SAA5233 [NXP]

Dual standard PDC decoder; 双重标准PDC解码器
SAA5233
型号: SAA5233
厂家: NXP    NXP
描述:

Dual standard PDC decoder
双重标准PDC解码器

解码器 光电二极管
文件: 总20页 (文件大小:86K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
SAA5233  
Dual standard PDC decoder  
June 1994  
Objective specification  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
FEATURES  
Digital data slicer  
Acquisition and decoding of VPS data  
(EBU PDC System A)  
Acquisition and decoding of Teletext packet 8/30/2 data  
(EBU PDC System B)  
Separate storage of VPS data and packet 8/30/2  
allowing dual standard PDC decoders  
I2C-bus interface with automatic word address  
increment  
Programmable interrupt for data received  
Programmable error level detection  
Single +5 V power supply.  
GENERAL DESCRIPTION  
The SAA5233 is a dual standard Program Delivery Control  
(PDC) decoder, allowing the reception and decoding of  
both VPS data (EBU PDC System A) and Teletext packet  
8/30/2 data (EBU PDC System B). It is intended for use in  
European video recorders which are manually  
programmed, so that they receive broadcast real time  
switching signals for accurate timing of program recording.  
QUICK REFERENCE DATA  
SYMBOL  
VDD  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
supply voltage  
supply current  
4.5  
5.0  
30  
5.5  
45  
V
IDD  
mA  
fclk  
crystal input frequency  
27  
MHz  
V
Vsync  
Vvid(p-p)  
CVBS sync voltage amplitude  
0.1  
0.7  
0.3  
1.0  
0.6  
1.4  
CVBS video voltage amplitude  
(peak-to-peak value)  
V
Tamb  
Tstg  
operating ambient temperature  
storage temperature  
20  
55  
+70  
°C  
°C  
+125  
ORDERING INFORMATION  
TYPE NUMBER  
PACKAGE  
MATERIAL  
PINS  
16  
PIN POSITION  
DIP16  
CODE  
SAA5233P  
SAA5233T  
plastic  
plastic  
SOT38-1  
20  
SO20L  
SOT163-1  
June 1994  
2
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
BLOCK DIAGRAM  
SCL  
SDA  
12  
13  
2
14  
I C BUS  
MEMORY  
INTERFACE  
AND RAM  
AD  
INTERFACE  
15  
INTERRUPT  
CONTROL  
INT  
SAA5233  
4
V
8/30/2  
ACQUISITION  
AND  
DD  
TELETEXT  
AND VPS  
CONTROL  
5
V
DECODING  
SS1  
9
V
SS2  
VPS  
ACQUISITION  
AND  
10  
V
SS3  
11  
V
SS4  
DECODING  
DATA SLICER  
AND CLOCK  
16  
V
SS5  
REGENERATOR  
POWER  
ON RESET  
PLL AND  
TIMING  
13.5 MHz  
27 MHz  
1.125 MHz  
INPUT  
CLAMP  
AND SYNC  
SEPARATOR  
27 MHz  
OSCILLATOR  
AND DIVIDER  
ANALOGUE  
TO DIGITAL  
CONVERTER  
6
7
8
1
2
3
MLB725  
OSCOUT OSCIN OSCGND  
CVBS BLACK IREF  
Fig.1 Block diagram; pin numbers for DIP16.  
June 1994  
3
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
PINNING  
PIN  
SYMBOL  
DESCRIPTION  
DIP16  
SO20L  
CVBS  
BLACK  
n.c.  
1
2
1
2
composite video input  
video black level storage pin  
not connected  
3
IREF  
VDD  
3
4
reference current input  
+5 V supply  
4
5
VSS1  
OSCOUT  
n.c.  
5
6
0 V ground 1 (main ground pin)  
27 MHz crystal oscillator output  
not connected  
6
7
8
OSCIN  
OSCGND  
VSS2  
VSS3  
n.c.  
7
9
27 MHz crystal oscillator input  
27 MHz crystal oscillator ground  
0 V ground 2; connect to VSS1  
0 V ground 3; connect to VSS1  
not connected  
8
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
9
10  
VSS4  
SCL  
11  
12  
13  
connect to VSS1 in normal operation  
serial clock open-drain input for I2C-bus  
serial data open-drain input/output for I2C-bus  
SDA  
i.c.  
internally connected; do not connect in normal operation  
programmable I2C-bus address bit input  
interrupt open-drain output  
AD  
14  
15  
16  
INT  
VSS5  
connect to VSS1 in normal operation  
handbook, halfpage  
handbook, halfpage  
V
1
2
20  
19  
18  
CVBS  
BLACK  
n.c.  
