TJA1027TK/20/1J_技术文档

TJA1027

LIN 2.2A/SAE J2602 transceiver

Rev. 2 — 24 April 2013

Product data sheet

1. General description

The TJA1027 is the interface between the Local Interconnect Network (LIN) master/slave

protocol controller and the physical bus in a LIN network. It is primarily intended for

in-vehicle sub-networks using baud rates up to 20 kBd and is compliant with LIN 2.0,

LIN 2.1, LIN 2.2, LIN 2.2A and SAE J2602. The TJA1027 is pin-compatible with the

TJA1020 and the TJA1021.

The transmit data stream generated by the protocol controller is converted by the

TJA1027 into an optimized bus signal shaped to minimize ElectroMagnetic Emissions

(EME). The LIN bus output pin is pulled HIGH via an internal termination resistor. For a

master application, an external resistor in series with a diode should be connected

between pin V_BATand pin LIN. The receiver detects a receive data stream on the LIN bus

input pin and transfers it via pin RXD to the microcontroller.

Power consumption is very low in Sleep mode. However, the TJA1027 can still be woken

up via pins LIN and SLP_N.

2. Features and benefits

2.1 General

 Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and SAE J2602

 Baud rate up to 20 kBd

 Very low ElectroMagnetic Emissions (EME)

 Very low current consumption in Sleep mode with remote LIN wake-up

 Input levels compatible with 3.3 V and 5 V devices

 Integrated termination resistor for LIN slave applications

 Passive behavior in unpowered state

 Operational during cranking pulse: full operation from 5 V upwards

 Undervoltage detection

 K-line compatible

 Available in SO8 and HVSON8 packages

 Leadless HVSON8 package (3.0 mm  3.0 mm) with improved Automated Optical

Inspection (AOI) capability

 Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)

compliant)

 Pin-compatible subset of the TJA1020 and TJA1021

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

2.2 Protection

 Very high ElectoMagnetic Immunity (EMI)

 Very high ESD robustness: 8 kV according to IEC 61000-4-2 for pins LIN and V_BAT

 Bus terminal and battery pin protected against transients in the automotive

environment (ISO 7637)

 Bus terminal short-circuit proof to battery and ground

 Thermally protected

 Initial transmit data (TXD) dominant check

3. Quick reference data

Table 1.

Symbol Parameter

V_BATbattery supply voltage

Quick reference data

Conditions

Min

0.3

5

Typ

Max

+42

18

Unit

V

limiting values

-

operating range

-

V

I_BAT

battery supply current

Sleep mode; V_LIN= V_BAT; V_{SLP_N}= 0 V

2.5

7

10

A

Standby mode; V_LIN= V_BAT; V_{SLP_N}= 0 V 2.5

7

10

Normal mode; V_LIN= V_BAT; V_{SLP_N}= 5 V; 200

V_TXD= 5 V

800

1600

V_LIN

voltage on pin LIN

limiting value; with respect to GND and

V_BAT

42

-

+42

V

V_ESD

T_vj

electrostatic discharge voltage on pin LIN; according to IEC 61000-4-2

virtual junction temperature

8

-

+8

kV

40

+150

C

4. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

plastic small outline package; 8 leads; body width 3.9 mm

Version

TJA1027T/20

SO8

SOT96-1

TJA1027TK/20

HVSON8

plastic thermal enhanced very thin small outline package; no leads;

SOT782-1

8 terminals; body 3  3  0.85 mm

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

2 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

5. Block diagram

TJA1027

POWER-ON RESET &

7

6

V

BAT

UNDERVOLTAGE DETECTION

1

2

4

RXD

BUS

TIMER

LIN

SLP_N

TXD

CONTROL

5

GND

TEMPERATURE

PROTECTION

015aaa212

Fig 1. Block diagram

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

3 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

6. Pinning information

6.1 Pinning

terminal 1

index area

TJA1027T

TJA1027TK

1

2

3

4

8

7

6

5

RXD

SLP_N

n.c.

V

RXD

SLP_N

n.c.

1

2

3

4

8

7

6

5

BAT

V

BAT

LIN

TXD

GND

TXD

GND

015aaa214

Transparent top view

015aaa213

a. TJA1027T/20: SO8 package

b. TJA1027TK/20: HVSON8 package

Fig 2. Pin configuration diagrams

6.2 Pin description

Table 3.

