SC16C2550BIA44-T [NXP]

5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs - Channel: 2 ; Data transfer rate: 3 Mb/s; F<sub>max</sub>: 48 MHz; Features: 16 Bytes FIFO / DMA mode / HW &amp; SW Flow Control ; Function: UART ; Operating temperature: -40 +85 Cel; Other features: 4-level receive trigger level, ; Supply voltage: 2.5~5.0 V;
SC16C2550BIA44-T
型号: SC16C2550BIA44-T
厂家: NXP    NXP
描述:

5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs - Channel: 2 ; Data transfer rate: 3 Mb/s; F<sub>max</sub>: 48 MHz; Features: 16 Bytes FIFO / DMA mode / HW &amp; SW Flow Control ; Function: UART ; Operating temperature: -40 +85 Cel; Other features: 4-level receive trigger level, ; Supply voltage: 2.5~5.0 V

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SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with  
16-byte FIFOs  
Rev. 02 — 14 December 2004  
Product data  
1. Description  
The SC16C2550B is a two channel Universal Asynchronous Receiver and  
Transmitter (UART) used for serial data communications. Its principal function is to  
convert parallel data into serial data and vice versa. The UART can handle serial data  
rates up to 5 Mbit/s.  
The SC16C2550B is pin compatible with the ST16C2550. It will power-up to be  
functionally equivalent to the 16C2450. The SC16C2550B provides enhanced UART  
functions with 16-byte FIFOs, modem control interface, DMA mode data transfer. The  
DMA mode data transfer is controlled by the FIFO trigger levels and the TXRDY and  
RXRDY signals. On-board status registers provide the user with error indications and  
operational status. System interrupts and modem control features may be tailored by  
software to meet specific user requirements. An internal loop-back capability allows  
on-board diagnostics. Independent programmable baud rate generators are provided  
to select transmit and receive baud rates.  
The SC16C2550B operates at 5 V, 3.3 V and 2.5 V and the Industrial temperature  
range, and is available in plastic PLCC44, LQFP48 and DIP40 packages.  
2. Features  
2 channel UART  
5 V, 3.3 V and 2.5 V operation  
Industrial temperature range  
Pin and functionally compatible to 16C2450 and software compatible with  
INS8250, SC16C550  
Up to 5 Mbit/s data rate at 5 V and 3.3 V, and 3 Mbit/s at 2.5 V  
16 byte transmit FIFO to reduce the bandwidth requirement of the external CPU  
16 byte receive FIFO with error flags to reduce the bandwidth requirement of the  
external CPU  
Independent transmit and receive UART control  
Four selectable Receive FIFO interrupt trigger levels  
Software selectable Baud Rate Generator  
Standard asynchronous error and framing bits (Start, Stop, and Parity Overrun  
Break)  
Transmit, Receive, Line Status, and Data Set interrupts independently controlled  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
Fully programmable character formatting:  
5, 6, 7, or 8-bit characters  
Even, Odd, or No-Parity formats  
1, 112, or 2-stop bit  
Baud generation (DC to 5 Mbit/s)  
False start-bit detection  
Complete status reporting capabilities  
3-State output TTL drive capabilities for bi-directional data bus and control bus  
Line Break generation and detection  
Internal diagnostic capabilities:  
Loop-back controls for communications link fault isolation  
Prioritized interrupt system controls  
Modem control functions (CTS, RTS, DSR, DTR, RI, DCD).  
3. Ordering information  
Table 1:  
Ordering information  
Package  
Name  
Type number  
Description  
Version  
SC16C2550BIN40 DIP40  
SC16C2550BIA44 PLCC44  
SC16C2550BIB48 LQFP48  
plastic dual in-line package; 40 leads (600 mil)  
plastic leaded chip carrier; 44 leads  
SOT129-1  
SOT187-2  
SOT313-2  
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
2 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
4. Block diagram  
SC16C2550B  
TRANSMIT  
FIFO  
TRANSMIT  
SHIFT  
TXA, TXB  
REGISTER  
REGISTER  
D0–D7  
IOR  
IOW  
DATA BUS  
AND  
CONTROL LOGIC  
RESET  
RECEIVE  
FIFO  
RECEIVE  
SHIFT  
RXA, RXB  
REGISTER  
REGISTER  
A0–A2  
CSA  
CSB  
REGISTER  
SELECT  
LOGIC  
DTRA, DTRB  
RTSA, RTSB  
OP2A, OP2B  
MODEM  
CONTROL  
LOGIC  
CTSA, CTSB  
RIA, RIB  
INTA, INTB  
TXRDYA, TXRDYB  
RXRDYA, RXRDYB  
CLOCK AND  
BAUD RATE  
GENERATOR  
INTERRUPT  
CONTROL  
LOGIC  
CDA, CDB  
DSRA, DSRB  
002aaa595  
XTAL1  
XTAL2  
Fig 1. SC16C2550B block diagram.  
9397 750 14449  
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Product data  
Rev. 02 — 14 December 2004  
3 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
5. Pinning information  
5.1 Pinning  
D0  
D1  
1
2
3
4
5
6
7
8
9
40 V  
CC  
39 RIA  
D2  
38 CDA  
37 DSRA  
36 CTSA  
35 RESET  
34 DTRB  
33 DTRA  
32 RTSA  
31 OP2A  
30 INTA  
29 INTB  
28 A0  
D3  
D4  
D5  
D6  
D7  
RXB  
RXA 10  
TXA 11  
TXB 12  
OP2B 13  
CSA 14  
CSB 15  
XTAL1 16  
XTAL2 17  
IOW 18  
CDB 19  
GND 20  
27 A1  
26 A2  
25 CTSB  
24 RTSB  
23 RIB  
22 DSRB  
21 IOR  
002aaa596  
Fig 2. DIP40 pin configuration.  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
4 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
D5  
D6  
D7  
7
8
9
39 RESET  
38 DTRB  
37 DTRA  
36 RTSA  
35 OP2A  
34 RXRDYA  
33 INTA  
32 INTB  
31 A0  
RXB 10  
RXA 11  
SC16C2550BIA44  
TXRDYB 12  
TXA 13  
TXB 14  
OP2B 15  
CSA 16  
30 A1  
CSB 17  
29 A2  
002aaa597  
Fig 3. PLCC44 pin configuration.  
9397 750 14449  
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Product data  
Rev. 02 — 14 December 2004  
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SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
D5  
D6  
1
2
3
4
5
6
7
8
9
36 RESET  
35 DTRB  
34 DTRA  
33 RTSA  
32 OP2A  
31 RXRDYA  
30 INTA  
29 INTB  
28 A0  
D7  
RXB  
RXA  
TXRDYB  
TXA  
SC16C2550BIB48  
TXB  
OP2B  
CSA 10  
CSB 11  
N.C. 12  
27 A1  
26 A2  
25 N.C.  
002aaa598  
Fig 4. LQFP48 pin configuration.  
5.2 Pin description  
Table 2:  
Symbol  
Pin description  
Pin  
DIP40 PLCC44 LQFP48  
Type Description  
A0  
A1  
A2  
28  
27  
26  
31  
30  
29  
28  
I
I
I
I
Address 0 select bit. Internal register address selection.  
Address 1 select bit. Internal register address selection.  
Address 2 select bit. Internal register address selection.  
27  
26  
CSA, CSB 14, 15 16, 17  
10, 11  
Chip Select A, B (Active-LOW). This function is associated with individual  
channels, A through B. These pins enable data transfers between the user  
CPU and the SC16C2550B for the channel(s) addressed. Individual UART  
sections (A, B) are addressed by providing a logic 0 on the respective CSA,  
CSB pin.  
D0-D7  
GND  
1-8  
20  
2-9  
22  
44-48,  
1-3  
I/O  
I
Data bus (bi-directional). These pins are the 8-bit, 3-State data bus for  
transferring information to or from the controlling CPU. D0 is the least  
significant bit and the first data bit in a transmit or receive serial data  
stream.  
17  
Signal and power ground.  
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Product data  
Rev. 02 — 14 December 2004  
6 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
Table 2:  
Symbol  
Pin description…continued  
Pin  
Type Description  
DIP40 PLCC44 LQFP48  
INTA,  
INTB  
30, 29 33, 32  
30, 29  
O
Interrupt A, B (3-State). This function is associated with individual channel  
interrupts, INTA, INTB. INTA, INTB are enabled when MCR bit 3 is set to a  
logic 1, interrupts are enabled in the interrupt enable register (IER), and is  
active when an interrupt condition exists. Interrupt conditions include:  
receiver errors, available receiver buffer data, transmit buffer empty, or  
when a modem status flag is detected.  
IOR  
21  
18  
24  
20  
19  
I
Read strobe (Active-LOW strobe). A logic 0 transition on this pin will load  
the contents of an internal register defined by address bits A0-A2 onto the  
SC16C2550B data bus (D0-D7) for access by external CPU.  
IOW  
15  
I
Write strobe (Active-LOW strobe). A logic 0 transition on this pin will  
transfer the contents of the data bus (D0-D7) from the external CPU to an  
internal register that is defined by address bits A0-A2.  