V
SS5  
1
2
3
4
16  
CVBS  
BLACK  
IREF  
SS5  
INT  
AD  
15  
14  
INT  
AD  
3
IREF  
4
17 i.c.  
V
13 SDA  
DD  
SAA5233  
V
16  
15  
14  
13  
12  
11  
V
SDA  
5
5
6
7
8
12  
DD  
SCL  
SS1  
SAA5233  
V
V
6
OSCOUT  
OSCIN  
SCL  
V
11  
SS1  
SS4  
V
V
10  
9
OSCOUT  
n.c.  
7
SS3  
SS2  
SS4  
OSCGND  
8
n.c.  
V
MLB726  
OSCIN  
OSCGND  
9
SS3  
V
10  
SS2  
MLB727  
Fig.2 Pin configuration; DIP16.  
Fig.3 Pin configuration; SO20L.  
June 1994  
4
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VDD  
PARAMETER  
MIN.  
0.3  
MAX.  
+6.5  
UNIT  
supply voltage  
V
V
V
VImax  
VOmax  
IIOmax  
IOmax  
Tamb  
Tstg  
maximum input voltage (any input)  
maximum output voltage (any output)  
maximum DC input or output diode current  
maximum output current (any output)  
operating ambient temperature  
storage temperature  
0.3  
0.3  
VDD + 0.3  
VDD + 0.3  
±20  
mA  
mA  
°C  
±10  
20  
55  
+70  
+125  
°C  
June 1994  
5
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
QUALITY AND RELIABILITY  
This device will meet the requirements of the “Philips Semiconductors General Quality Specification SNW-FQ-611E” in  
accordance with “Quality Reference Pocketbook (order number 9398 510 34011)”. The principal requirements are as  
shown in Tables 1 to 4.  
Group A  
Table 1 Acceptance tests per lot.  
TEST  
REQUIREMENTS(1)  
Mechanical  
Electrical  
cumulative target: <100 ppm  
cumulative target: <100 ppm  
Group B  
Table 2 Processability tests (by package family).  
TEST  
REQUIREMENTS(1)  
Solderability  
<7% LTPD  
<15% LTPD  
<15% LTPD  
Mechanical  
Solder heat resistance  
Group C  
Table 3 Reliability tests (by process family).  
TEST  
CONDITIONS  
REQUIREMENTS(1)  
Operational life  
Humidity life  
168 hours at Tj = 150 °C  
<1500 FPM; equivalent to <100 FITS  
at Tj = 70 °C  
temperature, humidity, bias  
(1000 hours, 85 °C, 85% RH or  
equivalent test)  
<2000 FPM  
Temperature cycling performance  
Tstg(min) to Tstg(max)  
<2000 FPM  
Table 4 Reliability tests (by device type).  
TEST  
CONDITIONS  
REQUIREMENTS(1)  
ESD and latch-up  
ESD Human body model  
<15% LTPD  
2000 V; 100 pF; 1.5 kΩ  
ESD Machine model  
200 V; 200 pF; 0 Ω  
<15% LTPD  
<15% LTPD  
latch-up 100 mA; 1.5 × VDD  
(absolute maximum)  
Note to Tables 1 to 4.  
1. ppm = fraction of defective devices, in parts per million.  
LTPD = Lot Tolerance Percent Defective.  
FPM = fraction of devices failing at test condition, in Failures Per Million.  
FITS = Failures In Time Standard.  
June 1994  
6
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
CHARACTERISTICS  
VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 20 to +70 °C; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS MIN.  
TYP.  
MAX.  