Pin description

Symbol

Description

RXD

1

receive data output (open-drain); active LOW after a wake-up

event

SLP_N

n.c.

2

sleep control input (active LOW); resets wake-up request on RXD

3

not connected

transmit data input

ground

TXD

GND

LIN

4

5^[1]

6

LIN bus line input/output

battery supply

not connected

V_BAT

n.c.

7

8

[1] For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should

be soldered to board ground (and not to any other voltage level).

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

4 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

7. Functional description

The TJA1027 is the interface between the LIN master/slave protocol controller and the

physical bus in a LIN network. According to the Open System Interconnect (OSI) model,

this is the LIN physical layer.

The LIN transceiver is optimized for, but not limited to, automotive applications with

excellent ElectroMagnetic Compatibility (EMC) performance.

7.1 LIN 2.x/SAE J2602 compliant

The TJA1027 is fully LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and SAE J2602 compliant. The

LIN physical layer is independent of higher OSI model layers (e.g. the LIN protocol).

Consequently, nodes containing a LIN 2.2A-compliant physical layer can be combined,

without restriction, with LIN physical layer nodes that comply with earlier revisions

(LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3, LIN 2.0, LIN 2.1 and LIN 2.2).

7.2 Operating modes

The TJA1027 supports modes for normal operation (Normal mode) and very-low-power

operation (Sleep mode). An intermediate wake-up mode between Sleep and Normal

modes is also supported (Standby mode). The state diagram is shown in Figure 3.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

5 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

falling V

< V

th(POR)L

BAT

Reset

RXD: floating

Transmitter: off

Normal

RXD: data output

(1)

Transmitter: on

rising V

> V

t

> t

BAT

th(POR)H

(SLP_N = 1) gotonorm

t

> t

gotonorm

(SLP_N = 1)

t

> t

gotosleep

(SLP_N = 0)

Sleep

Standby

RXD: low

Transmitter: off

RXD: floating

Transmitter: off

t

> t

wake(dom)LIN

(LIN = 0→1; after LIN = 0)

015aaa215

(1) A positive edge on SLP_N triggers a transition to Normal mode; the transmitter is enabled once

TXD goes HIGH; in the event of thermal shut down, the transmitter is disabled.

Fig 3. State diagram

Table 4.

Mode

Operating modes

SLP_N

RXD

Transmitter

Description

Reset

x

floating

off

all inputs ignored; all outputs

drivers off

Sleep^[1]

Standby^[2]

Normal

0

1

floating

LOW^[3]

off

no wake-up request detected

wake-up request detected

HIGH: recessive state Normal mode^[4]bus signal shaping enabled

LOW: dominant state

[1] The TJA1027 enters Sleep mode after a power-on reset (e.g. after switching on V_BAT).

[2] The TJA1027 will switch automatically to Standby mode if a LIN wake-up event occurs during Sleep mode.

[3] The wake-up interrupt (on pin RXD) is released after a positive edge on pin SLP_N.

[4] A positive edge on SLP_N will trigger a transition to Normal mode The transmitter will be off if TXD is LOW

and will be enabled as soon as TXD goes HIGH.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

6 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

7.2.1 Reset mode

When the TJA1027 is in Reset mode, it ignores all input signals and all output drivers are

off. The TJA1027 switches to Reset mode when the voltage on V_BATdrops below the

LOW-level power-on reset threshold, V_th(POR)L. When the voltage on V_BATrises above the

HIGH-level power-on reset threshold, V_th(POR)H, the TJA1027 switches to Sleep mode.

7.2.2 Sleep mode

The TJA1027 consumes significantly less power in Sleep mode than in any other mode.

Even though current consumption is extremely low in Sleep mode, the TJA1027 can still

be woken up remotely via pin LIN or activated directly via pin SLP_N. Filters on the

receiver input (LIN) and on pin SLP_N prevent unwanted wake-up events occurring due to

automotive transients or radio frequency interference. All wake-up events must be

maintained for a specific period of time (t_wake(dom)LINor t_gotonorm).

Sleep mode is initiated by a falling edge on pin SLP_N in Normal mode. The LIN transmit

path is immediately disabled when pin SLP_N goes LOW. In order to ensure the TJA1027

switches successfully to Sleep mode, the sleep command (pin SLP_N = LOW) must be

maintained for at least t_gotosleep

.

Sleep mode activation is independent of the levels on pins LIN or TXD. So the lowest

possible power consumption can be guaranteed, even when there is a continuous

dominant level on pins LIN and TXD.

