MC34982CHFK [NXP]
High-Side Switch, 12V, Single 2mOhm, PQFN 16, Tray;
| 型号： | MC34982CHFK |
| 厂家： | 
NXP |
| 描述： | High-Side Switch, 12V, Single 2mOhm, PQFN 16, Tray |
| 文件： | 总34页 (文件大小：669K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MC34982
Rev. 1.0, 9/2014
ale Semiconductor
ce Information
Single Intelligent High-current
Self-protected High-side Switch
(2.0 mOhm)
34982
The 34982 is a self-protected 2.0 mOhm high-side switch replacing
electromechanical relays, fuses, and discrete devices in power management
applications. The 34982 is designed for harsh environments and includes self-
recovery features. The device is suitable for loads with high inrush current, as
well as motors and all types of resistive and inductive loads.
HIGH-SIDE SWITCH
Programming, control, and diagnostics are implemented via the serial peripheral
interface (SPI). A dedicated parallel input is available for alternate and pulse-
width modulation (PWM) control of the output. SPI-programmable fault trip
thresholds allow the device to be adjusted for optimal performance in the
application.
The 34982 is packaged in a power-enhanced 12 x 12 mm nonleaded PQFN
package with exposed tabs and powered by SMARTMOS technology.
BOTTOM VIEW
Features
FK SUFFIX
98ARL10521D
• Single 2.0 m max. high-side switch with parallel input or SPI control
• 6.0 V to 27 V operating voltage with standby currents < 5.0 A
• Output current monitoring with two SPI-selectable current ratios
• SPI control of overcurrent limit, overcurrent fault blanking time, output OFF
open load detection, output ON/OFF control, watchdog timeout, slew-
rates, and fault status reporting
• SPI status reporting of overcurrent, open and shorted loads,
overtemperature shutdown, undervoltage and overvoltage shutdown, Fail-
safe pin status, and program status
16-PIN PQFN
Applications
• Low-voltage factory automation
• DC motor or solenoid
• Resistive and inductive loads
• Low-voltage industrial lighting
• Enhanced -16 V reverse polarity VPWR protection
VDD
VDD
VDD
VPWR
34982
VDD
FS
VPWR
GND
I/O
I/O
WAKE
SI
SO
SCLK
CS
SCLK
CS
MCU
HS
SO
RST
IN
SI
I/O
I/O
LOAD
CSNS
FSI
A/D
GND
GND
PWR GND
Figure 1. 34982 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2014. All rights reserved.
BLE PARTS
ORDERABLE PARTS
Table 1. Orderable Part Variations
Temperature (T )
Part Number
Package
A
MC34982CHFK(1)
-40 °C to 125 °C
16 PQFN
Notes
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
2
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
VPWR
VIC
Internal
Regulator
Overvoltage
Protection
IUP
CS
SO
Programmable
Switch Delay
0–525 ms
Selectable Slew
Rate Gate Drive
SPI
3.0 MHz
HS
Selectable Overcurrent
SI
SCLK
FS
High Detection
150 A or 100 A
Logic
IN
Selectable Overcurrent
Selectable
Overcurrent
Low Detection
15–50 A
RST
WAKE
Low Detection
Blanking Time
0.15–155 ms
Open Load
Detection
IDWN
RDWN
Overtemperature
Detection
VIC
Selectable
Output Current
Recopy
Programmable
Watchdog
310–2500 ms
IUP
1/5400 or 1/40000
FSI
GND
Figure 2. 34982 Simplified Internal Block Diagram
CSNS
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ECTIONS
PIN CONNECTIONS
12 11 10
9
8
7
6
5
4
3
2
1
13
GND
TRANSPARENT
TOP VIEW
14
VPWR
15
HS
16
HS
Figure 3. 34982 Pin Connections
Functional descriptions of many of these pins can be found in the Functional Pin Description section beginning on page 16.
Table 2. Pin Definitions
Pin
Pin Name Pin Function
Formal Name
Definition
Number
This pin is used to output a current proportional to the high-side output current and
used externally to generate a ground-referenced voltage for the microcontroller to
monitor output current.
Output Current
Monitoring
1
CSNS
WAKE
Output
Input
This pin is used to input a Logic [1] signal in order to enable the watchdog timer
function.
2
Wake
This input pin is used to initialize the device configuration and fault registers, as well
as place the device in a low current sleep mode.
3
4
5
RST
IN
Input
Input
Reset (Active Low)
Direct Input
The input pin is used to directly control the output.
Fault Status
(Active Low)
This is an open drain configured output requiring an external pull-up resistor to VDD
for fault reporting.
FS
Output
The value of the resistance connected between this pin and ground determines the
state of the output after a watchdog timeout occurs.
6
7
FSI
CS
Input
Input
Input
Input
Input
Output
Fail-safe Input
Chip Select
(Active Low)
This input pin is connected to a chip select output of a master microcontroller (MCU).
This input pin is connected to the MCU providing the required bit shift clock for SPI
communication.
8
SCLK
SI
Serial Clock
Serial Input
This is a command data input pin connected to the SPI Serial Data Output of the
MCU or to the SO pin of the previous device in a daisy chain of devices.
9
Digital Drain Voltage
(Power)
10
11
VDD
SO
This is an external voltage input pin used to supply power to the SPI circuit.
This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI
pin of the next device in a daisy chain of devices.
Serial Output
12
13
NC
NC
No Connect
Ground
This pin may not be connected.
GND
Ground
This pin is the ground for the logic and analog circuitry of the device.
34982
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
PIN CONNECTIONS
Table 2. Pin Definitions (continued)
Pin
Pin Name Pin Function
Number
Formal Name
Definition
This pin connects to the positive power supply and is the source input of operational
power for the device.
14
VPWR
HS
Input
Positive Power Supply
High-side Output
Protected high-side power output to the load. Output pins must be connected in
parallel for operation.
15, 16
Output
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
CAL CHARACTERISTICS
RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground, unless otherwise noted.
Symbol
Rating
Value
Unit
Notes
ELECTRICAL RATINGS
Operating Voltage Range
VPWR
-16 to 41
V
V
Steady-state
VDD
VDD Supply Voltage
-0.3 to 5.5
VIN, RST, FSI,
CSNS, SI, SCLK, Input/Output Voltage
CS, FS
(1)
(1)
-0.3 to 7.0
V
VSO
ICL(WAKE)
ICL(CSNS)
IHS
SO Output Voltage
-0.3 to VDD+0.3
V
mA
mA
A
WAKE Input Clamp Current
CSNS Input Clamp Current
Output Current
2.5
10
60
(2)
Output Voltage
Positive
VHS
41
-15
V
J
Negative
Output Clamp Energy
34982C
(3)
(4)
ECL
1.0
ESD Voltage
VESD1
VESD3
Human Body Model (HBM)
Charge Device Model (CDM)
Corner Pins (1, 12, 15, 16)
±2000
V
±750
±500
All Other Pins (2, 11, 13, 14)
Notes
1. Exceeding this voltage limit may cause permanent damage to the device.
2. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current
using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 16 mH, RL = 0, VPWR = 12 V, TJ = 150 °C).
4. ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ESD3 testing is performed in
accordance with the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
34982
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted.