UNIT  
Supplies  
VDD  
IDD  
supply voltage  
4.5  
5.0  
30  
5.5  
V
supply current  
45  
mA  
Inputs  
CVBS  
Vsync  
sync voltage amplitude  
0.1  
0.7  
0.3  
1.0  
0.6  
1.4  
V
V
Vvid(p-p)  
video voltage amplitude  
(peak-to-peak value)  
Vdat(text)  
Teletext data voltage  
amplitude  
0.30  
0.46  
0.70  
V
Vdat(vps)  
Zsource  
ZI  
VPS data voltage amplitude  
source impedance  
input impedance  
0.30  
0.50  
0.70  
250  
V
2.5  
5.0  
kΩ  
pF  
CI  
input capacitance  
10  
IREF  
Rgnd  
resistor to ground  
27  
kΩ  
VIREF  
input reference voltage  
0.5VDD  
V
AD  
VIL  
VIH  
ILI  
LOW level input voltage  
HIGH level input voltage  
input leakage current  
input capacitance  
0.3  
0.7VDD  
10  
+0.3VDD  
VDD + 0.3  
+10  
V
V
VI = 0 to VDD  
µA  
pF  
CI  
10  
SCL  
VIL  
VIH  
ILI  
CI  
fclk  
tr  
LOW level input voltage  
HIGH level input voltage  
input leakage current  
input capacitance  
clock frequency  
0.3  
+0.3VDD  
VDD + 0.3  
+10  
V
0.7VDD  
V
VI = 0 to VDD  
10  
µA  
pF  
kHz  
ns  
ns  
10  
0
100  
input rise time  
0.3VDD to 0.7VDD  
0.7VDD to 0.3VDD  
1000  
300  
tf  
input fall time  
June 1994  
7
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
SYMBOL  
Outputs  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
INT (OPEN-DRAIN OUTPUT)  
VPU  
VOL  
IOL  
CL  
pull-up voltage at pin  
0
VDD  
LOW level output voltage  
LOW level output current  
load capacitance  
IOL = 3 mA  
0.4  
4.0  
V
mA  
pF  
ns  
400  
100  
tf  
output fall time  
CL = 100 pF;  
0.7VDD to 0.3VDD  
Inputs/Outputs  
BLACK  
Cblack  
ILI  
storage capacitor to ground  
input leakage current  
100  
nF  
VI = 0 to VDD  
10  
+10  
µA  
SDA (OPEN-DRAIN OUTPUT)  
VIL  
VIH  
ILI  
CI  
CL  
tr  
LOW level input voltage  
0.3  
+0.3VDD  
VDD + 0.3  
+10  
V
HIGH level input voltage  
input leakage current  
input capacitance  
load capacitance  
input rise time  
0.7VDD  
V
VI = 0 to VDD  
10  
µA  
pF  
pF  
ns  
ns  
V
10  
400  
0.3VDD to 0.7VDD  
0.7VDD to 0.3VDD  
IOL = 3 mA  
1000  
300  
tf  
input fall time  
VOL  
tf  
LOW level output voltage  
output fall time  
0
0.4  
CL = 400 pF;  
200  
ns  
0.7VDD to 0.3VDD  
CRYSTAL OSCILLATOR (OSCIN; OSCOUT)  
Vosc  
oscillator voltage amplitude  
(peak-to-peak value)  
1.0  
V
Gv  
CI  
small signal voltage gain  
input capacitance  
1.0  
10  
pF  
pF  
Cfb  
feedback capacitance  
1
June 1994  
8
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
I2C-bus timing (see Fig.4)  
fclk  
SCL clock frequency  
0
100  
kHz  
tBUF  
bus free time between a  
STOP and START  
4.7  
µs  
tHD;STA  
tLOW  
repeated START hold time note 1  
SCL clock LOW time  
4.0  
4.7  
4.0  
4.7  
µs  
µs  
µs  
µs  
tHIGH  
SCL clock HIGH time  
tSU;STA  
set-up time for a repeated  
START  
tHD;DAT  
tSU;DAT  
tr  
data hold time  
0
ns  
ns  
ns  
ns  
µs  
data set-up time  
250  
SDA, SCL input rise time  
SDA, SCL input fall time  
set-up time for STOP  
0.3VDD to 0.7VDD  
0.7VDD to 0.3VDD  
1000  
300  
tf  
tSU;STO  
4.0  
Note  
1. After this time the first clock pulse is generated.  
a
SDA  
t
t
f
t
BUF  
LOW  
SCL  
SDA  
t
HIGH  
t
t
HD;STA  
r
t
HD;DAT  
t
SU;DAT  
MBC764  
t
SU;STA  
t
SU;STO  
Fig.4 I2C-bus timing diagram.  
June 1994  
9
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
data is biphase decoded and stored with 4 data bits stored  
in the lower nibble of each byte, in the same way as  
Teletext packet 8/30/2 data; see Tables 11 and 12. In  
addition to the VCR data, Word 4  
(Program Source Identification, ASCII sequential) is  
stored, which may be useful for future applications.  