7.2.3 Standby mode

Standby mode is activated automatically when a local or remote wake-up event occurs

while the TJA1027 is in Sleep mode. In Standby mode, pin RXD is held LOW to provide

an interrupt flag for the microcontroller.

7.2.4 Normal mode

In Normal mode, the TJA1027 can transmit and receive data via the LIN bus.

The receiver detects the data stream on the LIN bus input pin and transfers it via pin RXD

to the microcontroller (see Figure 6): HIGH for a recessive level and LOW for a dominant

level on the bus. The receiver has a supply-voltage related threshold with hysteresis and

an integrated filter to suppress bus line noise.

The transmit data stream from the protocol controller is detected on pin TXD and is

converted by the transmitter into an optimized bus signal shaped to minimize EME. The

LIN bus output pin is pulled HIGH via an internal slave termination resistor. For a master

application, an external resistor in series with a diode should be connected between pin

V_BATand pin LIN (see Figure 6).

If pin SLP_N is pulled HIGH while the TJA1027 is in Sleep or Standby mode, the LIN

transceiver switches to Normal mode after t_gotonorm

.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

7 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

7.3 Transceiver wake-up

7.3.1 Remote wake-up via the LIN bus

A falling edge on pin LIN followed by a LOW level maintained for t_wake(dom)LINfollowed by

a rising edge on pin LIN triggers a remote wake-up (see Figure 4). It should be noted that

the time period t_wake(dom)LINis measured either in Normal mode while TXD is HIGH, or in

Sleep mode irrespective of the status of pin TXD.

LIN recessive

V

BUSrec

V

t

wake(dom)LIN

BUSdom

LIN

LIN dominant

sleep mode

ground

standby mode

015aaa241

Fig 4. Remote wake-up behavior

7.3.2 Wake-up via pin SLP_N

If SLP_N is held HIGH for t_gotonorm, the TJA1027 will switch from Sleep mode to Normal

mode.

7.4 Operation during automotive cranking pulses

TJA1027 remains fully operational during automotive cranking pulses because the LIN

transceiver is fully specified down to V_BAT= 5 V.

7.5 Operation when supply voltage is outside specified operating range

If V_BAT> 18 V or V_BAT< 5 V, the TJA1027 may remain operational, but parameter values

cannot be guaranteed to remain within the operation ranges specified in Table 7 and

Table 8.

In Normal mode:

• If the input level on pin TXD is HIGH, the LIN transmitter output on pin LIN will be

recessive.

• If the input level on pin LIN is recessive, the receiver output on pin RXD will be HIGH.

• If the voltage on pin V_BATrises to 27 V (e.g. during an automotive jump start), the total

LIN network pull-up resistance should be greater than 680  and the total LIN network

capacitance should be less than 6.8 nF to ensure reliable LIN data transfer.

• If the voltage on pin V_BATdrops below the LOW-level V_BATLOW threshold, V_th(VBATL)L

,

the LIN transmit path is interrupted and the LIN output remains recessive. The LIN

transmit path is switched on again when V_BATrises above V_th(VBATL)Hand the input to

pin TXD is recessive.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

8 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

If the voltage on pin V_BATdrops below the LOW-level power-on reset threshold, V_th(POR)L

,

the TJA1027 switches to Reset mode (i.e. all output drivers are disabled and all inputs are

ignored). The TJA1027 switches to Sleep mode if V_BAT> V_th(POR)H

.

7.6 Fail-safe features

Pin TXD provides a pull-down to GND in order to force a predefined level on the transmit

data input if the pin is disconnected.

Pin SLP_N provides a pull-down to GND in order to force the transceiver into Sleep mode

if pin SLP_N is disconnected.

Pin RXD is set floating if V_BATis disconnected.

The current in the transmitter output stage is limited in order to protect the transmitter

against short circuits to pins V_BATor GND.

A loss of power (pins V_BATand GND) has no impact on the bus line or on the

microcontroller. No reverse currents flow from the bus into pin LIN. The current path from

V

_BATto LIN via the integrated LIN slave termination resistor remains. The LIN transceiver

can be disconnected from the power supply without influencing the LIN bus.

The output driver on pin LIN is protected against overtemperature conditions. If the

junction temperature exceeds the shutdown junction temperature, T_j(sd), the thermal

protection circuit disables the output driver. The driver is enabled again when the junction

temperature falls below T_j(sd)and pin TXD is recessive.

