TDA1301T [NXP]

Digital servo processor DSIC2; 数字伺服处理器DSIC2
TDA1301T
型号: TDA1301T
厂家: NXP    NXP
描述:

Digital servo processor DSIC2
数字伺服处理器DSIC2

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中文:  中文翻译
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Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
– 28-pin SO package  
FEATURES  
– Great flexibility towards different CD mechanisms  
– Full and transparent application information  
High robustness/shock insensitivity  
– Sophisticated track-loss (TL) detection mechanism  
– Fast focus restart procedure  
The DSIC2 realizes the following servo functions:  
Diode signal preprocessing  
Focus servo loop  
Radial servo loop  
Sledge motor servo loop  
– Extended radial error signal  
Three-line serial interface via the microcontroller  
– Adjustable radial shock detector  
The other features include:  
– Defect drop-out detector  
Full digital signal processing  
Low power consumption, down to 30 mW  
Low voltage supply 3 to 5.5 V  
Fully automatic jump procedure for radial servo  
Automatic focus start-up procedure and built-in FOK  
(Focus OK)  
Integrated analog-to-digital converters and digital servo  
loop filters  
Fast radial jump or access procedure  
Self-operational servo-control without continuous  
communication via the microcontroller  
Double speed possible  
Easy application  
Direct communication to photodiode optics; no external  
preprocessing.  
– Single supply voltage  
– Small number of external components; only  
6 decoupling capacitors  
GENERAL DESCRIPTION  
– Flexible system oscillator circuitry  
The TDA1301T is a fully digital servo processor which has  
been designed to provide all servo functions, except the  
spindle motor control, in two-stage three-spot compact  
disc systems. The device offers a high degree of  
integration, combined with the low additional cost of  
external components. The servo characteristics have a  
wide range of adjustment via a three-line serial interface.  
This offers an enormous flexibility with respect to  
applications for different CD mechanisms. The circuit is  
optimized for low-power low-voltage applications.  
– Usable for single/double Foucault and astigmatic  
focus  
– Full automatic radial error signal initialization offset  
control and level initialization for track position  
indicator  
– No external adjustments required; no component  
ageing  
– Wide range of adjustable servo characteristics  
– Simple 3-line serial command interface  
QUICK REFERENCE DATA  
SYMBOL  
VDDD  
PARAMETER  
digital supply voltage  
CONDITIONS  
MIN.  
3.0  
TYP.  
MAX.  
5.5  
UNIT  
5
5
V
VDDA  
IDDD  
IDDA  
IDDD(q)  
Ii(cd)  
analog supply voltage  
3.0  
5.5  
V
digital supply current  
mA  
mA  
µA  
µA  
µA  
mW  
°C  
analog supply current  
digital quiescent supply current  
central diode input currents (D1 to D4)  
10  
15.8  
7.9  
note 1  
Ii(sd)  
satellite diode input currents (R1 and R2) note 1  
total power dissipation  
Ptot  
50  
Tamb  
operating ambient temperature  
40  
+85  
Note  
1.  
fsys = 4.2336 MHz; VRL = 0 V; VRH = 2.5 V (externally applied).  
March 1994  
2
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
ORDERING INFORMATION  
EXTENDED TYPE  
PACKAGE  
PIN POSITION  
NUMBER  
PINS  
MATERIAL  
CODE  
TDA1301T  
28  
SO28L  
plastic  
SOT136A  
BLOCK DIAGRAM  
Fig.1 Block diagram.  
March 1994  
3
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
PINNING  
SYMBOL PIN  
DESCRIPTION  
RST  
LDON  
VSSA  
VRH  
1
2
3
4
reset input (active LOW)  
laser drive on output  
analog ground  
reference input for reference voltage  
generator  
D1  
D2  
D3  
5
6
7
unipolar current input  
(central diode signal input)  
unipolar current input  
(central diode signal input)  
unipolar current input  
(central diode signal input)  
VRL  
D4  
8
9
reference input for ADC  
unipolar current input  
(central diode signal input)  
R1  
R2  
10  
11  
unipolar current input  
(satellite diode signal input)  
unipolar current input  
(satellite diode signal input)  
VDDA  
XTALref  
TEST1  
TEST2  
OTD  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
analog supply voltage  
oscillator reference input  
test input 1  
test input 2  
off-track detector output  
clock output  
CLKO  
XTALO  
XTALI  
VDDD1  
VSSD  
RA  
oscillator output  
oscillator input  
digital power supply 1  
digital ground  
radial actuator output  
focus actuator output  
sledge output  
FO  
SL  
SILD  
SICL  
SIDA  
VDDD2  
serial interface load input  
serial interface clock input  
serial interface data input/output  
digital power supply 2  
Fig.2 Pin configuration.  
