TDA8002C/AD [NXP]
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other;
| 型号： | TDA8002C/AD |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other |
| 文件： | 总28页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8002
IC card interface
1997 Nov 04
Product specification
Supersedes data of 1997 Mar 13
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
IC card interface
TDA8002
• Supply supervisor for spikes elimination and emergency
FEATURES
deactivation.
• Single supply voltage interface (3.3 or 5 V environment)
• Low-power sleep mode
APPLICATIONS
• Three specific protected half-duplex bidirectional
• IC card readers for:
– GSM applications
– banking
buffered I/O lines
• VCC regulation (5 V ±5%, ICC <65 mA at VDD = 5 V, with
controlled rise and fall times
• Thermal and short-circuit protections with current
limitations
– electronic payment
– identification
– Pay TV
• Automatic ISO 7816 activation and deactivation
sequences
– road tolling.
• Enhanced ESD protections on card side (>6 kV)
• Clock generation for the card up to 12 MHz with
synchronous frequency changes
GENERAL DESCRIPTION
The TDA8002 is a complete low-power, analog interface
for asynchronous and synchronous cards. It can be placed
between the card and the microcontroller. It performs all
supply, protection and control functions. It is directly
compatible with ISO 7816, GSM11.11 and EMV
specifications.
• Clock generation up to 20 MHz (auxiliary clock)
• Synchronous and asynchronous cards (memory and
smart cards)
• ISO 7816, GSM11.11 compatibility and EMV (Europay,
Mastercard, Visa) compliant
• Step-up converter for VCC generation
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Supply
VDDA
IDD
analog supply voltage
supply current
3.0
−
5
−
−
6.5
150
6
V
sleep mode
µA
mA
idle mode; fCLK = 2.5 MHz;
fCLKOUT = 10 MHz; VDD = 5 V
−
active mode; fCLK = 2.5 MHz;
fCLKOUT = 10 MHz; VDD = 5 V
−
−
−
−
9
mA
mA
active mode; fCLK = 2.5 MHz;
12
fCLKOUT = 10 MHz; VDD = 3 V
Card supply
VCC(O)
output voltage
output current
DC load <65 mA
4.75
−
−
5.25
100
V
ICC(O)
VCC short-circuited to GND
−
mA
General
fCLK
Tde
Ptot
card clock frequency
0
−
12
MHz
deactivation cycle time
continuous total power dissipation
TDA8002AT; TDA8002BT
TDA8002G
60
80
100
µs
T
amb = −25 to +85 °C
amb = −25 to +85 °C
−
−
−
−
0.56
0.46
+85
W
W
°C
T
−
Tamb
operating ambient temperature
−25
1997 Nov 04
2
Philips Semiconductors
Product specification
IC card interface
TDA8002
ORDERING INFORMATION
TYPE NUMBER(1)
PACKAGE
DESCRIPTION
MARKING
NAME
VERSION
TDA8002AT/3/C2(2) TDA8002AT/3
TDA8002AT/5/C2(3) TDA8002AT/5
TDA8002BT/3/C2(2) TDA8002BT/3
TDA8002BT/5/C2(3) TDA8002BT/5
TDA8002G/3/C2(2) 80023
SO28 plastic small outline package; 28 leads;
body width 7.5 mm
SOT136-1
LQFP32 plastic low profile quad flat package; 32 leads;
