PCK2001DL,112 [NXP]

PCK2001 - 14.318-150 MHz I2C 1:18 clock buffer SSOP 48-Pin;
PCK2001DL,112
型号: PCK2001DL,112
厂家: NXP    NXP
描述:

PCK2001 - 14.318-150 MHz I2C 1:18 clock buffer SSOP 48-Pin

PC 驱动 光电二极管 逻辑集成电路
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INTEGRATED CIRCUITS  
PCK2001  
14.318–150 MHz I2C 1:18 clock buffer  
Product data  
2002 Jun 03  
Supersedes data of 1999 Jul 06  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
FEATURES  
HIGH speed, LOW noise non-inverting 1–18 buffer  
Typically used to support four SDRAM DIMMs  
Multiple V , V pins for noise reduction  
DD  
SS  
3.3 V operation  
Separate 3-State pin for testing  
ESD protection exceeds 2000 V per Standard 801.2  
Optimized for 66 MHz, 100 MHz and 133 MHz operation  
175 ps skew outputs  
DESCRIPTION  
The PCK2001 is a 1–18 fanout buffer used for 133/100 MHz CPU,  
66/33 MHz PCI, 14.318 MHz REF, or 133/100/66 MHz SDRAM clock  
distribution. 18 outputs are typically used to support up to four  
SDRAM DIMMS commonly found in desktop, workstation or server  
applications.  
Available in 48-pin SSOP package  
See PCK2001M for mobile (reduced pincount) 28-pin 1-10 buffer  
version  
All clock outputs meet Intel’s drive, rise/fall time, accuracy, and skew  
2
requirements. An I C interface is included to allow each output to be  
2
enabled/disabled individually. An output disabled via the I C  
interface will be held in the LOW state. In addition, there is an OE  
input which 3-States all outputs.  
2
Individual clock output enable/disable via I C  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
= 3.3 V; C = 30 pF  
TYPICAL  
UNIT  
t
t
Propagation delay  
2.5  
2.5  
PLH  
PHL  
V
ns  
CC  
L
BUF_IN to BUF_OUT  
Rise time  
n
t
r
V
CC  
V
CC  
V
CC  
= 3.3 V, C = 30 pF  
1.0  
700  
50  
ns  
ps  
µA  
L
t
f
Fall time  
= 3.3 V, C = 20 pF  
L
I
Total supply current  
= 3.465 V  
CC  
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE  
ORDER CODE  
DRAWING NUMBER  
48-Pin Plastic SSOP  
0 °C to +70 °C  
PCK2001DL  
SOT370-1  
PIN CONFIGURATION  
PIN DESCRIPTION  
PIN  
NUMBER  
I/O  
TYPE  
SYMBOL  
FUNCTION  
RESERVED  
RESERVED  
1
2
3
4
5
6
7
8
9
48  
47  
46  
RESERVED  
RESERVED  
4, 5, 8, 9  
Output BUF_OUT (0–3) Buffered clock outputs  
V
V
DD9  
DD0  
13, 14, 17, 18 Output BUF_OUT (4–7) Buffered clock outputs  
45  
BUF_OUT0  
BUF_OUT1  
BUF_OUT15  
31, 32, 35,  
36  
BUF_OUT  
(8–11)  
44 BUF_OUT14  
V
Output  
Output  
Buffered clock outputs  
Buffered clock outputs  
V
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
SS0  
SS9  
DD8  
V
V
40, 41, 44,  
45  
BUF_OUT  
(12–15)  
DD1  
BUF_OUT2  
BUF_OUT13  
BUF_OUT12  
BUF_OUT3  
V
BUF_OUT  
(16–17)  
21, 28  
11  
Output  
Input  
Buffered clock outputs  
Buffered clock input  
V
SS1 10  
SS8  
OE  
BUF_IN 11  
BUF_IN  
V
V
DD2 12  
DD7  
Active-HIGH output  
enable  
BUF_OUT4 13  
BUF_OUT11  
BUF_OUT10  
38  
Input  
OE  
BUF_OUT5 14  
V
2
24  
25  
I/O  
SDA  
SCL  
I C serial data  
V
SS2  
DD3  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
SS7  
V
V
2
DD6  
Input  
I C serial clock  
BUF_OUT6  
BUF_OUT7  
BUF_OUT9  
BUF_OUT8  
3, 7, 12, 16,  
20, 29, 33,  
37, 42, 46  
Input  
V
3.3 V power supply  
Ground  
DD (0–9)  
V
V
SS3  
SS6  
V
V
DD4  
DD5  
6, 10, 15, 19,  
22, 27, 30,  
34, 39, 43  
BUF_OUT17  
BUF_OUT16  
Input  
Input  
V
SS (0–9)  
V
V
27  
SS4  
SS5  
V
V
DDI2C  
SDA  
26 SSI2C  
2
3.3 V I C power  
25  
23  
V
DDI2C  
SCL  
supply  
SW00567  
2
26  
Input  
n/a  
V
I C ground  
SSI2C  
2
I C is a trademark of Koninklijke Philips Electronics N.V.  
