SAA5191 [NXP]
Teletext video processor; 图文电视视频处理器
| 型号： | SAA5191 |
| 厂家： | 
NXP |
| 描述： | Teletext video processor |
| 文件： | 总9页 (文件大小：55K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
SAA5191
Teletext video processor
March 1991
Preliminary specification
File under Integrated Circuits, IC02
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
GENERAL DESCRIPTION
FEATURES
The SAA5191 is a bipolar integrated circuit that extracts
teletext data from the video signal (CVBS), regenerates
the teletext clock (TTC) and synchronizes the text display
to the television signals (VCS). This device operates in
conjunction with the Digital Video Teletext (back-end)
Decoder (DVTB - SAA9042A) or any other compatible
device.
• Adaptive data slicer
• Crystal-controlled data clock regeneration with a bit rate
of 6.9375 MHz
• Adaptive sync separator, horizontal phase detector and
13.5 MHz VCO to provide display phase locked loop
(PLL)
• TV synchronization at teletext mode
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
supply voltage (pin 16)
MIN.
TYP.
12
MAX.
UNIT
−
−
−
−
V
IP
supply current
70
mA
Vi CVBS
CVBS input signal on pin 27 (peak-to-peak value)
at pin 2 LOW
−
1
−
−
V
V
V
at pin 2 open-circuit
−
2.5
3.5
Vo
outputs signals TTC and TTD
2.5
4.5
(peak-to-peak value, pins 14, 15)
VF13
VSYNC
13.5 MHz clock output signal
(peak-to-peak value pin 17)
1
2
3
V
video sync output signal (peak-to-peak value, pin 1)
SYNC output signal TCS
video composite sync level on output pin 25
LOW
−
−
1
V
200
450
650
mV
VCS
Tamb
−
−
−
−
0.4
5.5
+70
V
HIGH
2.4
0
V
operating ambient temperature
°C
ORDERING AND PACKAGE INFORMATION
EXTENDED TYPE
PACKAGE
NUMBER
PINS
PIN POSITION
MATERIAL
CODE
SAA5191
28
DIL
plastic
SOT117(1)
Note
1. SOT117-1;1996 November 14
March 1991
2
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
EM1H49
March 1991
3
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
PINNING
PIN CONFIGURATION
SYMBOL PIN
DESCRIPTION
STTV
VILS
Cfilt
1
sync output signal to TV (positive or negative going)
level select input of video input (LOW equals 1 V)
video filtering capacitor of HF loss compensation
HF storage capacitor
2
3
Cstore
Campl
Czero
EXD
Ctime
CCLK
CBB
XTAL
CLF
4
5
amplitude capacitor
page
6
zero level capacitor
STTV
VILS
TCS
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
7
external data current input (note 1)
data timing capacitor for the adaptive data slicer
clock phase detector capacitor
CVBS
8
C
3
C
filt
BL
9
C
VCS
4
store
10
11
12
13
14
15
16
17
18
19
blanking insertion input
C
C
T
5
ampl
13.875 MHz crystal (double of data rate)
6.9375 MHz clock frequency filter
ground (0 V)
C
6
R
T
zero
GND
TTC
TTD
VP
EXD
PL
7
SAA5191
teletext clock output (for computer controlled teletext)
teletext data output (for computer controlled teletext)
+12 V supply voltage
C
8
C
time
hor
C
OSCI
9
CLK
CCB
XTAL
CLF
C
10
11
12
13
VCR
F13
13.5 MHz VCO output (for sandcastle generation)
oscillator output to series LC-circuit or crystal
OSCO
F13
OSCO
CVCR
short time constant capacitor at video recorder mode
(note 2)
GND
V
P
OSCI
Chor
PL
20
21
22
23
24
25
26
27
28
oscillator input from series LC-circuit or crystal
horizontal phase capacitor / VCR mode
sandcastle input (generated in CCT)
timing resistor for pulse generator
TTC 14
15 TTD
MEH150
RT
CT
timing capacitor for pulse generator
video composite sync output to CCT
black level capacitor
VCS
CBL
CVBS
TCS
composite video input signal from TV
text-composite/scan-composite sync input (TSC/SCS)
Fig.2 Pin configuration.
Notes
1. Sliced teletext data from external: active HIGH level (current), low
impedance input.
2. While the loop is locking up.
March 1991
4
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
supply voltage (pin 16)
MIN.
MAX.
13.2
UNIT
VP
0
0
V
V
V5
voltage on pin 5
5.5
Tstg
Tamb
storage temperature range
operating ambient temperature range
−20
125
+70
°C
°C
0
CHARACTERISTICS
VP = 12 V; Tamb = 25 °C and measurements taken in Fig.3, unless otherwise specified.
SYMBOL
VP
IP
PARAMETER
supply voltage range (pin 16)
supply current
CONDITIONS
MIN.