Symbol
Rating
Value
Unit
Notes
THERMAL RATINGS
Operating Temperature
(5)
TA
TJ
Ambient
Junction
-40 to 125
-40 to 150
C
C
TSTG
Storage Temperature
-55 to 150
Thermal Resistance
Junction-to-Case
(6)
R
R
<1.0
30
C/W
JC
JA
Junction-to-Ambient
(7), (8)
°C
TPPRT
Peak Package Reflow Temperature During Reflow
Note 8
Notes
5. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not exceed
125 C.
6. Device mounted on a 2s2p test board per JEDEC JESD51-2.
7. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
CAL CHARACTERISTICS
LECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
POWER INPUT
Power Supply Voltage Range
VPWR
6.0
–
–
–
27
20
V
Full Operational
VPWR Operating Supply Current
Output ON, IHS = 0 A
IPWR(ON)
mA
VPWR Supply Current
Output OFF, Open Load Detection Disabled, WAKE > 0.7 VDD
RST = VLOGIC HIGH
,
IPWR(SBY)
–
–
5.0
mA
Sleep State Supply Current (VPWR < 14 V, RST < 0.5 V,
WAKE < 0.5 V)
IPWR(SLEEP)
A
TJ = 25 C
TJ = 85 C
–
–
–
–
10
50
VDD(ON)
VDD Supply Voltage
4.5
5.0
5.5
V
VDD Supply Current
IDD(ON)
No SPI Communication
3.0 MHz SPI Communication
–
–
–
–
1.0
5.0
mA
IDD(SLEEP)
VPWR(OV)
VPWR(OVHYS)
VPWR(UV)
VDD Sleep State Current
–
28
0.2
5.0
–
–
32
5.0
36
1.5
6.0
–
A
V
Overvoltage Shutdown Threshold
Overvoltage Shutdown Hysteresis
Undervoltage Output Shutdown Threshold
Undervoltage Hysteresis
0.8
5.5
0.25
–
V
(9)
V
(10)
VPWR(UVHYS)
VPWR(UVPOR)
POWER OUTPUT
V
Undervoltage Power-ON Reset
–
5.0
V
Output Drain-to-Source ON Resistance (IHS = 30 A, TJ = 25 C)
VPWR = 6.0 V
–
–
–
–
–
–
3.0
2.0
2.0
RDS(on)
m
m
V
PWR = 10 V
VPWR = 13 V
Output Drain-to-Source ON Resistance (IHS = 30 A, TJ = 150 C)
VPWR = 6.0 V
–
–
–
–
–
–
5.1
3.4
3.4
RDS(on)
VPWR = 10 V
V
PWR = 13 V
Output Source-to-Drain ON Resistance (IHS = 30 A,
TJ = 25 C)
(11)
RDS(on
–
2.0
4.0
m
VPWR = -12 V
Output Overcurrent High Detection Levels (9.0 V < VPWR < 16 V)
IOCH0
IOCH1
SOCH = 0
SOCH = 1
120
80
150
100
186
124
A
Notes
9. This applies to all internal device logic that is supplied by VPWR and assumes that the external VDD supply is within specification.
10. This applies when the undervoltage fault is not latched (IN = 0).
11. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR
.
34982
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
POWER OUTPUT (CONTINUED)
Overcurrent Low Detection Levels (SOCL[2:0])
IOCL0
IOCL1
IOCL2
IOCL3
IOCL4
IOCL5
IOCL6
IOCL7
000
001
010
011
100
101
110
111
41
36
32
29
25
20
16
12
50
45
40
35
30
25
20
15
62
57
51
44
38
33
27
21
A
Current Sense Ratio (9.0 V < VPWR < 16 V, CSNS < 4.5 V)
CSR0
CSR1
DICR D2 = 0
DICR D2 = 1
–
–
1/5400
1/40000
–
–
–
Current Sense Ratio (CSR0) Accuracy
Output Current
10 A
-20
-14
-13
-12
-13
-13
–
–
–
–
–
–
20
14
13
12
13
13
20 A
25 A
30 A
40 A
CSR0_ACC
%
50 A
Current Sense Ratio (CSR1) Accuracy
Output Current
10 A
-25
-19
-18
-17
-18
-18
–
–
–
–
–
–
25
19
18
17
18
18
20 A
25 A
30 A
40 A
CSR1_ACC
%
V
50 A
Current Sense Clamp Voltage
CSNS Open, IHS = 59 A
VCL(CSNS)
4.5
6.0
7.0
Current Sense Leakage
(12)
(13)
ILEAK(CSNS)
IOLDC
0.0
30
10
–
20
100
4.0
A
A
V
IN=1 with OUT opened of load or IN=0
Open Load Detection Current
Output Fault Detection Threshold
Output Programmed OFF
VOLD(THRES)
2.0
3.0
Output Negative Clamp Voltage
0.5 A < IHS < 2.0 A, Output OFF
VCL
V
-20
160
5.0
–
175
–
-15
190
20
(14)
(14)
TSD
Overtemperature Shutdown
C
C
TSD(HYS)
Overtemperature Shutdown Hysteresis
Notes
12. This parameter is achieved by the design characterization by measuring a statistically relevant sample size across process variations but, not
tested in production.
13. Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence of an open
load condition when the specific output is commanded OFF.
14. Guaranteed by process monitoring. Not production tested.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
CAL CHARACTERISTICS
LECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
CONTROL INTERFACE
(15)
(15)
(16)
VIH
VIL
Input Logic High-voltage
Input Logic Low-voltage
0.7 x VDD
–
–
–
0.2 x VDD
1200
20
V
V
–
100
5.0
4.5
–
VIN(HYS)
IDWN
VRST
CSO
Input Logic Voltage Hysteresis
Input Logic Pull-down Current (SCLK, IN, SI)
RST Input Voltage Range
600
–
mV
A
V
5.0
–
5.5
(17)
SO, FS Tri-state Capacitance
20
pF
k
pF
RDWN
CIN
Input Logic Pull-down Resistor (RST) and WAKE
Input Capacitance
100
–
200
4.0
400
(17)
(18)
12
WAKE Input Clamp Voltage
ICL(WAKE) < 2.5 mA
VCL(WAKE)
VF(WAKE)
VSOH
V
V
7.0
-2.0
–
–
14
-0.3
–
WAKE Input Forward Voltage
ICL(WAKE) = -2.5 mA
SO High-state Output Voltage
IOH = 1.0 mA
V
0.8 x VDD
–
FS, SO Low-state Output Voltage
IOL = -1.6 mA
VSOL
V
–
0.2
0.0
–
0.4
5.0
20
SO Tri-state Leakage Current
CS > 0.7 x VDD
ISO(LEAK)
A
A
-5.0
Input Logic Pull-up Current
CS, VIN > 0.7 x VDD
(19)
IUP
5.0
RFS
FSI Input Pin External Pull-down Resistance
FSI Disabled, HS Indeterminate
FSI Enabled, HS OFF
RFSDIS
RFSOFF
RFSON
–
6.0
30
0.0
10
–
1.0
14
–
k
FSI Enabled, HS ON
Notes
15. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN, and WAKE input signals. The WAKE and RST signals may be
supplied by a derived voltage reference to VPWR
.
16. No hysteresis on FSI and wake pins. Parameter is guaranteed by process monitoring but is not production tested.
17. Input capacitance of SI, CS, SCLK, RST, and WAKE. This parameter is guaranteed by process monitoring but is not production tested.
18. The current must be limited by a series resistance when using voltages > 7.0 V.
19. Pull-up current is with CS OPEN. CS has an active internal pull-up to VDD
.