The initial TXD dominant check prevents the bus line from being driven to a permanent

dominant state (blocking all network communications) if pin TXD is forced permanently

LOW by a hardware and/or software application failure. The TXD input level is checked

after a transition to Normal mode. If TXD is LOW, the transmit path will remain disabled

and will only be enabled when TXD goes HIGH.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

9 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin GND, unless

otherwise specified. Positive currents flow into the IC.

Symbol

V_BAT

Parameter

Conditions

Min

0.3

42

Max

+42

+7

Unit

V

battery supply voltage

voltage on pin TXD

voltage on pin RXD

voltage on pin SLP_N

voltage on pin LIN

V_TXD

V

V_RXD

V_{SLP_N}

V_LIN

+7

V

+7

V

with respect to GND and V_BAT

+42

V

V_ESD

electrostatic discharge voltage

[1]

[2]

according to IEC 61000-4-2 on pins LIN and V_BAT

8

+8

kV

V

human body model

on pins LIN and V_BAT

on pins TXD, RXD and SLP_N

all pins

8

+8

2

+2

charge device model

machine model

750

200

40

55

+750

+200

+150

[3]

[4]

all pins

V

T_vj

virtual junction temperature

storage temperature

C

T_stg

[1] Equivalent to discharging a 150 pF capacitor through a 330  resistor.

[2] Equivalent to discharging a 100 pF capacitor through a 1.5 k resistor.

[3] Equivalent to discharging a 200 pF capacitor through a 10  resistor and a 0.75 H coil.

[4] Junction temperature in accordance with IEC 60747-1. An alternative definition is: T_j= T_amb+ P  R_th(j-a), where R_th(j-a)is a fixed value.

The rating for T_vjlimits the allowable combinations of power dissipation (P) and ambient temperature (T_amb).

9. Thermal characteristics

Table 6.

Thermal characteristics

According to IEC 60747-1.

Symbol

Parameter

Conditions

Typ

145

50

Unit

K/W

R_th(j-a)

thermal resistance from junction to ambient

SO8 package; in free air

HVSON8 package; in free air

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

10 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

10. Static characteristics

Table 7.

_BAT= 5 V to 18 V; T_vj= 40 C to +150 C; R_L(LIN-VBAT)= 500 ; all voltages are referenced to pin GND; positive currents

flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.^[1]

Static characteristics

V

Symbol

Supply

V_BAT

Parameter

Conditions

Min

Typ

Max

Unit

battery supply voltage

battery supply current

5

-

18

10

V

I_BAT

Sleep mode; bus recessive;

V_LIN= V_BAT; V_{SLP_N}= 0 V

2.5

7

A

Sleep mode; bus dominant;

V_LIN= 0 V; V_BAT= 12 V;

V_{SLP_N}= 0 V

150

400

1200

A

Standby mode; bus recessive;

2.5

7

10

A

V_LIN= V_BAT; V_{SLP_N}= 0 V

[2]

Standby mode; bus dominant;

V_LIN= 0 V; V_BAT= 12 V;

V_{SLP_N}= 0 V

100

300

1000

Normal mode; bus recessive;

200

1

800

2

1600

4

A

V_LIN= V_BAT; V_{SLP_N}= 5 V;

V_TXD= 5 V

Normal mode; bus dominant;

V_TXD= 0 V; V_{SLP_N}= 5 V;

V_BAT= 12 V

mA

Undervoltage reset

V_th(POR)L

LOW-level power-on reset power-on reset

threshold voltage

1.6

3.1

3.4

0.3

4.4

4.7

0.3

3.9

4.3

1

V

V_th(POR)H

V_hys(POR)

V_th(VBATL)L

V_th(VBATL)H

V_hys(VBATL)

HIGH-level power-on reset

threshold voltage

2.3

[2]

power-on reset hysteresis

voltage

0.05

3.9

LOW-level V_BATLOW

threshold voltage

4.7

4.9

0.6

HIGH-level V_BATLOW

threshold voltage

4.2

[2]

V_BATLOW hysteresis

voltage

0.15

Pins TXD and SLP_N

V_IH

V_IL

HIGH-level input voltage

2

-

7

V

LOW-level input voltage

hysteresis voltage

0.3

50

-

+0.8

400

325

650

V

[2]

V_hys

R_pd

200

125

250

mV

k

pull-down resistance

on TXD

50

on SLP_N

100

Pin RXD (open-drain)

I_OLLOW-level output current V_RXD= 0.4 V

I_LH

2

-

mA

[2]

HIGH-level leakage

current

5

+5

A

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

11 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

Table 7.