FUNCTIONAL DESCRIPTION  
Control of device  
The function of the device is controlled via the I2C-bus.  
Pin AD provides a choice of two alternative addresses.  
The PDC acquisition section requires little software control  
apart from enabling the interrupts which occur when data  
is found. Interrupts can be enabled for either Teletext  
packet 8/30/2 or VPS and both can be enabled to allow for  
the presence of both standards being transmitted on the  
same TV channel. The interrupt register is accessed as  
address 01 WRITE, see Section “Register 01: Interrupt  
(reset state X00X XXXX)”.  
The stored data is read via the I2C-bus in the normal way.  
Multiple reception/majority error correction of the data is  
the responsibility of the control software, the device simply  
stores the data as transmitted after Hamming or biphase  
decoding. As both VPS and Teletext packet 8/30/2 signals  
are stored separately, it is possible to deal with future  
situations where both EBU PDC System A and EBU PDC  
System B transmissions may be present on the same TV  
channel, the defaults and level of service being chosen by  
the software control.  
When an interrupt is signalled, a bit is set in the status  
register to indicate its source. Information about the  
received PDC data is given in the status register D5 and  
D6. The microcontroller must service the ‘data received’  
interrupts within 40 ms (VPS) or 200 ms  
Error indication  
Indication of errors in the received data is given in two  
ways and is programmable by setting bit D4 in the control  
register.  
(Teletext packet 8/30/2), since new data may be written  
after this period. The status register is accessed as  
address 00 READ; see Section  
“Register 00:Control/Status (reset state XXX0 XX00)”.  
When the status register has been read the data received  
flags and interrupt signal are reset.  
The first is a flag to indicate Hamming or biphase errors  
and is stored with the related data in bit 0 of the upper  
nibble of the data byte.  
Data of both types is constantly received and stored, but  
can be selectively acquired by setting bits D1 and D0 of the  
control register. This allows acquisition of only Teletext  
packet 8/30/2 on every VBI line or only VPS data on every  
VBI line. The control register is accessed as address  
00 WRITE, see Section “Register 00:Control/Status (reset  
state XXX0 XX00)”.  
The second is no interrupt which is sent to the  
microcontroller but the data signal quality bit (D7) is set.  
The level of interrupt is controlled by the Interrupt  
Error Level bit which is D4 of the control register. If this bit  
is not set then an interrupt only occurs if an error free line  
of either Teletext packet 8/30/2 or VPS data is received  
and stored in RAM. If this bit is set then an interrupt occurs  
if the correct framing code and Teletext packet header  
8/30/2 is found, or the correct start code for VPS data is  
found. The data is then stored in the RAM with any errors  
indicated in the upper nibble. This may be used by more  
sophisticated software, which could decide the importance  
of an error in a particular nibble.  
Storage of PDC data  
The PDC data memory is accessed at address 02 (HEX)  
to 31 (HEX). The exact addresses of Teletext packet  
8/30/2 and VPS data is shown in Table 5.  
TELETEXT DATA  
The Teletext packet 8/30/2 data is stored after hardware  
Hamming correction. There are 4 data bits stored in the  
lower nibble of each byte in address 11 (HEX)  
I2C-bus interface  
FEATURES  
Standard I2C-bus slave transceiver  
Operates from 0 to 100 kHz  
to 1D (HEX); see Table 13, in the order shown in Table 5.  
The status message, which is odd parity coded, is stored  
as a byte which represents a Teletext character in address  
1E (HEX) to 31 (HEX); see Table 14.  
Acknowledge function is performed  
Auto-increment between registers and direct addressing  
Selectable I2C-bus slave address dependent on  
VPS DATA  
address pin AD.  
The VPS data from Line 16 is stored in register address  
02 (HEX) to 0F (HEX) in the order shown in Table 5. VPS  
June 1994  
10  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
Register map  
The data received when address locations 00 (HEX) to 31 (HEX) are read or written is shown in Table 5.  
Table 5 Register map.  