34982
Analog Integrated Circuit Device Data
10
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER OUTPUT TIMING
Output Rising Slow Slew Rate A (DICR D3 = 0)
9.0 V < VPWR < 16 V
(20)
(21)
(20)
(21)
(20)
(21)
(20)
SRRA_SLOW
SRRB_SLOW
SRRA_FAST
SRRB_FAST
SRFA_SLOW
SRFB_SLOW
SRFA_FAST
0.15
0.06
0.3
0.5
0.2
0.8
0.2
0.5
0.2
1.6
1.0
0.6
3.2
2.4
1.0
0.6
3.2
V/s
V/s
V/s
V/s
V/s
V/s
V/s
Output Rising Slow Slew Rate B (DICR D3 = 0)
9.0 V < VPWR < 16 V
Output Rising Fast Slew Rate A (DICR D3 = 1)
9.0 V < VPWR < 16 V
Output Rising Fast Slew Rate B (DICR D3 = 1)
9.0 V < VPWR < 16 V
0.06
0.15
0.06
0.6
Output Falling Slow Slew Rate A (DICR D3 = 0)
9.0 V < VPWR < 16 V
Output Falling Slow Slew Rate B (DICR D3 = 0)
9.0 V < VPWR < 16 V
Output Falling Fast Slew Rate A (DICR D3 = 1)
9.0 V < VPWR < 16 V
Output Falling Fast Slew Rate B (DICR D3 = 1)
9.0 V < VPWR < 16 V
(21)
(22)
(23)
(23)
SRFB_FAST
0.2
0.5
10
0.7
18
2.4
100
250
V/s
s
Output Turn-ON Delay Time in Fast/Slow Slew Rate
DICR = 0, DICR = 1
tDLY(ON)
Output Turn-OFF Delay Time in Slow Slew Rate Mode
DICR = 0
tDLY_SLOW(OFF)
115
s
Output Turn-OFF Delay Time in Fast Slew Rate Mode
DICR = 1
tDLY_FAST(OFF)
1.0
–
30
100
–
s
fPWM
Direct Input Switching Frequency (DICR D3 = 0)
300
Hz
Overcurrent Low Detection Blanking Time (OCLT[1:0])
tOCL0
tOCL1
tOCL2
tOCL3
00
01
10
11
108
6.0
0.8
155
10
1.2
202
13
1.6
ms
0.08
0.15
0.25
tOCH
Overcurrent High Detection Blanking Time
CS to CSNS Valid Time
1.0
–
10
–
20
10
s
s
(24)
tCNSVAL
Notes
20. Rise and Fall Slew Rates A measured across a 5.0 resistive load at high-side output = 0.5 V to VPWR-3.5 V. These parameters are guaranteed
by process monitoring.
21. Rise and Fall Slow Slew Rates B measured across a 5.0 resistive load at high-side output = VPWR-3.5 V to VPWR-0.5 V. These parameters are
guaranteed by process monitoring.
22. Turn-ON delay time measured from rising edge of any signal (IN, SCLK, CS) that would turn the output ON to VHS = 0.5 V with
RL = 5.0 resistive load.
23. Turn-OFF delay time measured from falling edge of any signal (IN, SCLK, CS) that would turn the output OFF to VHS = VPWR-0.5 V with RL = 5.0
resistive load.
24. Time necessary for the CSNS to be within ±5% of the targeted value.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
CAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER OUTPUT TIMING (CONTINUED)
Output Switching Delay Time (OSD[2:0])
tOSD0
tOSD1
tOSD2
tOSD3
tOSD4
tOSD5
tOSD6
tOSD7
000
001
010
011
100
101
110
111
–
52
0.0
75
–
95
105
157
210
262
315
367
150
225
300
375
450
525
195
293
390
488
585
683
ms
Watchdog Timeout (WD[1:0])
tWDTO0
tWDTO1
tWDTO2
tWDTO3
00
01
10
11
434
207
1750
875
620
310
2500
1250
806
403
3250
1625
(25)
ms
SPI INTERFACE CHARACTERISTICS
fSPI
Recommended Frequency of SPI Operation
Required Low-state Duration for RST
–
–
–
3.0
MHz
ns
(26)
tWRST
50
167
SPI INTERFACE CHARACTERISTICS
(27)
(27)
(27)
(27)
(27)
(27)
(28)
(28)
tCS
Rising Edge of CS to Falling Edge of CS (Required Setup Time)
–
–
–
–
–
–
–
–
–
–
300
5.0
167
167
167
167
83
ns
s
ns
ns
ns
ns
ns
ns
tENBL
Rising Edge of RST to Falling Edge of CS (Required Setup Time)
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
Required High-state Duration of SCLK (Required Setup Time)
Required Low-state Duration of SCLK (Required Setup Time)
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
SI to Falling Edge of SCLK (Required Setup Time)
tLEAD
50
–
tWSCLKH
tWSCLKL
tLAG
–
50
25
25
tSI(SU)
tSI(HOLD)
Falling Edge of SCLK to SI (Required Setup Time)
83
SO Rise Time
CL = 200 pF
tRSO
ns
ns
–
25
50
SO Fall Time
CL = 200 pF
tFSO
–
–
–
25
–
50
50
50
(28)
(28)
tRSI
tFSI
SI, CS, SCLK, Incoming Signal Rise Time
SI, CS, SCLK, Incoming Signal Fall Time
ns
ns
–
Notes
25. Watchdog timeout delay measured from the rising edge of WAKE to RST from a sleep state condition to output turn-ON with the output driven OFF
and FSI floating. The values shown are for WDR setting of [00]. The accuracy of tWDTO is consistent for all configured watchdog timeouts.
26. RST low duration measured with outputs enabled and going to OFF or disabled condition.
27. Maximum setup time required for the 34982 is the minimum guaranteed time needed from the microcontroller.
28. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
34982
Analog Integrated Circuit Device Data
12
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V VDD 5.5 V, 6.0 V VPWR 27 V, -40 C TA 125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SPI INTERFACE CHARACTERISTICS (CONTINUED)
(29)
(30)
tSO(EN)
tSO(DIS)
Time from Falling Edge of CS to SO Low-impedance
–
–
–
145
145
ns
ns
Time from Rising Edge of CS to SO High-impedance
65
Time from Rising Edge of SCLK to SO Data Valid
(31)
tVALID
ns
0.2 VDD SO 0.8 VDD, CL = 200 pF
–
65
105
Notes
29. Time required for output status data to be available for use at SO. 1.0 kon pull-up on CS.
30. Time required for output status data to be terminated at SO. 1.0 kon pull-up on CS.
31. Time required to obtain valid data out from SO following the rise of SCLK.
TIMING DIAGRAMS
CS
V
PWR
SRFB_SLOW & SRFB_FAST
VPWR-0.5 V
SRRB_SLOW
&
SRRB_FAST
RrB
&
VPWR-3.5 V
SRFA_SLOW & SRFA_FAST
SR
SRrA
SRRA _FAST
RA_SLOW
0.5 V
HS
tDLY_SLOW(OFF) & tDLY_FAST(OFF)
t
DLY(ON)
Figure 4. Output Slew Rate and Time Delays
IOCH
x
Load
Current
IOCLx
tOCH
Time
tOCLx
Figure 5. Overcurrent Shutdown
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
CAL CHARACTERISTICS
AGRAMS
I
I
I
OCH
0
OCH1
OCL0
IOCL1
I
OCL2
Load
Current
I
OCL3
I
I
I
I
OCL4
OCL5
OCL6
OCL7
Time
t
t
t
t
t
OCL0
OCH
OCL3
OCL2
OCL1
x
Figure 6. Overcurrent Low and High Detection
Figure 6 illustrates the overcurrent detection level (IOCLX, IOCHX) the device can reach for each overcurrent detection blanking time (tOCHX
OCLX):
,
t
• During tOCHX, the device can reach up to Ioch0 overcurrent level.
