TJA1028_技术文档

TJA1028

LIN transceiver with integrated voltage regulator

Rev. 2 — 25 February 2011

Product data sheet

1. General description

The TJA1028 is a LIN 2.0/2.1/SAE J2602 transceiver with an integrated low-drop voltage

regulator. The voltage regulator can deliver up to 70 mA and is available in 3.3 V and

5.0 V variants. TJA1028 facilitates the development of compact nodes in LIN bus

systems. To support robust designs, the TJA1028 offers strong ElectroStatic Discharge

(ESD) performance and can withstand high voltages on the LIN bus. In order to minimize

current consumption, the TJA1028 supports a Sleep mode in which the LIN transceiver

and the voltage regulator are powered down while still having wake-up capability via the

LIN bus.

The TJA1028 comes in an SO8 package, and also in a 3 mm × 3 mm HVSON8 package

that reduces the required board space by over 70 %. This feature can prove extremely

valuable when board space is limited.

2. Features and benefits

LIN 2.0/2.1 compliant

SAE J2602 compliant

Downward compatible with LIN 1.3

Internal LIN slave termination resistor

Voltage regulator offering 5 V or 3.3 V, 70 mA capability

±2 % voltage regulator accuracy over specified temperature and supply ranges

Voltage regulator output undervoltage detection with reset output

Voltage regulator is short-circuit proof to ground

Voltage regulator stable with ceramic, tantalum and aluminum electrolyte capacitors

Robust ESD performance; ±8 kV according to IEC61000-4-2 for pins LIN and V_BAT

Pins LIN and V_BATprotected against transients in the automotive environment

(ISO 7637)

Very low LIN bus leakage current of < 2 μA when battery not connected

LIN pin short-circuit proof to battery and ground

Transmit data (TXD) dominant time-out function

Thermally protected

Very low ElectroMagnetic Emission (EME)

High ElectroMagnetic Immunity (EMI)

Typical Standby mode current of 45 μA

Typical Sleep mode current of 12 μA

LIN bus wake-up function

Available in SO8 and HVSON8 packages

Leadless HVSON8 package with wettable sides

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

K-line compatible

Pb-free; Restriction of Hazardous Substances (RoHS) and dark green compliant

3. Ordering information

Table 1.

Ordering information

Type number

Package

Name

Description

Version

TJA1028T/xxx/xx^[1][2]

TJA1028TK/xxx/xx^[1][2]

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

HVSON8

plastic thermal enhanced very thin small outline package; no leads; SOT782-1

8 terminals; body 3 × 3 × 0.85 mm

[1] TJA1028T/5V0/xx and TJA1028TK/5V0/xx for the versions with the 5 V regulator; TJA1028T/3V3/xx and TJA1028TK/3V3/xx for the

versions with the 3.3 V regulator.

[2] TJA1028T/xxx/20 and TJA1028TK/xxx/20 for the normal slope versions that support baud rates up to 20 kBd; TJA1028T/xxx/10 and

TJA1028TK/xxx/10 for the low slope versions that support baud rates up to 10.4 kBd (SAE J2602).

4. Marking

Table 2.

Marking codes

Type number

Marking

1028/51

1028/52

1028/31

1028/32

28/51

TJA1028T/5V0/10

TJA1028T/5V0/20

TJA1028T/3V3/10

TJA1028T/3V3/20

TJA1028TK/5V0/10

TJA1028TK/5V0/20

TJA1028TK/3V3/10

TJA1028TK/3V3/20

28/52

28/31

28/32

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

2 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

5. Block diagram

V

BAT

V

UV

DET

BAT

VOLTAGE

REFERENCE

V

CC

V

UV

CC

EN

DET

VREG

GND

V

BAT

OVERTEMP

DETECTION

CONTROL

RSTN

RXD

Rx

Tx

LIN

V

CC

TXD

TIMEOUT

TIMER

LIN

TXD

TJA1028

015aaa085

GND

Fig 1. Block diagram

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

6. Pinning information

6.1 Pinning

terminal 1

index area

1

2

3

4

8

7

6

5

V

CC

BAT

EN

RSTN

TXD

TJA1028TK

1

2

3

4

8

7

6

5

V

CC

BAT

GND

LIN

RSTN

TXD

EN

TJA1028T

RXD

GND

LIN

RXD

015aaa244

Transparent top view

015aaa082

a. TJA1028T/xxx/xx: SO8

Fig 2. Pin configuration diagrams

b. TJA1028TK/xxx/xx: HVSON8

6.2 Pin description

Table 3.

