PDTC144VK [NXP]
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ; NPN电阻配备晶体管; R1 = 47 kΩ的， R2 = 10 kΩ的
| 型号： | PDTC144VK |
| 厂家： | 
NXP |
| 描述： | NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ |
| 文件： | 总11页 (文件大小：139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PDTC144V series
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
Rev. 04 — 16 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN resistor-equipped transistors.
Table 1. Product overview
Type number
Package
NXP
PNP complement
JEITA
SC-75
SC-59A
SC-101
SC-43A
-
PDTC144VE
PDTC144VK
PDTC144VM
PDTC144VS[1]
PDTC144VT
PDTC144VU
SOT416
SOT346
SOT883
SOT54 (TO-92)
SOT23
PDTA144VE
PDTA144VK
PDTA144VM
PDTA144VS
PDTA144VT
PDTA144VU
SOT323
SC-70
[1] Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
Built-in bias resistors
Reduces component count
Simplifies circuit design
Reduces pick and place costs
1.3 Applications
General-purpose switching and
amplification
Circuit drivers
Inverter and interface circuits
1.4 Quick reference data
Table 2.
Symbol
VCEO
IO
Quick reference data
Parameter
Conditions
Min
-
Typ
-
Max
50
Unit
V
collector-emitter voltage
output current (DC)
bias resistor 1 (input)
bias resistor ratio
open base
-
-
100
61
mA
kΩ
R1
33
0.17
47
0.21
R2/R1
0.26
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
Symbol
SOT54
1
2
3
input (base)
2
3
output (collector)
GND (emitter)
R1
1
1
1
1
1
1
2
3
R2
001aab347
006aaa145
SOT54A
1
2
3
input (base)
2
3
output (collector)
GND (emitter)
R1
R1
R1
R1
1
2
R2
3
001aab348
006aaa145
SOT54 variant
1
2
3
input (base)
2
3
output (collector)
GND (emitter)
1
2
3
R2
001aab447
006aaa145
SOT23, SOT323, SOT346, SOT416
1
2
3
input (base)
3
3
2
GND (emitter)
output (collector)
R2
1
2
006aaa144
sym007
SOT883
1
2
3
input (base)
3
2
GND (emitter)
output (collector)
R2
sym007
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
2 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
3. Ordering information
Table 4.
Ordering information
Type number Package
Name
Description
Version
SOT416
SOT346
PDTC144VE
PDTC144VK
PDTC144VM
SC-75
plastic surface mounted package; 3 leads
SC-59A plastic surface mounted package; 3 leads
SC-101
leadless ultra small plastic package; 3 solder lands; SOT883
body 1.0 × 0.6 × 0.5 mm
PDTC144VS[1] SC-43A plastic single-ended leaded (through hole) package; SOT54
3 leads
PDTC144VT
PDTC144VU
-
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
SOT23
SC-70
SOT323
[1] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
Table 5.
Marking codes
Type number
PDTC144VE
PDTC144VK
PDTC144VM
PDTC144VS
PDTC144VT
PDTC144VU
Marking code[1]
18
29
G6
TC144V
*AA
*18
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
3 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
VI
Parameter
Conditions
open emitter
open base
Min
Max
50
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
-
-
-
50
V
open collector
15
V
positive
-
-
-
-
+40
−15
100
100
V
negative
V
IO
output current (DC)
peak collector current
total power dissipation
SOT416
mA
mA
ICM
Ptot
[1]
[1]
Tamb ≤ 25 °C
Tamb ≤ 25 °C
Tamb ≤ 25 °C
Tamb ≤ 25 °C
Tamb ≤ 25 °C
Tamb ≤ 25 °C
-
150
250
250
500
250
200
+150
150
+150
mW
mW
mW
mW
mW
mW
°C
SOT346
-
[2][3]
[1]
SOT883
-
SOT54
-
[1]
SOT23
-
[1]
SOT323
-
Tstg
Tj
storage temperature
junction temperature
ambient temperature
−65
-
°C
Tamb
−65
°C
[1] Refer to standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
[3] Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60 μm copper strip line.
6. Thermal characteristics
Table 7.
Symbol Parameter
Rth(j-a) thermal resistance from
Thermal characteristics
Conditions
Min
Typ
Max
Unit
in free air
junction to ambient
[1]
[1]
SOT416
-
-
-
-
-
-
-
-
-
-
-
-
833
500
500
250
500
625
K/W
K/W
K/W
K/W
K/W
K/W
SOT346
[2][3]
[1]
SOT883
SOT54
[1]
SOT23
[1]
SOT323
[1] Refer to standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
[3] Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60 μm copper strip line.
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
4 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
7. Characteristics
Table 8.