ADDRESS (HEX)  
DATA(1)  
control/status  
interrupt  
ADDRESSING  
00  
01  
02  
03  
04  
05  
06  
07  
08  
09  
0A  
0B  
0C  
0D  
0E  
0F  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
1A  
1B  
1C  
1D  
1E  
:
direct  
direct  
VPS B5  
direct/auto-increments to 03  
direct/auto-increments to 04  
direct/auto-increments to 05  
direct/auto-increments to 06  
direct/auto-increments to 07  
direct/auto-increments to 08  
direct/auto-increments to 09  
direct/auto-increments to 0A  
direct/auto-increments to 0B  
direct/auto-increments to 0C  
direct/auto-increments to 0D  
direct/auto-increments to 0E  
direct/auto-increments to 0F  
stop value  
VPS B5  
VPS B11  
VPS B11  
VPS B12  
VPS B12  
VPS B13  
VPS B13  
VPS B14  
VPS B14  
VPS B15  
VPS B15  
VPS B4  
VPS B4  
direct  
8/30/2 B13  
8/30/2 B14  
8/30/2 B15  
8/30/2 B16  
8/30/2 B17  
8/30/2 B18  
8/30/2 B19  
8/30/2 B20  
8/30/2 B21  
8/30/2 B22  
8/30/2 B23  
8/30/2 B24  
8/30/2 B25  
status message  
:
direct/auto-increments to 12  
direct/auto-increments to 13  
direct/auto-increments to 14  
direct/auto-increments to 15  
direct/auto-increments to 16  
direct/auto-increments to 17  
direct/auto-increments to 18  
direct/auto-increments to 19  
direct/auto-increments to 1A  
direct/auto-increments to 1B  
direct/auto-increments to 1C  
direct/auto-increments to 1D  
direct/auto-increments to 1E  
direct/auto-increments to 1F  
direct/auto-increments  
31  
status message  
stop value  
Note  
1. For the address range 02H to 0FH, even addresses hold the least significant nibble and odd addresses hold the most  
significant nibble. BXX refers to byte definitions, EBU specification of the domestic video PDC system.  
June 1994  
11  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
Register 00:Control/Status (reset state XXX0 XX00)  
Register 00 is split into two parts. The control part (WRITE only) consisting of bits D4, D1 and D0 and status part (READ  
only) consisting of bits D7 to D5.  
Table 6 Register 00.  
D7  
D6  
D5  
D4  
IEL  
D3  
D2  
D1  
D0  
ACQ 8/30/2 ACQ VPS  
DSQ  
8/30/2 RF  
VPS RF  
Table 7 Register 00 bit description.  
SYMBOL  
IEL  
BIT  
FUNCTION  
D4  
Interrupt Error Level.  
When logic 0, signal only completely valid data lines from Teletext packet 8/30/2  
received and VPS received flags.  
When logic 1, signal valid framing code and Teletext packet header 8/30/2 received or  
valid start codeword for VPS received.  
ACQ 8/30/2  
ACQ VPS  
D1  
D0  
Acquire 8/30/2.  
Acquire VPS.  
Allows selective decoding of either Teletext packet 8/30/2 data or VPS data. If both are  
set to the same value the system automatically selects the format being transmitted  
(see Table 8).  
DSQ  
D7  
D6  
Data Signal Quality.  
When logic 1, good Teletext or VPS data signal is being received.  
When logic 0, no Teletext or VPS data signal is being received.  
8/30/2 RF  
8/30/2 Received Flag.  
When logic 1, and IEL (D4) = logic 0 an error-free Teletext packet 8/30/2 has been  
received, Hamming decoded and stored in the RAM. When logic 1, and IEL(D4) =  
logic 1 a Teletext packet with a valid framing code and 8/30/2 header has been  
received, Hamming decoded and stored in RAM.  
When logic 0 no Teletext packet 8/30/2 data received.  
VPS RF  
D5  
VPS Received Flag.  
When logic 1, and IEL(D4) = logic 0, an error-free VPS data line has been received,  
biphase decoded and stored in the RAM. When logic 1, and IEL(D4) = logic 1 a VPS  
data line with valid start code has been received, biphase decoded and stored in RAM.  
When logic 0 no VPS data received.  
Table 8 Selection of Teletext packet 8/30/2 data or VPS data.  
ACQ 8/30/2  
ACQ VPS  
FUNCTION  
use automatic selection algorithm for line 16  
0
0
1
1
0
1
0
1
acquire only VPS data on every VBI line  
acquire only 8/30/2 data on every line 16  
use automatic selection algorithm for line 16  
June 1994  
12  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
Register 01: Interrupt (reset state X00X XXXX)  
Register R01 is WRITE only.  