Pin description

Symbol

V_BAT

EN

1

Description

battery supply for the TJA1028

enable input

2

GND

LIN

3^[1]

ground

4

LIN bus line

RXD

TXD

RSTN

V_CC

5

LIN receive data output

LIN transmit data input

reset output (active LOW)

voltage regulator output

6

7

8

[1] HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The

GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is

recommended that the exposed center pad also be soldered to board ground.

7. Functional description

The TJA1028 combines the functionality of a LIN transceiver and a voltage regulator in a

single chip and offers wake-up by bus activity. The voltage regulator is designed to power

the Electronic Control Unit’s (ECU) microcontroller and its peripherals.

The TJA1028 is the interface between a LIN master/slave protocol controller and the

physical bus in a Local Interconnect Network (LIN). It is LIN 2.0/2.1/SAE J2602 compliant

and achieves optimum ElectroMagnetic Compatibility (EMC) performance by wave

shaping the LIN output.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

4 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

The TJA1028T/xxx/20 and TJA1028TK/xxx/20 versions are optimized for a speed of

20 kBd, the maximum specified in the LIN standard. The TJA1028T/xxx/10 and

TJA1028TK/xxx/10 versions are optimized for a transmission speed of 10.4 kBd, as

specified in SAE J2602.

7.1 Operating modes

The TJA1028 supports four operating modes: Normal, Standby, Sleep and Off. The

operating modes, and the transitions between modes, are illustrated in Figure 3.

AII states

V

BAT

< V

OR

th(det)poff

T

> T

th(act)otp

vj

remote

wake-up

V

BAT

T

> V

th(det)pon AND

th(rel)otp

EN = 1 AND

RSTN = 1

< T

vj

OFF

LIN = off

STANDBY

LIN = off

(1)

NORMAL

RXD = floating

RSTN = LOW

LIN = on

(RXD signals

wake source)

EN = 1 0 AND

TXD = 1 AND

RSTN = 1

(3)

EN = 1

0 AND

TXD = 0 AND

RSTN = 1

EN = 1

(3)

wake-up

event

SLEEP

LIN = off

Voltage regulator - on

Voltage regulator - off

(2)

RXD = V

RSTN = LOW

CC

015aaa086

(1) In Normal mode, the LIN transmitter is enabled - but if EN and/or RSTN go LOW, the LIN

transmitter will be disabled. Remote wake-up signalling will be activated.

(2) Until V_CCdrops below 2 V.

(3) If a wake-up event and a go-to-sleep event occur simultaneously, the device will switch directly to

Standby mode without initiating a reset.

Fig 3. State diagram

7.1.1 Off mode

The TJA1028 switches to Off mode from all other modes if the battery supply voltage

drops below the power-off detection threshold (V_th(det)poff) or the junction temperature

exceeds the overtemperature protection activation threshold (T_th(act)otp).

The voltage regulator and the LIN physical layer are disabled in Off mode, and pin RSTN

is forced LOW.

7.1.2 Standby mode

Standby mode is a low-power mode that guarantees very low current consumption.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

The TJA1028 switches from Off mode to Standby mode as soon as the battery supply

voltage rises above the power-on detection threshold (V_BAT> V_th(det)pon), provided the

junction temperature is below the overtemperature protection release threshold

(T_vj< T_th(rel)otp).

The TJA1028 switches to Standby mode from Normal mode during the mode select

window if TXD is HIGH and EN is LOW (see Section 7.1.5), provided RSTN = 1.

A remote wake-up event will trigger a transition to Standby mode from Sleep mode. The

remote wake-up event will be signalled by a continuous LOW level on pin RXD.

In Standby mode, the voltage regulator is on, the LIN physical layer is disabled and

remote wake-up detection is active. The wake-up source is indicated by the level on RXD

(LOW indicates a remote wake-up).