Static characteristics …continued

V_BAT= 5 V to 18 V; T_vj= 40 C to +150 C; R_L(LIN-VBAT)= 500 ; all voltages are referenced to pin GND; positive currents

flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.^[1]

Symbol

Pin LIN

I_{BUS_LIM}

Parameter

Conditions

Min

Typ

Max

Unit

current limitation for driver V_BAT= 18 V; V_LIN= 18 V;

dominant state _TXD= 0 V

40

-

100

-

mA

V

[2]

I_{BUS_PAS_dom}receiver dominant input

V_BAT= 12 V; V_LIN= 0 V;

600

A

leakage current including V_TXD= 5 V

pull-up resistor

I_{BUS_PAS_rec}

receiver recessive input

leakage current

V_BAT= 5 V; V_LIN= 18 V;

-

0

1

A

V_TXD= 5 V

[2]

I_{BUS_NO_GND}loss-of-ground bus current V_BAT= 18 V; V_LIN= 0 V

I_{BUS_NO_BAT}loss-of-battery bus current V_BAT= 0 V; V_LIN= 18 V

750

-

+10

A

V

-

1

V_BUSdom

V_BUSrec

receiver dominant state

receiver recessive state

receiver center voltage

-

0.4V_BAT

-

0.6V_BAT

V

V_{BUS_CNT}

=

0.475V_BAT0.5V_BAT

0.525V_BAT

V

(V_BUSdom+ V_BUSrec) / 2

[2]

V_HYS

receiver hysteresis voltage V_HYS= V_BUSrec V_BUSdom

-

0.175V_BAT

1.0

V

V_SerDiode

voltage drop at the serial

diode

in pull-up path with R_slave

I_SerDiode= 0.9 mA

;

0.4

[2]

V_O(dom)

dominant output voltage

Normal mode; V_TXD= 0 V;

V_BAT= 7.0 V

-

1.4

2.0

V

Normal mode; V_TXD= 0 V;

V_BAT= 18 V

R_slave

C_LIN

slave resistance

20

-

30

-

60

20

k

[2]

capacitance on pin LIN

with respect to GND

pF

Thermal shutdown

T_j(sd)shutdown junction

temperature

150

-

200

C

[1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage range.

[2] Not tested in production; guaranteed by design.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

12 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

11. Dynamic characteristics

Table 8.

_BAT= 5 V to 18 V; T_vj= 40 C to +150 C; R_L(LIN-VBAT)= 500 ; all voltages are referenced to pin GND; positive currents

flow into the IC; typical values are given at V_BAT= 12 V, unless otherwise specified.^[1]

Dynamic characteristics

V

Symbol

Duty cycles

1

Parameter

Conditions

Min

Typ

Max Unit

[2][4][5]

[3][4][5]

[2][4][5]

[3][4][5]

duty cycle 1

V_th(rec)(max)= 0.744  V_BAT

V_th(dom)(max)= 0.581  V_BAT

;

0.396 -

-

;

t

_bit= 50 s; V_BAT= 7 V to 18 V

V_th(rec)(max)= 0.768  V_BAT

V_th(dom)(max)= 0.6  V_BAT

_bit= 50 s; V_BAT= 5 V to 7 V

;

-

;

t

2

3

4

duty cycle 2

duty cycle 3

duty cycle 4

V

_th(rec)(min)= 0.422  V_BAT

_th(dom)(min)= 0.284  V_BAT

;

-

0.581

-

;

t_bit= 50 s; V_BAT= 7.6 V to 18 V

_th(rec)(min)= 0.405  V_BAT

V_th(dom)(min)= 0.271  V_BAT

t_bit= 50 s; V_BAT= 5.6 V to 7.6 V

V_th(rec)(max)= 0.778  V_BAT

V_th(dom)(max)= 0.616  V_BAT

t_bit= 96 s; V_BAT= 7 V to 18 V

_th(rec)(max)= 0.805  V_BAT

V_th(dom)(max)= 0.637  V_BAT

t_bit= 96 s; V_BAT= 5 V to 7 V

_th(rec)(min)= 0.389  V_BAT

V_th(dom)(min)= 0.251  V_BAT

t_bit= 96 s; V_BAT= 7.6 V to 18 V

_th(rec)(min)= 0.372  V_BAT

V

;