March 1994  
4
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
Ii (max) = fsys × (VRH VRL) × 1.5 × 106 [µA]  
(1)  
FUNCTIONAL DESCRIPTION  
Three spots front-end  
The maximum current for the satellite signals is given in  
The photo detector in a two-stage three-spots compact  
disc system normally contains six discrete elements. Four  
of these elements (in the event of single Foucault: three  
elements) carry the central aperture (CA) signal while the  
other two elements (satellite signals) carry the radial  
tracking information. Besides the HF signal, which is finally  
applied to both of the audio channels, the central aperture  
also contains information for the focus servo loop. To  
enable the HF signal to be processed, the frequency  
contents of the central aperture signal must be divided into  
an HF data part and an LF servo part. The HF signal is  
processed outside the DSIC2 by the TDA1302 or a  
discrete amplifier-equalizer. The necessary crossover  
point, to extract the LF servo part, is compensated for in  
the amplifier.  
equation (2).  
Ii (max) = fsys × (VRH VRL) × 0.75 × 106 [µA]  
(2)  
VRH is generated internally. There are four different levels  
(1.0, 1.5, 2.0 and 2.5 V) which can be selected under  
software control. In the application VRL is connected to  
VSSA. It is also possible to drive VRH with an external  
voltage source but in this situation the internal voltage  
source has to be switched off (software controlled).  
Signal conditioning  
The digital codes retrieved from the ADCs are applied to  
logic circuitry to obtain the various control signals. The  
signals from the central aperture detectors are processed  
so that the normalized focus error signal (FE) given in  
equation (3) is realized:  
Diode signal processing  
The analog signals from the photo detectors are converted  
into a digital representation using analog-to-digital  
converters. The ADCs are designed to convert unipolar  
currents into a digital code. The dynamic range of the input  
currents is adjustable within a given range and is  
dependent on the ADC input reference voltages VRL and  
VRH. The maximum current for the central diodes signals  
is given in equation (1).  
D1 D2 D3 D4  
D1 + D2 D3 + D4  
FEn  
=
(3)  
---------------------- ----------------------  
Where the detector set-up is assumed to be as illustrated  
in Fig.3.  
Fig.3 Diode configuration.  
March 1994  
5
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
In the event of single Foucault focusing method, the DSIC2  
signal conditioning can be switched under software control  
so that the signal processing conforms to that given in  
equation (4).  
reached, the FOK signal becomes true. If the FOK signal  
is true when the level on the FEn signal is reached the  
focus PID is enabled and switches on when the next zero  
crossing is detected in the FEn signal.  
D1 D2  
FOCUS POSITION CONTROL LOOP  
FEn = 2 × ----------------------  
D1 + D2  
(4)  
The focus control loop contains a digital PID controller  
which has 5 parameters available to the user. These  
coefficients influence the integrating (foc_int), proportional  
(foc_prop) and differentiating (foc_pole_lead) action of this  
PID and the digital low-pass filter (foc_pole_noise) which  
follows the PID. The fifth coefficient (foc_gain) influences  
the loop gain.  
The FEn thus obtained is further processed by a  
proportional integral and differential filter section (PID).  
A focus OK flag (FOK) is generated by means of the  
central aperture signal and an adjustable reference level.  
This signal is used to provide extra protection for the  
Track-Loss (TL) generation, the focus start-up procedure  
and the drop-out detection. The radial or tracking error  
signal is generated by the satellite detector signals R1 and  
R2. The radial error signal (RE) can be formulated as per  
equation (5).  