7.1.3 Normal mode

If the EN pin is pulled HIGH while the TJA1028 is in Standby mode (with RSTN = 1) or

Sleep mode, the device will enter Normal mode. The LIN physical layer and the voltage

regulator are enabled in Normal mode.

7.1.3.1 The LIN transceiver in Normal mode

The LIN transceiver is activated when the TJA1028 enters Normal mode.

In Normal mode, the transceiver can transmit and receive data via the LIN bus. The

receiver detects data streams on the LIN pin and transfers them to the microcontroller via

pin RXD. LIN recessive is represented by a HIGH level on RXD, LIN dominant by a LOW

level.

The transmit data streams of the protocol controller at the TXD input are converted by the

transmitter into bus signals with optimized slew rate and wave shaping to minimize EME.

A LOW level at the TXD input is converted to a LIN dominant level while a HIGH level is

converted to a LIN recessive level.

7.1.4 Sleep mode

Sleep mode features extremely low power consumption.

The TJA1028 switches to Sleep mode from Normal mode during the mode select window

if TXD and EN are both LOW (see Section 7.1.5), provided RSTN = 1.

The voltage regulator and the LIN physical layer are disabled in Sleep mode. Pin RSTN is

forced LOW. Remote wake-up detection is active.

7.1.5 Transition from Normal to Sleep or Standby mode

When EN is driven LOW in Normal mode, the TJA1028 disables the transmit path. The

mode select window opens t_msel(min)after EN goes LOW, and remains open until t_msel(max)

after EN goes LOW (see Figure 4).

The TXD pin is sampled in the mode select window. A transition to Standby mode is

triggered if TXD is HIGH, or to Sleep mode if TXD is LOW.

TJA1028

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Product data sheet

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

To avoid complicated timing in the application, EN and TXD can be pulled LOW at the

same time without having any effect on the LIN bus. In order to ensure that the remote

wake-up time (t_{wake(busdom)min}) is not reset on a transition to Sleep mode, TXD should be

pulled LOW at least t_d(EN-TXD)after EN goes LOW. This is guaranteed by design.

The user must ensure the appropriate level is present on pin TXD while the mode select

window is open.

EN

TXD

mode select window

operating

mode

Normal withTXD

path blocked

Sleep or Standby depending on

TXD level in mode select window

Normal

t

msel(min)

t

msel(max)

015aaa087

TXD is sampled during the mode select window. The TJA1028 switches to Standby (TXD HIGH) or

Sleep (TXD LOW) mode after sampling.

Fig 4. Transition from Normal to Sleep/Standby mode

7.2 Power supplies

7.2.1 Battery (pin V_BAT

)

The TJA1028 contains a single supply pin, V_BAT. An external diode is needed in series to

protect the device against negative voltages. The operating range is from 4.5 V to 28 V.

The TJA1028 can handle voltages up to 40 V (max). If the voltage on pin V_BATfalls below

V

_th(det)poff, the TJA1028 switches to Off mode, shutting down the internal logic and the

voltage regulator and disabling the LIN transmitter. The TJA1028 exits Off mode as soon

as the voltage rises above V_th(det)pon, provided the junction temperature is below T_th(rel)otp

.

7.2.2 Voltage regulator (pin V_CC

)

The TJA1028 contains a voltage regulator supplied via pin V_BAT, which delivers up to

70 mA. It is designed to supply the microcontroller and its periphery via pin V_CC

.

The output voltage on pin V_CCis monitored continuously and a system reset signal is

generated (pin RSTN goes LOW) if an undervoltage event is detected (V_CC< V_uvdfor

t_det(uv)(VCC)).

7.3 LIN transceiver

The transceiver is the interface between a LIN master/slave protocol controller and the

physical bus in a Local Interconnect Network (LIN). It is primarily intended for in-vehicle

sub-networks using baud rates from 2.4 kBd up to 20 kBd and is LIN 2.0/LIN 2.1/SAE

J2602 compliant.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

7 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

7.4 Remote wake-up

A remote wake-up is triggered by a falling edge on pin LIN, followed by LIN remaining

LOW for at least t_{wake(busdom)min}, followed by a rising edge on pin LIN (see Figure 5).