SOT401-1
body 5 × 5 × 1.4 mm
TDA8002G/5/C2(3) 80025
Notes
1. The /3 or /5 suffix indicates the voltage supervisor option.
2. The /3 version can be used with a 3 or 5 V power supply environment (see Chapter “Functional description”).
3. The /5 version can be used with a 5 V power supply environment.
1997 Nov 04
3
Philips Semiconductors
Product specification
IC card interface
TDA8002
BLOCK DIAGRAM
V
V
DDD
100 nF
DDA
100 nF
100 nF
S1
14
S2
12
13
28
SUPPLY
4
STEP-UP CONVERTER
ALARM
ALARM
INTERNAL
REFERENCE
3
V
REF
VUP
15
INTERNAL OSCILLATOR
f
INT
100 nF
VOLTAGE SENSE
ALARM
EN1 CLKUP
EN2
26
25
24
27
V
23
22
OFF
RSTIN
CC
PV
V
CC
CC
GENERATOR
100
nF
CMDVCC
MODE
EN5
RST
RST
BUFFER
SEQUENCER
19
18
6
7
5
PRES
PRES
CLKDIV1
CLKDIV2
CLKSEL
HORSEQ
CLK
CLOCK
CIRCUITRY
EN4
21
CLOCK
BUFFER
8
9
CLK
STROBE
CLKOUT
EN3
THERMAL
PROTECTION
30
31
XTAL1
XTAL2
OSCILLATOR
20
17
16
1
2
I/O
AUX1
AUX2
I/O
AUX1UC
AUX2UC
TRANSCEIVER
TDA8002G
I/O
TRANSCEIVER
32
I/O
I/OUC
TRANSCEIVER
29
11
10
MGE730
DGND2
AGND
DGND1
All capacitors are mandatory.
Fig.1 Block diagram (TDA8002G).
4
1997 Nov 04
Philips Semiconductors
Product specification
IC card interface
TDA8002
PINNING
PIN
TYPE A TYPE B TYPE G
SYMBOL
I/O
DESCRIPTION
XTAL1
XTAL2
I/OUC
1
2
3
4
1
2
3
4
30
31
32
1
I/O
I/O
I/O
I/O
crystal connection or input for external clock
crystal connection
data I/O line to and from microcontroller
AUX1UC
auxiliary line to and from microcontroller for synchronous
applications
AUX2UC
5
−
2
I/O
auxiliary line to and from microcontroller for synchronous
applications
ALARM
ALARM
−
5
6
3
4
O
O
open drain NMOS reset output for microcontroller (active LOW)
6
open drain PMOS reset output for microcontroller (active
HIGH)
CLKSEL
7
7
5
I
control input signal for CLK (LOW = XTAL oscillator;
HIGH = STROBE input)
CLKDIV1
CLKDIV2
STROBE
CLKOUT
DGND1
AGND
S2
8
8
6
I
I
control input with CLKDIV2 for choosing CLK frequency
control input with CLKDIV1 for choosing CLK frequency
external clock input for synchronous applications
clock output (see Table 1)
9
9
7
10
11
12
13
14
15
16
17
18
19
20
−
10
11
12
13
14
15
16
17
18
−
8
I
9
O
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
supply digital ground 1
supply analog ground
I/O
capacitance connection for voltage doubler
VDDA
supply analog supply voltage
S1
I/O
I/O
I/O
I/O
I
capacitance connection for voltage doubler
VUP
output of voltage doubler (connect to 100 nF)
data I/O line to and from card
I/O
AUX2
PRES
PRES
AUX1
CLK
auxiliary I/O line to and from card
active LOW card input presence contact
active HIGH card input presence contact
auxiliary I/O line to and from card
clock to card output (C3) (see Table 1)
card reset output (C2)
19
20
21
22
23
24
25
I
21
22
23
24
25
I/O
O
RST
O
VCC
O
supply for card (C1) (decouple with 100 nF)
CMDVCC
I
active LOW start activation sequence input from
microcontroller
RSTIN
OFF
26
27
26
27
25
26
I
card reset input from microcontroller
O
open drain NMOS interrupt output to microcontroller (active
LOW)
MODE
VDDD
28
−
28
−
27
28
29
I
operating mode selection input (HIGH = normal; LOW = sleep)
supply digital supply voltage
supply digital ground 2
DGND2
−
−
1997 Nov 04
5
Philips Semiconductors
Product specification
IC card interface
TDA8002
handbook, halfpage
handbook, halfpage
XTAL1
XTAL2
I/OUC
MODE
28
1
2
XTAL1
XTAL2
MODE
OFF
1
2
28
27
26
25
24
OFF
27
26
25
24
3
RSTIN
CMDVCC
I/OUC
3
RSTIN
CMDVCC
AUX1UC
ALARM
4
AUX1UC
AUX2UC
ALARM
4
V
V
5
5
CC
CC
ALARM
6
23 RST
CLK
23 RST
CLK
6
CLKSEL
CLKDIV1
CLKDIV2
STROBE
CLKOUT
22
7
CLKSEL
CLKDIV1
CLKDIV2
STROBE
CLKOUT
22
7
TDA8002B
TDA8002A
8
21 AUX1
8
21 AUX1
PRES
PRES
I/O
9
20
19
18
17
16
15
PRES
AUX2
I/O
9
20
19
18
17
16
15
10
11
10
11
DGND1 12
AGND
VUP
S1
DGND1 12
AGND
VUP
S1
13
S2 14
13
S2 14
V
V
DDA
DDA
MGE732
MGE731
Fig.2 Pin configuration (TDA8002A).