Table 9 Register 01.  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
8/30/2 IE  
VPS IE  
Table 10 Register 01 bit description.  
SYMBOL  
BIT  
FUNCTION  
8/30/2 IE  
D6  
8/30/2 Interrupt Enable.  
This allows the reception of Teletext packet 8/30/2 data to be signalled on the INT pin.  
When logic 0 reception of Teletext packet 8/30/2 data is not signalled on INT pin.  
When logic 1 reception of Teletext packet 8/30/2 data is signalled on INT pin.  
VPS IE  
D5  
VPS Interrupt Enable.  
This allows the reception of VPS data to be signalled on the INT pin.  
When logic 0 reception of VPS data is not signalled on INT pin.  
When logic 1 reception of VPS data is signalled on INT pin.  
Register 02 to 0F (HEX): VPS data bytes  
A single VPS data bytes is stored as two memory bytes, the least significant nibble of both memory bytes is the data  
making up the single VPS data byte. The most significant nibble of each memory byte is used to indicate a biphase error  
in the least significant nibble. This is indicated by the least significant bit being set, the top three bits are not used and  
are fixed to logic 0 (see Table 11).  
Table 11 VPS data bytes.  
ADDRESS (HEX)  
REGISTER  
DATA  
02  
03  
VPS B5 least significant nibble  
VPS B5 most significant nibble  
0000 1100(1)  
0000 0101(1)  
Note  
1. Equivalent to VPS B5 0101 1100 (MSB to LSB).  
Table 12 Register 02.  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIPHASE  
DATA BIT 3 DATA BIT 2 DATA BIT 1 DATA BIT 0  
ERROR BIT  
Register 11 to 1D (HEX): Teletext packet 8/30/2 data bytes  
Data is stored as single bytes. The four least significant bits represent the data. The fifth bit if set indicates a Hamming  
error in the stored data. The top three bits of the byte are not used and are fixed to logic 0.  
Table 13 Register 11.  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
HAMMING  
DATA BIT 3 DATA BIT 2 DATA BIT 1 DATA BIT 0  
ERROR BIT  
June 1994  
13  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
Register 1E to 31D (HEX): Status display message  
Data is stored as bytes which represent a Teletext character. The data is odd parity checked, if a parity error occurs this  
causes the byte not to be written to the RAM. The MSB is not used and is fixed to logic 0.  
Table 14 Register 11.  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DATA BIT 6 DATA BIT 5 DATA BIT 4 DATA BIT 3 DATA BIT 2 DATA BIT 1 DATA BIT 0  
I2C-bus slave address  
Table 16 Increment between registers.  
The slave address for the device can take one of two  
values dependent on the state of the input pin AD.  
ADDRESS  
CONTENTS  
02 to 0F (HEX) VPS data bytes  
11 to 31 (HEX) Teletext packet 8/30/2 data bytes and  
Status display message  
Table 15 Device address.  
AD  
0
SLAVE ADDRESS  
0010 001X(1)  
Addressing any register in either of these ranges will  
initialize an increment until the final stop value provided  
each byte is acknowledged by the receiver.  
1
0010 000X(1)  
Note  
Initialization during power-up  
1. Where X is the R/W bit.  
The device has an internal power-on reset unit which is  
used to reset the I2C-bus interface to be a slave  
transceiver. It also initializes the device to receive only  
completely valid Teletext packet 8/30/2 and VPS data. The  
interrupt signals for both Teletext packet 8/30/2 and VPS  
are disabled.  
I2C-bus increment  
The I2C-bus will also increment between registers as listed  
in Table 16  
June 1994  
14  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
APPLICATION INFORMATION  
100 nF  
5 V  
1
2
3
16  
15  
14  
13  
12  
11  
10  
9
video  
input  
V
CVBS  
BLACK  
IREF  
SS5  
4.7  
kΩ  
100 nF  
220 Ω  
INT to  
microcontroller  
INT  
27 kΩ  
AD  
4
5
6
(1)  
V
5 V  
SDA  
SCL  
DD  
2
100  
nF  
33  
µF  
I C bus  
SAA5233  
to microcontroller  
V
SS1  
V
OSCOUT  
OSCIN  
SS4  
SS3  
SS2  
10  
pF  
100  
nF  
15 pF  
4.7 µH  
7
8
V
V
3.3  
kΩ  
OSCGND  
27 MHz 3rd  
overtone  
MLB728  
(1) I2C-bus address 0010 001R/W.  