OP2A,  
OP2B  
31, 13 35, 15  
32, 9  
O
Output 2 (user-defined). This function is associated with individual  
channels, A through B. The state at these pin(s) are defined by the user  
and through MCR register bit 3. INTA, INTB are set to the active mode and  
OP2 to logic 0 when MCR[3] is set to a logic 1. INTA, INTB are set to the  
3-State mode and OP2 to a logic 1 when MCR[3] is set to a logic 0. See  
bit 3, Modem Control Register (MCR[3]). Since these bits control both the  
INTA, INTB operation and OP2 outputs, only one function should be used  
at one time, INT or OP2.  
RESET  
35  
-
39  
36  
I
Reset (Active-HIGH). A logic 1 on this pin will reset the internal registers  
and all the outputs. The UART transmitter output and the receiver input will  
be disabled during reset time. (See Section 7.10 “SC16C2550B external  
reset condition” for initialization details.)  
RXRDYA,  
RXRDYB  
34, 23  
31, 18  
O
Receive Ready A, B (Active-LOW). This function is associated with  
PLCC44 and LQFP48 packages only. This function provides the  
RX FIFO/RHR status for individual receive channels (A-B). RXRDYn is  
primarily intended for monitoring DMA mode 1 transfers for the receive data  
FIFOs. A logic 0 indicates there is a receive data to read/upload, i.e.,  
receive ready status with one or more RX characters available in the  
FIFO/RHR. This pin is a logic 1 when the FIFO/RHR is empty or when the  
programmed trigger level has not been reached. This signal can also be  
used for single mode transfers (DMA mode 0).  
TXRDYA,  
TXRDYB  
-
1, 12  
43, 6  
O
Transmit Ready A, B (Active-LOW). This function is associated with  
PLCC44 and LQFP48 packages only. These outputs provide the  
TX FIFO/THR status for individual transmit channels (A-B). TXRDYn is  
primarily intended for monitoring DMA mode 1 transfers for the transmit  
data FIFOs. An individual channel’s TXRDYA, TXRDYB buffer ready status  
is indicated by logic 0, i.e., at lease one location is empty and available in  
the FIFO or THR. This pin goes to a logic 1 (DMA mode 1) when there are  
no more empty locations in the FIFO or THR. This signal can also be used  
for single mode transfers (DMA mode 0).  
VCC  
40  
16  
44  
18  
42  
13  
I
I
Power supply input.  
XTAL1  
Crystal or external clock input. Functions as a crystal input or as an  
external clock input. A crystal can be connected between this pin and  
XTAL2 to form an internal oscillator circuit. Alternatively, an external clock  
can be connected to this pin to provide custom data rates. (See Section 6.5  
“Programmable baud rate generator”.) See Figure 5.  
9397 750 14449  
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Product data  
Rev. 02 — 14 December 2004  
7 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
Table 2:  
Symbol  
Pin description…continued  
Pin  
Type Description  
DIP40 PLCC44 LQFP48  
XTAL2  
17  
19  
14  
O
Output of the crystal oscillator or buffered clock. (See also XTAL1.)  
Crystal oscillator output or buffered clock output. Should be left open if an  
external clock is connected to XTAL1. For extended frequency operation,  
this pin should be tied to VCC via a 2 kresistor.  
CDA,  
CDB  
38, 19 42, 21  
36, 25 40, 28  
40, 16  
38, 23  
I
I
Carrier Detect (Active-LOW). These inputs are associated with individual  
UART channels A through B. A logic 0 on this pin indicates that a carrier  
has been detected by the modem for that channel.  
CTSA,  
CTSB  
Clear to Send (Active-LOW). These inputs are associated with individual  
UART channels, A through B. A logic 0 on the CTS pin indicates the  
modem or data set is ready to accept transmit data from the SC16C2550B.  
Status can be tested by reading MSR[4]. This pin has no effect on the  
UART’s transmit or receive operation.  
DSRA,  
DSRB  
37, 22 41, 25  
33, 34 37, 38  
39, 20  
34, 35  
I
Data Set Ready (Active-LOW). These inputs are associated with  
individual UART channels, A through B. A logic 0 on this pin indicates the  
modem or data set is powered-on and is ready for data exchange with the  
UART. This pin has no effect on the UART’s transmit or receive operation.  
DTRA,  
DTRB  
O
Data Terminal REady (Active-LOW). These outputs are associated with  
individual UART channels, A through B. A logic 0 on this pin indicates that  
the SC16C2550B is powered-on and ready. This pin can be controlled via  
the modem control register. Writing a logic 1 to MCR[0] will set the DTR  
output to logic 0, enabling the modem. This pin will be a logic 1 after writing  
a logic 0 to MCR[0], or after a reset. This pin has no effect on the UART’s  
transmit or receive operation.  
RIA, RIB 39, 23 43, 26  
41, 21  
33, 22  
I
Ring Indicator (Active-LOW). These inputs are associated with individual  
UART channels, A through B. A logic 0 on this pin indicates the modem has  
received a ringing signal from the telephone line. A logic 1 transition on this  
input pin will generate an interrupt.  
RTSA,  
RTSB  
32, 24 36, 27  
O
Request to Send (Active-LOW). These outputs are associated with  
individual UART channels, A through B. A logic 0 on the RTS pin indicates  
the transmitter has data ready and waiting to send. Writing a logic 1 in the  
modem control register MCR[1] will set this pin to a logic 0, indicating data  
is available. After a reset this pin will be set to a logic 1. This pin has no  
effect on the UART’s transmit or receive operation.  
RXA, RXB 10, 9 11, 10  
TXA, TXB 11, 12 13, 14  
5, 4  
7, 8  
I
Receive data A, B. These inputs are associated with individual serial  
channel data to the SC16C2550B receive input circuits, A-B. The RX signal  
will be a logic 1 during reset, idle (no data), or when the transmitter is  
disabled. During the local loop-back mode, the RX input pin is disabled and  
TX data is connected to the UART RX input, internally.  
O
Transmit data A, B. These outputs are associated with individual serial  
transmit channel data from the SC16C2550B. The TX signal will be a  
logic 1 during reset, idle (no data), or when the transmitter is disabled.  
During the local loop-back mode, the TX output pin is disabled and TX data  
is internally connected to the UART RX input.  
9397 750 14449  
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Product data  
Rev. 02 — 14 December 2004  
8 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
6. Functional description  
The SC16C2550B provides serial asynchronous receive data synchronization,  
parallel-to-serial and serial-to-parallel data conversions for both the transmitter and  
receiver sections. These functions are necessary for converting the serial data  
stream into parallel data that is required with digital data systems. Synchronization for  
the serial data stream is accomplished by adding start and stop bits to the transmit  
data to form a data character (character orientated protocol). Data integrity is insured  
by attaching a parity bit to the data character. The parity bit is checked by the receiver  
for any transmission bit errors. The electronic circuitry to provide all these functions is  
fairly complex, especially when manufactured on a single integrated silicon chip. The  
SC16C2550B represents such an integration with greatly enhanced features. The  
SC16C2550B is fabricated with an advanced CMOS process.  
The SC16C2550B is an upward solution that provides a dual UART capability with  
16 bytes of transmit and receive FIFO memory, instead of none in the 16C2450. The  
SC16C2550B is designed to work with high speed modems and shared network  
environments that require fast data processing time. Increased performance is  
realized in the SC16C2550B by the transmit and receive FIFOs. This allows the  
external processor to handle more networking tasks within a given time. For example,  
the ST16C2450 without a receive FIFO, will require unloading of the RHR in  
93 microseconds (this example uses a character length of 11 bits, including start/stop  
bits at 115.2 kbit/s). This means the external CPU will have to service the receive  
FIFO less than every 100 microseconds. However, with the 16 byte FIFO in the  
SC16C2550B, the data buffer will not require unloading/loading for 1.53 ms. This  
increases the service interval, giving the external CPU additional time for other  
applications and reducing the overall UART interrupt servicing time. In addition, the  
four selectable receive FIFO trigger interrupt levels is uniquely provided for maximum  
data throughput performance especially when operating in a multi-channel  
environment. The FIFO memory greatly reduces the bandwidth requirement of the  
external controlling CPU, increases performance, and reduces power consumption.  
The SC16C2550B is capable of operation up to 5 Mbit/s with a 80 MHz clock. With a  
crystal or external clock input of 7.3728 MHz, the user can select data rates up to  
460.8 kbit/s.  
The rich feature set of the SC16C2550B is available through internal registers.  
Selectable receive FIFO trigger levels, selectable TX and RX baud rates, and modem  
interface controls are all standard features. Following a power-on reset or an external  
reset, the SC16C2550B is software compatible with the previous generation,  
ST16C2450.  
6.1 UART A-B functions  
The UART provides the user with the capability to bi-directionally transfer information  
between an external CPU, the SC16C2550B package, and an external serial device.  
A logic 0 on chip select pins CSA and/or CSB allows the user to configure, send data,  
and/or receive data via UART channels A-B. Individual channel select functions are  
shown in Table 3.  