Fig.3 Pin configuration (TDA8002B).
AUX1UC
AUX2UC
ALARM
CMDVCC
1
2
3
4
5
6
7
8
24
23
V
CC
22 RST
ALARM
21
20
19
18
17
CLK
TDA8002G
CLKSEL
CLKDIV1
CLKDIV2
STROBE
AUX1
PRES
PRES
AUX2
MGE733
Fig.4 Pin configuration (TDA8002G).
6
1997 Nov 04
Philips Semiconductors
Product specification
IC card interface
TDA8002
FUNCTIONAL DESCRIPTION
Power supply
Clock circuitry
The TDA8002 supports both synchronous and
asynchronous cards (I2C-bus memories requiring an
acknowledge signal from the master are not supported).
There are three methods to clock the circuitry:
The supply pins for the chip are VDDA, VDDD, AGND,
DGND1 and DGND2. VDDA and VDDD (i.e. VDD) should be
in the range of 3.0 to 6.5 V. All card contacts remain
inactive during power-up or power-down.
• Apply a clock signal to pin STROBE
• Use of an internal RC oscillator
On power-up, the logic is reset by an internal signal.
The sequencer is not activated until VDD reaches
Vth2 + Vhys2 (see Fig.5). When VDD falls below Vth2, an
automatic deactivation sequence of the contacts is
performed.
• Use of a quartz oscillator which should be connected
between pins XTAL1 and XTAL2.
When CLKSEL is HIGH, the clock should be applied on the
STROBE pin, and when CLKSEL is LOW, one of the
internal oscillators is used.
Supply voltage supervisor (VDD
)
When an internal clock is used, the clock output is
available on pin CLKOUT. The RC oscillator is selected by
making CLKDIV1 HIGH and CLKDIV2 LOW. The clock
output to the card is available on pin CLK. The frequency
of the card clock can be the input frequency divided by
2 or 4, STOP LOW or 1.25 MHz, depending on the states
of CLKDIV1 or CLKDIV2 (see Table 1).
This block surveys the VDD supply. A defined reset pulse
of 10 ms minimum (tW) can be retriggered and is delivered
on the ALARM outputs during power-up or power-down of
VDD (see Fig.5). This signal is also used for eliminating the
spikes on card contacts during power-up or power-down.
When VDD reaches Vth2 + Vhys2, an internal delay is
started. The ALARM outputs are active until this delay has
expired. When VDD falls below Vth2, ALARM is activated
and a deactivation sequence of the contacts is performed.
Do not change CLKSEL during activation. When in
low-power (sleep) mode, the internal oscillator frequency
which is available on pin CLKOUT is lowered to
approximately 16 kHz for power-economy purposes.
For 3 V supply, the supervisor option must be chosen at
3 V. For 5 V supply, both options (3 or 5 V) may be chosen
depending on the application.
V
V
+ V
hys2
th2
th2
V
DD
t
t
W
W
ALARM
ALARM
MGE734
Fig.5 Alarm as a function of VDD (pulse width 10 ms).
1997 Nov 04
7
Philips Semiconductors
Product specification
IC card interface
TDA8002
Table 1 Clock circuitry definition
FREQUENCY
OF CLK
FREQUENCY
OF CLKOUT
MODE
CLKSEL
CLKDIV1
CLKDIV2
HIGH
HIGH
HIGH
HIGH
HIGH
LOW(2)
LOW
LOW
LOW
LOW
HIGH
X(1)
HIGH
LOW
LOW
HIGH
X(1)
LOW
LOW
HIGH
HIGH
X(1)
1⁄2fint
1⁄4fxtal
1⁄2fxtal
1⁄2fint
fxtal
fxtal
fxtal
fxtal
STOP LOW
STROBE
STOP LOW
X(1)
X(1)
1⁄2fint
(3)
Notes
1. X = don’t care.
2. In low-power mode.
3. fint = 32 kHz in low-power mode.