LIN recessive

V

BAT

0.6V

BAT

V

LIN

0.4V

t

wake(busdom)min

BAT

LIN dominant

ground

Standby/Sleep mode

Standby mode

LOW

Sleep: floating/Standby: HIGH

RXD

015aaa088

Fig 5. Remote wake-up behavior

The remote wake-up request is communicated to the microcontroller in Standby mode by

a continuous LOW level on pin RXD.

Note that t_{wake(busdom)min}is measured in Sleep and Standby modes, and in Normal mode if

TXD is HIGH.

7.5 Fail-safe features

7.5.1 General fail-safe features

The following general fail-safe features have been implemented:

• An internal pull-up towards V_CCon pin TXD guarantees a recessive bus level if the pin

is left floating by a bad solder joint or floating microcontroller port pin.

• The current in the transmitter output stage is limited in order to protect the transmitter

against short circuits to pin V_BAT

.

• A loss of power (pins V_BATand GND) has no impact on the bus line or on the

microcontroller. There will be no reverse currents from the bus.

• The LIN transmitter is automatically disabled when either EN or RSTN is LOW.

• After a transition to Normal mode, the LIN transmitter is only enabled if a recessive

level is present on pin TXD.

7.5.2 TXD dominant time-out function

A TXD dominant time-out timer circuit prevents the bus line being driven to a permanent

dominant state (blocking all network communications) if TXD is forced permanently LOW

by a hardware or software application failure. The timer is triggered by a negative edge on

the TXD pin. If the pin remains LOW for longer than the TXD dominant time-out time

(t_to(dom)TXD), the transmitter is disabled, driving the bus line to a recessive state. The timer

is reset by a positive edge on TXD.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

8 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

7.5.3 Temperature protection

The temperature of the IC is monitored in Normal, Standby and Off modes. If the

temperature is too high (T_vj> T_th(act)otp), the TJA1028 will switch to Off mode (if in Standby

or Normal modes). The voltage regulator and the LIN transmitter will be switched off and

the RSTN pin driven LOW.

When the temperature falls below the overtemperature protection release threshold

(T_vj< T_th(rel)otp), the TJA1028 switches to Standby mode.

8. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Max

Unit

V_BAT

V_x

battery supply voltage

DC; continuous

−0.3

+40

V

voltage on pin x

DC value

pin V_CC

−0.3

−40

+7

V

pins TXD, RXD, RSTN and EN

V_CC+ 0.3

+40

pin LIN with respect to GND

[1]

[2]

V_ESD

electrostatic discharge

voltage

HBM

at pins LIN and V_BAT

−8

−2

+8

+2

kV

at any other pin

[3]

[4]

[5]

IEC 61000-4-2

at pins LIN and V_BAT

−8

+8

kV

V

MM

at any pin

−250 +250

CDM

at corner pins

−750 +750

−500 +500

−150 +100

V

at any other pin

[6]

V_trt

transient voltage

on pin V_BATvia reverse polarity diode/capacitor;

on pin LIN via 1 nF coupling capacitor

[1] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).

[2] V_CCand V_BATconnected to GND, emulating application circuit.

[3] ESD performance of pins LIN and V_BATaccording to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house.

[4] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).

[5] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).

[6] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

9. Thermal characteristics

Table 5.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

132

93

Unit

K/W

[1]

[2]

[1]

[2]

thermal resistance from junction to ambient

SO8; single-layer board

SO8; four-layer board

HVSON8; single-layer board

HVSON8; four-layer board

129

67

[1] According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.

[2] According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers

(thickness: 35 μm) and thermal via array under the exposed pad connected to the first inner copper layer.

10. Static characteristics

Table 6.