• During tOCL3 or tOCL2 or tOCL1 or tOCL0, the device can be programmed to detect up to Iocl0.
VIH
RST
0.2 VDD
0.2 DD
VIL
tENBL
tCS
tWRST
VIH
0.7 V
DD
CS
0.2V
DD
VIL
tRSI
t
WSCLKH
TrI
t
LEAD
tLAG
VIH
0.7 VDD
SCLK
0.2 VDD
VIL
t
SI(SU)
t
WSCLKl
tFSI
t
SI(HOLD)
VIH
0.7V
DD
Don’t Care
Don’t Care
Don’t Care
Valid
Valid
SI
0.2 VDD
V
IH
Figure 7. Input Timing Switching Characteristics
34982
Analog Integrated Circuit Device Data
14
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
tRSI
tFSI
VOH
3.5 V
50%
SCLK
1.0 V
VOL
tSO(EN)
0.2V
VOH
0.7 V
DD
SO
DD
VOL
Low to High
tRSO
tVALID
tFSO
SO
VOH
0.7 V
DD
High to Low
0.2 VDD
VOL
tSO(DIS)
Figure 8. SCLK Waveform and Valid SO Data Delay Time
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
NAL DESCRIPTION
CTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 34982 is a self-protected silicon 2.0 m high-side switch used to replace electromechanical relays, fuses, and discrete devices in
power management applications. The 34982 is designed for harsh environments, including self-recovery features. The device is suitable
for loads with high inrush current, as well as motors and all types of resistive and inductive loads.
Programming, control, and diagnostics are implemented via the serial peripheral interface (SPI). A dedicated parallel input is available for
alternate and pulse width modulation (PWM) control of the output. SPI programmable fault trip thresholds allow the device to be adjusted
for optimal performance in the application.
The 34982 is packaged in a power-enhanced 12 x 12 nonleaded PQFN package with exposed tabs.
FUNCTIONAL PIN DESCRIPTION
OUTPUT CURRENT MONITORING (CSNS)
The CSNS pin outputs a current proportional to the high-side output current and used externally to generate a ground-referenced voltage
for the microcontroller to monitor output current.
WAKE (WAKE)
This pin is used to input a Logic [1] signal in order to enable the watchdog timer function. An internal clamp protects this pin from high
damaging voltages when the output is current limited with an external resistor. This input has a passive internal pull-down.
RESET (RST)
This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current sleep mode. The
pin also starts the watchdog timer when transitioning from logic Low to logic High. This pin should not be allowed to be logic High until VDD
is in regulation. This pin has a passive internal pull-down.
DIRECT IN (IN)
The Input pin is used to directly control the output. This input has an active internal pull-down current source and requires CMOS logic
levels. This input may be configured via the SPI.
FAULT STATUS (FS)
This is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. When a device fault condition is
detected, this pin is active Low. Specific device diagnostic faults are reported via the SPI SO pin.
FAIL-SAFE INPUT (FSI)
The value of the resistance connected between this pin and ground determines the state of the output after a watchdog timeout occurs.
Depending on the resistance value, either the output is OFF or ON. When the FSI pin is connected to GND, the watchdog circuit and Fail-
safe operation are disabled. This pin incorporates an active internal pull-up current source.
CHIP SELECT (CS)
This input pin is connected to a chip select output of a master microcontroller (MCU). The MCU determines which device is addressed
(selected) to receive data by pulling the CS pin of the selected device logic Low, enabling SPI communication with the device. Other
unselected devices on the serial link having their CS pins pulled up logic High disregard the SPI communication data sent. This pin
incorporates an active internal pull-up current source.
SERIAL CLOCK (SCLK)
This input pin is connected to the MCU providing the required bit shift clock for SPI communication. It transitions one time per bit transferred
at an operating frequency, fSPI, defined by the communication interface. The 50 percent duty cycle CMOS-level serial clock signal is idle
between command transfers. The signal is used to shift data into and out of the device. This input has an active internal pull-down current
source.
SERIAL INTERFACE (SI)
This is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device in a daisy
chain of devices. The input requires CMOS logic level signals and incorporates an active internal pull-down current source. Device control
is facilitated by the input's receiving the MSB first of a serial 8-bit control command. The MCU ensures data is available upon the falling
edge of SCLK. The logic state of SI present upon the rising edge of SCLK loads that bit command into the internal command shift register.
34982
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
DIGITAL DRAIN VOLTAGE POWER (VDD)
This is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost, an internal supply provides power to
a portion of the logic, ensuring limited functionality of the device. All device configuration registers are reset.
SERIAL OUTPUT (SO)
This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device in a daisy chain of devices.
This output will remain tri-stated (high-impedance OFF condition) so long as the CS pin of the device is logic High. SO is only active when
the CS pin of the device is asserted logic Low. The generated SO output signals are CMOS logic levels. SO output data is available on
the falling edge of SCLK and transitions immediately on the rising edge of SCLK.
POSITIVE POWER SUPPLY (VPWR)
This pin connects to the positive power supply and is the source input of operational power for the device. The VPWR pin is a backside
surface mount tab of the package.
HIGH-SIDE OUTPUT (HS)
This pin protects high-side power output to the load. Output pins must be connected in parallel for operation.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
NAL DESCRIPTION
NAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC34982 - Functional Block Diagram
Power Supply
Self-protected
High-side Switch
HS
MCU Interface and Output Control
Parallel Control Inputs
SPI Interface
High-side Switch
Power Supply
MCU Interface and Output Control
Figure 9. Functional Internal Block Diagram
POWER SUPPLY
The 34982 is designed to operate from 4.0 V to 28 V on the VPWR pin. Characteristics are provided from 6.0 V to 20 V for the device. The
VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for serial peripheral interface (SPI)
communication in order to configure and diagnose the device. This IC architecture provides a low quiescent current sleep mode. Applying
VPWR and VDD to the device will place the device in the Normal mode. The device will transit to Fail-safe mode in case of failures on the
SPI (watchdog timeout).
HIGH-SIDE SWITCH: HS
This pin is the high-side output controlling multiple loads with high inrush current, as well as motors and all types of resistive and inductive
loads. This N-channel MOSFET with a 2.0 m RDS(on), is self-protected and presents extended diagnostics in order to detect load
disconnections and short-circuit fault conditions. The HS output is actively clamped during a turn-off of inductive loads.
MCU INTERFACE AND OUTPUT CONTROL
In Normal mode, the load is controlled directly from the MCU through the SPI. With a dedicated SPI command, it is possible to
independently turn on and off several loads that are PWMed at the same frequency, and duty cycles with only one PWM signal. An analog
feedback output provides a current proportional to the load current. The SPI is used to configure and to read the diagnostic status (faults)
of high-side output. The reported fault conditions are: open load, short-circuit to ground (OCLO-resistive and OCHI-severe short-circuit),
thermal shutdown, and under/overvoltage.
In Fail-safe mode, the load is controlled with dedicated parallel input pins. The device is configured in default mode.
34982
Analog Integrated Circuit Device Data
18
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
The 34982 has four operating modes: Sleep, Normal, Fault, and Fail-safe. Table 6 summarizes details contained in succeeding
paragraphs.
Table 6. Fail-safe Operation and Transitions to Other 34982 Modes
Mode
Sleep
FS
x
WAKE
RST
0
WDTO
Comments
Device is in Sleep mode. All outputs are OFF.