9397 750 14449  
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Product data  
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SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
Table 3:  
Serial port selection  
Chip Select  
CSA-CSB = 1  
CSA = 0  
Function  
none  
UART channel A  
UART channel B  
CSB = 0  
6.2 Internal registers  
The SC16C2550B provides two sets of internal registers (A and B) consisting of  
12 registers each for monitoring and controlling the functions of each channel of the  
UART. These registers are shown in Table 4. The UART registers function as data  
holding registers (THR/RHR), interrupt status and control registers (IER/ISR), a FIFO  
control register (FCR), line status and control registers (LCR/LSR), modem status  
and control registers (MCR/MSR), programmable data rate (clock) control registers  
(DLL/DLM), and a user accessible scratchpad register (SPR).  
Table 4:  
A2  
Internal registers decoding  
A0 READ mode  
A1  
WRITE mode  
General register set (THR/RHR, IER/ISR, MCR/MSR, FCR, LSR, SPR)[1]  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Receive Holding Register  
Interrupt Enable Register  
Interrupt Status Register  
Line Control Register  
Modem Control Register  
Line Status Register  
Transmit Holding Register  
Interrupt Enable Register  
FIFO Control Register  
Line Control Register  
Modem Control Register  
n/a  
Modem Status Register  
n/a  
Scratchpad Register  
Scratchpad Register  
Baud rate register set (DLL/DLM)[2]  
0
0
0
0
0
1
LSB of Divisor Latch  
MSB of Divisor Latch  
LSB of Divisor Latch  
MSB of Divisor Latch  
[1] These registers are accessible only when LCR[7] is a logic 0.  
[2] These registers are accessible only when LCR[7] is a logic 1.  
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SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
6.3 FIFO operation  
The 16 byte transmit and receive data FIFOs are enabled by the FIFO Control  
Register (FCR) bit 0. The user can set the receive trigger level via FCR bits 6-7, but  
not the transmit trigger level. The receiver FIFO section includes a time-out function  
to ensure data is delivered to the external CPU. An interrupt is generated whenever  
the Receive Holding Register (RHR) has not been read following the loading of a  
character or the receive trigger level has not been reached.  
Table 5:  
Flow control mechanism  
Selected trigger level (characters)  
INT pin activation  
1
1
4
4
8
8
14  
14  
6.4 Hardware/software and time-out interrupts  
The interrupts are enabled by IER[0-3]. Care must be taken when handling these  
interrupts. Following a reset, if Interrupt Enable Register (IER) bit 1 = 1, the  
SC16C2550B will issue a Transmit Holding Register interrupt. This interrupt must be  
serviced prior to continuing operations. The ISR register provides the current singular  
highest priority interrupt only. A condition can exist where a higher priority interrupt  
may mask the lower priority interrupt(s). Only after servicing the higher pending  
interrupt will the lower priority interrupt(s) be reflected in the status register. Servicing  
the interrupt without investigating further interrupt conditions can result in data errors.  
When two interrupt conditions have the same priority, it is important to service these  
interrupts correctly. Receive Data Ready and Receive Time Out have the same  
interrupt priority (when enabled by IER[0]). The receiver issues an interrupt after the  
number of characters have reached the programmed trigger level. In this case, the  
SC16C2550B FIFO may hold more characters than the programmed trigger level.  
Following the removal of a data byte, the user should re-check LSR[0] for additional  
characters. A Receive Time Out will not occur if the receive FIFO is empty. The  
time-out counter is reset at the center of each stop bit received or each time the  
receive holding register (RHR) is read. The actual time-out value is 4 character time,  
including data information length, start bit, parity bit, and the size of stop bit, i.e., 1×,  
1.5×, or 2× bit times.  
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Product data  
Rev. 02 — 14 December 2004  
11 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
6.5 Programmable baud rate generator  
The SC16C2550B supports high speed modem technologies that have increased  
input data rates by employing data compression schemes. For example, a 33.6 kbit/s  
modem that employs data compression may require a 115.2 kbit/s input data rate.  
A 128.0 kbit/s ISDN modem that supports data compression may need an input  
data rate of 460.8 kbit/s. The SC16C2550B can support a standard data rate of  
921.6 kbit/s.  
A single baud rate generator is provided for the transmitter and receiver, allowing  
independent TX/RX channel control. The programmable Baud Rate Generator is  
capable of operating with a frequency of up to 80 MHz. To obtain maximum data rate,  
it is necessary to use full rail swing on the clock input. The SC16C2550B can be  
configured for internal or external clock operation. For internal clock oscillator  
operation, an industry standard microprocessor crystal is connected externally  
between the XTAL1 and XTAL2 pins. Alternatively, an external clock can be  
connected to the XTAL1 pin to clock the internal baud rate generator for standard or  
custom rates (see Table 6).  
The generator divides the input 16× clock by any divisor from 1 to 216 1. The  
SC16C2550B divides the basic external clock by 16. The basic 16× clock provides  
table rates to support standard and custom applications using the same system  
design. The rate table is configured via the DLL and DLM internal register functions.  
Customized Baud Rates can be achieved by selecting the proper divisor values for  
the MSB and LSB sections of baud rate generator.  
Programming the Baud Rate Generator Registers DLM (MSB) and DLL (LSB)  
provides a user capability for selecting the desired final baud rate. The example in  
Table 6 shows the selectable baud rate table available when using a 1.8432 MHz  
external clock input.  
1.5 k  
X1  
X1  
1.8432 MHz  
1.8432 MHz  
C1  
22 pF  
C2  
33 pF  
C1  
22 pF  
C2  
47 pF  
002aaa586  
Fig 5. Crystal oscillator connection.  
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Table 6:  
Baud rate generator programming table using a 1.8432 MHz clock  
Output  
Output  
Output  
DLM  
DLL  
baud rate  
16 × clock divisor 16 × clock divisor program value  
program value  
(HEX)  
(decimal)  
2304  
1536  
1047  
768  
384  
192  
96  
(HEX)  
900  
600  
417  
300  
180  
C0  
60  
(HEX)  
09  
06  
04  
03  
01  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
50  
00  
00  
17  
00  
80  
C0  
60  
30  
20  
18  
10  
0C  
06  
03  
02  
01  
75  
110  
150  
300  
600  
1200  
2400  
3600  
4800  
7200  
9600  
19.2 k  
38.4 k  
57.6 k  
115.2 k  
48  
30  
32  
20  
24  
18  
16  
10  
12  
0C  
06  
6
3
03  
2
02  
1
01  
6.6 DMA operation  
The SC16C2550B FIFO trigger level provides additional flexibility to the user for block  
mode operation. LSR[5,6] provide an indication when the transmitter is empty or has  
an empty location(s). The user can optionally operate the transmit and receive FIFOs  
in the DMA mode (FCR[3]). When the transmit and receive FIFOs are enabled and  
the DMA mode is de-activated (DMA Mode 0), the SC16C2550B activates the  
interrupt output pin for each data transmit or receive operation. When DMA mode is  
activated (DMA Mode 1), the user takes the advantage of block mode operation by  
loading or unloading the FIFO in a block sequence determined by the receive trigger  
level and the transmit FIFO. In this mode, the SC16C2550B sets the TXRDY (or  
RXRDY) output pin when characters in the transmit FIFO is below 16, or the  
characters in the receive FIFOs are above the receive trigger level.  
6.7 Loop-back mode  
The internal loop-back capability allows on-board diagnostics. In the loop-back mode,  
the normal modem interface pins are disconnected and reconfigured for loop-back  
internally (see Figure 6). MCR[0-3] register bits are used for controlling loop-back  
diagnostic testing. In the loop-back mode, the transmitter output (TX) and the receiver  
input (RX) are disconnected from their associated interface pins, and instead are  
connected together internally. The CTS, DSR, CD, and RI are disconnected from  
their normal modem control inputs pins, and instead are connected internally to RTS,  
DTR, MCR[3] (OP2) and MCR[2] (OP1). Loop-back test data is entered into the  
transmit holding register via the user data bus interface, D0-D7. The transmit UART  
serializes the data and passes the serial data to the receive UART via the internal  
loop-back connection. The receive UART converts the serial data back into parallel  
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data that is then made available at the user data interface D0-D7. The user optionally  
compares the received data to the initial transmitted data for verifying error-free  
operation of the UART TX/RX circuits.  
In this mode, the receiver and transmitter interrupts are fully operational. The Modem  
Control Interrupts are also operational.  
SC16C2550B  
TRANSMIT  
FIFO  
TRANSMIT  
SHIFT  
TXA, TXB  
REGISTER  
REGISTER  
D0–D7  
IOR  
IOW  
DATA BUS  
AND  
CONTROL LOGIC  
RESET  
MCR[4] = 1  
RECEIVE  
FIFO  
REGISTER  
RECEIVE  
SHIFT  
REGISTER  
RXA, RXB  
RTSA, RTSB  
A0–A2  
CSA, CSB  
REGISTER  
SELECT  
LOGIC  
CTSA, CTSB  
DTRA, DTRB  
MODEM  
CONTROL  
LOGIC  
DSRA, DSRB  
(OP1A, OP1B)  
RIA, RIB  
INTA, INTB  
TXRDYA, TXRDYB  
RXRDYA, RXRDYB  
CLOCK AND  
BAUD RATE  
GENERATOR  
INTERRUPT  
CONTROL  
LOGIC  
(OP2A, OP2B)  
CDA, CDB  
002aaa599  
XTAL1  
XTAL2  
Fig 6. Internal loop-back mode diagram.  