Static characteristics

V_BAT= 5.5 V to 28 V; T_vj= −40 °C to +150 °C; R_L(LIN-VBAT)= 500 Ω; all voltages are defined with respect to ground; positive

currents flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply; pin V_BAT

I_BAT

battery supply current

Standby mode; V_LIN= V_BAT

Sleep mode; V_LIN= V_BAT

-

45

59

μA

12

18

Normal mode; bus recessive;

850

1800

V_LIN= V_BAT; V_RXD= V_CC; V_RSTN= HIGH

Normal mode; bus dominant;

-

2.0

4.5

5.25

4.5

-

mA

V

V_BAT= 12 V; V_TXD= 0 V; V_RSTN= HIGH

V_th(det)pon

V_th(det)poff

V_hys(det)pon

power-on detection threshold V_BAT= 2 V to 28 V

voltage

-

power-off detection threshold V_BAT= 2 V to 28 V

voltage

3

50

V

power-ondetection hysteresis V_BAT= 2 V to 28 V

voltage

mV

Supply; pin V_CC

V_CC

supply voltage

V_CC(nom)= 5 V; I_VCC= −70 mA to 0 mA

4.9

5

5.1

V

V_CC(nom)= 3.3 V; V_BAT= 4.5 V to 28 V;

3.234

3.3

3.366

I_VCC= −70 mA to 0 mA

I_Olim

V_uvd

output current limit

V_CC= 0 V to 5.5 V

V_CC(nom)= 5 V

−250

4.5

-

−70

4.75

3.135

4.9

mA

V

undervoltage detection

voltage

V_CC(nom)= 3.3 V

V_CC(nom)= 5 V

2.97

4.6

V

V_uvr

undervoltage recovery

voltage

V

V_CC(nom)= 3.3 V

3.036

-

3.234

5

V

[1]

R_(VBAT-VCC)

resistance between pin V_BATV_CC(nom)= 5 V; V_BAT= 4.5 V to 5.5 V;

and pin V_CC

Ω

I_VCC= −70 mA to −5 mA;

regulator in saturation

C_o

output capacitance

equivalent series resistance < 5 Ω

1.8

10

-

μF

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

Table 6.

Static characteristics …continued

V_BAT= 5.5 V to 28 V; T_vj= −40 °C to +150 °C; R_L(LIN-VBAT)= 500 Ω; all voltages are defined with respect to ground; positive

currents flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

LIN transmit data input; pin TXD

V_th(sw)

switching threshold voltage

V_CC= 2.97 V to 5.5 V

0.3 ×

V_CC

-

0.7 ×

V_CC

V

V_hys(i)

R_pu

input hysteresis voltage

pull-up resistance

200

5

-

mV

12

25

kΩ

LIN receive data output; pin RXD

I_OH

HIGH-level output current

Normal mode;

V_LIN= V_BAT; V_RXD= V_CC− 0.4 V

-

−0.4

mA

I_OL

LOW-level output current

Normal mode;

0.4

-

V_LIN= GND; V_RXD= 0.4 V

Enable input; pin EN

V_th(sw)

R_pd

switching threshold voltage

pull-down resistance

0.8

50

-

2

V

130

400

kΩ

Reset output; pin RSTN

R_pupull-up resistance

V_RSTN= V_CC− 0.4 V;

V_CC= 2.97 V to 5.5 V

3

-

12

40

0.5

kΩ

mA

V

I_OL

LOW-level output current

LOW-level output voltage

HIGH-level output voltage

V_RSTN= 0.4 V; V_CC= 2.97 V to 5.5 V;

−40 °C < T_vj< 195 °C

3.2

0

V_OL

V_OH

V_CC= 2.5 V to 5.5 V;

−40 °C < T_vj< 195 °C

0.8 ×

V_CC

0.3

+

V

LIN bus line; pin LIN

I_{BUS_LIM}

current limitation for driver

dominant state

V_BAT= V_LIN= 18 V; V_TXD= 0 V

40

-

100

mA

μA

I_{BUS_PAS_rec}

receiver recessive input

leakage current

V_LIN= 18 V; V_BAT= 5.5 V; V_TXD= V_CC

2

-

I_{BUS_PAS_dom}receiver dominant input

leakage current including

pull-up resistor

Normal mode;