When the input is back to HIGH level, a current booster is
turned on during the delay td on the output side and then
both sides are back to their idle state, ready to detect the
next logic 0 on any side.
I/O circuitry
The three I/O transceivers are identical. The state is HIGH
for all I/O pins (i.e. I/O, I/OUC, AUX1, AUX1UC, AUX2 and
AUX2UC). Pin I/O is referenced to VCC and pin I/OUC to
In case of a conflict, both lines may remain LOW until the
software enables the lines to be HIGH. The anti-latch
circuitry ensures that the lines do not remain LOW if both
sides return HIGH, regardless of the prior conditions.
The maximum frequency on the lines is approximately
1 MHz.
V
DD, thus ensuring proper operation in case VCC ≠ VDD.
The first side on which a falling edge is detected becomes
a master (input). An anti-latch circuitry first disables the
detection of the falling edge on the other side, which
becomes slave (output).
After a delay time td (about 50 ns), the logic 0 present on
the master side is transferred on the slave side.
I/O
I/OUC
t
t
t
d
conflict
idle
d
d
MGD703
Fig.6 Master and slave signals.
1997 Nov 04
8
Philips Semiconductors
Product specification
IC card interface
TDA8002
If pin MODE goes LOW in the active mode, a normal
deactivation sequence is performed before entering
low-power mode. When pin MODE goes HIGH, the circuit
enters normal operation after a delay of at least 6 ms
(96 cycles of CLKOUT). During this time the CLKOUT
remains at 16 kHz.
Logic circuitry
After power-up, the circuit has six possible states of
operation. Table 1 shows the sequence of these states.
IDLE MODE
After reset, the circuit enters the idle mode.
A minimum number of functions in the circuit are active
while waiting for the microcontroller to start a session:
• All card contacts are inactive
• Oscillator XTAL does not run
• The VDD supervisor, ALARM output, card presence
detection and OFF output remain functional
• All card contacts are inactive
• I/OUC, AUX1UC and AUX2UC are high-impedance
• Oscillator XTAL runs, delivering CLKOUT
• Voltage supervisor is active.
• Internal oscillator is slowed to 32 kHz, CLKOUT
providing 16 kHz.
ACTIVE MODE
LOW-POWER (SLEEP) MODE
When the activation sequence is completed, the TDA8002
will be in the active mode. Data is exchanged between the
card and the microcontroller via the I/O lines.
When pin MODE goes LOW, the circuit enters the
low-power (sleep) mode. As long as pin MODE is LOW, no
activation is possible.
State diagram
ACTIVATION
POWER
OFF
IDLE
MODE
ACTIVE
FAULT
MODE
LOW-POWER
MODE
DEACTIVATION
MGE735
Fig.7 State diagram.
1997 Nov 04
9
Philips Semiconductors
Product specification
IC card interface
TDA8002
Figures 8 to 10 illustrate the activation sequence as
ACTIVATION SEQUENCE
described below:
From idle mode, the circuit enters the activation mode
when the microcontroller sets the CMDVCC line LOW or
sets the MODE line HIGH when the CMDVCC line is
already LOW. The internal circuitry is then activated, the
internal clock is activated and an activation sequence is
executed. When RST is enabled, it becomes the inverse of
RSTIN.
1. Step-up converter is started (t1 ≈ t0)
2. VCC rises from 0 to 5 V (t2 = t1 + 11⁄2T)
3. I/O, AUX1, AUX2 are enabled and CLK is enabled
(t3 = t1 + 4T); a special circuitry ensures that I/O
remains below VCC during falling slope of VCC
4. CLK is set by setting RSTIN to HIGH (t4)
5. RST is enabled (t5 = t1 + 7T); after t5, RSTIN has no
further action on CLK, but is only controlling RST.