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7. Register descriptions  
Table 7 details the assigned bit functions for the SC16C2550B internal registers. The  
assigned bit functions are more fully defined in Section 7.1 through Section 7.10.  
Table 7:  
SC16C2550B internal registers  
A2 A1 A0 Register Default[1] Bit 7  
General Register Set[2]  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
0
0
0
0
0
0
0
0
1
RHR  
THR  
IER  
XX  
XX  
00  
bit 7  
bit 7  
0
bit 6  
bit 6  
0
bit 5  
bit 5  
0
bit 4  
bit 4  
0
bit 3  
bit 3  
bit 2  
bit 2  
bit 1  
bit 1  
bit 0  
bit 0  
modem receive transmit receive  
status line holding holding  
interrupt status register register  
interrupt interrupt  
XMIT RCVR  
FIFO FIFO  
0
0
0
1
1
1
0
0
1
FCR  
ISR  
00  
01  
00  
RCVR  
trigger  
(MSB)  
RCVR  
trigger  
(LSB)  
reserved reserved DMA  
0
FIFOs  
enable  
0
mode  
select  
reset  
reset  
FIFOs  
enabled enabled  
FIFOs  
0
0
INT  
priority  
bit 2  
INT  
priority  
bit 1  
INT  
priority  
bit 0  
INT  
status  
LCR  
divisor  
latch  
enable  
set break set parity even  
parity  
parity  
enable  
stop bits word  
length  
word  
length  
bit 0  
bit 1  
1
1
0
0
0
1
MCR  
LSR  
00  
60  
0
0
0
loop back OP2/INT (OP1)  
enable  
RTS  
DTR  
FIFO  
data  
error  
THR and THR  
TSR  
empty  
break  
framing parity  
overrun receive  
error  
empty  
interrupt error  
error  
data  
ready  
1
1
1
1
0
1
MSR  
SPR  
X0  
FF  
CD  
RI  
DSR  
bit 5  
CTS  
bit 4  
CD  
RI  
DSR  
CTS  
bit 7  
bit 6  
bit 3  
bit 2  
bit 1  
bit 0  
Special Register Set[3]  
0
0
0
0
0
1
DLL  
XX  
XX  
bit 7  
bit 6  
bit 5  
bit 4  
bit 3  
bit 2  
bit 1  
bit 9  
bit 0  
bit 8  
DLM  
bit 15  
bit 14  
bit 13  
bit 12  
bit 11  
bit 10  
[1] The value shown in represents the register’s initialized HEX value; X = n/a.  
[2] Accessible only when LCR[7] is logic 0.  
[3] Baud rate registers accessible only when LCR[7] is logic 1.  
7.1 Transmit (THR) and Receive (RHR) Holding Registers  
The serial transmitter section consists of an 8-bit Transmit Hold Register (THR) and  
Transmit Shift Register (TSR). The status of the THR is provided in the Line Status  
Register (LSR). Writing to the THR transfers the contents of the data bus (D7-D0) to  
the TSR and UART via the THR, providing that the THR is empty. The THR empty  
flag in the LSR register will be set to a logic 1 when the transmitter is empty or when  
data is transferred to the TSR. Note that a write operation can be performed when the  
THR empty flag is set (logic 0 = at least one byte in FIFO/THR, logic 1 = FIFO/THR  
empty).  
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The serial receive section also contains an 8-bit Receive Holding Register (RHR) and  
a Receive Serial Shift Register (RSR). Receive data is removed from the  
SC16C2550B and receive FIFO by reading the RHR register. The receive section  
provides a mechanism to prevent false starts. On the falling edge of a start or false  
start bit, an internal receiver counter starts counting clocks at the 16× clock rate. After  
7-12 clocks, the start bit time should be shifted to the center of the start bit. At this  
time the start bit is sampled, and if it is still a logic 0 it is validated. Evaluating the start  
bit in this manner prevents the receiver from assembling a false character. Receiver  
status codes will be posted in the LSR.  
7.2 Interrupt Enable Register (IER)  
The Interrupt Enable Register (IER) masks the interrupts from receiver ready,  
transmitter empty, line status and modem status registers. These interrupts would  
normally be seen on the INTA, INTB output pins.  
Table 8:  
Interrupt Enable Register bits description  
Bit  
7-4  
3
Symbol  
IER[7-4]  
IER[3]  
Description  
Not used.  
Modem Status Interrupt. This interrupt will be issued whenever  
there is a modem status change as reflected in MSR[0-3].  
Logic 0 = Disable the modem status register interrupt (normal  
default condition).  
Logic 1 = Enable the modem status register interrupt.  
2
1
IER[2]  
IER[1]  
Receive Line Status interrupt. This interrupt will be issued  
whenever a receive data error condition exists as reflected in  
LSR[1-4].  
Logic 0 = Disable the receiver line status interrupt (normal  
default condition).  
Logic 1 = Enable the receiver line status interrupt.  
Transmit Holding Register interrupt. In the 16C450 mode, this  
interrupt will be issued whenever the THR is empty, and is  
associated with LSR[5]. In the FIFO modes, this interrupt will be  
issued whenever the FIFO is empty.  
Logic 0 = Disable the Transmit Holding Register Empty (TXRDY)  
interrupt (normal default condition).  
Logic 1 = Enable the TXRDY (ISR level 3) interrupt.  
0
IER[0]  
Receive Holding Register. In the 16C450 mode, this interrupt will  
be issued when the RHR has data, or is cleared when the RHR is  
empty. In the FIFO mode, this interrupt will be issued when the  
FIFO has reached the programmed trigger level or is cleared when  
the FIFO drops below the trigger level.  
Logic 0 = Disable the receiver ready (ISR level 2, RXRDY)  
interrupt (normal default condition).  
Logic 1 = Enable the RXRDY (ISR level 2) interrupt.  
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7.2.1 IER versus Transmit/Receive FIFO interrupt mode operation  
When the receive FIFO (FCR[0] = logic 1), and receive interrupts (IER[0] = logic 1)  
are enabled, the receive interrupts and register status will reflect the following:  
The receive RXRDY interrupt (Level 2 ISR interrupt) is issued to the external CPU  
when the receive FIFO has reached the programmed trigger level. It will be cleared  
when the receive FIFO drops below the programmed trigger level.  
Receive FIFO status will also be reflected in the user accessible ISR register when  
the receive FIFO trigger level is reached. Both the ISR register receive status bit  
and the interrupt will be cleared when the FIFO drops below the trigger level.  
The receive data ready bit (LSR[0]) is set as soon as a character is transferred  
from the shift register (RSR) to the receive FIFO. It is reset when the FIFO is  
empty.  
When the Transmit FIFO and interrupts are enabled, an interrupt is generated  
when the transmit FIFO is empty due to the unloading of the data by the TSR and  
UART for transmission via the transmission media. The interrupt is cleared either  
by reading the ISR register, or by loading the THR with new data characters.  
7.2.2 IER versus Receive/Transmit FIFO polled mode operation  
When FCR[0] = logic 1, resetting IER[0-3] enables the SC16C2550B in the FIFO  
polled mode of operation. In this mode, interrupts are not generated and the user  
must poll the LSR register for TX and/or RX data status. Since the receiver and  
transmitter have separate bits in the LSR either or both can be used in the polled  
mode by selecting respective transmit or receive control bit(s).  
LSR[0] will be a logic 1 as long as there is one byte in the receive FIFO.  
LSR[1-4] will provide the type of receive errors, or a receive break, if encountered.  
LSR[5] will indicate when the transmit FIFO is empty.  
LSR[6] will indicate when both the transmit FIFO and transmit shift register are  
empty.  
LSR[7] will show if any FIFO data errors occurred.  
7.3 FIFO Control Register (FCR)  
This register is used to enable the FIFOs, clear the FIFOs, set the receive FIFO  
trigger levels, and select the DMA mode.  
7.3.1 DMA mode  
Mode 0 (FCR bit 3 = 0): Set and enable the interrupt for each single transmit or  
receive operation, and is similar to the 16C450 mode. Transmit Ready (TXRDY) on  
PLCC44 and LQFP48 packages will go to a logic 0 whenever the FIFO (THR, if FIFO  
is not enabled) is empty. Receive Ready (RXRDY) on PLCC44 and LQFP48  
packages will go to a logic 0 whenever the Receive Holding Register (RHR) is loaded  
with a character.  
Mode 1 (FCR bit 3 = 1): Set and enable the interrupt in a block mode operation. The  
transmit interrupt is set when the transmit FIFO is empty. TXRDY on PLCC and  
LQFP48 packages remains a logic 0 as long as one empty FIFO location is available.  
