1.0
W
IOS
10
mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
VCC power supply voltage
Input “H” level
Symbol
VCC
Condition
Min.
2.7
Typ.
—
Max.
3.6
Unit
V
VCC = 2.7 to 3.6 V
VIH
2.2
—
VCC+0.5∗
V
V
Input “L” level
VIL
–0.5∗∗
—
0.6
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Input
Symbol
CIN1
Condition
VI = 0 V
Min.
—
Typ.
—
Max.
8
Unit
pF
BYTE#
Output
CIN2
—
—
100
10
COUT
VO = 0 V
—
—
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Input leakage current
Output leakage current
VCC power supply current
(Standby)
Symbol
ILI
Condition
VI = 0 to VCC
VO = 0 to VCC
CE# = VCC
CE# = VIH
Min.
—
Typ.
—
Max.
Unit
µA
5
5
5
1
ILO
—
—
µA
ICCSC
ICCST
—
—
µA
—
—
mA
VCC power supply current
(Read)
CE# = VIL, OE# = VIH
tc = 200 ns
—
ICCA
—
—
18
mA
Input “H” level
Input “L” level
VIH
VIL
2.2
–0.5∗∗
2.4
—
—
—
—
VCC+0.5∗
0.6
V
V
V
V
—
Output “H” level
Output “L” level
VOH
VOL
IOH = –1 mA
IOL = 2 mA
—
—
0.4
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Address cycle time
Address access time
CE# access time
Symbol
tC
Condition
—
Min.
80
—
—
—
0
Max.
—
Unit
ns
ns
ns
ns
ns
ns
ns
tACC
tCE
CE# = OE# = VIL
OE# = VIL
80
80
30
20
20
—
OE# access time
tOE
CE# = VIL
tCHZ
tOHZ
tOH
OE# = VIL
Output disable time
Output hold time
CE# = VIL
0
CE# = OE# = VIL
0
Measurement conditions
Input signal level --------------------------------------0 V/3 V
Input timing reference level-------------------------1/2Vcc
Output load ---------------------------------------------50 pF
Output timing reference level ----------------------1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
TIMING CHART (READ CYCLE)
16-Bit Read Mode (BYTE# = VIH)
tC
tC
A0 to A18
tOH
tACC
tCE
CE#
tCHZ
tOE
tOH
OE#
tOHZ
tACC
D0 to D15
Valid Data
Valid Data
Hi-Z
Hi-Z
8-Bit Read Mode (BYTE# = VIL)
tC
tC
A-1 to A18
tOH
tACC
tCE
CE#
OE#
tCHZ
tOE
tOH
tOHZ
tACC
D0 to D7
Valid Data
Valid Data
Hi-Z
Hi-Z
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
PACKAGE DIMENSIONS
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.55 TYP.
1/Dec. 2, 1999
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
(Unit: mm)
SOP44-P-600-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
2.10 TYP.
4/Dec. 5, 1996
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
7/10
FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
(Unit: mm)
TSOP(2)44-P-400-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.54 TYP.
3/Dec. 10, 1996
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T802F-02-05
OKI Semiconductor
MR27T802F / P2ROM
REVISION HISTORY
Page
Previous
Document
No.
Date
Description
Current
Edition
Edition
FEDR27T802F-02-01
FEDR27T802F-02-02
Dec., 2002
–
–
Final edition 1
Change Operating temperature under bias
(Ta) to 0 to 70°C.
Jun. 17, 2003
3, 4
3, 4
FEDR27T802F-02-03
FEDR27T802F-02-04
FEDR27T802F-02-05
Jul. 9, 2004
Sep. 3, 2004
Dec. 28, 2004
3
1
1
3
Add PD condition and IOS = 10mA
Add MR27T802F-xxxMA
1, 7
1, 8
Add MR27T802F-xxxTP
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FEDR27T802F-02-05
OKI Semiconductor
NOTICE
MR27T802F / P2ROM
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an explanation
for the standard action and performance of the product. When planning to use the product, please ensure that the
external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted
by us in connection with the use of the product and/or the information and drawings contained herein. No
responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any system
or application where the failure of such system or application may result in the loss or damage of property, or
death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products and
will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2004 Oki Electric Industry Co., Ltd.
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