OSC_INT/64
t
act
T = 25 µs
t
CMDVCC
VUP
0
t
1
t
V
2
CC
t
t
3
5
I/O
CLK
high - Z
t
4
RSTIN
RST
MGE736
Fig.8 Activation sequence using RSTIN and CMDVCC.
1997 Nov 04
10
Philips Semiconductors
Product specification
IC card interface
TDA8002
OSC_INT/64
t
act
CLKDIV1
CLKDIV2
t
CMDVCC
VUP
0
t
1
t
V
2
CC
t
3
I/O
CLK
high - Z
RSTIN
RST
MGE737
Fig.9 Activation sequence using CMDVCC, CLKDIV1 and CLKDIV2 signals to enable CLK.
t
OSC_INT/64
act
PRES, OFF
CMDVCC
V
CC
I/O
RSTIN
high - Z
STROBE
RST
MGE738
Fig.10 Activation sequence for synchronous application.
11
1997 Nov 04
Philips Semiconductors
Product specification
IC card interface
TDA8002
Figures 11 and 12 illustrate the deactivation sequence as
described below:
DEACTIVATION SEQUENCE
When a session is completed, the microcontroller sets the
CMDVCC line to HIGH state or MODE line to LOW state.
The circuit then executes an automatic deactivation
sequence by counting the sequencer down and ends in
idle mode.
1. RST goes LOW (t11 ≈ t10)
2. CLK is stopped (t12 = t11 + 1⁄2T)
3. I/O, AUX1, AUX2 are outputs into high-impedance
state (t13 = t11 + T)
4. VCC falls to zero (t14 = t11 + 11⁄2T); a special circuitry
ensures that I/O remains below VCC during falling
slope of VCC
5. VUP falls (t15 = t11 + 5T).
t
OSC_INT/64
de
t
10
CMDVCC
VUP
t
15
t
14
V
CC
t
13
I/O
CLK
high - Z
t
12
RSTIN
RST
t
11
MGE739
Fig.11 Deactivation sequence.
1997 Nov 04
12
Philips Semiconductors
Product specification
IC card interface
TDA8002
When one or more of these faults are detected, the circuit
pulls the interrupt line OFF to its active LOW state and a
deactivation sequence is initiated. In case the card is
present the interrupt line OFF is set to HIGH when the
microcontroller has reset the CMDVCC line HIGH (after
completion of the deactivation sequence). In case the card
is not present OFF remains LOW.
Fault detection
The following fault conditions are monitored by the circuit:
• Short-circuit or high current on VCC
• Removing card during transaction
• VDD dropping
• Overheating.
t
OSC_INT/64
de
t
OFF
10
PRES
t
14
V
CC
t
13
I/O
CLK
RST
high - Z
t
12
t
11
MGE740
Fig.12 Emergency deactivation sequence.
1997 Nov 04
13
Philips Semiconductors
Product specification
IC card interface
TDA8002
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.3
MAX.
+6.5
UNIT
V
V
Vi(CMOS)
voltage on CMOS pins
XTAL1, XTAL2, ALARM, ALARM,
MODE, RSTIN, CLKSEL, AUX2UC,
AUX1UC, CLKDIV1, CLKDIV2,
CLKOUT, STROBE, CMDVCC and
OFF
−0.3
+6.5
Vi(card)
voltage on card contact pins
I/O, AUX2, PRES, PRES, AUX1,
CLK, RST and VCC
−0.3
−6
+6.5
+6
V
Ves
electrostatic handling
on pins I/O, RST, VCC, CLK, AUX1,
AUX2, PRES and PRES
kV
on all other pins
−2
+2
kV
Tstg
Ptot
storage temperature
continuous total power dissipation
TDA8002T
−55
+125
°C
T
amb = −25 to +85 °C
amb = −25 to +85 °C
−
0.56
0.46
+85
150
W
W
°C
°C
TDA8002G
T
−
Tamb
Tj
operating ambient temperature
junction temperature
