BU2525DW [NXP]

Silicon Diffused Power Transistor; 硅扩散型功率晶体管
BU2525DW
型号: BU2525DW
厂家: NXP    NXP
描述:

Silicon Diffused Power Transistor
硅扩散型功率晶体管

晶体 晶体管
文件: 总7页 (文件大小:79K)
中文:  中文翻译
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Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
GENERAL DESCRIPTION  
New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic  
envelope intended for use in horizontal deflection circuits of large screen colour television receivers up to 32 kHz.  
QUICK REFERENCE DATA  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
VCESM  
VCEO  
Collector-emitter voltage peak value  
VBE = 0  
-
-
1500  
800  
V
V
Collector-emitter voltage  
(open base)  
IC  
Collector current (DC)  
Collector current peak value  
Total power dissipation  
Collector-emitter saturation voltage  
Collector saturation current  
Storage time  
-
-
12  
30  
125  
5.0  
-
A
A
ICM  
Ptot  
VCEsat  
ICsat  
ts  
T
mb 25 ˚C  
-
W
V
IC = 8.0 A; IB = 1.6 A  
-
8
A
ICsat = 8.0 A; IB(end) = 1.1 A  
3.0  
4.0  
µs  
PINNING - SOT429  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
c
base  
2
collector  
emitter  
b
3
Rbe  
tab collector  
2
1
3
e
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1500  
800  
12  
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
A
ICM  
Collector current peak value  
Base current (DC)  
-
30  
A
IB  
IBM  
-IB(AV)  
-IBM  
Ptot  
Tstg  
Tj  
-
8
12  
200  
9
125  
150  
150  
A
Base current peak value  
Reverse base current  
-
A
average over any 20 ms period  
-
mA  
A
Reverse base current peak value 1  
Total power dissipation  
Storage temperature  
-
-
Tmb 25 ˚C  
W
˚C  
˚C  
-65  
-
Junction temperature  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Rth j-mb  
Rth j-a  
Junction to mounting base  
Junction to ambient  
-
-
1.0  
-
K/W  
K/W  
in free air  
45  
1 Turn-off current.  
September 1997  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
STATIC CHARACTERISTICS  
Tmb = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
ICES  
ICES  
Collector cut-off current 2  
VBE = 0 V; VCE = VCESMmax  
VBE = 0 V; VCE = VCESMmax  
Tj = 125 ˚C  
-
-
-
-
1.0  
2.0  
mA  
mA  
;
IEBO  
REB  
BVEBO  
VCEOsust  
Emitter cut-off current  
Base-emitter resistance  
Emitter-base breakdown voltage  
VEB = 6.0 V; IC = 0 A  
VEB = 6.0 V  
72  
-
7.5  
800  
110  
55  
13.5  
-
218  
mA  
V
V
-
-
-
IB = 600 mA  
Collector emitter-sustaining voltage IB = 0A;IC = 100mA;  
L= 25 mH  
VCEsat  
VBEsat  
hFE  
hFE  
VF  
Collector-emitter saturation voltage IC = 8.0 A; IB = 1.6 A  
-
-
-
-
5.0  
1.1  
-
9.5  
2.0  
V
V
Base-emitter saturation voltage  
DC current gain  
IC = 8.0 A; IB = 1.6 A  
IC = 1 A; VCE = 5 V  
IC = 8 A; VCE = 5 V  
IF = 8 A  
-
11  
7
5
Diode forward voltage  
1.6  
V
DYNAMIC CHARACTERISTICS  
Tmb = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Cc  
Collector capacitance  
IE = 0 A; VCB = 10 V; f = 1 MHz  
145  
-
pF  
Switching times (32 kHz line  
deflection circuit)  
ICsat = 8.0 A; LC = 260 µH; Cfb = 13 nF;  
IB(end) = 1.1 A; LB = 2.5 µH; -VBB = 4 V;  
(-dIB/dt = 1.6 A/µs)  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
3.0  
0.2  
4.0  
0.35  
µs  
µs  
Vfr  
tfr  
Anti-parallel diode forward recovery IF = 8 A; dIF/dt = 50 A/µs  
16  
V
voltage  
Anti-parallel diode forward recovery VF = 5 V  
time  
410  
ns  
I
ICsat  
90 %  
Csat  
TRANSISTOR  
IC  
IB  
DIODE  
t
t
IC  
IB  
IBend  
10 %  
tf  
t
t
ts  