1, 2, 47, 48  
RESERVED  
Undefined  
2
2002 Jun 03  
853-2072 28362  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
FUNCTION TABLE  
2
OE  
L
BUF_IN  
I CEN  
BUF_OUTn  
X
L
X
X
H
L
Z
L
H
H
H
H
H
L
H
1, 2  
ABSOLUTE MAXIMUM RATINGS  
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to V (V = 0 V).  
SS  
SS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITION  
UNIT  
MIN  
MAX  
+4.6  
–50  
5.5  
V
I
DC 3.3 V supply voltage  
DC input diode current  
DC input voltage  
–0.5  
V
mA  
V
DD  
V < 0 V  
I
IK  
V
I
Note 2  
–0.5  
–0.5  
–65  
I
DC output diode current  
DC output voltage  
V
> V or V < 0 V  
±50  
mA  
V
OK  
O
DD  
O
V
O
Note 2  
>= 0 V to V  
DD  
V
CC  
+ 0.5  
I
O
DC output source or sink current  
Storage temperature range  
V
±50  
mA  
°C  
O
T
stg  
+150  
Power dissipation per package  
plastic medium-shrink SO (SSOP)  
For temperature range: 0 to +70 °C  
above +55 °C derate linearly with 11.3 mW/K  
P
TOT  
850  
mW  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
MIN  
3.135  
20  
MAX  
3.465  
30  
V
DD  
DC 3.3 V supply voltage  
V
pF  
V
C
Capacitive load  
L
V
I
DC input voltage range  
0
V
DD  
V
DD  
V
O
DC output voltage range  
0
V
T
amb  
Operating ambient temperature range in free air  
0
+70  
°C  
3
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
DC CHARACTERISTICS  
LIMITS  
= 0 °C to +70 °C  
TEST CONDITIONS  
OTHER  
T
UNIT  
SYMBOL  
PARAMETER  
amb  
V
DD  
(V)  
MIN  
2.0  
– 0.3  
MAX  
+ 0.3  
DD  
V
IH  
HIGH level input voltage  
LOW level input voltage  
3.3 V output HIGH voltage  
3.3 V output LOW voltage  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.135 to 3.465  
3.465  
V
V
V
V
IL  
V
SS  
0.8  
V
OH  
I
= –1 mA  
2.4  
V
OH  
V
OL  
I
= 1 mA  
0.4  
V
OL  
V
= 2.0 V  
= 3.135 V  
= 1.0 V  
–54  
mA  
mA  
mA  
mA  
µA  
µA  
µA  
OUT  
I
Output HIGH current  
Output LOW current  
OH  
V
–46  
OUT  
V
V
54  
OUT  
OUT  
I
OL  
= 0.4 V  
53  
5
±I  
I
Input leakage current  
±I  
3-State output OFF-State current  
Quiescent supply current  
3.465  
V
OUT  
= V or GND  
I
I
= 0  
= 0  
10  
100  
OZ  
CC  
DD  
O
I
3.465  
V = V or GND  
I
DD  
O
Additional quiescent supply current  
given per control pin  
I  
CC  
3.135 to 3.465  
V = V – 0.6 V  
I
O
= 0  
500  
µA  
I
DD  
4
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
SDRAM CLOCK OUTPUT BUFFER PULL-UP CHARACTERISTICS  
PULL-UP  
I
VOLTAGE  
(mA)  
(V)  
MIN  
TYP  
–116  
–116  
–110  
–107  
–103  
–98  
–90  
–69  
–56  
–15  
0
MAX  
–198  
–198  
–188  