DROP-OUT DETECTION  
This detector can be influenced by one parameter  
(CA_drop). The FOK signal will become false and the  
integrator of the PID will hold if the CA signal drops below  
the programmed absolute CA level. When the FOK signal  
becomes false it is assumed, initially, to be caused by a  
black dot.  
(5)  
REs = (R1 R2) × RE_gain  
(R1 + R2) × RE_offset  
+
Where the index ‘s’ indicates the automatic scaling  
operation which is performed on the radial error signal.  
FOCUS LOSS DETECTION AND FAST RESTART  
This scaling is necessary to avoid non-optimum dynamic  
range usage in the digital representation and, also, to  
reduce radial bandwidth spread. The radial error signal will  
also be released from offset during disc start-up. The four  
signals from the central aperture detectors, together with  
the satellite detector signals, generate a track position  
signal (TPI) which can be formulated as per equation (6).  
Whenever FOK is false for longer than approximately  
3 ms, it is assumed that the focus point is lost. A fast  
restart procedure is initiated which is capable of restarting  
the focus loop within 200 to 300 ms depending on the  
programmed coefficients set by the microcontroller.  
FOCUS LOOP GAIN SWITCHING  
TPI = sin [ (D1 + D2 + D3 + D4)  
(6)  
The gain of the focus control loop (foc_gain) can be  
multiplied by a factor of 2 or divided by a factor of 2 during  
normal operation. The integrator value of the PID is  
corrected accordingly. The differentiating (foc_pole_lead)  
action of the PID can be switched at the same time as the  
gain switching is performed.  
]
(R1 + R2) × Sum_gain  
Where the weighting factor Sum_gain is generated  
internally in the DSIC2 during initialization.  
Focus control  
The following focus servo functions are incorporated in the  
DSIC2 digital controller.  
Radial control  
The following radial servo functions are incorporated in  
the DSIC2 digital controller.  
FOCUS START-UP  
Five initially loaded coefficients influence the start-up  
behaviour of the focus controller. The automatically  
generated triangular voltage can be influenced by  
3 parameters, for the height (ramp_heigth) and DC-offset  
(ramp_offset) of the triangle and its steepness (ramp_inc).  
To protect against false focus point detections two  
parameters are available. One is an absolute level on the  
CA signal (CA_start) and the other is an absolute level on  
the FEn signal (FE_start). When the CA_start level is  
LEVEL INITIALIZATION  
During start-up an automatic adjustment procedure is  
activated to set the values of the radial error gain  
(RE_gain), offset (RE_offset) and satellite sum signal gain  
(Sum_gain) for TPI level generation. The initialization  
procedure runs in a radial open-loop situation and is  
300 ms. This start-up time period may coincide with the  
last part of the turn table motor start-up time period.  
March 1994  
6
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
Automatic gain adjustment: as a result of this initialization  
the amplitude of the RE signal is adjusted within 10%  
around the nominal RE amplitude.  
The sledge is then continuously controlled using the  
filtered value of the integrator contents of the actuator.  
All filter parameters (for actuator and sledge) are user  
programmable.  
In the sledge jump mode, maximum power (user  
programmable) is applied to the sledge in the correct  
direction, while the actuator becomes Idle (the contents of  
the actuator integrator leaks to zero just after the sledge  
jump mode is initiated).  
Offset adjustment: the additional offset in RE due to  
the limited accuracy of the start-up procedure is less  
than 50 nm.  
TPI level generation: the accuracy of the initialization  
procedure is such that the duty cycle range of TPI  
becomes 0.4 < δ < 0.6 {δ = TPI(HIGH)/TPI(period)}.  
Table 1 Access procedure.  
SLEDGE HOME  
ACCESS  
JUMP SIZE  
ACCESS SPEED  
Sledge moves to reference position (end_stop_switch) at  
the inner side of the disc with user defined voltage.  
TYPE  
Actuator 1 break distance (1) decreasing velocity  
jump  
TRACKING CONTROL  
Sledge  
jump  
break (1) 32768  
minimum power to  
sledge (1)  
The actuator is controlled using a PID loop-filter with user  
defined coefficients and gain. For stable operation  
between the tracks, the S-curve is extended over 34 track.  
Upon request from the microcontroller S-curve extension  
over 2 tracks is used, automatically changing to access  
control when these two tracks are exceeded.  