The receive interrupt is set when the receive FIFO fills to the programmed trigger  
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level. However, the FIFO continues to fill regardless of the programmed level until the  
FIFO is full. RXRDY on PLCC44 and LQFP48 packages transitions LOW when the  
FIFO reaches the trigger level, and transitions HIGH when the FIFO empties.  
7.3.2 FIFO mode  
Table 9:  
FIFO Control Register bits description  
Bit  
Symbol  
Description  
7-6  
FCR[7-6]  
RCVR trigger. These bits are used to set the trigger level for the  
receive FIFO interrupt.  
Logic 0 (or cleared) = normal default condition.  
Logic 1 = RX trigger level.  
An interrupt is generated when the number of characters in the  
FIFO equals the programmed trigger level. However, the FIFO will  
continue to be loaded until it is full. Refer to Table 10.  
5-4  
3
FCR[5-4]  
FCR[3]  
Not used; initialized to logic 0.  
DMA mode select.  
Logic 0 = Set DMA mode ‘0’  
Logic 1 = Set DMA mode ‘1’  
Transmit operation in mode ‘0’: When the SC16C2550B is in the  
16C450 mode (FIFOs disabled; FCR[0] = logic 0) or in the FIFO  
mode (FIFOs enabled; FCR[0] = logic 1; FCR[3] = logic 0), and  
when there are no characters in the transmit FIFO or transmit  
holding register, the TXRDY pin in PLCC44 or LQFP48 packages  
will be a logic 0. Once active, the TXRDY pin will go to a logic 1  
after the first character is loaded into the transmit holding register.  
Receive operation in mode ‘0’: When the SC16C2550B is in  
mode ‘0’ (FCR[0] = logic 0), or in the FIFO mode (FCR[3] = logic 0)  
and there is at lease one character in the receive FIFO, the  
RXRDY pin will be a logic 0. Once active, the RXRDY pin on  
PLCC44 and LQFP48 packages will go to a logic 1 when there are  
no more characters in the receiver.  
Transmit operation in mode ‘1’: When the SC16C2550B is in  
FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1), the TXRDY pin on  
PLCC44 and LQFP48 packages will be a logic 1 when the transmit  
FIFO is completely full. It will be a logic 0 if one or more FIFO  
locations are empty.  
Receive operation in mode ‘1’: When the SC16C2550B is in  
FIFO mode (FCR[0] = logic 1; FCR[3] = logic 1) and the trigger  
level has been reached, or a Receive Time-Out has occurred, the  
RXRDY pin on PLCC44 and LQFP48 packages will go to a logic 0.  
Once activated, it will go to a logic 1 after there are no more  
characters in the FIFO.  
2
FCR[2]  
XMIT FIFO reset.  
Logic 0 = Transmit FIFO not reset (normal default condition).  
Logic 1 = Clears the contents of the transmit FIFO and resets  
the FIFO counter logic (the transmit shift register is not cleared  
or altered). This bit will return to a logic 0 after clearing the FIFO.  
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Table 9:  
FIFO Control Register bits description…continued  
Bit  
Symbol  
Description  
1
FCR[1]  
RCVR FIFO reset.  
Logic 0 = Receive FIFO not reset (normal default condition).  
Logic 1 = Clears the contents of the receive FIFO and resets the  
FIFO counter logic (the receive shift register is not cleared or  
altered). This bit will return to a logic 0 after clearing the FIFO.  
0
FCR[0]  
FIFOs enabled.  
Logic 0 = Disable the transmit and receive FIFO (normal default  
condition).  
Logic 1 = Enable the transmit and receive FIFO. This bit must  
be a ‘1’ when other FCR bits are written to, or they will not  
be programmed.  
Table 10: RCVR trigger levels  
FCR[7]  
FCR[6]  
RX FIFO trigger level  
0
0
1
1
0
1
0
1
01  
04  
08  
14  
7.4 Interrupt Status Register (ISR)  
The SC16C2550B provides four levels of prioritized interrupts to minimize external  
software interaction. The Interrupt Status Register (ISR) provides the user with four  
interrupt status bits. Performing a read cycle on the ISR will provide the user with the  
highest pending interrupt level to be serviced. No other interrupts are acknowledged  
until the pending interrupt is serviced. A lower level interrupt may be seen after  
servicing the higher level interrupt and re-reading the interrupt status bits. Table 11  
“Interrupt source” shows the data values (bits 0-3) for the four prioritized interrupt  
levels and the interrupt sources associated with each of these interrupt levels.  
Table 11: Interrupt source  
Priority ISR[3] ISR[2] ISR[1] ISR[0] Source of the interrupt  
level  
1
2
2
3
4
0
0
1
0
0
1
1
1
0
0
1
0
0
1
0
0
0
0
0
0
LSR (Receiver Line Status Register)  
RXRDY (Received Data Ready)  
RXRDY (Receive Data time-out)  
TXRDY (Transmitter Holding Register Empty)  
MSR (Modem Status Register)  
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Table 12: Interrupt Status Register bits description  
Bit  
Symbol  
Description  
7-6  
ISR[7-6]  
FIFOs enabled. These bits are set to a logic 0 when the FIFOs are  
not being used in the 16C450 mode. They are set to a logic 1  
when the FIFOs are enabled in the SC16C2550B mode.  
Logic 0 or cleared = default condition.  
Not used.  
5-4  
3-1  
ISR[5-4]  
ISR[3-1]  
INT priority bits 2-0. These bits indicate the source for a pending  
interrupt at interrupt priority levels 1, 2, and 3 (see Table 11).  
Logic 0 or cleared = default condition.  
INT status.  
0
ISR[0]  
Logic 0 = An interrupt is pending and the ISR contents may be  
used as a pointer to the appropriate interrupt service routine.  
Logic 1 = No interrupt pending (normal default condition).  
7.5 Line Control Register (LCR)  
The Line Control Register is used to specify the asynchronous data communication  
format. The word length, the number of stop bits, and the parity are selected by  
writing the appropriate bits in this register.  
Table 13: Line Control Register bits description  
Bit  
Symbol  
Description  
7
LCR[7]  
Divisor latch enable. The internal baud rate counter latch and  
Enhance Feature mode enable.  
Logic 0 = Divisor latch disabled (normal default condition).  
Logic 1 = Divisor latch enabled.  
6
LCR[6]  
Set break. When enabled, the Break control bit causes a break  
condition to be transmitted (the TX output is forced to a logic 0  
state). This condition exists until disabled by setting LCR[6] to a  
logic 0.  
Logic 0 = no TX break condition (normal default condition)  
Logic 1 = forces the transmitter output (TX) to a logic 0 for  
alerting the remote receiver to a line break condition.  
5-3  
2
LCR[5-3]  
LCR[2]  
Programs the parity conditions (see Table 14).  
Stop bits. The length of stop bit is specified by this bit in  
conjunction with the programmed word length (see Table 15).  
Logic 0 or cleared = default condition.  
1-0  
LCR[1-0]  
Word length bits 1, 0. These two bits specify the word length to be  
transmitted or received (see Table 16).  
Logic 0 or cleared = default condition.  
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Table 14: LCR[5-3] parity selection  
LCR[5]  
LCR[4]  
LCR[3]  
Parity selection  
no parity  
X
X
0
0
1
X
0
1
0
1
0
1
1
1
1
ODD parity  
EVEN parity  
forced parity ‘1’  
forced parity ‘0’  
Table 15: LCR[2] stop bit length  
LCR[2]  
Word length  
5, 6, 7, 8  
5
Stop bit length (bit times)  
0
1
1
1
1-12  
6, 7, 8  
2
Table 16: LCR[1-0] word length  
LCR[1]  
LCR[0]  
Word length  
0
0
1
1
0
1
0
1
5
6
7
8
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7.6 Modem Control Register (MCR)  
This register controls the interface with the modem or a peripheral device.  
Table 17: Modem Control Register bits description  
Bit  
7-5  
4
Symbol  
MCR[7-5]  
MCR[4]  
Description  
Reserved; set to ‘0’.  
Loop-back. Enable the local loop-back mode (diagnostics). In this  
mode the transmitter output (TX) and the receiver input (RX), CTS,  
DSR, CD, and RI are disconnected from the SC16C2550B I/O pins.  
Internally the modem data and control pins are connected into a  
loop-back data configuration (see Figure 6). In this mode, the receiver  
and transmitter interrupts remain fully operational. The Modem  
Control Interrupts are also operational, but the interrupts’ sources are  
switched to the lower four bits of the Modem Control. Interrupts  
continue to be controlled by the IER register.  
Logic 0 = Disable loop-back mode (normal default condition).  
Logic 1 = Enable local loop-back mode (diagnostics).  
OP2/INT enable  
3
2
MCR[3]  
MCR[2]  
Logic 0 = Forces INT (A-B) outputs to the 3-State mode and sets  
OP2 to a logic 1 (normal default condition).  
Logic 1 = Forces the INT (A-B outputs to the active mode and sets  
OP2 to a logic 0.  
(OP1). OP1A/OP1B are not available as an external signal in the  
SC16C2550B. This bit is instead used in the Loop-back mode only. In  
the loop-back mode, this bit is used to write the state of the modem RI  
interface signal.  