−25
−
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
SOT136-1
SOT401-1
70
91
K/W
K/W
1997 Nov 04
14
Philips Semiconductors
Product specification
IC card interface
TDA8002
CHARACTERISTICS
VDD = 5 V; Tamb = 25 °C; fxtal = 10 MHz; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
positive supply voltage
option 5 V power supply
(TDA8002xx/5)
4.5
5
5
6.5
V
V
option 3.3 V or 5 V power
supply (TDA8002xx/3)
3
6.5
IDD(sl)
supply current
supply current
sleep mode; VDD = 5 V
−
−
−
−
200
6
µA
IDD(idle)
idle mode; VDD = 5 V;
fCLK = 2.5 MHz;
mA
fCLKOUT = 10 MHz
IDD(active)
supply current
active mode
V
DD = 5 V;
−
−
−
−
9
mA
mA
fCLK = 2.5 MHz;
fCLKOUT = 10 MHz
V
DD = 3.3 V;
fCLK = 2.5 MHz;
CLKOUT = 10 MHz
falling
12
f
Vth2
threshold voltage on VDD for
voltage supervisor
option 5 V power supply 3.9
(TDA8002xx/5)
4.05
2.7
4.2
2.8
V
V
option 3.3 V or 5 V power 2.6
supply (TDA8002xx/3)
rising
option 5 V power supply
(TDA8002xx/5)
4
4.2
4.4
V
option 3.3 or 5 V power 2.7
supply (TDA8002xx/3)
2.85
150
2.99
200
V
Vhys2
hysteresis on Vth2
output voltage
100
mV
CARD SUPPLY
VCC(O)(idle)
idle mode
−
−
0.4
V
VCC(O)(active) output voltage
active mode
I
CC < 20 mA: DC load
with 3 V < VDD < 3.3 V
CC < 65 mA: DC load
with 3.3 V < VDD < 6.5 V
CC = 40 mA: AC load
VCC(O) = from 0 to 5 V
CC short-circuited to
4.75
4.75
−
−
5.25
5.25
V
V
I
I
4.6
−
−
−
−
5.4
65
V
ICC(O)
output current
slew rate
mA
mA
V
−
100
ground
SR
rising or falling slope
0.12
0.17
0.22
V/µs
1997 Nov 04
15
Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Crystal connections (XTAL1 and XTAL2)
Cext
fxtal
external capacitors
note 1
note 2
−
15
−
pF
resonance frequency
2
−
24
MHz
Data lines
GENERAL
tedge
delay between falling edge of
I/O, AUX1, AUX2 and I/OUC,
AUX1UC, AUX2UC
−
−
200
200
−
−
ns
ns
µs
delay between falling edge of
I/OUC, AUX1UC, AUX2UC and
I/O, AUX1, AUX2
−
tr, tf
rise and fall times
Ci = Co = 30 pF
−
0.5
DATA LINES I/O, AUX1 AND AUX2
VOH(I/O)
HIGH-level output voltage on
data lines
IOH = −20 µA
V
CC − 0.5
−
−
−
VCC + 0.1 V
I
OH = −100 µA
3.5
−
V
VOL(I/O)
VIH(I/O)
VIL(I/O)
VI/O(idle)
Rpu
LOW-level output voltage on
data lines
II/O = 1 mA
−
300
mV
HIGH-level input voltage on data
lines
1.8
0
−
VCC
0.8
0.4
12
V
LOW-level input voltage on data
lines
−
V
voltage on data lines outside a
session
−
−
V
internal pull-up resistance
between data lines and VCC
8
10
1
kΩ
mA
µA
µA
Iedge
current from data lines when
active pull-up is active
−
−
IIL(I/O)
IIH(I/O)
LOW-level input current on data VIL = 0.4 V
lines
−
−
−600
10
HIGH-level input current on data VIH = VCC
lines
−
−
DATA LINES I/OUC, AUX1UC AND AUX2UC
VOH(I/OUC)
VOL(I/OUC)
VIH(I/OUC)
VIL(I/OUC)
ZI/OUC(idle)
HIGH-level output voltage on
data lines
IOH = −20 µA
V
DD − 1
−
−
−
−
−
VDD + 0.2 V
LOW-level output voltage on
data lines
II/OUC = 1 mA
−
300
VDD
0.3VDD
−
mV
HIGH-level input voltage on data
lines
0.7VDD
V
LOW-level input voltage on data
lines