Characteristics
T
amb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
ICBO
Min
Typ
Max
Unit
collector-base cut-off VCB = 50 V; IE = 0 A
current
-
-
100
nA
ICEO
collector-emitter
cut-off current
VCE = 30 V; IB = 0 A
-
-
-
-
1
μA
μA
VCE = 30 V; IB = 0 A;
50
Tj = 150 °C
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
-
-
150
μA
hFE
DC current gain
VCE = 5 V; IC = 5 mA
40
-
-
-
-
VCEsat
collector-emitter
IC = 10 mA; IB = 0.5 mA
150
mV
saturation voltage
VI(off)
VI(on)
R1
off-state input voltage VCE = 5 V; IC = 100 μA
on-state input voltage VCE = 300 mV; IC = 2 mA
bias resistor 1 (input)
-
3.1
3.8
47
1
V
6
-
V
33
0.17
-
61
0.26
2
kΩ
R2/R1
Cc
bias resistor ratio
0.21
-
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
pF
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
5 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
006aaa099
006aaa100
3
10
1
h
FE
(2) (1)
V
CEsat
(V)
2
10
(3)
−1
10
(1)
(2)
(3)
10
−2
1
10
10
−1
2
2
1
10
10
1
10
10
I
(mA)
I (mA)
C
C
VCE = 5 V
IC/IB = 20
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
Fig 1. DC current gain as a function of collector
current; typical values
Fig 2. Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa101
006aaa102
10
10
V
V
I(off)
(V)
I(on)
(1)
(2)
(1)
(2)
(V)
(3)
(3)
1
10
1
10
−1
2
−1
1
10
10
1
10
I
(mA)
I (mA)
C
C
VCE = 0.3 V
VCE = 5 V
(1) Tamb = −40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(1) Tamb = −40 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 3. On-state input voltage as a function of
collector current; typical values
Fig 4. Off-state input voltage as a function of
collector current; typical values
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
6 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
8. Package outline
3.1
2.7
1.3
1.0
1.8
1.4
0.95
0.60
3
0.6
0.2
3
0.45
0.15
3.0 1.7
2.5 1.3
1.75 0.9
1.45 0.7
1
2
1
2
0.30
0.15
0.25
0.10
0.50
0.35
0.26
0.10
1.9
1
Dimensions in mm
04-11-04
Dimensions in mm
04-11-11
Fig 5. Package outline SOT416 (SC-75)
Fig 6. Package outline SOT346 (SC-59A/TO-236)
0.62
0.55
0.50
0.46
0.55
0.47
0.45
0.38
4.2
3.6
3
0.30
0.22
0.48
0.40
1.02
0.95
0.65
1
2
4.8
4.4
2.54
0.30
0.22
1.27
3
2
1
0.20
0.12
5.2
5.0
14.5
12.7
0.35
Dimensions in mm
03-04-03
Dimensions in mm
04-11-16
Fig 7. Package outline SOT883 (SC-101)
Fig 8. Package outline SOT54 (SC-43A/TO-92)
0.45
0.38
0.45
0.38
4.2
3.6
4.2
3.6
1.27
0.48
0.40
3 max
1
2.5
max
0.48
0.40
1
2
3
2
4.8
4.4
5.08
4.8
4.4
2.54
1.27
2.54
3
5.2
5.0
14.5
12.7
5.2
5.0
14.5
12.7
Dimensions in mm
04-06-28
Dimensions in mm
05-01-10
Fig 9. Package outline SOT54A
Fig 10. Package outline SOT54 variant
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
7 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
3
3
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
1
2
1
2
0.4
0.3
0.25
0.10
0.48
0.38
0.15
0.09
1.9
1.3
Dimensions in mm
04-11-04
Dimensions in mm
04-11-04
Fig 11. Package outline SOT23 (TO-236AB)
Fig 12. Package outline SOT323 (SC-70)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
5000
10000
-135
-135
-315
-
PDTC144VE
PDTC144VK
PDTC144VM
PDTC144VS
SOT416
SOT346
SOT883
SOT54
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
bulk, straight leads
-115
-
-115
-
-
-
-
-412
SOT54A
tape and reel, wide pitch
-
-
-116
-126
-
tape ammopack, wide pitch
bulk, delta pinning
-
-
SOT54 variant
SOT23
-
-112
PDTC144VT
PDTC144VU
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-215
-115
-
-
-235
-135
SOT323
[1] For further information and the availability of packing methods, see Section 12.
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
8 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
10. Revision history
Table 10. Revision history
Document ID
Release date
20091116
Data sheet status
Change notice
Supersedes
PDTC144V_SER_4
Modifications:
Product data sheet
-
PDTC144V_SER_3
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PDTC144V_SER_3
PDTC144VT_2
PDTC144VT_1
20050215
20040511
20040305
Product data sheet
Objective data sheet
Objective data sheet
-
-
-
PDTC144VT_2
PDTC144VT_1
-
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
9 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PDTC144V_SER_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 16 November 2009
10 of 11
PDTC144V series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 November 2009
Document identifier: PDTC144V_SER_4
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