PHP83N06T,127 [NXP]

PHP83N06T;
PHP83N06T,127
型号: PHP83N06T,127
厂家: NXP    NXP
描述:

PHP83N06T

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PHP83N06T  
TrenchMOS™ Standard Level FET  
Rev. 01 — 11 January 2002  
Product data  
M3D307  
1. Description  
N-channel enhancement mode field-effect power transistor in a plastic package using  
TrenchMOS™1 technology, featuring very low on-state resistance.  
Product availability:  
PHP83N06T in SOT78 (TO-220AB).  
2. Features  
TrenchMOS™ technology  
Fast switching  
Low on-state resistance.  
3. Applications  
Switch mode power supplies  
Uninterruptible power supplies  
General purpose switching.  
4. Pinning information  
Table 1: Pinning - SOT78, simplified outline and symbol  
Pin  
1
Description  
gate (g)  
Simplified outline  
Symbol  
d
s
mb  
2
drain (d)  
3
source (s)  
g
mb  
mounting base;  
connected to drain (d)  
MBB076  
MBK106  
1
2 3  
SOT78 (TO-220AB)  
1. TrenchMOS is a trademark of Koninklijke Philips Electronics N.V.  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
5. Quick reference data  
Table 2: Quick reference data  
Symbol Parameter  
Conditions  
Typ  
Max  
60  
Unit  
V
VDS  
ID  
drain-source voltage (DC)  
drain current (DC)  
-
-
-
-
Tmb = 25 °C; VGS = 10 V  
Tmb = 25 °C  
75  
A
Ptot  
Tj  
total power dissipation  
junction temperature  
166  
175  
W
°C  
RDSon  
drain-source on-state resistance  
VGS = 10 V; ID = 25 A  
Tj = 25 °C  
9
-
12  
24  
mΩ  
mΩ  
Tj = 175 °C  
6. Limiting values  
Table 3: Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
Max  
60  
Unit  
V
VDS  
VDGR  
VGS  
ID  
drain-source voltage (DC)  
-
drain-gate voltage (DC)  
gate-source voltage (DC)  
drain current (DC)  
RGS = 20 kΩ  
-
60  
V
-
±20  
75  
V
Tmb = 25 °C; VGS = 10 V; Figure 2 and 3  
Tmb = 100 °C; VGS = 10 V; Figure 2  
Tmb = 25 °C; pulsed; tp 10 µs; Figure 3  
Tmb = 25 °C; Figure 1  
-
A
-
59  
A
IDM  
Ptot  
Tstg  
Tj  
peak drain current  
-
240  
166  
+175  
+175  
A
total power dissipation  
storage temperature  
-
W
°C  
°C  
55  
55  
operating junction temperature  
Source-drain diode  
IDR  
reverse drain current (DC)  
pulsed reverse drain current  
Tmb = 25 °C  
-
-
75  
A
A
IDRM  
Tmb = 25 °C; pulsed; tp 10 µs  
240  
Avalanche ruggedness  
EDS(AL) non-repetitive avalanche energy  
unclamped inductive load; ID = 65 A;  
-
211  
mJ  
VDS 55 V; VGS = 10 V; RGS = 50 ;  
starting Tmb = 25 °C  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
2 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
03ag75  
120  
120  
I
P
der  
der  
(%)  
(%)  
80  
80  
40  
40  
0
0
0
50  
100  
150  
T
200  
0
50  
100  
150  
200  
(oC)  
(ºC)  
T
mb  
mb  
V
GS 4.5 V  
Ptot  
Pder  
=
× 100%  
----------------------  
P
ID  
°
tot(25 C)  
Ider  
=
× 100%  
------------------  
I
°
D(25 C)  
Fig 1. Normalized total power dissipation as a  
function of mounting base temperature.  
Fig 2. Normalized continuous drain current as a  
function of mounting base temperature.  