0
V
impedance on data lines outside
a session
10
MΩ
1997 Nov 04
16
Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ALARM, ALARM and OFF when connected (open-drain outputs)
IOH(ALARM)
HIGH-level output current on
pin ALARM
VOH(ALARM) = 5 V
IOL(ALARM) = 2 mA
VOH(OFF) = 5 V
−
−
−
−
−
V
6
−
−
−
−
−
−
−
5
µA
V
VOL(ALARM) LOW-level output voltage on
pin ALARM
0.4
5
IOH(OFF)
HIGH-level output current on
pin OFF
µA
V
VOL(OFF)
IOL(ALARM)
LOW-level output voltage on
pin OFF
I
OL(OFF) = 2 mA
0.4
−5
−
LOW-level output current on
pin ALARM
VOL(ALARM) = 0 V
µA
V
VOH(ALARM) HIGH-level output voltage on
pin ALARM
IOH(ALARM) = −2 mA
DD − 1
tW
ALARM pulse width
20
ms
Clock output (CLKOUT; powered from VDD
)
fCLKOUT
frequency on CLKOUT
0
−
0
V
−
−
20
−
MHz
kHz
V
low power
16
−
VOL
VOH
tr, tf
δ
LOW-level output voltage
HIGH-level output voltage
rise and fall times
IOL = 1 mA
0.5
−
IOH = −1 mA
DD − 0.5
−
V
CL = 15 pF; notes 3 and 5
−
8
ns
duty factor
CL = 15 pF; notes 3 and 5 40
−
60
%
Internal oscillator
fint
frequency of internal oscillator
active mode
sleep mode
2.2
2.7
32
3.2
MHz
kHz
−
−
Card reset output (RST)
VO(inact)
td(RST)
VOL
output voltage
inactive modes
0
−
−
−
−
−
0.3
V
delay between RSTIN and RST RST enabled
−
100
0.3
ns
V
LOW-level output voltage
HIGH-level output voltage
IOL = 200 µA
0
VOH
IOH = −200 µA
4.3
VCC
VCC
V
IOH = −50 µA
V
CC − 0.5
V
Card clock output (CLK)
VO(inact)
output voltage
inactive modes
IOL = 200 µA
0
0
V
−
−
−
−
−
−
−
−
−
0.3
0.3
VCC
8
V
VOL
VOH
tr
LOW-level output voltage
HIGH-level output voltage
rise time
V
IOH = −50 µA
CC − 0.5
V
CL = 30 pF; note 3
CL = 30 pF; note 3
CL = 30 pF; note 3
ns
ns
%
tf
fall time
8
δ
duty factor
45
55
−
SR
slew rate (rise and fall)
0.2
V/ns
1997 Nov 04
17
Philips Semiconductors
Product specification
IC card interface
TDA8002
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Strobe input (STROBE)
fSTROBE
VIL
frequency on STROBE
0
0
−
−
−
20
MHz
V
LOW-level input voltage
HIGH-level input voltage
0.3VDD
VDD
VIH
0.7VDD
V
Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 4
VIL
VIH
LOW-level input voltage
HIGH-level input voltage
0
−
−
0.8
V
V
1.8
VDD
Logic inputs (PRES, PRES); note 4
VIL
LOW-level input voltage
HIGH-level input voltage
0
−
−
−
0.3VDD
VDD
V
VIH
0.7VDD
V
IIL(PRES)
LOW-level input current on
pin PRES
VOL = 0 V
−
−10
µA
IIH(PRES)
HIGH-level input current on
pin PRES
−
−
10
µA
Protections
Tsd
shut-down local temperature
shut-down current at VCC
−
−
135
−
°C
ICC(sd)
−
90
mA
Timing
tact
activation sequence duration
see Fig.9; guaranteed by
design
−
180
70
−
220
90
µs
µs
µs
µs
tde
t3
deactivation sequence duration see Fig.11; guaranteed by 50
design
start of the window for sending
CLK to the card
see Figs 8 and 9
−
130
−
t5
end of the window for sending
CLK to the card
see Fig.8
150
−
Notes
1. It may be necessary to put capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or
resonator.