1
0
MCR[1]  
MCR[0]  
RTS  
Logic 0 = Force RTS output to a logic 1 (normal default condition).  
Logic 1 = Force RTS output to a logic 0.  
DTR  
Logic 0 = Force DTR output to a logic 1 (normal default condition).  
Logic 1 = Force DTR output to a logic 0.  
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7.7 Line Status Register (LSR)  
This register provides the status of data transfers between the SC16C2550B and  
the CPU.  
Table 18: Line Status Register bits description  
Bit  
Symbol  
Description  
7
LSR[7]  
FIFO data error.  
Logic 0 = No error (normal default condition).  
Logic 1 = At least one parity error, framing error or break  
indication is in the current FIFO data. This bit is cleared when  
there are no remaining error flags associated with the remaining  
data in the FIFO.  
6
5
LSR[6]  
LSR[5]  
THR and TSR empty. This bit is the Transmit Empty indicator. This  
bit is set to a logic 1 whenever the transmit holding register and the  
transmit shift register are both empty. It is reset to logic 0 whenever  
either the THR or TSR contains a data character. In the FIFO  
mode, this bit is set to ‘1’ whenever the transmit FIFO and transmit  
shift register are both empty.  
THR empty. This bit is the Transmit Holding Register Empty  
indicator. This bit indicates that the UART is ready to accept a new  
character for transmission. In addition, this bit causes the UART to  
issue an interrupt to CPU when the THR interrupt enable is set.  
The THR bit is set to a logic 1 when a character is transferred from  
the transmit holding register into the transmitter shift register. The  
bit is reset to a logic 0 concurrently with the loading of the  
transmitter holding register by the CPU. In the FIFO mode, this bit  
is set when the transmit FIFO is empty; it is cleared when at least  
1 byte is written to the transmit FIFO.  
4
3
2
LSR[4]  
LSR[3]  
LSR[2]  
Break interrupt.  
Logic 0 = No break condition (normal default condition).  
Logic 1 = The receiver received a break signal (RX was a logic 0  
for one character frame time). In the FIFO mode, only one break  
character is loaded into the FIFO.  
Framing error.  
Logic 0 = No framing error (normal default condition).  
Logic 1 = Framing error. The receive character did not have a  
valid stop bit(s). In the FIFO mode, this error is associated with  
the character at the top of the FIFO.  
Parity error.  
Logic 0 = No parity error (normal default condition.  
Logic 1 = Parity error. The receive character does not have  
correct parity information and is suspect. In the FIFO mode, this  
error is associated with the character at the top of the FIFO.  
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Table 18: Line Status Register bits description…continued  
Bit  
Symbol  
Description  
1
LSR[1]  
Overrun error.  
Logic 0 = No overrun error (normal default condition).  
Logic 1 = Overrun error. A data overrun error occurred in the  
receive shift register. This happens when additional data arrives  
while the FIFO is full. In this case, the previous data in the shift  
register is overwritten. Note that under this condition, the data  
byte in the receive shift register is not transferred into the FIFO,  
therefore the data in the FIFO is not corrupted by the error.  
0
LSR[0]  
Receive data ready.  
Logic 0 = No data in receive holding register or FIFO (normal  
default condition).  
Logic 1 = Data has been received and is saved in the receive  
holding register or FIFO.  
7.8 Modem Status Register (MSR)  
This register provides the current state of the control interface signals from the  
modem, or other peripheral device to which the SC16C2550B is connected. Four bits  
of this register are used to indicate the changed information. These bits are set to a  
logic 1 whenever a control input from the modem changes state. These bits are set to  
a logic 0 whenever the CPU reads this register.  
Table 19: Modem Status Register bits description  
Bit  
Symbol  
Description  
7
MSR[7]  
CD. During normal operation, this bit is the complement of the CD  
input. Reading this bit in the loop-back mode produces the state of  
MCR[3] (OP2).  
6
5
4
3
MSR[6]  
MSR[5]  
MSR[4]  
MSR[3]  
RI. During normal operation, this bit is the complement of the RI  
input. Reading this bit in the loop-back mode produces the state of  
MCR[2] (OP1).  
DSR. During normal operation, this bit is the complement of the  
DSR input. During the loop-back mode, this bit is equivalent to  
MCR[0] (DTR).  
CTS. During normal operation, this bit is the complement of the  
CTS input. During the loop-back mode, this bit is equivalent to  
MCR[1] (RTS).  
CD [1]  
Logic 0 = No CD change (normal default condition).  
Logic 1 = The CD input to the SC16C2550B has changed state  
since the last time it was read. A modem Status Interrupt will be  
generated.  
2
MSR[2]  
RI [1]  
Logic 0 = No RI change (normal default condition).  
Logic 1 = The RI input to the SC16C2550B has changed from a  
logic 0 to a logic 1. A modem Status Interrupt will be generated.  
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Table 19: Modem Status Register bits description…continued  
Bit  
Symbol  
Description  
1
MSR[1]  
DSR [1]  
Logic 0 = No DSR change (normal default condition).  
Logic 1 = The DSR input to the SC16C2550B has changed state  
since the last time it was read. A modem Status Interrupt will be  
generated.  
0
MSR[0]  
CTS [1]  
Logic 0 = No CTS change (normal default condition).  
Logic 1 = The CTS input to the SC16C2550B has changed state  
since the last time it was read. A modem Status Interrupt will be  
generated.  
[1] Whenever any MSR bit 0-3 is set to logic 1, a Modem Status Interrupt will be generated.  
7.9 Scratchpad Register (SPR)  
The SC16C2550B provides a temporary data register to store 8 bits of user  
information.  
7.10 SC16C2550B external reset condition  
Table 20: Reset state for registers  
Register  
IER  
Reset state  
IER[7-0] = 0  
FCR  
ISR  
FCR[7-0] = 0  
ISR[7-1] = 0; ISR[0] = 1  
LCR[7-0] = 0  
LCR  
MCR  
LSR  
MCR[7-0] = 0  
LSR[7] = 0; LSR[6-5] = 1; LSR[4-0] = 0  
MSR[7-4] = input signals; MSR[3-0] = 0  
SFR[7-0] = 1  
MSR  
SPR  
DLL  
DLL[7-0] = X  
DLM  
DLM[7-0] = X  
Table 21: Reset state for outputs  
Output  
Reset state  
Logic 1  
TXA, TXB  
OP2A, OP2B  
RTSA, RTSB  
DTRA, DTRB  
INTA, INTB  
Logic 1  
Logic 1  
Logic 1  
3-State condition  
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8. Limiting values  
Table 22: Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
Parameter  
Conditions  
Min  
Max  
7
Unit  
V
supply voltage  
-
Vn  
voltage at any pin  
GND 0.3  
VCC + 0.3  
+85  
V
Tamb  
operating temperature  
storage temperature  
total power dissipation per package  
40  
65  
-
°C  
°C  
mW  
Tstg  
+150  
500  
Ptot(pack)  
9. Static characteristics  
Table 23: DC electrical characteristics  
Tamb = 40 °C to +85 °C; VCC = 2.5 V, 3.3 V or 5.0 V ±10%, unless otherwise specified.  
Symbol Parameter  
Conditions  
2.5 V  
Max  
3.3 V  
Max  
5.0 V  
Unit  
Min  
0.3  
1.8  
Min  
0.3  
2.4  
Min  
0.5  
3.0  
Max  
0.6  
VIL(CK)  
VIH(CK)  
VIL  
LOW-level clock input voltage  
0.45  
VCC  
0.65  
0.6  
VCC  
0.8  
V
V
V
HIGH-level clock input voltage  
VCC  
0.8  
LOW-level input voltage  
(except X1 clock)  
0.3  
0.3  
0.5  
VIH  
HIGH-level input voltage  
(except X1 clock)  
1.6  
-
2.0  
-
2.2  
-
V
V
V
V
V
V
V
V
V
µA  
VOL  
LOW-level output voltage  
on all outputs[1]  
IOL = 5 mA  
(databus)  
-
-
-
-
-
0.4  
I
OL = 4 mA  
(other outputs)  
OL = 2 mA  
(databus)  
OL = 1.6 mA  
-
-
-
0.4  
-
-
I
-
0.4  
-
-
-
-
I
-
0.4  
-
-
-
-
(other outputs)  
VOH  
HIGH-level output voltage  
IOH = 5 mA  
(databus)  
-
-
-
-
2.4  
-
I
OH = 1 mA  
(other outputs)  
OH = 800 µA  
(data bus)  
OH = 400 µA  
-
-
2.0  
-
-
-
-
-
-
I
1.85  
1.85  
-
-
-
-
-
-
-
I
-
-
-
(other outputs)  
ILIL  
LOW-level input leakage  
current  
±10  
±10  
±10  
ICL  
ICC  
Ci  
clock leakage  
-
-
-
±30  
3.5  
5
-
-
-
±30  
4.5  
5
-
-
-
±30  
4.5  
5
µA  
mA  
pF  
supply current  
input capacitance  
f = 5 MHz  
[1] Except x2, VOL = 1 V typical.  
