PESD5V2S18U [NXP]
ESD protection array; ESD保护阵列
| 型号： | PESD5V2S18U |
| 厂家： | 
NXP |
| 描述： | ESD protection array |
| 文件： | 总8页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
PESD5V2S18U
ESD protection array
Product specification
2003 Apr 28
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
FEATURES
PINNING
PIN
• Uni-directional ESD protection of
up to 18 lines
DESCRIPTION
1 to 5
6 and 16
7 to 15
cathode (k1 to k5)
• Maximum peak reverse power:
PPP = 100 W at tp = 8/20 µs
common anode (a1; a2)
cathode (k6 to k14)
• Low clamping voltage:
VCL = 12 V max. at IZSM = 10 A
17 to 20
cathode (k15 to k18)
• Low leakage current:
IR = 100 nA typ. at VRWM = 5.2 V
handbook, 4 columns
• IEC 61000-4-2, level 4 (ESD);
1
2
20
19
18
17
16
15
14
13
12
11
15 kV (air) and 8 kV (contact).
1
20
3
APPLICATIONS
4
• Printer parallel ports
5
• Computers and peripherals
• Communication systems.
6
7
DESCRIPTION
8
Monolithic ESD protection device
designed to protect up to
18 transmission or data lines from the
damage caused by electrostatic
discharge (ESD) and surge pulses.
9
10
11
10
MHC510
Fig.1 Simplified outline (SSOP20; SOT339-1) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
IPP
PARAMETER
CONDITIONS
tp = 8/20 µs
tp = 8/20 µs
MIN.
MAX.
10
UNIT
non-repetitive peak reverse current
−
−
A
PPP
non-repetitive peak reverse power
dissipation
100
W
Tstg
Tj
storage temperature
−65
−65
+150
+150
−
°C
°C
kV
kV
junction temperature
electrostatic discharge voltage
IEC 61000-4-2 (contact discharge) 30
HBM MIL-Std 883
10
−
ESD standards compliance
IEC 61000-4-2, level 4 (ESD)
HBM MIL-Std 883, class 3
>15 kV (air); >8 kV (contact)
>4 kV
2003 Apr 28
2
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to
ambient
one or more diodes loaded
135
K/W
Note
1. Refer to SOT339-1 standard mounting conditions.
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
5.2
UNIT
VRWM
crest working reverse
voltage
−
−
V
IR
reverse current
VRWM = 5.2 V
IZSM = 3 A; tp = 8/20 µs; see Fig.5
ZSM = 10 A; tp = 8/20 µs; see Fig.5
−
−
−
0.1
−
1
µA
V
VCL
clamping voltage
8
I
−
12
7.2
40
8
V
VBR
rdiff
breakdown voltage
IZ = 5 mA
6.4
−
6.8
−
V
differential resistance
IZ = 1 mA
Ω
IZ = 5 mA
−
−
Ω
Cd
diode capacitance
VR = 0; f = 1 MHz; see Fig.4
−
100
−
pF
2003 Apr 28
3
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
MHC485
MHC486
3
2
10
10
handbook, halfpage
handbook, halfpage
P
I
ZSM
ZSM
(W)
(A)
2
10
10
10
10
1
10
−2
−1
−2
−1
10
1
10
10
1
10
t
(ms)
t (ms)
p
p
Fig.2 Maximum non-repetitive peak reverse
power as a function of pulse duration.
Fig.3 Maximum non-repetitive peak reverse
current as a function of pulse duration.
MHC488
MHC487
110
11
handbook, halfpage
handbCook, halfpage
d
V
CL
(V)
(pF)
100
10
90
80
70
9
8
7
60
50
40
3
4
5
6
7
8
9
I
10
(A)
0
1
2
3
4
5
6
V
(V)
PP
R
f = 1 MHz; Tamb = 25 °C
tp = 8/20 µs
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
Fig.5 Clamping voltage as a function of peak
reverse pulse current; typical values.
2003 Apr 28
4
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
ESD TESTER
RG 223/U
50 Ω coax
DIGITIZING
OSCILLOSCOPE
R
Z
450 Ω
10×
ATTENUATOR
C
Z
50 Ω
note 1
Note 1: attenuator is only used for open
socket high voltage measurements
IEC 1000-4-2 network
C
= 150 pF; R = 330 Ω
Z
Z
1/18 PESD5V2S18U
vertical scale = 200 V/Div
horizontal scale = 50 ns/Div
vertical scale = 5 V/Div
horizontal scale = 50 ns/Div
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC 1000−4−2 network)
clamped +1 kV ESD voltage waveform
(IEC 1000−4−2 network)
GND
GND
vertical scale = 200 V/Div
horizontal scale = 50 ns/Div
vertical scale = 5 V/Div
horizontal scale = 50 ns/Div
unclamped −1 kV ESD voltage waveform
(IEC 1000−4−2 network)
clamped −1 kV ESD voltage waveform
(IEC 1000−4−2 network)
MHC489
Fig.6 ESD clamping test set-up and waveforms.
2003 Apr 28
5
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A
X
c
H
v
M
A
y
E
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.9
0.5
mm
2
0.65
0.25
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT339-1
MO-150
2003 Apr 28
6
Philips Semiconductors
Product specification
ESD protection array
PESD5V2S18U
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Apr 28
7
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/01/pp8
Date of release: 2003 Apr 28
Document order number: 9397 750 10889
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