–184  
–177  
–170  
–157  
–126  
–107  
–46  
0
–72  
–72  
–68  
–67  
–64  
–60  
–54  
–39  
–30  
0
1
1.40  
1.50  
1.65  
1.80  
2.00  
2.40  
2.60  
3.135  
3.30  
3.465  
–23  
0
SDRAM PULL-UP  
0
0.25 0.5 0.75  
1
1.25 1.5 1.75  
2
2.25 2.5 2.75  
3
3.25 3.5  
0
–20  
–40  
–60  
–80  
MIN  
TYP  
MAX  
–100  
–120  
–140  
–160  
–180  
–200  
I
(mA)  
OH  
V
(V)  
OUT  
SW00249  
5
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
SDRAM CLOCK OUTPUT BUFFER PULL-DOWN CHARACTERISTICS  
PULL-UP  
I
VOLTAGE  
(V)  
(mA)  
TYP  
0
MIN  
0
MAX  
0
0
0.4  
23  
35  
43  
49  
61  
64  
67  
70  
72  
72  
34  
53  
0.65  
0.85  
1.00  
1.4  
52  
83  
65  
104  
118  
152  
159  
168  
177  
184  
204  
204  
74  
93  
1.5  
98  
1.65  
1.8  
103  
108  
112  
112  
112  
1.95  
3.135  
3.6  
SDRAM PULL-DOWN  
225  
200  
175  
150  
125  
100  
75  
MIN  
TYP  
MAX  
I
OL  
(mA)  
50  
25  
0
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
2.8  
3.2  
3.6  
V
(V)  
OUT  
SW00250  
6
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
AC CHARACTERISTICS  
LIMITS  
= 0 °C to +70 °C  
TEST CONDITIONS  
NOTES  
T
amb  
SYMBOL  
PARAMETER  
UNIT  
9
MIN  
15.0  
5.6  
5.3  
10.0  
3.3  
3.1  
7.4  
2.6  
2.1  
1.5  
1.5  
1.0  
1.0  
1.0  
1.0  
45  
TYP  
MAX  
T
T
SDRAM CLK period  
1, 6  
2, 6, 8  
3, 6, 8  
1, 6  
15.2  
7.8  
7.4  
10.01  
5.1  
4.9  
7.5  
3.2  
2.8  
2.0  
2.9  
2.5  
2.5  
2.6  
2.7  
52  
15.5  
8.4  
8.0  
10.5  
5.7  
5.5  
7.7  
3.8  
3.5  
4.0  
4.0  
3.5  
3.5  
5.0  
5.0  
55  
SDKP  
SDRAM CLK HIGH time  
SDRAM CLK LOW time  
SDRAM CLK period  
66 MHz  
100 MHz  
133 MHz  
ns  
ns  
ns  
SDKH  
T
SDKL  
SDKP  
SDKH  
T
T
SDRAM CLK HIGH time  
SDRAM CLK LOW time  
SDRAM clock period  
2, 6, 8  
3, 6, 8  
1, 6  
T
SDKL  
SDKP  
SDKH  
T
T
SDRAM CLK HIGH time  
SDRAM CLK LOW time  
SDRAM rise time  
2, 6, 8  
3, 6, 8  
4, 6, 10  
4, 6, 11  
6, 7  
T
SDKL  
T
V/ns  
V/ns  
ns  
SDRISE  
SDFALL  
T
SDRAM fall time  
T
T
SDRAM buffer LH propagation delay  
SDRAM buffer HL propagation delay  
SDRAM buffer enable time  
SDRAM buffer disable time  
PLH  
PHL  
6, 7  
ns  
T
T
, T  
6, 7  
ns  
PZL PZH  
, T  
6, 7  
ns  
PLZ PHZ  
DUTY CYCLE Output Duty Cycle  
Measured at 1.5 V  
5, 6, 7  
1, 6  
%
T
T
SDRAM Bus CLK skew  
Device to device skew  
150  
250  
250  
ps  
SDSKW  
ps  
DDSKW  
NOTES:  
1. Clock period and skew are measured on the rising edge at 1.5 V.  
2. T  
3. T  
4. T  
is measured at 2.4 V as shown in Figure 4.  
is measured at 0.4 V as shown in Figure 4.  