Note  
1. Can be preset by the microcontroller.  
Defect detector  
Both modes of S-curve extension make use of a  
track-count mechanism as described in Section “Off-track  
counting” . In this mode track counting results in automatic  
‘return-to-zero track’, to avoid major music rhythm  
disturbances in the audio output to provide improved  
shock resistance. The sledge is continuously controlled  
using the filtered value of the integrator contents of the  
actuator, or upon request by the microcontroller. The  
microcontroller can read out this integrator value and  
provides the sledge with step pulses to reduce power  
consumption. Filter coefficients of the continuous sledge  
control can be preset by the user.  
A built-in defect detector prevents the light spot from going  
out-of-focus and going off-track due to disc drop-out  
excitations. The defect detector can be switched ON or  
OFF under software control and can be applied to the  
focus control only, or to both the focus and radial control.  
The detected defect signal holds the focus and radial loop  
filter outputs. The hold signal is generated whenever the  
reflected light intensity drops rapidly (<1.5 ms) down to  
75% of the actual intensity level.  
Shock detector  
The shock detector can be switched ON during normal  
track following. The shock detector detects, within an  
adjustable frequency band, whether the disturbances in  
the radial spot position relative to the track exceeds an  
adjustable level. Every time the radial tracking error (RE)  
exceeds this level the radial control bandwidth is switched  
directly to twice the original bandwidth.  
The shock detection level is adjustable in 64 steps from  
0 to 100% of the nominal radial amplitude. The bandpass  
filter (BPF) lower frequency (3 dB) can be fixed at 0 or  
20 Hz. Independently, the BPF upper frequency (3 dB)  
can be fixed at 750 or 1850 Hz.  
ACCESS  
The access procedure is divided into 2 different modes,  
depending on the requested jump size.  
The access procedure makes use of a track counting  
mechanism (see Section “Off-track counting” ), a velocity  
signal based upon the number of tracks passed within a  
fixed time interval, a velocity setpoint calculated from the  
number of tracks to go and a user programmable  
parameter indicating the maximum sledge performance.  
If the number of tracks to go is greater than break_dist the  
sledge jump mode will be activated (otherwise the actuator  
jump will be performed). The requested jump size together  
with the required sledge braking distance at maximum  
access speed defines the value break_dist.  
Off-track counting  
TPI is a flag which is used to indicate whether the spot is  
positioned on the track (with a margin of 14 of the  
track-pitch).  
During the actuator jump mode, velocity control with a PI  
controller is used for the actuator.  
March 1994  
7
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
In combination with the radial polarity flag (RP) the relative  
spot-position over the tracks can be determined. These  
signals are, however, affected with some uncertainties  
caused by:  
Serial clock line (SICL  
Serial data line (SIDA)  
Serial control line (SILD).  
The SICL line is controlled by a microcontroller and can be  
completely asynchronous from the oscillator frequency of  
the DSIC2. The SILD line is used for read/write control and  
end-of-byte signalling.  
The communication is bi-directional and processes 8-bit  
words (1 byte, MSB first). The data present on the SIDA  
line is clocked on the positive edge of SICL. One  
information exchange consists of one command byte and  
up to 7 data bytes.  
Disc defects such as scratches and fingerprints.  
The HF information on the disc, which is considered as  
noise by the detector signals.  
In order to determine the spot position with sufficient  
accuracy, extra conditions are necessary to generate a TL  
signal as well as an off-track counter value. These extra  
conditions influence the maximum speed and this implies  
that, internally, one of the three following counting states is  
selected. These states are:  
The first byte defines the command, and is always input to  
the DSIC2. This byte defines if data has to be written to or  
read from the DSIC2. If data has to be written to the DSIC2  
this byte also specifies the number of data bytes. The  
number of bytes read from the DSIC2 can vary from 0 up  
to 5 and only depends on how many the microprocessor  
requires to read. Further information concerning the serial  
protocol is available upon request.  
1. Protected state: used in normal play situations.  
A good detection caused by disc defects is important  
in this state.  
2. Slow counting state: used in low velocity track jump  
situations.  