Normal mode. Watchdog is active if enabled.
0
x
1
x
0
1
0
1
x
Normal
1
1
No
0
x
Fault
No
The device is currently in Fault mode. The faulted output is OFF.
0
1
1
1
Watchdog has timed out and the device is in Fail-safe mode. The output is as
configured with the RFS resistor connected to FSI. RST and WAKE must be
transitioned to Logic [0] simultaneously to bring the device out of the Fail-safe mode or
momentarily tied the FSI pin to ground.
1
1
Fail-safe
1
1
Yes
1
0
x = Don’t care.
SLEEP MODE
The default mode of the 34982 is the Sleep mode. This is the state of the device after first applying power voltage (VPWR), prior to any
I/O transitions. This is also the state of the device when the WAKE and RST are both Logic [0]. In the Sleep mode, the output and all
unused internal circuitry, such as the internal 5.0 V regulator, are off to minimize current draw. In addition, all SPI-configurable features
of the device are as if set to Logic [0]. The device will transition to the Normal or Fail-safe operating modes based on the WAKE and RST
inputs as defined in Table 6.
NORMAL MODE
The 34982 is in Normal mode when:
• VPWR is within the normal voltage range.
•
RST pin is Logic [1].
• No fault has occurred.
FAIL-SAFE MODE AND WATCHDOG
If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or RST input pin transitions from Logic [0]
to Logic [1]. The WAKE input is capable of being pulled up to VPWR with a series of limiting resistance that limits the internal clamp current.
The watchdog timeout is a multiple of an internal oscillator and is specified in Table 15. As long as the WD bit (D7) of an incoming SPI
message is toggled within the minimum watchdog timeout period (WDTO), based on the programmed value of the WDR the device will
operate normally. If an internal watchdog timeout occurs before the WD bit, the device will revert to a Fail-safe mode until the device is
reinitialized.
During the Fail-safe mode, the output will be ON or OFF depending upon the resistor RFS connected to the FSI pin, regardless of the
state of the various direct inputs and modes (Table 7). In this mode, the SPI register content is retained except for overcurrent high and
low detection levels and timing, which are reset to their default value (SOCL, SOCH, OCLT). The watchdog, overvoltage,
overtemperature, and overcurrent circuitry (with default value for this one) are fully operational.
Table 7. Output State During Fail-safe Mode
RFS (k)
High-side State
Fail-safe Mode Disabled
HS OFF
0
10
30
HS ON
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
NAL DEVICE OPERATION
ION AND DIAGNOSIS FEATURES
The Fail-safe mode can be detected by monitoring the WDTO bit D2 of the WDR register. This bit is Logic [1] when the device is in Fail-
safe mode. The device can be brought out of the Fail-safe mode by transitioning the WAKE and RST pins from Logic [1] to Logic [0] or
forcing the FSI pin to Logic [0]. Table 6 summarizes the various methods for resetting the device from the latched Fail-safe mode.
If the FSI pin is tied to GND, the Watchdog Fail-safe operation is disabled.
LOSS OF VDD
If the external 5.0 V supply is not within specification, or even disconnected, all register content is reset. The output can still be driven by
the direct input IN. The 34982 uses the supply input to power the output MOSFET related current sense circuitry, and any other internal
Logic, providing Fail-safe device operation with no VDD supplied. In this state, the watchdog, overvoltage, overtemperature, and
overcurrent circuitry are fully operational with default values. Current recopy is active with the default current recopy value.
FAULT MODE
The 34982 indicates the following faults as they occur by driving the FS pin to Logic [0]:
• Overtemperature fault
• Overvoltage and undervoltage fault
• Open load fault
• Overcurrent fault (high and low)
The FS pin will automatically return to Logic [1] when the fault condition is removed, except for overcurrent and in some cases
undervoltage. Fault information is retained in the fault register and is available (and reset) via the SO pin during the first valid SPI
communication (refer to Table 17).
PROTECTION AND DIAGNOSIS FEATURES
OVERTEMPERATURE FAULT (NON-LATCHING)
The 34982 incorporates overtemperature detection and shutdown circuitry in the output structure. Overtemperature detection is enabled
when the output is in the ON state.
For the output, an overtemperature fault (OTF) condition results in the faulted output turning OFF until the temperature falls below the
TSD(HYS). This cycle will continue indefinitely until action is taken by the MCU to shut OFF the output, or until the offending load is removed.
When experiencing this fault, the OTF fault bit will be set in the status register and cleared after either a valid SPI read or a power reset
of the device.
OVERVOLTAGE FAULT (NON-LATCHING)
The 34982 shuts down the output during an overvoltage fault (OVF) condition on the VPWR pin. The output remains in the OFF state until
the overvoltage condition is removed. When experiencing this fault, the OVF fault bit is set in bit OD1 and cleared after either a valid SPI
read or a power reset of the device.
The overvoltage protection and diagnostic can be disabled through the SPI (bit OV_dis).
UNDERVOLTAGE SHUTDOWN (LATCHING OR NON-LATCHING)
The output(s) will latch off at some supply voltage below 6.0 V. As long as the VDD level stays within the normal specified range, the internal
logic states within the device will be sustained.
In the cases where the supply voltage drops below the undervoltage threshold, (VPWRUV) the output will turn off, FS will go to Logic [0],
and the fault register UVF bit will be set to 1.
Two cases need to be considered when the supply level recovers:
• If the output(s) command is (are) low, FS will go to Logic [1], but the UVF bit will remain set to 1 until the next read operation.
• If the output command is ON, then FS will remain at Logic [0]. The output must be turned OFF and ON again to re-enable the state
of output and release FS. The UVF bit will remain set to 1 until the next read operation.
The undervoltage protection can be disabled through the SPI (bit UV_dis = 1). In this case, the FS and UVF bits do not report any
undervoltage fault condition and the output state will not be changed as long as the supply voltage does not drop any lower than 2.5 V.
OPEN LOAD FAULT (NON-LATCHING)
The 34982 incorporates open load detection circuitry on the output. Output open load fault (OLF) is detected and reported as a fault
condition when the output is disabled (OFF). The open load fault is detected and latched into the status register after the internal gate
voltage is pulled low enough to turn OFF the output. The OLF fault bit is set in the status register. If the open load fault is removed, the
status register will be cleared after reading the register.
The open load protection can be disabled through the SPI (bit OL_dis). It is recommended to disable the open load detection circuitry
(OL_dis bit sets to logic [1]) in case of a permanent open load fault condition.
34982
Analog Integrated Circuit Device Data
20
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSIS FEATURES
OVERCURRENT FAULT (LATCHING)
The 34982 has eight programmable overcurrent low detection levels (IOCL) and two programmable overcurrent high detection levels
(IOCH) for maximum device protection. The two selectable, simultaneously active overcurrent detection levels, defined by IOCH and IOCL
are illustrated in Figure 6. The eight different overcurrent low detection levels (IOCL0:IOCL7) are likewise illustrated in Figure 6.
,
If the load current level ever reaches the selected overcurrent low detection level and the overcurrent condition exceeds the programmed
overcurrent time period (tOCx), the device will latch the output OFF.
If at any time the current reaches the selected IOCH level, then the device will immediately latch the fault and turn OFF the output,
regardless of the selected tOCL driver.
For both cases, the device output will stay off indefinitely until the device is commanded OFF and then ON again.