SDKH  
SDKL  
and T  
are measured as a transition through the threshold region V = 0.4 V and V = 2.4 V (1 mA) JEDEC specification.  
SDRISE  
SDFALL  
OL OH  
5. Duty cycle should be tested with a 50/50% input.  
6. Over MIN (20 pF) to MAX (30 pF) discrete load, process, voltage, and temperature.  
7. Input edge rate for these tests must be faster than 1 V/ns.  
8. Calculated at minimum edge rate (1.5 ns) to guarantee 45/55% duty cycle at 1.5 V. Pulse width is required to be wider at the faster edge to  
ensure duty cycle specification is met.  
9. All typical values are at V = 3.3 V and T  
= 25 °C.  
CC  
amb  
10.Typical is measured with MAX (30 pF) discrete load.  
11. Typical is measured with MIN (20 pF) discrete load.  
7
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
2
I C CONSIDERATIONS  
2
2
I C has been chosen as the serial bus interface to control the PCK2001. I C was chosen to support the JEDEC proposal JC-42.5 168 Pin  
2
Unbuffered SDRAM DIMM. All vendors are required to determine the legal issues associated with the manufacture of I C devices.  
1. Address assignment: The clock driver in this specification uses the single, 7-bit address shown below. All devices can use the address if  
2
only one master clock driver is used in a design. The address can be re-used for the CKBF device if no other conflicting I C clock driver is  
used in the system.  
The following address was confirmed by Philips on 09/04/96.  
A6  
1
A5  
1
A4  
0
A3  
1
A2  
0
A1  
0
A0  
1
R/W#  
0
2
NOTE: The R/W# bit is used by the I C controller as a data direction bit. A ‘zero’ indicates a transmission (WRITE) to the clock device. A  
‘one’ indicates a request for data (READ) from the clock driver. Since the definition of the clock buffer only allows the controller to WRITE  
data; the R/W# bit of the address will always be seen as ‘zero’. Optimal address decoding of this bit is left to the vendor.  
2. Options: It is our understanding that metal mask options and other pinouts of this type of clock driver will be allowed to use the same  
2
address as the original CKBF device. I C addresses are defined in terms of function (master clock driver) rather than form (pinout, and  
option).  
3. Slave/Receiver: The clock driver is assumed to require only slave/receiver functionality. Slave/transmitter functionality is optional.  
4. Data Transfer Rate: 100 kbits/s (standard mode) is the base functionality required. Fast mode (400 kbits/s) functionality is optional.  
2
5. Logic Levels: I C logic levels are based on a percentage of V for the controller and other devices on the bus. Assume all devices are  
DD  
based on a 3.3 Volt supply.  
6. Data Byte Format: Byte format is 8 Bits as described in the following appendices.  
2
7. Data Protocol: To simplify the clock I C interface, the clock driver serial protocol was specified to use only block writes from the controller.  
The bytes must be accessed in sequential order from lowest to highest byte with the ability to stop after any complete byte has been  
2
transferred. Indexed bytes are not allowed. However, the SMBus controller has a more specific format than the generic I C protocol.  
2
The clock driver must meet this protocol which is more rigorous than previously stated I C protocol. Treat the description from the viewpoint  
of controller. The controller “writes” to the clock driver and if possible would “read” from the clock driver (the clock driver is a slave/receiver  
only and is incapable of this transaction.)  
“The block write begins with a slave address and a write condition. After the command code the host (controller) issues a byte count which  
describes how many more bytes will follow in the message. If the host had 20 bytes to send, the first byte would be the number 20 (14h),  
followed by the 20 bytes of data. The byte count may not be 0. A block write command is allowed to transfer a maximum of 32 data bytes.”  
1 bit  
7 bits  
1
1
8 bits  
1
Start bit  
Slave Address  
R/W  
Ack  
Command Code Ack  
Byte Count = N  
...  
Ack  
1 bit  
Data Byte 1  
8 bits  
Ack  
1
Data Byte 2  
8 bits  
Ack  
1
Data Byte 2  
8 bits  
Ack  
1
Stop  
1
SW00279  
NOTE: The acknowledgement bit is returned by the slave/receiver (the clock driver).  