In this state a fast response is important rather than  
the protection against disc defects (if the phase  
relationship between TL and RP of a 12π rad is affected  
too much, the direction cannot be determined  
accurately any more).  
Clock generation  
The DSIC2 operates with an internal clock frequency of  
approximately 4 MHz. The circuit that generates the clock  
has three modes: the oscillator frequency divided by 2, 3  
or 4 (software controlled). It is therefore possible to  
connect a crystal or a resonator with a frequency of  
8.4672, 11.2896 or 16.9344 MHz. These frequencies are  
derived from today’s frequently used decoder IC  
3. Fast counting state: used in high velocity track jump  
situations.  
Highest obtainable velocity is the most important  
feature in this state.  
Off-track detection  
frequencies. It is also possible to drive the clock circuit with  
an external clock signal. The clock buffer output (CLKO)  
can supply the system clock or twice the system clock  
(also switchable under software control via the serial bus)  
to be used as a clock generator for other ICs. The oscillator  
circuit is optimized for low power dissipation. To guarantee  
optimum performance with a quartz crystal or a resonator  
the gain of the oscillator can be adjusted by an external  
resistor connected to the XTALref input.  
During active radial tracking, off-track detection is realized  
by continuously monitoring the off-track counter value. The  
off-track flag (OTD) becomes valid whenever the off-track  
counter value is not equal to zero. Depending on the type  
of extended S-curve the off-track counter will be reset after  
34 extend or at the original track in the 214 track extend  
mode.  
Output stages  
The control signals for the different actuators are 1-bit  
noise shaped digital outputs at 1.0584 MHz. An analog  
representation of the output signals can be achieved by  
connecting a first-order low-pass filter to the outputs.  
When the RST pin is held LOW, the focus, radial and  
sledge output stages are 3-state.  
Reset  
The reset is controlled by means of the RST pin (active  
LOW). This circuit ensures proper initialization of the  
digital circuit and the output stages.  
Laser drive on  
Serial interface  
The LDON pin is used to switch the laser drive OFF and  
ON. It is an open-drain output. When the laser is ON, the  
output has a high impedance.  
To control the DSIC2 operation, a serial interface is  
implemented which allows communication with a  
microcontroller via a 3-line serial bus consisting of:  
March 1994  
8
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VDDD  
PARAMETER  
MIN.  
MAX.  
UNIT  
digital supply voltage  
analog supply voltage  
0
0
6.5  
V
VDDA  
VSS  
Pmax  
Tstg  
6.5  
V
difference in ground supply voltage between VSSA and VSSD 5.0  
+5.0  
100  
+150  
+85  
mV  
maximum power dissipation  
storage temperature  
mW  
°C  
65  
40  
Tamb  
operating ambient temperature  
°C  
HANDLING  
Classification A: human body model; C = 100 pF; R = 1500 Ω; V 2000 V.  
Charge device model: C = 200 pF; R = 0 ; V 250 V.  
Pulse widths in accordance with “UZW-BO/FQ-A302 and B302” are applicable and can be found in the “Quality reference  
pocket-book” (ordering number 9398 510 34011).  