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10. Dynamic characteristics  
Table 24: AC electrical characteristics  
Tamb = 40 °C to +85 °C; VCC = 2.5 V, 3.3 V or 5.0 V ±10%, unless otherwise specified.  
Symbol Parameter  
Conditions  
2.5 V  
Max  
3.3 V  
Max  
5.0 V  
Unit  
Min  
10  
-
Min  
6
Min Max  
t1w, t2w  
t3w  
clock pulse duration  
-
-
6
-
ns  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[1]  
oscillator/clock frequency  
address set-up time  
address hold time  
48  
-
80  
-
80  
-
t6s  
0
-
0
0
t6h  
0
-
0
-
0
-
t7d  
IOR delay from chip select  
IOR strobe width  
10  
77  
0
-
10  
26  
0
-
10  
23  
0
-
t7w  
25 pF load  
-
-
-
t7h  
chip select hold time from IOR  
read cycle delay  
-
-
-
t9d  
25 pF load  
25 pF load  
25 pF load  
20  
-
-
20  
-
-
20  
-
-
t12d  
t12h  
t13d  
t13w  
t13h  
t15d  
t16s  
t16h  
t17d  
t18d  
delay from IOR to data  
data disable time  
77  
26  
15  
-
23  
15  
-
-
15  
-
-
IOW delay from chip select  
IOW strobe width  
10  
20  
0
-
10  
20  
0
10  
15  
0
-
-
-
chip select hold time from IOW  
write cycle delay  
-
-
-
25  
20  
15  
-
-
25  
20  
5
-
20  
15  
5
-
data set-up time  
-
-
-
data hold time  
-
-
-
delay from IOW to output  
25 pF load  
100  
100  
-
33  
24  
-
29  
23  
delay to set interrupt from Modem 25 pF load  
input  
-
-
-
t19d  
t20d  
t21d  
t22d  
t23d  
t24d  
t25d  
t26d  
t27d  
t28d  
tRESET  
N
delay to reset interrupt from IOR  
delay from stop to set interrupt  
delay from IOR to reset interrupt  
delay from start to set interrupt  
delay from IOW to transmit start  
delay from IOW to reset interrupt  
delay from stop to set RXRDY  
delay from IOR to reset RXRDY  
delay from IOW to set TXRDY  
delay from start to reset TXRDY  
Reset pulse width  
25 pF load  
-
100  
1
-
24  
1
-
23  
1
ns  
-
-
-
Rclk  
ns  
25 pF load  
-
100  
100  
24  
-
29  
45  
24  
45  
1
-
28  
40  
24  
40  
1
-
-
-
ns  
8
8
-
8
-
Rclk  
ns  
-
100  
1
-
-
-
Rclk  
ns  
-
100  
100  
8
-
45  
45  
8
-
40  
40  
8
-
-
-
ns  
-
-
-
Rclk  
200  
1
-
40  
1
-
40  
1
-
ns  
baud rate divisor  
216 1  
216 1  
216 1 Rclk  
[1] Applies to external clock, crystal oscillator max 24 MHz.  
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10.1 Timing diagrams  
t
6h  
valid  
address  
A0 to A2  
t
t
13h  
6s  
active  
CSx  
IOW  
t
t
13d  
15d  
t
13w  
active  
t
16h  
t
16s  
D0 to D7  
data  
002aaa109  
Fig 7. General write timing.  
t
t
6h  
7h  
valid  
address  
A0 to A2  
t
6s  
active  
CSx  
IOR  
t
t
7d  
9d  
t
7w  
active  
t
t
12h  
12d  
D0 to D7  
data  
002aaa110  
Fig 8. General read timing.  
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IOW  
ACTIVE  
t
17d  
RTS  
DTR  
CHANGE OF STATE  
CHANGE OF STATE  
DCD  
CTS  
DSR  
CHANGE OF STATE  
CHANGE OF STATE  
t
t
18d  
18d  
INT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
t
19d  
IOR  
ACTIVE  
t
18d  
RI  
CHANGE OF STATE  
002aaa111  
Fig 9. Modem input/output timing.  
t
t
1w  
2w  
EXTERNAL  
CLOCK  
002aaa112  
t
3w  
Fig 10. External clock timing.  
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next  
data  
start  
bit  
parity stop start  
bit  
bit  
bit  
data bits (0 to 7)  
D3 D4  
RX  
D0  
D1  
D2  
D5  
D6  
D7  
5 data bits  
6 data bits  
7 data bits  
t
20d  
active  
INT  
t
21d  
active  
IOR  
16 baud rate clock  
002aaa113  
Fig 11. Receive timing.  
NEXT  
DATA  
START  
BIT  
PARITY STOP START  
BIT BIT  
BIT  
DATA BITS (5–8)  
RX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
t
25d  
ACTIVE  
DATA  
READY  
RXRDY  
t
26d  
ACTIVE  
IOR  
002aaa578  
Fig 12. Receive ready timing in non-FIFO mode.  
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Philips Semiconductors  
START  
BIT  
PARITY STOP  
BIT  
BIT  
DATA BITS (5–8)  
RX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
FIRST BYTE THAT  
REACHES THE  
TRIGGER LEVEL  
t
25d  
ACTIVE  
DATA  
READY  
RXRDY  
t
26d  
ACTIVE  
IOR  
002aaa579  
Fig 13. Receive ready timing in FIFO mode.  
next  
data  
start  
bit  
parity stop start  
bit bit  
bit  
data bits (0 to 7)  
TX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
5 data bits  
6 data bits  
7 data bits  
active  
INT  
transmitter ready  
t
22d  
t
24d  
t
23d  
active  
active  
IOW  
16 baud rate clock  
002aaa116  
Fig 14. Transmit timing.  
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5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
NEXT  
DATA  
START  
BIT  
PARITY STOP START  
BIT  
BIT  
BIT  
DATA BITS (5-8)  
TX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
ACTIVE  
IOW  
D0-D7  
BYTE #1  
t
28d  
t
27d  
ACTIVE  
TRANSMITTER READY  
TXRDY  
TRANSMITTER  
NOT READY  
002aaa580  
Fig 15. Transmit ready timing in non-FIFO mode.  
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5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
START  
BIT  
PARITY STOP  
BIT  
BIT  
DATA BITS (5-8)  
TX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
5 DATA BITS  
6 DATA BITS  
7 DATA BITS  
ACTIVE  
IOW  
D0–D7  
TXRDY  
t
28d  
BYTE #16  
t
27d  
FIFO FULL  
002aaa581  
Fig 16. Transmit ready timing in FIFO mode (DMA mode ‘1’).  
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11. Package outline  
DIP40: plastic dual in-line package; 40 leads (600 mil)  
SOT129-1  
D
M
E
A
2
A
L
A
1
c
e
w M  
Z
b
1
(e )  
1
b
M
H
40  
21  
pin 1 index  
E
1
20  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
w
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
1
1
E
H
max.  
min.  
max.  
max.  
1.70  
1.14  
0.53  
0.38  
0.36  
0.23  
52.5  
51.5  
14.1  
13.7  
3.60  
3.05  
15.80  
15.24  
17.42  
15.90  
4.7  
0.51  
4
2.54  
0.1  
15.24  
0.6  
0.254  
0.01  
2.25  
0.067  
0.045  
0.021  
0.015  
0.014  
0.009  
2.067  
2.028  
0.56  
0.54  
0.14  
0.12  
0.62  
0.60  
0.69  
0.63  
inches  
0.19  
0.02  
0.16  
0.089  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT129-1  
051G08  
MO-015  
SC-511-40  
Fig 17. DIP40 package outline (SOT129-1).  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
34 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
PLCC44: plastic leaded chip carrier; 44 leads  
SOT187-2  
e
e
E
D
y
X
A
39  
29  
b
p
Z
E
28  
40  
b
1
w
M
44  
1
H
E
E
pin 1 index  
A
A
1
A
4
e
(A )  
3
6
18  
β
L
p
k
detail X  
7
17  
v
M
A
e
Z
D
D
B
H
v
M
B
D
0
5
10 mm  
scale  
DIMENSIONS (mm dimensions are derived from the original inch dimensions)  
(1)  
(1)  
A
A
Z
Z
E
4
1
(1)  
(1)  
D
UNIT  
mm  
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
3
1
D
E
D
E
p
max.  
min.  
max. max.  