03ag66  
3
10  
I
D
R
= V  
/ I  
DS D  
DSon  
(A)  
t
= 10 µs  
p
2
10  
100 µs  
1 ms  
10  
DC  
10 ms  
100 ms  
1
2
10  
1
10  
V
(V)  
DS  
Tmb = 25 °C; IDM single pulse; VGS = 10 V  
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
3 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
7. Thermal characteristics  
Table 4: Thermal characteristics  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
Rth(j-mb) thermal resistance from junction to mounting base Figure 4  
-
-
-
0.9 K/W  
K/W  
Rth(j-a)  
thermal resistance from junction to ambient  
SOT78 package; vertical in still air  
60  
-
7.1 Transient thermal impedance  
03ag65  
1
Z
th(j-mb)  
(K/W)  
δ = 0.5  
0.2  
-1  
10  
10  
10  
0.1  
0.05  
0.02  
-2  
-3  
t
p
P
δ =  
T
single pulse  
t
t
p
T
t
-6  
10  
-5  
10  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
1
(s)  
p
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
4 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
8. Characteristics  
Table 5: Characteristics  
Tj = 25 °C unless otherwise specified.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
Static characteristics  
V(BR)DSS drain-source breakdown voltage  
ID = 0.25 mA; VGS = 0 V  
Tj = 25 °C  
60  
55  
-
-
-
-
V
V
Tj = 55 °C  
VGS(th)  
gate-source threshold voltage  
drain-source leakage current  
ID = 1 mA; VDS = VGS; Figure 9  
Tj = 25 °C  
2
1
-
3
-
4
V
V
V
Tj = 175 °C  
-
Tj = 55 °C  
-
4.4  
IDSS  
VDS = 55 V; VGS = 0 V  
Tj = 25 °C  
-
-
-
0.05 10  
µA  
Tj = 175 °C  
-
500 µA  
IGSS  
gate-source leakage current  
VGS = ±20 V; VDS = 0 V  
VGS = 10 V; ID = 25 A; Figure 7 and 8  
Tj = 25 °C  
2
100 nA  
RDSon  
drain-source on-state resistance  
-
-
9
-
12  
24  
mΩ  
mΩ  
Tj = 175 °C  
Dynamic characteristics  
Qg(tot)  
Qgs  
Qgd  
Ciss  
Coss  
Crss  
td(on)  
tr  
total gate charge  
gate-source charge  
gate-drain (Miller) charge  
input capacitance  
output capacitance  
reverse transfer capacitance  
turn-on delay time  
rise time  
VDD = 44 V; ID = 25 A; VGS = 10 V; Figure 13  
VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 11  
VDD = 30 V; RL = 1.2 ; VGS = 10 V; RG = 10 Ω  
-
-
-
-
-
-
-
-
-
-
70  
10  
26  
-
-
-
nC  
nC  
nC  
2230 3093 pF  
510 645 pF  
290 467 pF  
18  
90  
84  
68  
-
-
-
-
ns  
ns  
ns  
ns  
td(off)  
tf  
turn-off delay time  
fall time  
Source-drain diode  
VSD  
trr  
source-drain (diode forward) voltage IS = 25 A; VGS = 0 V; Figure 12  
-
-
-
0.85 1.2  
V
reverse recovery time  
recovered charge  
IS = 20 A; dIS/dt = 100 A/µs  
VGS = 10 V; VDS = 30 V  
62  
-
-
ns  
nC  
Qr  
140  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
5 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
03ag67  
6 V  
03afg69  
80  
80  
D
10 V 7 V  
T
= 25 ºC  
V
> I x R  
DSon  
j
DS  
D
I
I
D
(A)  
60  
(A)  
60  
5.5 V  
40  
20  
0
40  
20  
0
5 V  
175 ºC  
V
= 4.5 V  
T = 25 ºC  
j
GS  
0
0.4  
0.8  
1.2  
1.6  
2
0
2
4
6
8
V
(V)  
GS  
V
(V)  
DS  
Tj = 25 °C; tp = 300 µs  
Tj = 25 °C and 175 °C; VDS > ID × RDSon  
Fig 5. Output characteristics: drain current as a  
function of drain-source voltage; typical values.  
Fig 6. Transfer characteristics: drain current as a  
function of gate-source voltage; typical values.  
03ag68  
0.02  
2.4  
a
R
T = 25 ºC  
V = 6 V  
GS  
DSon  
j
()  
0.015  
0.01  
0.005  
0
1.8  
7 V  
1.2  
0.6  
0
10 V  
0
20  
40  
60  
80  
-60  
0
60  
120  
180  
T (oC)  
I
(A)  
D
j
Tj = 25 °C  
RDSon  
a =  
---------------------------  
RDSon(25 C)  
°
Fig 7. Drain-source on-state resistance as a function  
of drain current; typical values.  