THERMAL RESISTANCE  
SYMBOL  
PARAMETER  
THERMAL RESISTANCE  
Rth j-a  
from junction to ambient in free air  
80 K/W  
March 1994  
9
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
CHARACTERISTICS  
VDDD = VDDA = 5 V; VSSA = VSSD = 0 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VDDD  
VDDA  
IDDD  
digital supply voltage  
analog supply voltage  
digital supply current  
analog supply current  
quiescent current  
3.0  
5
5
5.5  
V
V
3.0  
5.5  
mA  
mA  
µA  
°C  
IDDA  
IDDD(q)  
Ptot  
60  
+85  
total power dissipation  
40  
Analog part  
Ii(cd)max  
maximum input current for  
central diode input signal  
note 1  
note 1  
15.8  
7.9  
µA  
µA  
Ii(sd)max  
VRH  
maximum input current for  
satellite diode input signal  
HIGH level reference voltage note 2  
output stage 1  
0.9  
1.0  
1.5  
2.0  
2.5  
55  
1.1  
1.65  
2.2  
2.75  
V
output stage 2  
1.35  
1.8  
V
output stage 3  
V
output stage 4  
2.25  
45  
V
PSRR  
power supply ripple rejection note 3  
at pin 4  
dB  
VRH  
VRL  
HIGH level reference voltage input state; note 4  
LOW level reference voltage  
0.5  
0
V
DDA 0.5  
V
V
DDA 1.5  
V
(THD+N)/S total harmonic distortion plus at 0 dB; note 5  
signal-to-noise ratio  
50  
45  
dB  
S/N  
signal-to-noise ratio  
55  
45  
dB  
dB  
PSRR  
power supply ripple rejection note 3  
at pin 12  
Gtol  
gain tolerance  
note 6  
10  
+15  
2
%
%
G  
variation of gain between  
channels  
αcs  
channel separation  
60  
dB  
Digital part  
INPUTS: TEST1, TEST2, SICL AND SILD  
VIL  
VIH  
ILI  
LOW level input voltage  
HIGH level input voltage  
input leakage current  
Tamb = 40 to +85 °C  
Tamb = 40 to +85 °C  
0.3VDDD  
V
0.75VDDD  
V
10  
µA  
INPUT: NRST  
VIL  
VIH  
ILI  
LOW level input voltage  
HIGH level input voltage  
input leakage current  
Tamb = 40 to +85 °C  
Tamb = 40 to +85 °C  
0.2VDDD  
V
0.8VDDD  
V
10  
µA  
March 1994  
10  
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
OUTPUTS: CLKO AND OTD  
IOL  
IOH  
tr  
LOW level output current  
VOL = 0.4 V  
1.6  
mA  
HIGH level output current  
rise time  
VOH = VDDD 0.4 V  
note 7  
1.3  
mA  
ns  
44  
40  
tf  
fall time  
note 7  
ns  
OUTPUT: LDON  
IOL LOW level output current  
IOZ  
VOL = 0.4 V  
3.3  
mA  
3-state output leakage current Tamb = 40 to +85 °C;  
1.5  
µA  
VO = VSSD/VDDD  
tr  
tf  
rise time, LOW to 3-state  
fall time, 3-state to LOW  
CL = 50 pF  
CL = 50 pF  
37  
20  
ns  
ns  
OUTPUTS; RA, FO AND SL  
IOL  
IOH  
IOZ  
LOW level output current  
HIGH level output current  
VOL = 0.4 V  
3.3  
1.8  
mA  
mA  
µA  
VOH = VDDD 0.4 V  
3-state output leakage current Tamb = 40 to +85 °C;  
1.5  
VO = VSSD/VDDD  
tr  
tf  
rise time  
fall time  
note 7  
note 7  
37  
20  
ns  
ns  
INPUT/OUTPUT: SIDA  
VIL  
VIH  
IOL  
IOH  
LOW level input voltage  
HIGH level input voltage  
Tamb = 40 to +85 °C  
Tamb = 40 to +85 °C  
0.3VDDD  
V
0.75VDDD  
3.3  
V
LOW level output sink current VOL = 0.4 V  
mA  
mA  
HIGH level output source  
current  
VOH = VDDD 0.4 V  
1.8  
IOZ  
3-state output leakage current Tamb = 40 to +85 °C;  
1.5  
µA  
VO = VSSD or VDDD  
tr  
tf  
rise time  
fall time  
note 7  
note 7  
37  
20  
ns  
ns  
OSCILLATOR  
fosc  
Ci  
oscillator frequency  
input capacitance  
8
17  
4
MHz  
pF  
Co  
output capacitance  
feedback capacitance  
4
pF  
Cfb  
Rxtal  
3
pF  
external oscillator reference  
resistor  
note 8  
note 9  
25  
100  
kΩ  
Rext  
external reference resistor  
10  
kΩ  
V19(p-p)  
minimum input clock voltage AC-coupled;  
500  
mV  
level from external oscillator  
(peak-to-peak value)  
Rext = 10 kΩ;  
Rbias = 1 Mconnected  
between pins 18 and 19  
March 1994  
11  
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Slave clock mode: XTALI  
VIL  
VIH  
tH  
LOW level input voltage  
0.5  
V
V
HIGH level input voltage  
HIGH level input time  
2.0  
45  
relative to the clock  
period  
55  
%
Notes  
1. fsys = 4.2336 MHz; VRL = 0 V; VRH = 2.5 V (externally applied).  
