PDTC144TU [NXP]
PNP resistor-equipped transistors; R1 = 47 kW-ohm, R2 = open; PNP电阻配备晶体管; R1 = 47千瓦欧姆， R2 =开放
| 型号： | PDTC144TU |
| 厂家： | 
NXP |
| 描述： | PNP resistor-equipped transistors; R1 = 47 kW-ohm, R2 = open |
| 文件： | 总14页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
PDTA144T series
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
Product specification
2004 Aug 05
Supersedes data of 2004 Apr 27
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
FEATURES
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
PARAMETER
TYP. MAX. UNIT
• Simplified circuit design
VCEO
collector-emitter
voltage
−
−50
V
• Reduction of component count
• Reduced pick and place costs.
IO
output current (DC)
bias resistor
open
−
−100 mA
R1
R2
47
−
−
−
kΩ
−
APPLICATIONS
• General purpose switching and amplification
• Inverter and interface circuits
• Circuit driver.
DESCRIPTION
PNP resistor-equipped transistor (see “Simplified outline,
symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
MARKING CODE
NPN COMPLEMENT
PHILIPS
SOT416
EIAJ
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TM
PDTA144TS
PDTA144TT
PDTA144TU
SC-75
SC-89
SC-59
SC-101
SC-43
−
5B
2M
PDTC144TE
PDTC144TEF
PDTC144TK
PDTC144TM
PDTC144TS
PDTC144TT
PDTC144TU
SOT490
SOT346
58
SOT883
F9
SOT54 (TO-92)
SOT23
TA144T
*AF(1)
*7A(1)
SOT323
SC-70
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
2004 Aug 05
2
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
DESCRIPTION
PDTA144TS
1
2
3
base
collector
emitter
handbook, halfpage
2
3
1
2
3
R1
1
MAM352
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TT
PDTA144TU
1
2
3
base
emitter
collector
handbook, halfpage
3
3
2
R1
1
1
2
Top view
MDB272
PDTA144TM
1
2
3
base
emitter
collector
handbook, halfpage
3
R1
2
1
3
1
2
Bottom view
MDB268
2004 Aug 05
3
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PDTA144TE
PDTA144TEF
PDTA144TK
PDTA144TM
−
−
−
−
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
SOT416
SOT490
SOT346
SOT883
leadless ultra small plastic package; 3 solder lands;
body 1.0 × 0.6 × 0.5 mm
PDTA144TS
PDTA144TT
PDTA144TU
−
−
−
plastic single-ended leaded (through hole) package; 3 leads
plastic surface mounted package; 3 leads
SOT54
SOT23
SOT323
plastic surface mounted package; 3 leads
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
VCEO
VEBO
IO
PARAMETER
CONDITIONS
open emitter
MIN.
MAX.
−50
UNIT
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current (DC)
peak collector current
total power dissipation
SOT23
−
−
−
−
−
V
open base
−50
−5
V
open collector
V
−100
−100
mA
mA
ICM
Ptot
Tamb ≤ 25 °C
note 1
−
−
−
−
−
−
−
250
500
200
250
150
250
250
+150
150
+150
mW
mW
mW
mW
mW
mW
mW
°C
SOT54
note 1
SOT323
note 1
SOT346
note 1
SOT416
note 1
SOT490
notes 1 and 2
notes 2 and 3
SOT883
Tstg
Tj
storage temperature
junction temperature
operating ambient temperature
−65
−
°C
Tamb
−65
°C
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 µm copper strip line.
2004 Aug 05
4
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
SOT23
note 1
500
250
625
500
833
500
500
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT54
note 1
SOT323
SOT346
SOT416
SOT490
SOT883
note 1
note 1
note 1
notes 1 and 2
notes 2 and 3
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 µm copper strip line.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
VCB = −50 V; IE = 0 A
MIN.
TYP. MAX. UNIT
collector-base cut-off current
collector-emitter cut-off current
−
−
−100
−1
nA
µA
µA
nA
ICEO
VCE = −30 V; IB = 0 A
−
−
VCE = −30 V; IB = 0; Tj = 150 °C
VEB = −5 V; IC = 0 A
−
−
−50
−100
−
IEBO
hFE
emitter-base cut-off current
DC current gain
−
−
VCE = −5 V; IC = −1 mA
100
−
−
VCEsat
R1
collector-emitter saturation voltage IC = −10 mA; IB = −0.5 mA
−
−150
61
mV
kΩ
pF
input resistor
33
−
47
−
Cc
collector capacitance
IE = ie = 0; VCB = −10 V;
3
f = 1 MHz
2004 Aug 05
5
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
PACKAGE OUTLINES
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
1
UNIT
A
b
b
c
D
d
E
e
e
L
1
1
max.
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
97-02-28
04-06-28
SOT54
TO-92
SC-43A
2004 Aug 05
6
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-02-28
99-09-13
SOT23
TO-236AB
2004 Aug 05
7
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface mounted package; 3 leads
SOT346
E
A
D
B
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
L
p
e
1
b
p
w M
B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
A
p
1
p
1
E
1.3
1.0
0.1
0.013
0.50
0.35
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
1.9
0.95
0.2
0.2
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
98-07-17
SOT346
TO-236
SC-59
2004 Aug 05
8
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface mounted package; 3 leads
SOT323
D
B
E
A
X
H
y
v M
A
E
3
Q
A
A
1
c
1
2
L
p
e
1
b
p
w
M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
A
UNIT
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.3
0.65
0.2
0.2
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT323
SC-70
97-02-28
2004 Aug 05
9
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface mounted package; 3 leads
SOT416
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
1
2
c
e
1
b
p
w
M
B
L
p
e
detail X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
A
UNIT
b
c
D
E
e
e
H
L
p
Q
v
w
p
1
E
max
0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7
1.75
1.45
0.45
0.15
0.23
0.13
0.95
0.60
mm
0.1
1
0.5
0.2
0.2
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-02-28
SOT416
SC-75
2004 Aug 05
10
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Plastic surface mounted package; 3 leads
SOT490
D
B
E
A
X
H
v
M
A
E
3
A
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
p
c
D
E
e
e
H
L
v
w
A
p
1
E
0.8
0.6
0.33
0.23
0.2
0.1
1.7
1.5
0.95
0.75
1.7
1.5
0.5
0.3
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
98-10-23
SOT490
SC-89
2004 Aug 05
11
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
1
UNIT
A
b
b
D
E
e
e
L
L
1
1
1
max.
0.50
0.46
0.20 0.55 0.62 1.02
0.12 0.47 0.55 0.95
0.30 0.30
0.22 0.22
mm
0.03
0.35 0.65
Note
1. Including plating thickness
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEITA
03-02-05
03-04-03
SOT883
SC-101
2004 Aug 05
12
Philips Semiconductors
Product specification
PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = open
PDTA144T series
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL ://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Aug 05
13
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/03/pp14
Date of release: 2004 Aug 05
Document order number: 9397 750 13661
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