0.417 -

;

V

;

-

;

V

;

-

0.590

;

V

V_th(dom)(min)= 0.238  V_BAT

t_bit= 96 s; V_BAT= 5.6 V to 7.6 V

Timing characteristics

[5]

t_{rx_pd}

receiver propagation

delay

rising and falling;

C_RXD= 20 pF; R_RXD= 2.4 k

-

6

s

t_{rx_sym}

receiver propagation

delay symmetry

C_RXD= 20 pF; R_RXD= 2.4 k;

rising edge with respect to falling edge

2

30

2

-

+2

150

10

t_wake(dom)LIN

t_gotonorm

LIN dominant wake-up

time

Sleep mode

80

6

go to normal time

time period for mode change from

Sleep or Standby mode to Normal

mode

t_init(norm)

t_gotosleep

normal mode

initialization time

7

2

-

20

10

s

go to sleep time

time period for mode change from

Normal to Sleep mode

6

[1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage ranges.

t_{busrecmin}

-------------------------------

[2] 1 3 =

. Variable t_{bus(rec)(min)}is illustrated in the LIN timing diagram in Figure 5.

2  t_bit

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

13 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

t_{busrecmax}

-------------------------------

[3] 2 4 =

. Variable t_{bus(rec)(max)}is illustrated in the LIN timing diagram in Figure 5.

2  t_bit

[4] Bus load conditions: C_BUS= 1 nF and R_BUS= 1 k; C_BUS= 6.8 nF and R_BUS= 660 ; C_BUS= 10 nF and R_BUS= 500 .

[5] See timing diagram in Figure 5.

t

bit

t

bit

V

TXD

t

bus(rec)(min)

bus(dom)(max)

V

th(rec)(max)

th(dom)(max)

th(rec)(min)

th(dom)(min)

thresholds of

receiving node 1

LIN BUS

signal

t

bus(dom)(min)

bus(rec)(max)

V

BAT

thresholds of

receiving node 2

t

rx_pdf

rx_pdr

rx_pdf

V

RXD

receiving

node 1

t

rx_pdf

rx_pdr

RXD

receiving

node 2

015aaa237

Fig 5. Timing diagram of LIN transceiver duty cycle

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

14 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

12. Application information

12.1 Application diagram

V

ECU

LIN BUS

LINE

BATTERY

+3 V/

+5 V

only for

master node

V

7

BAT

1 kΩ

RXD

V

DD

RX0

TX0

Px.x

1

4

2

TXD

MICRO-

CONTROLLER

TJA1027

SLP_N

LIN

6

GND

5

(1)

015aaa238

(1) Master: C = 1 nF; slave: C = 220 pF

Fig 6. Application diagram

12.2 ESD robustness according to LIN EMC test specification

ESD robustness (IEC 61000-4-2) has been tested by an external test house according to

the LIN EMC test specification (part of Conformance Test Specification Package for

LIN 2.1, October 10th, 2008). The test report is available on request.

Table 9.

ESD robustness (IEC 61000-4-2) according to LIN EMC test specification

Test configuration

Value

13

Unit

kV

LIN

no capacitor connected to LIN pin

220 pF capacitor connected to LIN pin

100 nF capacitor connected to V_BATpin

12

kV

V_BAT

> 15

kV

12.3 Hardware requirements for LIN interfaces in automotive applications

The TJA1027 satisfies the "Hardware Requirements for LIN, CAN and FlexRay Interfaces

in Automotive Applications", Version 1.1, December 2009.

13. Test information

13.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for

integrated circuits, and is suitable for use in automotive applications.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

15 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

14. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

c

y

H

v

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 7. Package outline SOT96-1 (SO8)

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

16 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

X

D

B

A

E

A

1

c

detail X

terminal 1

index area

e

1

C

terminal 1

index area

v

C

A

B

e

b

y

1

y

w

C

1

4

L

K

E

h

8

5

D

h

0

1

2 mm

L

scale

Dimensions

(1)

Unit

A

b

c

D

h

E

e

1

K

v

w

y

1

h

max 1.00 0.05 0.35

mm nom 0.85 0.03 0.30 0.2 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.1 0.05 0.05 0.1

min 0.80 0.00 0.25 2.90 2.35 2.90 1.55 0.25 0.35

3.10 2.45 3.10 1.65

0.35 0.45

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot782-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