8
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
Consider the command code and the byte count bytes required as the first two bytes of any transfer. The command code is software  
programmable via the controller, but will be specified as 0000 0000 in the clock specification. The byte count byte is the number of  
additional bytes required to transfer, not counting the command code and byte count bytes. Additionally, the byte count byte is required to  
be a minimum of 1 byte and a maximum of 32 bytes to satisfy the above requirement.  
For example:  
Byte count byte  
Notes:  
MSB  
0000  
0000  
0000  
0000  
0000  
0000  
0000  
0000  
0010  
LSB  
0000 Not allowed. Must have at least one byte.  
0001 Data for functional and frequency select register (currently byte 0 in spec)  
0010 Reads first two bytes of data. (byte 0 then byte 1)  
0011 Reads first three bytes (byte 0, 1, 2 in order)  
0100 Reads first four bytes (byte 0, 1, 2, 3 in order)  
0101 Reads first five bytes (byte 0, 1, 2, 3, 4 in order)  
0110 Reads first six bytes (byte 0, 1, 2, 3, 4, 5 in order)  
0111 Reads first seven bytes (byte 0, 1, 2, 3, 4, 5, 6 in order)  
0000 Max byte count supported = 32  
A transfer is considered valid after the acknowledge bit corresponding to the byte count is read by the controller. The serial controller  
interface can be simplified by discarding the information in both the command code and the byte count bytes and simply reading all the bytes  
that are sent to the clock driver after being addressed by the controller. It is expected that the controller will not provide more bytes than the  
clock driver can handle. A clock vendor may choose to discard any number of bytes that exceed the defined byte count.  
8. Clock stretching: The clock device must not hold/stretch the SCLOCK or SDATA lines low for more than 10 mS. Clock stretching is  
discouraged and should only be used as a last resort. Stretching the clock/data lines for longer than this time puts the device in an  
error/time-out mode and may not be supported in all platforms. It is assumed that all data transfers can be completed as specified without  
the use of clock/data stretching.  
9. General Call: It is assumed that the clock driver will not have to respond to the “general call.”  
2
10.Electrical Characteristics: All electrical characteristics must meet the standard mode specifications found in section 15 of the I C  
specification.  
a. Pull-Up Resistors: Any internal resistors pull-ups on the SDATA and SCLOCK inputs must be stated in the individual data sheet. The use of  
internal pull-ups on these pins of below 100 kis discouraged. Assume that the board designer will use a single external pull-up resistor for  
2
2
each line and that these values are in the 5 to 6 krange. Assume one I C device per DIMM (serial presence detect), one I C controller,  
2
one clock driver plus one/two more I C devices on the platform for capacitive loading purposes.  
2
b. Input Glitch Filters: Only fast mode I C devices require input glitch filters to suppress bus noise. The clock driver is specified as a standard  
mode device and is not required to support this feature.  
11. PWR DWN#: If a clock driver is placed in PWR DWN# mode, the SDATA and SCLK inputs must be 3-Stated and the device must retain all  
2
programming information. I current due to the I C circuitry must be characterized and in the data sheet.  
DD  
2
2
For specific I C information consult the Philips I C Peripherals Data Handbook IC12 (1997).  
9
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
SERIAL CONFIGURATION MAP  
The serial bits will be read by the clock buffer in the following order:  
Byte 0 – Bits 7, 6, 5, 4, 3, 2, 1, 0  
Byte 1 – Bits 7, 6, 5, 4, 3, 2, 1, 0  
Byte 2 – Bits 7, 6, 5, 4, 3, 2, 1, 0  
All unused register bits (Reserved and N/A) should be defined as “Don’t Care”. It is expected that the controller will force all of these bits to a “0”  
level.  
All register bits labeled “Initialize to 0” must be written to zero during initialization. Failure to do so may result in a higher than normal operating  
current. The controller will read back the last written value.  
Byte 0: Output active/inactive register  
1 = enable; 0 = disable  
BIT  
7
PIN#  
18  
17  
14  
13  
9
NAME  
DESCRIPTION  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
BUF_OUT7  
BUF_OUT6  
BUF_OUT5  
BUF_OUT4  
BUF_OUT3  
BUF_OUT2  
BUF_OUT1  
BUF_OUT0  
6
5
4
3
2
8
1
5
0
4
NOTE:  
1. Inactive means outputs are held LOW and are disabled from switching. These outputs are designed to be configured at power-on and are  
not expected to be configured during the normal modes of operation.  