Table 8. Device Behavior in Case of Undervoltage
UV Disable
IN = 0
(Falling or
Rising VPWR
UV Disable
IN = 1
(Falling or
UV Enable
IN = 0
(Falling VPWR
UV Enable
IN = 0
(Rising VPWR
UV Enable
IN = 1
(Falling VPWR
UV Enable
IN = 1
(Rising VPWR)
High-side Switch
(VPWR Voltage)
State
)
)
)
)
Rising VPWR
)
Output State
FS State
OFF
1
OFF
1
ON
1
OFF
0
OFF
1
ON
1
VPWR > VPWRUV
SPI Fault
Register UVF
Bit
0
1 until next read
0
1
0
0
Output State
FS State
OFF
0
OFF
0
OFF
0
OFF
0
OFF
1
ON
1
VPWRUV > VPWR
UVPOR
>
SPI Fault
Register UVF
Bit
1
1
1
1
0
0
Output State
FS State
OFF
1
OFF
1
OFF
1
OFF
1
OFF
1
ON
1
UVPOR > VPWR
>
2.5 V
SPI Fault
Register UVF
Bit
1 until next read
1
1 until next read 1 until next read
0
0
Output State
FS State
OFF
1
OFF
1
OFF
1
OFF
1
OFF
1
OFF
1
2.5 V > VPWR > 0 V
SPI Fault
Register UVF
Bit
1 until next read 1 until next read 1 until next read 1 until next read
0
0
UV fault is
not latched
UV fault is
not latched
UV fault
is latched
Comments
Typical value; not guaranteed
While VDD remains within specified range.
= IN is equivalent to IN direct input or IN_spi SPI input.
REVERSE VOLTAGE
The output survives the application of reverse voltage as low as -16 V. Under these conditions, the output’s gate is enhanced to keep the
junction temperature less than 150 °C. The ON resistance of the output is fairly similar to that in the Normal mode. No additional passive
components are required. If more than one output is driving a DC motor with an external freewheeling diode in parallel to the load, a direct
current passes through this diode and the internal high-side switch in case of reverse voltage.
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
NAL DEVICE OPERATION
ION AND DIAGNOSIS FEATURES
34982
Figure 10. Reverse Voltage Protection
As shown in Figure 10, it is essential to protect this power line. The proposed solution is an external N-channel low-side with the gate tied
to supply voltage through a resistor.
GROUND DISCONNECT PROTECTION
In the event the 34982 ground is disconnected from load ground, the device protects itself and safely turns OFF the output regardless the
state of the output at the time of disconnection. A 10 k resistor needs to be added between the WAKE pin and the rest of the circuitry in
order to ensure that the device turns off in case of ground disconnect and to prevent this pin to exceed its maximum ratings.
34982
Analog Integrated Circuit Device Data
22
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
SPI PROTOCOL DESCRIPTION
The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Clock (SCLK), Serial
Input (SI), Serial Output (SO), and Chip Select (CS).
The SI/SO pins of the 34982 follow a first-in first-out (D7/D0) protocol with both input and output words transferring the most significant
bit (MSB) first. All inputs are compatible with 5.0 V CMOS logic levels.
The SPI lines perform the following functions:
SERIAL CLOCK (SCLK)
The SCLK pin clocks the internal shift registers of the 34982 device. The serial input pin (SI) accepts data into the input shift register on
the falling edge of the SCLK signal while the serial output pin (SO) shifts data information out of the SO line driver on the rising edge of
the SCLK signal. It is important that the SCLK pin be in a logic LOW state whenever CS makes any transition. For this reason, it is
recommended that the SCLK pin be in a Logic [0] state whenever the device is not accessed (CS Logic [1] state). SCLK has an active
internal pull-down, IDWN. When CS is Logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (high-impedance). (See
Figure 11 and Figure 12.)
SERIAL INTERFACE (SI)
This is a serial interface (SI) command data input pin. SI instruction is read on the falling edge of SCLK. An 8-bit stream of serial data is
required on the SI pin, starting with D7 to D0. The internal registers of the 34982 are configured and controlled using a 4-bit addressing
scheme, as shown in Table 9. Register addressing and configuration are described in Table 10. The SI input has an active internal pull-
down, IDWN
.
SERIAL OUTPUT (SO)
The SO pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CS pin is put into a
Logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, and the state of the key inputs. The
SO pin changes states on the rising edge of SCLK and reads out on the falling edge of SCLK. Fault and input status descriptions are
provided in Table 16.
CHIP SELECT (CS)
The CS pin enables communication with the master microcontroller (MCU). When this pin is in a Logic [0] state, the device is capable of
transferring information to and receiving information from the MCU. The 34982 latches in data from the input shift registers to the
addressed registers on the rising edge of CS. The device transfers status information from the power output to the shift register on the
falling edge of CS. The SO output driver is enabled when CS is Logic [0]. CS should transition from a Logic [1] to a Logic [0] state only
when SCLK is a Logic [0]. CS has an active internal pull-up, IUP
.
CS
SCLK
SI
D7
D6
D5
D4
D3
D2
D1
D0
SO
OD7
OD6
OD5
OD4
OD3
OD2
OD1 OD0
Notes 1. RST is a Logic [1] state during the above operation.
2. D7:D0 relate to the most recent ordered entry of data into the device.
3. OD7:OD0 relate to the first 8 bits of ordered fault and status data out of the device.
Figure 11. Single 8-Bit Word SPI Communication
34982
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
NAL DEVICE OPERATION
MMANDS AND REGISTERS
CS
SCLK
SI
D
7
D
6
D
5
D
2
D
1
D
0
D
7
*
D
6
*
D
5
*
D
2
*
D
1
*
D
0
*
O
D
7
O
D
6
O
D
5
O
D
2
O
D
1
O
D
0
D
7
D
6
D
5
D
2
D
1
D
0
SO
Notes
1. RST is a Logic [1] state during the above operation.
e
2. D
7
:D0
r
la
t
e
to
th
e
m
o
s
t
rec
e
n
t o
r
d
e
r
e
d
e
n
ty
r
o
f
d
a
ta
i
nto
th
ed
e
ic
e
.
3. D7*:D0* relate to the previous 8 bits (last command word) of data that was previously shifted into the device.
4. OD7:OD0 relate to the first8bits of ordered faultandstatus data outof thedevice.
Figure 12. Multiple 8-Bit Word SPI Communication
SERIAL INPUT COMMUNICATION
SPI communication is accomplished using 8-bit messages. A message is transmitted by the MCU starting with the MSB, D7, and ending
with the LSB, D0 (Table 9). Each incoming command message on the SI pin can be interpreted using the following bit assignments: the
MSB (D7) is the watchdog bit and in some cases a register address bit; the next three bits, D6:D4, are used to select the command
register; and the remaining four bits, D3:D0, are used to configure and control the output and its protection features.
Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable or to confirm
transmitted data as long as the messages are all multiples of eight bits. Any attempt made to latch in a message that is not eight bits will
be ignored.
The 34982 has defined registers, which are used to configure the device and to control the state of the output. Table 10, summarizes the
SI registers. The registers are addressed via D6:D4 of the incoming SPI word (Table 9).
Table 9. SI Message Bit Assignment
Bit Sig
SI Msg Bit
D7
Message Bit Description
MSB
Watchdog in: toggled to satisfy watchdog requirements; also used as a register address bit.
Register address bits.
D6:D4
D3:D1
D0
Used to configure the inputs, outputs, and the device protection features and SO status content.
Used to configure the inputs, outputs, and the device protection features and SO status content.