JEITA

- - -

09-08-25

09-08-28

SOT782-1

MO-229

Fig 8. Package outline SOT782-1 (HVSON8)

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

17 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in JESD625-A or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

18 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 9) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 10 and 11

Table 10. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

Table 11. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 9.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

19 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 9. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Soldering of HVSON packages

Section 16 contains a brief introduction to the techniques most commonly used to solder

Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON

leadless package ICs can found in the following application notes:

• AN10365 ‘Surface mount reflow soldering description”

• AN10366 “HVQFN application information”

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

20 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

18. Revision history

Table 12. Revision history

Document ID

TJA1027 v.2

Modifications:

Release date

20130424

Data sheet status

Change notice

Supersedes

Product data sheet

-

TJA1027 v.1

• text in Title, Section 1, Section 2.1, Section 7.1 revised to include LIN 2.2A compliance

• text in Section 7.1 revised to be consistent with TJA1029

• Figure 2: revised/resized

• Table 3, Table note 1: revised

• Figure 4: revised

• Table 7: revised measurement conditions for parameter I_{BUS_NO_BAT}

• Section 13.1: text revised

TJA1027 v.1

20111020

Product data sheet

-

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

21 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

19. Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use in automotive applications — This NXP

19.2 Definitions

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

22 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

TJA1027

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 24 April 2013

23 of 24

TJA1027

NXP Semiconductors

LIN 2.2A/SAE J2602 transceiver

21. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

18

Revision history . . . . . . . . . . . . . . . . . . . . . . . 21

2

2.1

2.2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

19

Legal information . . . . . . . . . . . . . . . . . . . . . . 22

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 23

19.1

19.2

19.3

19.4

3

4

5

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

20

21

Contact information . . . . . . . . . . . . . . . . . . . . 23

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

7.1

7.2

Functional description . . . . . . . . . . . . . . . . . . . 5

LIN 2.x/SAE J2602 compliant. . . . . . . . . . . . . . 5

Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5

Reset mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Transceiver wake-up . . . . . . . . . . . . . . . . . . . . 8

Remote wake-up via the LIN bus . . . . . . . . . . . 8

Wake-up via pin SLP_N . . . . . . . . . . . . . . . . . . 8

Operation during automotive cranking pulses . 8

Operation when supply voltage is outside

7.2.1

7.2.2

7.2.3

7.2.4

7.3

7.3.1

7.3.2

7.4

7.5

specified operating range . . . . . . . . . . . . . . . . . 8

Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 9

7.6

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10

Thermal characteristics . . . . . . . . . . . . . . . . . 10

Static characteristics. . . . . . . . . . . . . . . . . . . . 11

Dynamic characteristics . . . . . . . . . . . . . . . . . 13

9

10

11

12

12.1

12.2

Application information. . . . . . . . . . . . . . . . . . 15

Application diagram . . . . . . . . . . . . . . . . . . . . 15

ESD robustness according to LIN EMC test

specification . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Hardware requirements for LIN interfaces in

automotive applications . . . . . . . . . . . . . . . . . 15

12.3

13

13.1

14

Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

Quality information . . . . . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

Handling information. . . . . . . . . . . . . . . . . . . . 18

15

16

Soldering of SMD packages . . . . . . . . . . . . . . 18

Introduction to soldering . . . . . . . . . . . . . . . . . 18

Wave and reflow soldering . . . . . . . . . . . . . . . 18

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 18

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 19

16.1

16.2

16.3

16.4

17

Soldering of HVSON packages. . . . . . . . . . . . 20

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 24 April 2013

Document identifier: TJA1027


型号：	TJA1027TK/20/1J
厂家：	NXP
描述：	TJA1027 - LIN 2.2A/SAE J2602 transceiver SON 8-Pin 电信光电二极管电信集成电路
文件：	总24页 (文件大小：552K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TJA1027TK/20/1J [NXP]

相关型号：

TJA1028

TJA1028T/3V3/10

TJA1028T/3V3/20,11

TJA1028T/3V3/20/1J

TJA1028T/3V3/20/DZ

TJA1028T/5V0/10/2Z

TJA1028T/5V0/20

TJA1028T/5V0/20/1J

TJA1028T3V310

TJA1028T3V320

TJA1028T5V010

TJA1028T5V020