10us  
13us  
32us  
IBend  
VCE  
- IBM  
t
Fig.1. Switching times waveforms.  
Fig.2. Switching times definitions.  
2 Measured with half sine-wave voltage (curve tracer).  
September 1997  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
VBESAT / V  
B
I
I
1.2  
1.1  
1
F
F
Tj = 25 C  
Tj = 125 C  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
10%  
time  
t
fr  
V
IC/IB=  
3
F
4
5
V
5 V  
fr  
V
F
0.1  
1
10  
time  
IC / A  
Fig.3. Definition of anti-parallel diode Vfr and tfr  
Fig.6. Typical base-emitter saturation voltage.  
VBEsat = f (IC); parameter IC/IB  
VCESAT / V  
+ 150 v nominal  
adjust for ICsat  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
IC/IB =  
5
4
3
Lc  
Tj = 25 C  
Tj = 125 C  
D.U.T.  
LB  
IBend  
-VBB  
Cfb  
Rbe  
0.1  
10  
1
100  
IC / A  
Fig.4. Switching times test circuit  
Fig.7. Typical collector-emitter saturation voltage.  
VCEsat = f (IC); parameter IC/IB  
VBESAT / V  
hFE  
1.2  
1.1  
1
100  
10  
1
Tj = 25 C  
Tj = 125 C  
Tj = 25 C  
Tj = 125 C  
5 V  
0.9  
0.8  
0.7  
0.6  
IC=  
8 A  
1V  
6 A  
5 A  
4 A  
0
1
2
3
4
0.1  
1
10  
100  
IB / A  
IC / A  
Fig.5. Typical DC current gain. hFE = f (IC)  
parameter VCE  
Fig.8. Typical base-emitter saturation voltage.  
VBEsat = f (IB); parameter IC  
September 1997  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
Normalised Power Derating  
VCESAT / V  
PD%  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
Tj = 25 C  
Tj = 125 C  
8 A  
1
6 A  
5 A  
IC = 4 A  
0.1  
0
20  
40  
60  
80  
Tmb /  
100  
120  
140  
0.1  
1
IB / A  
10  
C
Fig.9. Typical collector-emitter saturation voltage.  
VCEsat = f (IB); parameter IC  
Fig.12. Normalised power dissipation.  
PD% = 100 PD/PD 25˚C = f (Tmb)  
Eoff / uJ  
Zth / (K/W)  
1000  
100  
10  
10  
1
IC = 8 A  
0.5  
7 A  
0.2  
0.1  
0.05  
0.1  
0.02  
t
T
p
t
p
P
D =  
D
0.01  
t
D = 0  
T
0.001  
0.1  
1
10  
1E-06  
1E-04  
1E-02  
t / s  
1E+00  
IB / A  
Fig.10. Typical turn-off losses. Tj = 85˚C  
Eoff = f (IB); parameter IC; f = 32 kHz  
Fig.13. Transient thermal impedance.  
Zth j-mb = f(t); parameter D = tp/T  
ts, tf / us  
12  
11  
10  
9
8
ts  
7
6
5
4
IC =  
8 A  
3
2
7 A  
1
tf  
1
0
0.1  
10  
IB / A  
Fig.11. Typical collector storage and fall time.  
ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 32 kHz  
September 1997  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
IC / A  
100  
tp =  
= 0.01  
ICM  
40 us  
ICDC  
10  
100 us  
Ptot  
1
1 ms  
10 ms  
DC  
0.1  
0.01  
VCE / V  
1000  
1
10  
100  
Fig.14. Forward bias safe operating area. Tmb = 25 ˚C  
CDC & ICM = f(VCE); ICM single pulse; parameter tp;  
Second-breakdown limits independant of temperature.  
I
September 1997  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
MECHANICAL DATA  
Dimensions in mm  
16 max  
5.3 max  
1.8  
Net Mass: 5 g  
o
3.5  
max  
5.3  
7.3  
3.5  
21  
max  
seating  
plane  
15.5  
max  
2.5  
4.0  
max  
15.5  
min  
1
2
3
0.9 max  
2.2 max  
3.2 max  
1.1  
0.4 M  
5.45 5.45  
Fig.15. SOT429; pin 2 connected to mounting base.  
Notes  
1. Refer to mounting instructions for SOT429 envelope.  
2. Epoxy meets UL94 V0 at 1/8".  
September 1997  
6
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU2525DW  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1997  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
September 1997  
7
Rev 1.100  

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