LSB
Table 10. Serial Input Address and Configuration Bit Map
Serial Input Data
SI Register
D7 D6 D5 D4
D3
D2
SOA2
0
D1
SOA1
CSNS EN
SOCL1
OCLT1
IN dis
OSD1
WD1
D0
STATR
OCR
x
x
x
x
x
0
1
0
1
x
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
0
1
1
1
0
1
0
1
0
1
1
0
0
1
0
SOA0
IN_SPI
SOCL0
OCLT0
A/O
0
SOCHLR
CDTOLR
DICR
SOCH
OL_dis
SOCL2
CD_dis
FAST SR CSNS high
OSDR
WDR
0
0
0
0
OSD2
OSD0
WD0
0
0
0
NAR
0
0
UOVR
TEST
UV_dis
OV_dis
Freescale Internal Use (Test)
x = Don’t care.
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FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
DEVICE REGISTER ADDRESSING
The following section describes the possible register addresses and their impact on device operation.
Address x000—Status Register (STATR)
The STATR register is used to read the device status and the various configuration register contents without disrupting the device
operation or the register contents. The register bits D2, D1, and D0 determine the content of the first eight bits of SO data. In addition to
the device status, this feature provides the ability to read the content of the OCR, SOCHLR, CDTOLR, DICR, OSDR, WDR, NAR, and
UOVR registers. (Refer to the section entitled Serial Output Communication (Device Status Return Data) beginning on page 27.)
Address x001—Output Control Register (OCR)
The OCR register allows the MCU to control the output through the SPI. Incoming message bit D0 (IN_SPI) reflects the desired states of
the high-side output: a Logic [1] enables the output switch and a Logic [0] turns it OFF. A Logic [1] on message bit D1 enables the Current
Sense (CSNS) pin. Bits D2 and D3 must be Logic [0]. Bit D7 is used to feed the watchdog if enabled.
Address x010—Select Overcurrent High and Low Register (SOCHLR)
The SOCHLR register allows the MCU to configure the output overcurrent low and high detection levels, respectively. In addition to
protecting the device, this slow blow fuse emulation feature can be used to optimize the load requirements to match system
characteristics. Bits D2:D0 are used to set the overcurrent low detection level to one of eight possible levels as defined in Table 11. Bit
D3 is used to set the overcurrent high detection level to one of two levels as defined in Table 12.
Table 11. Overcurrent Low Detection Levels
SOCL2 (D2) SOCL1 (D1) SOCL0 (D0)
Overcurrent Low Detection (Amperes)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50
45
40
35
30
25
20
15
Table 12. Overcurrent High Detection Levels
SOCH (D3)
Overcurrent High Detection (Amperes)
0
1
150
100
Address x011—Current Detection Time and Open Load Register (CDTOLR)
The CDTOLR register is used by the MCU to determine the amount of time the device will allow an overcurrent low condition before output
latches OFF occurs. Bits D1 and D0 allow the MCU to select one of four fault blanking times defined in Table 13. Note that these timeouts
apply only to the overcurrent low detection levels. If the selected overcurrent high level is reached, the device will latch off within 20 s.
Table 13. Overcurrent Low Detection Blanking Time
OCLT[1:0]
Timing
155 ms
10 ms
00
01
10
11
1.2 ms
150 s
A Logic [1] on bit D2 disables the overcurrent low (CD_dis) detection timeout feature. A Logic [1] on bit D3 disables the open load (OL)
detection feature.
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NAL DEVICE OPERATION
MMANDS AND REGISTERS
Address x100—Direct Input Control Register (DICR)
The DICR register is used by the MCU to enable, disable, or configure the direct IN pin control of the output. A Logic [0] on bit D1 will
enable the output for direct control by the IN pin. A Logic [1] on bit D1 will disable the output from direct control. While addressing this
register, if the input was enabled for direct control, a Logic [1] for the D0 bit will result in a Boolean AND of the IN pin with its corresponding
D0 message bit when addressing the OCR register. Similarly, a Logic [0] on the D0 pin will result in a Boolean OR of the IN pin with the
corresponding message bits when addressing the OCR register.
The DICR register is useful if there is a need to independently turn on and off several loads that are PWMed at the same frequency and
duty cycle with only one PWM signal. This type of operation can be accomplished by connecting the pertinent direct IN pins of several
devices to a PWM output port from the MCU, and configuring each of the outputs to be controlled via their respective direct IN pin. The
DICR is then used to Boolean AND the direct IN(s) of each of the outputs with the dedicated SPI bit that also controls the output. Each
configured SPI bit can now be used to enable and disable the common PWM signal from controlling its assigned output.
A Logic [1] on bit D2 is used to select the high ratio (C
, 1/40000) on the CSNS pin. The default value [0] is used to select the low ratio
SR1
(C
, 1/5400). A Logic [1] on bit D3 is used to select the high-speed slew rate. The default value [0] corresponds to the low-speed slew
SR0
rate.
Address 0101—Output Switching Delay Register (OSDR)
The OSDR register is used to configure the device with a programmable time delay that is active during Output On transitions that are
initiated via the SPI (not via direct input). Whenever the input is commanded to transition from Logic [0] to Logic [1], the output will be held
OFF for the time delay configured in the OSDR register.
The programming of the contents of this register has no effect on device Fail-safe mode operation. The default value of the OSDR register
is 000, equating to no delay, since the switching delay time is 0 ms. This feature allows the user a way to minimize inrush currents, or
surges, thereby allowing loads to be synchronously switched ON with a single command.
Table 14 shows the eight selectable output switching delay times, which range from 0 to 525 ms.
Table 14. Switching Delay
OSD[2:0] (D2:D0)
Turn ON Delay (ms)
000
001
010
011
100
101
110
111
0
75
150
225
300
375
450
525
Address 1101—Watchdog Register (WDR)
The WDR register is used by the MCU to configure the watchdog timeout. Watchdog timeout is configured using bits D1 and D0 (Table 15).
When bits D1 and D0 are programmed for the desired watchdog timeout period, the WD bit (D7) should be toggled as well to ensure that
the new timeout period is programmed at the beginning of a new count sequence.
Table 15. Watchdog Timeout
WD[1:0] (D1:D0)
Timing (ms)
620
00
01
10
11
310
2500
1250
Address 0110—No Action Register (NAR)
The NAR register can be used to no-operation fill SPI data packets in a daisy chain SPI configuration. This allows devices to not be affected
by commands being clocked over a daisy-chained SPI configuration, and by toggling the WD bit (D7) the watchdog circuitry will continue
to be reset while no programming or data readback functions are being requested from the device.
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Address 1110—Undervoltage/Overvoltage Register (UOVR)
The UOVR register can be used to disable or enable the overvoltage and/or undervoltage protection. By default ([0]), both protections are
active. When disabled, an undervoltage or overvoltage condition fault will not be reported in bits D1 and D0 of the output fault register.
Address x111—TEST
The TEST register is reserved for test and is not accessible with SPI during normal operation.
SERIAL OUTPUT COMMUNICATION (DEVICE STATUS RETURN DATA)
When the CS pin is pulled low, the output status register is loaded. Meanwhile, the data is clocked out MSB- (OD7-) first as the new
message data is clocked into the SI pin. The first eight bits of data clocking out of the SO, and following a CS transition, are dependant
upon the previously written SPI word.
Any bits clocked out of the SO pin after the first eight will be representative of the initial message bits clocked into the SI pin since the CS
pin first transitioned to a Logic [0]. This feature is useful for daisy chaining devices as well as message verification.