4.57  
4.19  
0.81 16.66 16.66  
0.66 16.51 16.51  
16.00 16.00 17.65 17.65 1.22 1.44  
14.99 14.99 17.40 17.40 1.07 1.02  
0.53  
0.33  
0.51 0.25 3.05  
0.02 0.01 0.12  
1.27  
0.05  
0.18 0.18  
0.1  
2.16 2.16  
o
45  
0.180  
0.165  
0.032 0.656 0.656  
0.026 0.650 0.650  
0.63 0.63 0.695 0.695 0.048 0.057  
0.59 0.59 0.685 0.685 0.042 0.040  
0.021  
0.013  
inches  
0.007 0.007 0.004 0.085 0.085  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
01-11-14  
SOT187-2  
112E10  
MS-018  
EDR-7319  
Fig 18. PLCC44 package outline (SOT187-2).  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
35 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm  
SOT313-2  
c
y
X
36  
25  
A
E
37  
24  
Z
E
e
H
E
A
2
A
(A )  
3
A
1
w M  
p
θ
pin 1 index  
b
L
p
L
13  
48  
detail X  
1
12  
Z
v M  
D
A
e
w M  
b
p
D
B
H
v
M
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.27 0.18 7.1  
0.17 0.12 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75  
0.45  
0.95 0.95  
0.55 0.55  
1.6  
mm  
0.25  
0.5  
1
0.2 0.12 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-01-19  
03-02-25  
SOT313-2  
136E05  
MS-026  
Fig 19. LQFP48 package outline (SOT313-2).  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
36 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
12. Soldering  
12.1 Introduction  
This text gives a very brief insight to a complex technology. A more in-depth account  
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit  
Packages (document order number 9398 652 90011).  
There is no soldering method that is ideal for all IC packages. Wave soldering is often  
preferred when through-hole and surface mount components are mixed on one  
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,  
but it is not suitable for fine pitch SMDs. In these situations reflow soldering is  
recommended. Driven by legislation and environmental forces the worldwide use of  
lead-free solder pastes is increasing.  
12.2 Through-hole mount packages  
12.2.1 Soldering by dipping or by solder wave  
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or  
265 °C, depending on solder material applied, SnPb or Pb-free respectively.  
The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the  
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).  
If the printed-circuit board has been pre-heated, forced cooling may be necessary  
immediately after soldering to keep the temperature within the permissible limit.  
12.2.2 Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the  
seating plane or not more than 2 mm above it. If the temperature of the soldering iron  
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit  
temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
12.3 Surface mount packages  
12.3.1 Reflow soldering  
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and  
binding agent) to be applied to the printed-circuit board by screen printing, stencilling  
or pressure-syringe dispensing before package placement.  
Several methods exist for reflowing; for example, convection or convection/infrared  
heating in a conveyor type oven. Throughput times (preheating, soldering and  
cooling) vary between 100 and 200 seconds depending on heating method.  
Typical reflow peak temperatures range from 215 to 270 °C depending on solder  
paste material. The top-surface temperature of the packages should preferably be  
kept:  
below 225 °C (SnPb process) or below 245 °C (Pb-free process)  
for all the BGA and SSOP-T packages  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
37 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
for packages with a thickness 2.5 mm  
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called  
thick/large packages.  
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with  
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.  
Moisture sensitivity precautions, as indicated on packing, must be respected at all  
times.  
12.3.2 Wave soldering  
Conventional single wave soldering is not recommended for surface mount devices  
(SMDs) or printed-circuit boards with a high component density, as solder bridging  
and non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically  
developed.  
If wave soldering is used the following conditions must be observed for optimal  
results:  
Use a double-wave soldering method comprising a turbulent wave with high  
upward pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be  
parallel to the transport direction of the printed-circuit board;  
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the  
transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
For packages with leads on four sides, the footprint must be placed at a 45° angle  
to the transport direction of the printed-circuit board. The footprint must  
incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of  
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or  
265 °C, depending on solder material applied, SnPb or Pb-free respectively.  
A mildly-activated flux will eliminate the need for removal of corrosive residues in  
most applications.  
12.3.3 Manual soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low  
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time  
must be limited to 10 seconds at up to 300 °C.  
When using a dedicated tool, all other leads can be soldered in one operation within  
2 to 5 seconds between 270 and 320 °C.  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
38 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
12.4 Package related soldering information  
Table 25: Suitability of IC packages for wave, reflow and dipping soldering methods  
Mounting  
Package[1]  
Soldering method  
Wave  
Reflow[2] Dipping  
Through-hole  
mount  
DBS, DIP, HDIP, RDBS,  
SDIP, SIL  
suitable[3]  
suitable  
Through-hole-  
surface mount  
PMFP[4]  
not suitable  
not suitable  
not  
suitable  
Surface mount  
BGA, LBGA, LFBGA,  
SQFP, SSOP-T[5],  
TFBGA, VFBGA  
suitable  
DHVQFN, HBCC, HBGA, not suitable[6]  
HLQFP, HSQFP, HSOP,  
suitable  
HTQFP, HTSSOP,  
HVQFN, HVSON, SMS  
PLCC[7], SO, SOJ  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended[7][8] suitable  
not recommended[9]  
suitable  
SSOP, TSSOP, VSO,  
VSSOP  
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note  
(AN01026); order a copy from your Philips Semiconductors sales office.  
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the  
maximum temperature (with respect to time) and body size of the package, there is a risk that internal  
or external package cracks may occur due to vaporization of the moisture in them (the so called  
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated  
Circuit Packages; Section: Packing Methods.  
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the  
printed-circuit board.  
[4] Hot bar soldering or manual soldering is suitable for PMFP packages.  
[5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must  
on no account be processed through more than one soldering cycle or subjected to infrared reflow  
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow  
oven. The package body peak temperature must be kept as low as possible.  
[6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom  
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with  
the heatsink on the top side, the solder might be deposited on the heatsink surface.  
[7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave  
direction. The package footprint must incorporate solder thieves downstream and at the side corners.  
[8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it  
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
[9] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than  
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
39 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
13. Revision history  
Table 26: Revision history  
Rev Date  
CPCN  
-
Description  
02 20041214  
Product data (9397 750 14449)  
Modifications:  
There is no modification to the data sheet. However, reader is advised to refer to  
AN10333 (Rev. 02) “SC16CXXXB baud rate deviation tolerance” (9397 750 14411)  
that was released together with this revision.  
01 20040329  
-
Product data (9397 750 11982)  
9397 750 14449  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data  
Rev. 02 — 14 December 2004  
40 of 42  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
14. Data sheet status  
Level Data sheet status[1]  
Product status[2][3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
15. Definitions  
16. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
licence or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
Contact information  
For additional information, please visit http://www.semiconductors.philips.com.  
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
41 of 42  
9397 750 14449  
Product data  
Rev. 02 — 14 December 2004  
SC16C2550B  
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs  
Philips Semiconductors  
Contents  
1
2
3
4
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26  
Static characteristics . . . . . . . . . . . . . . . . . . . 26  
Dynamic characteristics. . . . . . . . . . . . . . . . . 27  
Timing diagrams. . . . . . . . . . . . . . . . . . . . . . . 28  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 34  
9
10  
10.1  
11  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6  
12  
12.1  
12.2  
12.2.1  
12.2.2  
12.3  
12.3.1  
12.3.2  
12.3.3  
12.4  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Through-hole mount packages . . . . . . . . . . . 37  
Soldering by dipping or by solder wave . . . . . 37  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 37  
Surface mount packages . . . . . . . . . . . . . . . . 37  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 37  
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 38  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 38  
Package related soldering information. . . . . . 39  
6
Functional description . . . . . . . . . . . . . . . . . . . 9  
UART A-B functions . . . . . . . . . . . . . . . . . . . . . 9  
Internal registers. . . . . . . . . . . . . . . . . . . . . . . 10  
FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 11  
Hardware/software and time-out interrupts. . . 11  
Programmable baud rate generator . . . . . . . . 12  
DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 13  
Loop-back mode. . . . . . . . . . . . . . . . . . . . . . . 13  
6.1  
6.2  
6.3  
6.4  
6.5  
6.6  
6.7  
13  
14  
15  
16  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 40  
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 41  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
7
7.1  
Register descriptions . . . . . . . . . . . . . . . . . . . 15  
Transmit (THR) and Receive (RHR)  
Holding Registers . . . . . . . . . . . . . . . . . . . . . 15  
Interrupt Enable Register (IER) . . . . . . . . . . . 16  
IER versus Transmit/Receive FIFO interrupt  
mode operation . . . . . . . . . . . . . . . . . . . . . . . 17  
IER versus Receive/Transmit FIFO polled  
7.2  
7.2.1  
7.2.2  
mode operation . . . . . . . . . . . . . . . . . . . . . . . 17  
FIFO Control Register (FCR) . . . . . . . . . . . . . 17  
DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Interrupt Status Register (ISR) . . . . . . . . . . . . 19  
Line Control Register (LCR) . . . . . . . . . . . . . . 20  
Modem Control Register (MCR) . . . . . . . . . . . 22  
Line Status Register (LSR). . . . . . . . . . . . . . . 23  
Modem Status Register (MSR). . . . . . . . . . . . 24  
Scratchpad Register (SPR) . . . . . . . . . . . . . . 25  
SC16C2550B external reset condition . . . . . . 25  
7.3  
7.3.1  
7.3.2  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
7.10  
© Koninklijke Philips Electronics N.V. 2004.  
Printed in the U.S.A.  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or  
contract, is believed to be accurate and reliable and may be changed without notice. No  
liability will be accepted by the publisher for any consequence of its use. Publication  
thereof does not convey nor imply any license under patent- or other industrial or  
intellectual property rights.  
Date of release: 14 December 2004  
Document order number: 9397 750 14449  

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NXP

SC16C2550BIBS-S

5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
NXP

SC16C2550BIN40

5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
NXP