10.8
50
TYP. MAX. UNIT
12.0
70
13.2
105
V
mA
ZS ≤ 250 Ω
Video input, sync separator and data slicer
Vi CVBS
input signal sync to white
V2 = LOW
0.7
1
1.4
V
(peak-to-peak value, pin 27)
V2 = HIGH
1.75
0.1
0.3
0.75
0
2.5
−
3.5
1
V
sync amplitude (peak-to-peak value)
data slicing level
V
V2 = LOW
V2 = HIGH
0.46
1.15
−
0.7
1.75
0.8
5.5
−150
1
V
V
V2
I2
input voltage LOW (pin 2)
input voltage HIGH
input current LOW
V
open-circuit equals HIGH 2.0
0
−
V
−
µA
mA
input current HIGH
V2 < 5.5 V
0
−
Teletext data output (TTD)
V22
phase lock pulse (PL) input voltage
phase locked
0
−
3
V
(peak-to-peak value, pin 22)
phase unlocked
3.9
2.5
−
5.5
4.5
V
V
Vo TTD
data output signal on pin 15
(peak-to-peak value)
3.5
V15
CL
DC output voltage
mean level
3
4
5
V
load capacitance on pin 15
rise and fall time
−
−
40
45
pF
ns
t r, t f
20
30
Teletext clock output (TTC)
Vo TTC
clock output signal on pin 14
2.5
3.5
4.5
V
(peak-to-peak value)
V14
CL
DC output voltage
mean level
3
4
5
V
load capacitance on pin 14
rise and fall time
−
−
40
45
± 20
pF
ns
ns
t r, t f
t d
20
−
30
−
delay time of falling edge relative to
other edges of TTD
March 1991
5
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Text/ scan composite sync input (TCS/SCS)
V28
input voltage LOW for TCS (pin 28)
input voltage HIGH for TCS
input voltage LOW for SCS
input voltage HIGH for SCS
input current
0
−
0.8
7.0
1.5
7.0
−100
± 5
V
2.0
0
−
V
−
V
3.5
−40
−
−
V
I28
V28 = 0 to 7 V
28 = 10 to VP
−70
−
µA
µA
V
SYNC output buffer
Vo
CVBS sync output signal on pin 1
RL 1 = 1.2 kΩ to VP
−
−
1
V
(peak-to-peak value)
TCS output signal
RL 1 = 1.2 kΩ to GND
200
1.0
9.0
−
450
1.4
10.1
−
650
2.0
mV
V
V1
I1
DC output voltage at positive sync signal RL 1 = 1.2 kΩ to GND
DC output voltage at negative sync signal
output current
RL 1 = 1.2 kΩ to VP
11.0
± 3
V
mA
Video composite sync output (VCS)
V25
I25
td
output voltage LOW (pin 25)
output voltage HIGH
0
−
0.4
V
2.4
0
−
5.5
V
output current LOW
−
0.5
mA
mA
ns
output current HIGH
0
−
−1.5
400
sync separator delay time
250
350
Horizontal phase detector and 13.5 MHz VCO
V10
input voltage LOW (CBB), pin 10
blanking insertion HIGH
input current
blanking inserted
no blanking
0
−
−
−
2
0.5
5.5
−5
3
V
1.0
−
V
I10
Vo
µA
V
13.5 MHz clock output signal
(peak-to-peak value, pin 17)
1
V17
CL
DC output voltage
maximum swing
4
−
−
−
8.5
40
30
V
load capacitance on pin 17
rise and fall time
−
pF
ns
t r, t f
10
March 1991
6
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
bnok,lfuapgedwith
47 µF
47 nF
3.3 kΩ
82 Ω
47 nF
47 nF
V
= 12 V
P
15 µF
22 nF
+12 V
TCS
PL
VCS
1 nF
470
Ω
F13
15
µH
68
kΩ
2.2 µF
6.8
pF
10 nF
220
pF
68
nF
TTD
CVBS
(1) (2)
28
27
26
25
24
23
22
21
20
19
10
18
11
17
12
16
13
15
14
(4)
27
pF
15
µH
SAA5191
1.2
kΩ
1
2
3
4
5
6
7
8
9
sync
13.875
MHz
270
pF
100
pF
470
pF
15
pF
22
nF
TTC
1
nF
video
input
level
XTAL
(3)
1.2 kΩ
15
pF
select
data
input
CBB
XTAL (2)
MEH156
additional drawing
for crystal application
13.5
MHz
47
nF
47
nF
22
pF
21
20
19
18
SAA5191
(1) inductance 15 µH at 1 kHz, Co = 2.2 pF. Adjust free-running frequency to 13.5 ± 0.1 MHz or apply 13.5 MHz quartz crystal
as shown in additional drawing
(2) Crystal: f = 13.5 MHz (e.g. Philips catalogue number 4322 143 04101); adjustment tolerance ±40 × 10−6
;
load capacitance CL = 22 pF; resonance resistance Rr = 22 pF; typical motional capacitance C1 = 23 fF;
static parallel capacitance C0 = 5.5 pF; frequency tolerance ±30 × 10−6 in temperature range T = −20 to +70°.
Adjust free-running frequency to 13.5 ± 0.5 MHz.
(3) Crystal: f = 13.875 MHz; adjustment tolerance ±40 × 10−6; load capacitance CL = 15 pF;
typical resonance resistance Rr = 15 Ω (maximum 60 Ω); typical motional capacitance C1 = 19 fF;
static parallel capacitance Co = 5 pF; frequency tolerance ±30 × 10−6 in temperature range T = −20 to +70°.
(4) Coil: Fixed inductance 15 µH ±20%, quality factor Q > 20.
Fig.3 Test circuit and application circuit using LC-circuit or a crystal for VCO (clock F13).
March 1991
7
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
PACKAGE OUTLINE
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil)
SOT117-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
28
15
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
max.
A
A
Z
(1)
(1)
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
w
1
1
E
H
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.51
4.0
2.54
0.10
15.24
0.60
0.25
0.01
1.7
0.013
0.009
0.066
0.051
0.020
0.014
1.41
1.34
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.20
0.020
0.16
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT117-1
051G05
MO-015AH
March 1991
8
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1991
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