Fig 8. Normalized drain-source on-state resistance  
factor as a function of junction temperature.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
6 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
03aa32  
03aa35  
-1  
-2  
-3  
-4  
-5  
-6  
5
10  
D
I
V
GS(th)  
(A)  
10  
(V)  
4
3
2
1
0
max  
typ  
min  
typ  
max  
10  
10  
10  
10  
min  
-60  
0
60  
120  
180  
0
2
4
6
T (oC)  
V
GS  
(V)  
j
ID = 1 mA; VDS = VGS  
Tj = 25 °C; VDS = VGS  
Fig 9. Gate-source threshold voltage as a function of  
junction temperature.  
Fig 10. Sub-threshold drain current as a function of  
gate-source voltage.  
03ag71  
4
10  
C
(pF)  
C
iss  
3
10  
C
oss  
C
rss  
2
10  
-1  
2
10  
1
10  
10  
V
(V)  
DS  
VGS = 0 V; f = 1 MHz  
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
7 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
03ag70  
03ag72  
80  
10  
V
= 0 V  
V
I
= 25 A  
GS  
GS  
D
I
S
(V)  
(A)  
60  
T = 25 ºC  
j
8
6
4
2
0
V
= 14 V  
44 V  
DD  
40  
20  
0
T = 25 ºC  
175 ºC  
j
0
0.4  
0.8  
1.2  
0
20  
40  
60  
80  
V
(V)  
Q
(nC)  
SD  
G
VGS = 0 V  
Tj = 25 °C; ID = 25 A  
Fig 12. Reverse diode current as a function of reverse  
diode voltage; typical values.  
Fig 13. Gate-source voltage as a function of turn-on  
gate charge; typical values.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
8 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
9. Package outline  
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB  
SOT78  
E
p
A
A
1
q
mounting  
base  
D
1
D
(1)  
L
L
2
1
Q
b
1
L
1
2
3
b
c
e
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
b
L
max.  
(1)  
2
e
A
b
D
E
L
D
L
1
A
c
UNIT  
p
q
Q
1
1
1
4.5  
4.1  
1.39  
1.27  
0.9  
0.7  
1.3  
1.0  
0.7  
0.4  
15.8  
15.2  
6.4  
5.9  
10.3  
9.7  
15.0  
13.5  
3.30  
2.79  
3.8  
3.6  
3.0  
2.7  
2.6  
2.2  
mm  
3.0  
2.54  
Note  
1. Terminals in this zone are not tinned.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SC-46  
00-09-07  
01-02-16  
SOT78  
3-lead TO-220AB  
Fig 14. SOT78 (TO-220AB).  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
9 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
10. Revision history  
Table 6: Revision history  
Rev Date  
CPCN  
-
Description  
01 20020111  
Product data; initial version  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
10 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
11. Data sheet status  
[1]  
[2]  
Data sheet status  
Product status  
Definition  
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips Semiconductors  
reserves the right to change the specification in any manner without notice.  
Preliminary data  
Product data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be published at a  
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to  
improve the design and supply the best possible product.  
This data sheet contains data from the product specification. Philips Semiconductors reserves the right to  
make changes at any time in order to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change Notification (CPCN) procedure  
SNW-SQ-650A.  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
12. Definitions  
Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are  
stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics  
sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information Applications that are described herein for any of these products are for illustrative purposes  
only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified  
use without further testing or modification.  
13. Disclaimers  
Life support — These products are not designed for use in life support appliances, devices, or systems where  
malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers  
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips  
Semiconductors for any damages resulting from such application.  
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products,  
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or  
performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys  
no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or  
warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
9397 750 09122  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
Product data  
Rev. 01 — 11 January 2002  
11 of 13  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
Contact information  
For additional information, please visit http://www.semiconductors.philips.com.  
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.  
12 of 13  
9397 750 09122  
Product data  
Rev. 01 — 11 January 2002  
PHP83N06T  
TrenchMOS™ Standard Level FET  
Philips Semiconductors  
Contents  
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5  
Transient thermal impedance . . . . . . . . . . . . . . 5  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2
3
4
5
6
7
7.1  
8
9
10  
11  
12  
13  
© Koninklijke Philips Electronics N.V. 2002.  
Printed in The Netherlands  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or  
contract, is believed to be accurate and reliable and may be changed without notice. No  
liability will be accepted by the publisher for any consequence of its use. Publication  
thereof does not convey nor imply any license under patent- or other industrial or  
intellectual property rights.  
Date of release: 11 January 2002  
Document order number: 9397 750 09122  

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