A valid message length is determined following a CS transition of Logic [0] to Logic [1]. If there is a valid message length, the data is
latched into the appropriate registers. A valid message length is a multiple of eight bits. At this time, the SO pin is tri-stated and the fault
status register is now able to accept new fault status information.
The output status register correctly reflects the status of the STATR-selected register data at the time the CS is pulled to a Logic [0] during
SPI communication and/or for the period of time since the last valid SPI communication, with the following exceptions:
• The previous SPI communication was determined to be invalid. In this case, the status will be reported as though the invalid SPI
communication never occurred.
• Supply transients below 6.0 V resulting in an undervoltage shutdown of the outputs may result in incorrect data loaded into the status
register. The SO data transmitted to the MCU during the first SPI communication following an undervoltage VPWR condition should
be ignored.
• The RST pin transition from a Logic [0] to Logic [1] while the WAKE pin is at Logic [0] may result in incorrect data loaded into the
status register. The SO data transmitted to the MCU during the first SPI communication following this condition should be ignored.
Table 16. Serial Output Bit Map Descriptions
Previous STATR
Serial Output Returned Data
D7, D2, D1, D0
SOA3 SOA2 SOA1 SOA0
OD7
WDin
WDin
WDin
WDin
WDin
0
OD6
OD5
OD4
OD3
OD2
UVF
OD1
OVF
OD0
FAULT
IN_SPI
SOCL0
OCLT0
A/O
x
x
x
x
x
0
1
0
1
x
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
0
1
1
1
0
1
0
1
0
1
1
0
0
1
OTF
0
OCHF
OCLF
OLF
0
1
1
0
0
0
1
1
–
1
0
1
0
1
1
0
0
–
0
SOCH
OL_dis
Fast SR
FSM_HS
0
0
CSNS EN
SOCL1
OCLT1
IN dis
OSD1
WD1
0
SOCL2
CD_dis
CSNS High
OSD2
WDTO
IN Pin
1110
0
1
1
OSD0
WD0
1
1
0
1
0
FSI Pin
UV_dis
–
WAKE Pin
OV_dis
–
1
1
0
WDin
–
See Table 2
–
x = Don’t care.
SERIAL OUTPUT BIT ASSIGNMENT
The eight bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 16
summarizes the SO register content.
Bit OD7 reflects the state of the watchdog bit (D7) addressed during the prior communication. The contents of bits OD6:OD0 depend upon
the bits D2:D0 from the most recent STATR command SOA2:SOA0.
Previous Address SOA[2:0]=000
If the previous three MSBs are 000, bits OD6:OD0 reflect the current state of the Fault register (FLTR) (Table 17).
Previous Address SOA[2:0]=001
The data in bits OD1 and OD0 contain CSNS EN and IN_SPI programmed bits, respectively.
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27
NAL DEVICE OPERATION
MMANDS AND REGISTERS
Previous Address SOA[2:0]=010
The data in bit OD3 contain the programmed overcurrent high detection level (refer to Table 12), and the data in bits OD2, OD1, and OD0
contain the programmed overcurrent low detection levels (refer to Table 11).
Table 17. Fault Register
OD7
x
OD6
OTF
OD5
OD4
OD3
OLF
OD2
UVF
OD1
OVF
OD0
OCHF
OCLF
FAULT
OD7 (x) = Don’t care.
OD6 (OTF) = Overtemperature Flag.
OD5 (OCHF) = Overcurrent High Flag. (This fault is latched.)
OD4 (OCLF) = Overcurrent Low Flag. (This fault is latched.)
OD3 (OLF) = Open Load Flag.
OD2 (UVF) = Undervoltage Flag. (This fault is latched or not latched.)
OD1 (OVF) = Overvoltage Flag.
OD0 (FAULT) = This flag reports a fault and is reset by a read operation.
Note The FS pin reports a fault and is reset by a new Switch-ON command (via SPI or
direct input IN).
Previous Address SOA[2:0]=011
The data returned in bits OD1 and OD0 are current values for the overcurrent fault blanking time, illustrated in Table 13. Bit OD2 reports
when the overcurrent detection timeout feature is active. OD3 reports whether the open load circuitry is active.
Previous Address SOA[2:0]=100
The returned data contain the programmed values in the DICR.
Previous Address SOA[2:0]=101
• SOA3 = 0. The returned data contain the programmed values in the OSDR. Bit OD3 (FSM_HS) reflects the state of the output in the
Fail-safe mode after a watchdog timeout occurs.
• SOA3 = 1. The returned data contain the programmed values in the WDR. Bit OD2 (WDTO) reflects the status of the watchdog circuitry.
If WDTO bit is Logic [1], the watchdog has timed out and the device is in Fail-safe mode. If WDTO is Logic [0], the device is in Normal
mode (assuming device is powered and not in the Sleep mode), with the watchdog either enabled or disabled.
Previous Address SOA[2:0]=110
• SOA3 = 0. OD2, OD1, and OD0 return the state of the IN, FSI, and WAKE pins, respectively (Table 18).
Table 18. Pin Register
OD2
OD1
OD0
IN Pin
FSI Pin
WAKE Pin
• SOA3 = 1. The returned data contains the programmed values in the UOVR register. Bit OD1 reflects the state of the undervoltage
protection, while bit OD0 reflects the state of the overvoltage protection (refer to Table 16).
Previous Address SOA[2:0]=111
Null Data. No previous register Read Back command received, so bits OD2, OD1, and OD0 are null, or 000.
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TYPICAL APPLICATIONS
LOGIC COMMANDS AND REGISTERS
TYPICAL APPLICATIONS
VPWR
VDD
Voltage
Regulator
VDD
VDD NC VPWR
VDD
VPWR
10 k
10 k
10
MCU
14
VDD
NC
VPWR
100nF
10µF
2.5µF
10nF
2
4
8
12
15
16
WAKE
IN
NC
HS
10k
10k
I/O
SCLK
CS
SCLK
CS
10k
10k
7
3
34982
I/O
RST
SO
11
HS
SI
10k
9
5
1
6
SO
I/O
SI
FS
LOAD
A/D
CSNS
FSI
13
GND
1k
RFS
Figure 13. Typical Applications
The loads must be chosen in order to guarantee the device normal operating condition for junction temperatures from -40 °C to 150 °C.
In case of permanent short-circuit conditions, the duration and number of activation cycles must be limited with a dedicated MCU fault
management, using the fault reporting through the SPI. When driving DC motor or solenoid loads demanding multiple switching, an
external recirculation device must be used to maintain the device in its safe operating area. In this case, an additional protection is
necessary in order to sustain reverse battery (See Figure 10).
Two application notes are available:
• AN3274, which proposes safe configurations of the eXtreme switch devices in case of application faults, and to protect all circuitry with
minimum external components.
• AN2469, which provides guidelines for printed circuit board (PCB) design and assembly.
Development effort will be required by the end users to optimize the board design and PCB layout, in order to reach electromagnetic
compatibility standards (emission and immunity).
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29
NG
NG INFORMATION
PACKAGING
SOLDERING INFORMATION
SOLDERING INFORMATION
The 34982 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board. The
AN2467 provides guidelines for Printed Circuit Board design and assembly.
PACKAGE DIMENSIONS
For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ARL10596D. Dimensions
shown are provided for reference ONLY.
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PACKAGING
PACKAGE DIMENSIONS
34982
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31
NG
DIMENSIONS
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REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
• Initial Release
1.0
9/2014
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Freescale Semiconductor
33
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© 2014 Freescale Semiconductor, Inc.
Document Number: MC34982
Rev. 1.0
9/2014
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