Fig.5 Application diagram; DIL16.  
Table 17 Crystal characteristics.  
SYMBOL  
PARAMETER  
TYP.  
MAX.  
UNIT  
Crystal (27 MHz, 3rd overtone)  
C1  
C0  
CL  
Rr  
series capacitance  
1.7  
5.2  
20  
pF  
pF  
pF  
parallel capacitance  
load capacitance  
resonance resistance  
series resistance  
ageing  
50  
R1  
Xa  
Xj  
20  
year1  
±5 × 106  
±25 × 106  
±25 × 106  
adjustment tolerance  
drift  
Xd  
June 1994  
15  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
PACKAGE OUTLINES  
22.00  
21.35  
8.25  
7.80  
3.7  
max  
4.7  
max  
3.9  
3.4  
0.51  
min  
2.2  
max  
0.254 M  
2.54  
(7x)  
0.32 max  
0.53  
max  
7.62  
1.4 max  
9.5  
8.3  
MSA254  
16  
9
8
6.48  
6.14  
1
Dimensions in mm.  
Fig.6 Plastic dual in-line package; 16 leads (300 mil); DIP16, SOT38-1.  
June 1994  
16  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
13.0  
12.6  
7.6  
7.4  
A
10.65  
10.00  
0.1 S  
S
0.9  
0.4  
(4x)  
20  
11  
1.1  
1.0  
2.45  
2.25  
2.65  
2.35  
0.3  
0.1  
0.32  
0.23  
pin 1  
index  
1.1  
0.5  
o
0 to 8  
1
10  
detail A  
MBC234 - 1  
0.49  
0.36  
0.25 M  
(20x)  
1.27  
Dimensions in mm.  
Fig.7 Plastic small outline package; 20 leads; large body; SO20L, SOT163-1.  
June 1994  
17  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
SOLDERING  
BY SOLDER PASTE REFLOW  
Reflow soldering requires the solder paste (a suspension  
of fine solder particles, flux and binding agent) to be  
applied to the substrate by screen printing, stencilling or  
pressure-syringe dispensing before device placement.  
Plastic dual in-line packages  
BY DIP OR WAVE  
The maximum permissible temperature of the solder is  
260 °C; this temperature must not be in contact with the  
joint for more than 5 s. The total contact time of successive  
solder waves must not exceed 5 s.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt, infrared, and  
vapour-phase reflow. Dwell times vary between 50 and  
300 s according to method. Typical reflow temperatures  
range from 215 to 250 °C.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified storage maximum. If the printed-circuit board has  
been pre-heated, forced cooling may be necessary  
immediately after soldering to keep the temperature within  
the permissible limit.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 min at 45 °C.  
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING  
IRON OR PULSE-HEATED SOLDER TOOL)  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two, diagonally  
opposite, end pins. Apply the heating tool to the flat part of  
the pin only. Contact time must be limited to 10 s at up to  
300 °C. When using proper tools, all other pins can be  
soldered in one operation within 2 to 5 s at between 270  
and 320 °C. (Pulse-heated soldering is not recommended  
for SO packages.)  
Apply a low-voltage soldering iron below the seating plane  
(or not more than 2 mm above it). If its temperature is  
below 300 °C, it must not be in contact for more than 10 s;  
if between 300 and 400 °C, for not more than 5 s.  
Plastic small-outline packages  
BY WAVE  
For pulse-heated solder tool (resistance) soldering of VSO  
packages, solder is applied to the substrate by dipping or  
by an extra thick tin/lead plating before package  
placement.  
During placement and before soldering, the component  
must be fixed with a droplet of adhesive. After curing the  
adhesive, the component can be soldered. The adhesive  
can be applied by screen printing, pin transfer or syringe  
dispensing.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder bath is  
10 s, if allowed to cool to less than 150 °C within 6 s.  
Typical dwell time is 4 s at 250 °C.  
A modified wave soldering technique is recommended  
using two solder waves (dual-wave), in which a turbulent  
wave with high upward pressure is followed by a smooth  
laminar wave. Using a mildly-activated flux eliminates the  
need for removal of corrosive residues in most  
applications.  