V_TXD= V_CC; V_LIN= 0 V; V_BAT= 12 V

−600

I_L(log)

loss of ground leakage

current

V_BAT= 18 V; V_LIN= 0 V

V_BAT= 0 V; V_LIN= 18 V

V_BAT= 5.5 V to 18 V

−750

-

+10

μA

V

I_L(lob)

loss of battery leakage

current

-

2

-

V_rec(RX)

V_dom(RX)

V_th(cntr)RX

V_th(hys)RX

C_LIN

receiver recessive voltage

0.6 ×

V_BAT

receiver dominant voltage

-

0.4 ×

V_BAT

V

[2]

[1]

receiver center threshold

voltage

V_BAT= 5.5 V to 18 V;

V_th(cntr)RX= (V_th(rec)RX+ V_th(dom)RX) / 2

0.475 × 0.5 ×

V_BATV_BAT

0.525

× V_BAT

V

receiver hysteresis threshold V_BAT= 5.5 V to 18 V;

voltage

0.05 × 0.15 × 0.175

V_BAT

V

V_th(hys)RX= V_th(rec)RX- V_th(dom)RX

V_BAT

× V_BAT

capacitance on pin LIN

with respect to GND

-

30

pF

TJA1028

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Product data sheet

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TJA1028

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LIN transceiver with integrated voltage regulator

Table 6.

Static characteristics …continued

V_BAT= 5.5 V to 28 V; T_vj= −40 °C to +150 °C; R_L(LIN-VBAT)= 500 Ω; all voltages are defined with respect to ground; positive

currents flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_O(dom)

dominant output voltage

Normal mode;

-

1.4

V

V_TXD= 0 V; V_BAT= 7 V

Normal mode;

V_TXD= 0 V; V_BAT= 18 V

-

2.0

60

V

R_slave

slave resistance

between pin LIN and V_BAT

;

20

30

kΩ

V_LIN= 0 V; V_BAT= 12 V

Temperature protection

T_th(act)otpovertemperature protection

165

126

180

138

195

150

°C

activation threshold

temperature

T_th(rel)otp

overtemperature protection

release threshold

temperature

[1] Not tested in production; guaranteed by design.

[2] See Figure 7.

TJA1028

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Product data sheet

Rev. 2 — 25 February 2011

12 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

11. Dynamic characteristics

Table 7.

_BAT= 5.5 V to 18 V; T_vj= −40 °C to +150 °C; R_L(LIN-VBAT)= 500 Ω; all voltages are defined with respect to ground; positive

currents flow into the IC; typical values are given at V_BAT= 12 V; unless otherwise specified.^[1]

Dynamic characteristics

V

Symbol

Duty cycles

δ1

Parameter

Conditions

Min Typ

Max Unit

[2][3]

[4][5]

duty cycle 1

V_{th(rec)RX(max)}= 0.744V_BAT

;

0.396 -

-

V_{th(dom)RX(max)}= 0.581V_BAT

_bit= 50 μs;

V_BAT= 7 V to 18 V

;

t

[2][3]

[4][5]

V_{th(rec)RX(max)}= 0.76V_BAT

;

0.396 -

-

V_{th(dom)RX(max)}= 0.593V_BAT

t

_bit= 50 μs;

V_BAT= 5.5 V to 7.0 V

[2][4]

[5][6]

δ2

δ3

δ4

duty cycle 2

duty cycle 3

duty cycle 4

V

_{th(rec)RX(min)}= 0.422V_BAT

;

-

0.581

-

V_{th(domRX)(min)}= 0.284V_BAT;

t_bit= 50 μs;

V_BAT= 7.6 V to 18 V

[2][4]

[5][6]

V

_{th(rec)RX(min)}= 0.41V_BAT;

V_{th(dom)RX(min)}= 0.275V_BAT

t_bit= 50 μs;

V_BAT= 6.1 V to 7.6 V

;

[3][4]

[5]

V

_{th(rec)RX(max)}= 0.778V_BAT

;

0.417 -

V_{th(dom)RX(max)}= 0.616V_BAT

t_bit= 96 μs;

V_BAT= 7 V to 18 V

;

[3][4]

[5]

V

_{th(rec)RX(max)}= 0.797V_BAT

;

-

V_{th(dom)RX(max)}= 0.630V_BAT

t_bit= 96 μs;