2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH.
t1
3. The transition time and duty cycle definitions are shown in Fig.13; δ =
--------------
t1 + t2
4. PRES and CMDVCC are active LOW; RSTIN and PRES are active HIGH.
5. CLKOUT transition time and duty cycle do not need to be tested.
1997 Nov 04
18
Philips Semiconductors
Product specification
IC card interface
TDA8002
t
t
f
r
V
90%
90%
OH
1/2 V
CC
10%
10%
V
OL
t
t
1
2
MGE741
Fig.13 Definition of transition times.
1997 Nov 04
19
Philips Semiconductors
Product specification
IC card interface
TDA8002
APPLICATION INFORMATION
33 pF
33 pF
f = 14.75 MHz
+5 V
V
P1-0
P1-1
P1-2
P1-3
P1-4
P1-5
P1-6
P1-7
RST
CC
P0-0
P0-1
P0-2
P0-3
P0-4
P0-5
P0-6
P0-7
EA
MODE
OFF
XTAL1
1
2
3
4
5
6
28
27
XTAL2
RSTIN
I/OUC
26
25
24
23
CARD READ LM01
CMDVCC
AUX1UC
AUX2UC
ALARM
CLKSEL
CLKDIV1
CLKDIV2
STROBE
CLKOUT
DGND1
AGND
V
CC
C5I
C6I
C1I
C2I
RST
CLK
P3-0
P3-1
P3-2
P3-3
P3-4
P3-5
P3-6
P3-7
XTAL2
XTAL1
80C51
22
21
20
19
18
17
16
15
C7I
C8I
C3I
C4I
7
ALE
TDA8002A
AUX1
PRES
AUX2
I/O
8
9
PSEN
P2-7
P2-6
P2-5
P2-4
P2-3
P2-2
P2-1
P2-0
10
11
12
13
14
VUP
S1
K1
K2
V
S2
DDA
100
nF
V
SS
10
µF
100
nF
100
nF
100
nF
MGE742
Fig.14 Application diagram (for more details, consult “Application Note AN96096”).
20
1997 Nov 04
Philips Semiconductors
Product specification
IC card interface
TDA8002
PACKAGE OUTLINES
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
H
v
M
A
E
Z
28
15
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
14
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.71
0.014 0.009 0.69
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT136-1
075E06
MS-013AE
1997 Nov 04
21
Philips Semiconductors
Product specification
IC card interface
TDA8002
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
SOT401-1
c
y
X
A
E
17
24
Z
16
25
E
e
A
H
2
E
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
32
9
L
1
8
detail X
Z
v M
D
A
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.15 1.5
0.05 1.3
0.27 0.18 5.1
0.17 0.12 4.9
5.1
4.9
7.15 7.15
6.85 6.85
0.75
0.45
0.95 0.95
0.55 0.55
mm
1.60
0.25
0.5
1.0
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
97-08-04
SOT401-1
1997 Nov 04
22
Philips Semiconductors
Product specification
IC card interface
TDA8002
If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
SO
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
Reflow soldering
Reflow soldering techniques are suitable for all LQFP and
SO packages.
• The longitudinal axis of the package footprint must be
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
METHOD (LQFP AND SO)
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Wave soldering
LQFP
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
CAUTION
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.
1997 Nov 04
23
Philips Semiconductors
Product specification
IC card interface
TDA8002
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Nov 04
24
Philips Semiconductors
Product specification
IC card interface
TDA8002
NOTES
1997 Nov 04
25
Philips Semiconductors
Product specification
IC card interface
TDA8002
NOTES
1997 Nov 04
26
Philips Semiconductors
Product specification
IC card interface
TDA8002
NOTES
1997 Nov 04
27
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Vietnam: see Singapore
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/03/pp28
Date of release: 1997 Nov 04
Document order number: 9397 750 02454
相关型号：
TDA8002C/AD-T
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other
NXP
TDA8002C/BD
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other
NXP
TDA8002C/CD
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other
NXP
TDA8002C/CD-T
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, 7.50 MM, PLASTIC, SO-28, Microprocessor IC:Other
NXP
TDA8002CGB-T
IC SPECIALTY MICROPROCESSOR CIRCUIT, PQFP32, 5 X 5 X 1.40 MM, PLASTIC, LQFP-32, Microprocessor IC:Other
NXP
©2020 ICPDF网 联系我们和版权申明