Byte 1: Output active/inactive register  
1 = enable; 0 = disable  
BIT  
7
PIN#  
45  
NAME  
DESCRIPTION  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
Active/Inactive  
BUF_OUT15  
BUF_OUT14  
BUF_OUT13  
BUF_OUT12  
BUF_OUT11  
BUF_OUT10  
BUF_OUT9  
BUF_OUT8  
6
44  
5
41  
4
40  
3
36  
2
35  
1
32  
0
31  
NOTE:  
1. Inactive means outputs are held LOW and are disabled from switching. These outputs are designed to be configured at power-on and are  
not expected to be configured during the normal modes of operation.  
Byte 2: Optional register for possible future requirements  
BIT  
7
PIN#  
28  
21  
NAME  
DESCRIPTION  
Active/Inactive  
Active/Inactive  
(reserved)  
BUF_OUT17  
BUF_OUT16  
(reserved)  
(reserved)  
(reserved)  
(reserved)  
(reserved)  
(reserved)  
6
5
4
(reserved)  
3
(reserved)  
2
(reserved)  
1
(reserved)  
0
(reserved)  
NOTE:  
1. Inactive means outputs are held LOW and are disabled from switching. These outputs are designed to be configured at power-on and are  
not expected to be configured during the normal modes of operation.  
10  
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
AC WAVEFORMS  
V
V
V
V
= 1.5 V  
M
X
Y
= V + 0.3 V  
OL  
t
kp  
= V – 0.3 V  
OH  
t
kh  
DUTY CYCLE  
and V are the typical output voltage drop that occur with the  
OL  
OH  
output load.  
2.4  
1.5  
0.4  
V
DD  
t
kl  
BUF_IN  
INPUT  
V
V
M
t
M
t
r
t
f
t
PLH  
PHL  
SW00479  
Figure 4. SDRAM Output clock  
V
V
M
M
BUF_OUT  
TEST CIRCUIT  
SW00246  
S
Figure 1. Load circuitry for switching times.  
1
V
2<V  
DD  
DD  
Open  
V
SS  
V
I
500  
500Ω  
V
DD  
V
V
I
O
PULSE  
GENERATOR  
V
nOE INPUT  
GND  
M
D.U.T.  
R
C
L
T
t
t
PZL  
PLZ  
V
DD  
OUTPUT  
LOW-to-OFF  
OFF-to-LOW  
TEST  
S
1
V
M
t
t
/t  
Open  
V
PLH PHL  
X
V
OL  
t
/t  
2<V  
PLZ PZL  
DD  
/t  
V
SS  
t
t
PZH  
PHZ PZH  
PHZ  
V
OH  
OUTPUT  
HIGH-to-OFF  
OFF-to-HIGH  
V
Y
SW00251  
V
M
Figure 5. Load circuitry for switching times  
V
SS  
outputs  
enabled  
outputs  
enabled  
outputs  
disabled  
SW00245  
Figure 2. 3-State enable and disable times  
T
SDKP  
T
SDKH  
DUTY CYCLE  
2.4  
1.5  
0.4  
T
SDKL  
T
T
SDFALL  
SDRISE  
SW00247  
Figure 3. Buffer Output clock  
11  
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm  
SOT370-1  
12  
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
NOTES  
13  
2002 Jun 03  
Philips Semiconductors  
Product data  
14.318–150 MHz I2C 1:18 clock buffer  
PCK2001  
2
2
Purchase of Philips I C components conveys a license under the Philips’ I C patent  
2
to use the components in the I C system provided the system conforms to the  
I C specifications defined by Philips. This specification can be ordered using the  
2
code 9398 393 40011.  
Data sheet status  
Product  
status  
Definitions  
[1]  
Data sheet status  
[2]  
Objective data  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
Preliminary data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be  
published at a later date. Philips Semiconductors reserves the right to change the specification  
without notice, in order to improve the design and supply the best possible product.  
Product data  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply.  
Changes will be communicated according to the Customer Product/Process Change Notification  
(CPCN) procedure SNW-SQ-650A.  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Koninklijke Philips Electronics N.V. 2002  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 06-02  
9397 750 09944  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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