V_BAT= 5.5 V to 7 V

[4][5]

[6]

V

_{th(rec)RX(min)}= 0.389V_BAT

-

0.590

V_{th(dom)RX(min)}= 0.251V_BAT

t_bit= 96 μs

V_BAT= 7.6 V to 18 V

[4][5]

[6]

V

_{th(rec)RX(min)}= 0.378V_BAT

_{th(dom)RX(min)}= 0.242V_BAT

;

t_bit= 96 μs;

V_BAT= 6.1 V to 7.6 V

Timing characteristics

t_PD(RX)r

rising receiver propagation delay

C_RXD= 20 pF

Sleep mode

V_TXD= 0 V

-

6

μs

ms

μs

t_PD(RX)f

falling receiver propagation delay

-

6

t_PD(RX)sym

receiver propagation delay symmetry

−2

30

6

-

+2

150

20

1

t_{wake(busdom)min}minimum bus dominant wake-up time

80

-

t_to(dom)TXD

t_msel

t_d(EN-TXD)

t_det(uv)(VCC)

Reset output; pin RSTN

TXD dominant time-out time

mode select time

3

-

[7]

delay time from EN to TXD

0

-

undervoltage detection time on pin V_CCC_RSTN= 20 pF

1

-

15

t_rst

reset time

2

-

8

ms

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Product data sheet

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

[1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage ranges.

[2] Not applicable to the low slope versions (TJA1028T/xxx/10 and TJA1028TK/xxx/10) of the TJA1028.

t_{bus(rec)(min)}

[3] δ1, δ3 =

. Variable t_{bus(rec)(min)}is illustrated in the LIN timing diagram in Figure 7.

-------------------------------

2 × t_bit

[4] Bus load conditions are: C_L= 1 nF and R_L= 1 kΩ; C_L= 6.8 nF and R_L= 660 Ω; C_L= 10 nF and R_L= 500 Ω.

[5] For V_BAT> 18 V, the LIN transmitter might be suppressed. If TXD is HIGH then the LIN transmitter output is recessive.

t_{bus(rec)(max)}

[6] δ2, δ4 =

. Variable t_{bus(rec)(max)}is illustrated in the LIN timing diagram in Figure 7.

-------------------------------

2 × t_bit

[7] Not tested in production; guaranteed by design.

V

BAT

RXD

TXD

R

LIN

TJA1028

C

RXD

LIN

GND

C

LIN

015aaa198

Fig 6. Timing test circuit for LIN transceiver

t

bit

V

TXD

t

bus(rec)(min)

bus(dom)(max)

V

BAT

V

th(rec)RX(max)

thresholds of

receiving node A

th(dom)RX(max)

LIN bus signal

V

th(rec)RX(min)

thresholds of

receiving node B

th(dom)RX(min)

t

bus(rec)(max)

bus(dom)(min)

output of receiving

node A

V

RXD

t

PD(RX)r

PD(RX)f

output of receiving

node B

RXD

t

PD(RX)f

PD(RX)r

015aaa199

Fig 7. LIN transceiver timing diagram

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

12. Test information

12.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated

circuits, and is suitable for use in automotive applications.

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Product data sheet

Rev. 2 — 25 February 2011

15 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 8. Package outline SOT96-1 (SO8)

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Product data sheet

Rev. 2 — 25 February 2011

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TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

X

D

B

A

E

A

1

c

detail X

terminal 1

index area

e

1

C

terminal 1

index area

v

w

C

A

B

e

b

y

1

y

C

1

4

L

K

E

h

8

5

D

h

0

1

2 mm

L

scale

Dimensions

(1)

Unit

A

1

b

c

D

h

E

h

e

1

K

v

w

y

1

max 1.00 0.05 0.35

mm nom 0.85 0.03 0.30 0.2 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.1 0.05 0.05 0.1

min 0.80 0.00 0.25 2.90 2.35 2.90 1.55 0.25 0.35

3.10 2.45 3.10 1.65

0.35 0.45

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot782-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

JEITA

- - -

09-08-25

09-08-28

SOT782-1

MO-229

Fig 9. Package outline SOT782-1 (HVSON8)

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Product data sheet

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TJA1028

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LIN transceiver with integrated voltage regulator

14. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in JESD625-A or equivalent standards.

15. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

15.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

15.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

15.3 Wave soldering

Key characteristics in wave soldering are:

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LIN transceiver with integrated voltage regulator

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

15.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 10) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 8 and 9

Table 8.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm³)

< 350

≥ 350

220

< 2.5

235

220

≥ 2.5

220

Table 9.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 10.

TJA1028

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Product data sheet

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NXP Semiconductors

LIN transceiver with integrated voltage regulator

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 10. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

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Product data sheet

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LIN transceiver with integrated voltage regulator

16. Revision history

Table 10. Revision history

Document ID

TJA1028 v.2

Modifications:

Release date

20110225

Data sheet status

Change notice

Supersedes

Product data sheet

-

TJA1028 v.1

• Section 1, Section 2, Section 7: text amended

• TJA1028TK/xxx/xx versions added

• Table 3: Table note 1 added

• Table 4, Table 5, Table 6: parameter values/conditions revised

• Table 7: parameter added - t_det(uv)(VCC); Table note 1 and Table note 2 revised

• Section 4, Section 14, Section 15 and Section 16: added

• Figure 6: revised

TJA1028 v.1

20100921

Product data sheet

-

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TJA1028

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LIN transceiver with integrated voltage regulator

17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

suitable for use in medical, military, aircraft, space or life support equipment,

17.2 Definitions

nor in applications where failure or malfunction of an NXP Semiconductors

product can reasonably be expected to result in personal injury, death or

severe property or environmental damage. NXP Semiconductors accepts no

liability for inclusion and/or use of NXP Semiconductors products in such

equipment or applications and therefore such inclusion and/or use is at the

customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. The product is not designed, authorized or warranted to be

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Product data sheet

Rev. 2 — 25 February 2011

22 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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Product data sheet

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23 of 24

TJA1028

NXP Semiconductors

LIN transceiver with integrated voltage regulator

19. Contents

1

2

3

4

5

General description. . . . . . . . . . . . . . . . . . . . . . 1

18

19

Contact information . . . . . . . . . . . . . . . . . . . . 23

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

7.1

Functional description . . . . . . . . . . . . . . . . . . . 4

Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5

Off mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 6

The LIN transceiver in Normal mode . . . . . . . . 6

Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Transition from Normal to Sleep or

7.1.1

7.1.2

7.1.3

7.1.3.1

7.1.4

7.1.5

Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 7

Battery (pin V_BAT) . . . . . . . . . . . . . . . . . . . . . . . 7

Voltage regulator (pin V_CC). . . . . . . . . . . . . . . . 7

LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 7

Remote wake-up . . . . . . . . . . . . . . . . . . . . . . . 8

Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 8

General fail-safe features . . . . . . . . . . . . . . . . . 8

TXD dominant time-out function. . . . . . . . . . . . 8

Temperature protection. . . . . . . . . . . . . . . . . . . 9

7.2

7.2.1

7.2.2

7.3

7.4

7.5

7.5.1

7.5.2

7.5.3

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

Thermal characteristics . . . . . . . . . . . . . . . . . 10

Static characteristics. . . . . . . . . . . . . . . . . . . . 10

Dynamic characteristics . . . . . . . . . . . . . . . . . 13

Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

Quality information . . . . . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

Handling information. . . . . . . . . . . . . . . . . . . . 18

9

10

11

12

12.1

13

14

15

Soldering of SMD packages . . . . . . . . . . . . . . 18

Introduction to soldering . . . . . . . . . . . . . . . . . 18

Wave and reflow soldering . . . . . . . . . . . . . . . 18

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 18

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 19

15.1

15.2

15.3

15.4

16

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21

17

Legal information. . . . . . . . . . . . . . . . . . . . . . . 22

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23

17.1

17.2

17.3

17.4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 February 2011

Document identifier: TJA1028


型号：	TJA1028
厂家：	NXP
描述：	LIN transceiver with integrated voltage regulator LIN收发器集成稳压器稳压器
文件：	总24页 (文件大小：198K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TJA1028 [NXP]

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