June 1994  
18  
Philips Semiconductors  
Objective specification  
Dual standard PDC decoder  
SAA5233  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
June 1994  
19  
Philips Semiconductors – a worldwide company  
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)  
Norway: Box 1, Manglerud 0612, OSLO,  
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367  
Tel. (022)74 8000, Fax. (022)74 8341  
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Tel. (02)805 4455, Fax. (02)805 4466  
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,  
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Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,  
KARACHI 75600, Tel. (021)587 4641-49,  
Fax. (021)577035/5874546.  
Tel. (01)60 101-1236, Fax. (01)60 101-1211  
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474  
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,  
Tel. (31)40 783 749, Fax. (31)40 788 399  
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,  
CEP: 04552-903-SÃO PAULO-SP, Brazil.  
P.O. Box 7383 (01064-970).  
Portugal: PHILIPS PORTUGUESA, S.A.,  
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,  
Apartado 300, 2795 LINDA-A-VELHA,  
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Tel. (011)821-2333, Fax. (011)829-1849  
Canada: INTEGRATED CIRCUITS:  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. (800)234-7381, Fax. (708)296-8556  
DISCRETE SEMICONDUCTORS: 601 Milner Ave,  
SCARBOROUGH, ONTARIO, M1B 1M8,  
Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477  
Tel. (65)350 2000, Fax. (65)251 6500  
South Africa: S.A. PHILIPS Pty Ltd., Components Division,  
195-215 Main Road Martindale, 2092 JOHANNESBURG,  
P.O. Box 7430 Johannesburg 2000,  
Tel. (011)470-5911, Fax. (011)470-5494.  
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Tel. (03)301 6312, Fax. (03)301 42 43  
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Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,  
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,  
Fax. (571)217 4549  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. (032)88 2636, Fax. (031)57 1949  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
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Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,  
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.  
Tel. (9)0-50261, Fax. (9)0-520971  
France: 4 Rue du Port-aux-Vins, BP317,  
92156 SURESNES Cedex,  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong,  
Bangkok 10260, THAILAND,  
Tel. (662)398-0141, Fax. (662)398-3319.  
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Tel. (01)4099 6161, Fax. (01)4099 6427  
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P.O. Box 10 63 23, 20043 HAMBURG,  
Tel. (040)3296-0, Fax. (040)3296 213.  
Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. (0212)279 2770, Fax. (0212)269 3094  
Tel. (01)4894 339/4894 911, Fax. (01)4814 240  
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,  
Philips House, Torrington Place, LONDON, WC1E 7HD,  
Tel. (071)436 41 44, Fax. (071)323 03 42  
Hong Kong: PHILIPS HONG KONG Ltd., Components Div.,  
6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T.,  
Tel. (852)424 5121, Fax. (852)428 6729  
India: Philips INDIA Ltd, Components Dept,  
Shivsagar Estate, A Block ,  
Dr. Annie Besant Rd. Worli, Bombay 400 018  
Tel. (022)4938 541, Fax. (022)4938 722  
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,  
P.O. Box 4252, JAKARTA 12950,  
United States:INTEGRATED CIRCUITS:  
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. (800)234-7381, Fax. (708)296-8556  
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,  
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,  
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300  
Uruguay: Coronel Mora 433, MONTEVIDEO,  
Tel. (021)5201 122, Fax. (021)5205 189  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. (02)70-4044, Fax. (02)92 0601  
For all other countries apply to: Philips Semiconductors,  
International Marketing and Sales, Building BAF-1,  
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,  
Telex 35000 phtcnl, Fax. +31-40-724825  
Tel. (01)640 000, Fax. (01)640 200  
Italy: PHILIPS COMPONENTS S.r.l.,  
Viale F. Testi, 327, 20162 MILANO,  
Tel. (02)6752.3302, Fax. (02)6752 3300.  
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,  
SCD32  
© Philips Electronics N.V. 1994  
Tel. (03)3740 5028, Fax. (03)3740 0580  
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,  
All rights are reserved. Reproduction in whole or in part is prohibited without the  
prior written consent of the copyright owner.  
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,  
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880  
Mexico: Philips Components, 5900 Gateway East, Suite 200,  
The information presented in this document does not form part of any quotation  
or contract, is believed to be accurate and reliable and may be changed without  
notice. No liability will be accepted by the publisher for any consequence of its  
use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556  
Printed in The Netherlands  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB  
Tel. (040)783749, Fax. (040)788399  
533061/01/1500/pp20  
Date of release: June 1994  
9397 736 20011  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. (09)849-4160, Fax. (09)849-7811  
Document order number:  
Philips Semiconductors  

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