2. Internal reference source with 4 different output voltages. Selection is achieved via the serial interface. The given  
values are for an unloaded reference voltage.  
3. fripple = 1 kHz; Vripple = 0.5 V (p-p).  
4. Internal reference is switched OFF by serial interface. VRH is the reference input.  
5. Externally applied VRH = 2.5 V and VRL = 0 V, measuring bandwidth: 200 Hz to 20 kHz, fi(ADC) = 1 kHz.  
6. The gain of the ADC is defined as: GADC = fsys/Imax (counts/mA). Thus the digital output is II × GADC where: digital  
output is the number of pulses at the digital output in counts per second and II is the DC input current in mA.  
The maximum input current depends on the system frequency (fsys) and on Vref = VRH VRL  
For D1 to D4: Ii(max) = 1.5 × fsys × Vref × 106/Ri × fsys [µA].  
For R1 and R2: Ii(max) = 0.75 × fsys × Vref × 106/Ri × fsys [µA].  
The gain tolerance is the deviation from the calculated gain regarding note 1.  
7. At 10 to 90% levels with CL = 50 pF.  
8. A resistor must be connected to set the gain of the oscillator circuit. The value of the resistor depends on the crystal  
or resonator connected to the oscillator circuit (see also Chapter “Application information” ).  
9. When the TDA1301T is supplied by an external oscillator frequency, no crystal or resonator is required while the  
external reference resistor has different limits.  
March 1994  
12  
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
APPLICATION INFORMATION  
March 1994  
13  
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
PACKAGE OUTLINE  
18.1  
17.7  
7.6  
7.4  
A
10.65  
10.00  
0.1 S  
S
0.9  
0.4  
(4x)  
28  
15  
1.1  
1.0  
2.45  
2.25  
2.65  
0.3  
0.1  
0.32  
2.35  
0.23  
pin 1  
index  
1.1  
0.5  
o
0 to 8  
1
14  
detail A  
MBC236 - 1  
0.49  
0.36  
0.25  
M
1.27  
(28x)  
Dimensions in mm.  
Fig.5 28-lead small-outline; plastic (SO28L, SOT136A).  
March 1994  
14  
Philips Semiconductors  
Product specification  
Digital servo processor (DSIC2)  
TDA1301T  
Several techniques exist for reflowing; for example,  
SOLDERING  
thermal conduction by heated belt, infrared, and  
vapour-phase reflow. Dwell times vary between 50 and  
300 s according to method. Typical reflow temperatures  
range from 215 to 250 °C.  
Plastic small-outline packages  
BY WAVE  
During placement and before soldering, the component  
must be fixed with a droplet of adhesive. After curing the  
adhesive, the component can be soldered. The adhesive  
can be applied by screen printing, pin transfer or syringe  
dispensing.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 min at 45 °C.  
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING  
IRON OR PULSE-HEATED SOLDER TOOL)  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder bath is  
10 s, if allowed to cool to less than 150 °C within 6 s.  
Typical dwell time is 4 s at 250 °C.  
Fix the component by first soldering two, diagonally  
opposite, end pins. Apply the heating tool to the flat part of  
the pin only. Contact time must be limited to 10 s at up to  
300 °C. When using proper tools, all other pins can be  
soldered in one operation within 2 to 5 s at between  
270 and 320 °C. (Pulse-heated soldering is not  
recommended for SO packages.)  
A modified wave soldering technique is recommended  
using two solder waves (dual-wave), in which a turbulent  
wave with high upward pressure is followed by a smooth  
laminar wave. Using a mildly-activated flux eliminates the  
need for removal of corrosive residues in most  
applications.  
For pulse-heated solder tool (resistance) soldering of VSO  
packages, solder is applied to the substrate by dipping or  
by an extra thick tin/lead plating before package  
placement.  
BY SOLDER PASTE REFLOW  
Reflow soldering requires the solder paste (a suspension  
of fine solder particles, flux and binding agent) to be  
applied to the substrate by screen printing, stencilling or  
pressure-syringe dispensing before device placement.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
March 1994  
15  

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