BGU6009/N2 [NXP]

RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER;


型号：	BGU6009/N2
厂家：	NXP
描述：	RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER 放大器射频微波功率放大器
文件：	总10页 (文件大小：148K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BGU6009/N2

ꢀ

;

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and

COMPASS

Rev. 4 — 18 January 2017

Product data sheet

1. Product profile

1.1 General description

The BGU6009/N2 is, also known as the GPS1002M, a Low-Noise Amplifier (LNA) for

GNSS receiver applications in a plastic leadless 6-pin, very thin small outline SOT1230

package. The BGU6009/N2 requires only one external matching inductor and one

external decoupling capacitor.

1.2 Features and benefits

 Covers full GNSS L1 band, from 1559 MHz to 1610 MHz

 Noise figure = 0.9 dB

 Gain 17 dB

 High input 1 dB compression point P_i(1dB)of 4 dBm

 High out of band IP3_iof 7 dBm

 Supply voltage 1.5 V to 3.1 V

 Power-down mode current consumption < 2 A

 Optimized performance at low supply current of 5.1 mA

 Integrated matching for the output

 Requires only one input matching inductor and one supply decoupling capacitor

 Input and output DC decoupled

 ESD protection on all pins (HBM > 2 kV)

 Integrated temperature stabilized bias for easy design

 Small 6-pin leadless package 1.1 mm  0.9 mm  0.47 mm; 0.4 mm pitch: SOT1230

1.3 Applications

LNA for GPS, GLONASS, Gallileo and COMPASS (Beidou).

 Smart phones and feature phones

 Tablet PCs

 Personal Navigation Devices

 Digital Still Cameras

 Digital Video Cameras

 RF front-end modules

 Complete GPS chip set modules and theft protection (laptop, ATM)

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

1.4 Quick reference data

Table 1.

Quick reference data

f = 1559 MHz to 1610 MHz; V_CC= 1.8 V; V_I(ENABLE) 0.9 V; P_i< 40 dBm; T_amb= 25 C; input

matched to 50  using a 6.8 nH inductor; unless otherwise specified.

Symbol Parameter

Conditions

Min Typ Max Unit

V_CC

I_CC

supply voltage

supply current

power gain

RF input AC coupled

1.5 1.8 3.1

5.1

G_p

no jammer

[1]

noise figure

no jammer

0.9

P_i(1dB)

input power at 1 dB

gain compression

f = 1575 MHz

V_CC= 1.8 V

V_CC= 2.85 V

7

4

dBm

IP3_i

input third-order intercept point f = 1575 MHz

[2]

V_CC= 1.8 V

dBm

V_CC= 2.85 V

[1] PCB losses are subtracted.

[2] f₁= 1713 MHz; f₂= 1851 MHz; P_i= 20 dBm at f₁; P_i= 65 dBm at f₂.

2. Pinning information

Table 2.

Pinning

Description

GND

Simplified outline

Graphic symbol

ꢅ

ꢂ

V_CC

ꢁ

ꢃ

ꢅ

ꢀ

ꢂ

ꢄ

RF_OUT

GND_RF

RF_IN

ꢃ

ꢀ

ꢄ

ꢁ

DDDꢀꢁꢁꢂꢃꢁꢄ

ENABLE

transparent top view

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

SOT1230

BGU6009/N2

XSON6

plastic very thin small outline package; no leads;

6 terminals; body 1.1  0.9  0.47 mm

4. Marking

Table 4.

Marking codes

Type number

Marking code

BGU6009/N2

BGU6009_N2

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Product data sheet

Rev. 4 — 18 January 2017

2 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min Max Unit

V_CC

supply voltage

RF input AC coupled

V_I(ENABLE)< V_CC+ 0.6 V

DC; V_{I(RF_IN)}< V_CC+ 0.6 V

DC; V_{I(RF_OUT)}< V_CC+ 0.6 V

0.5 +5.0

[1]

[1][2]

V_I(ENABLE)input voltage on pin ENABLE

V_{I(RF_IN)}input voltage on pin RF_IN

V_{I(RF_OUT)}input voltage on pin RF_OUT

P_i

input power

dBm

[3]

P_tot

T_stg

T_j

total power dissipation

storage temperature

junction temperature

electrostatic discharge voltage

T_sp 130 C

65 +150 C

150

C

V_ESD

Human Body Model (HBM) according to

ANSI/ESDA/JEDEC standard JS-001

2.5 kV

Charged Device Model (CDM) according to

JEDEC standard JESD22-C101

1

[1] Warning: due to internal ESD diode protection, the applied DC voltage should not exceed V_CC+ 0.6 V and shall not exceed 5.0 V to

avoid excess current.

[2] The RF input and RF output are AC coupled through internal DC blocking capacitor.

[3] T_spis the temperature at the soldering point of GND_RF (pin 4).

6. Thermal characteristics

Table 6.

Symbol

R_th(j-sp)

Thermal characteristics

Parameter

Conditions

Typ

Unit

thermal resistance from junction to solder point

225

K/W

7. Characteristics

Table 7.

Characteristics at V_CC= 1.8 V

f = 1559 MHz to 1610 MHz; V_CC= 1.8 V; V_I(ENABLE) 0.9 V; P_i< 40 dBm; T_amb= 25 C; input matched to 50  using a

6.8 nH inductor; unless otherwise specified.

Symbol

V_CC

Parameter

Conditions

Min Typ Max Unit

supply voltage

supply current

RF input AC coupled

V_I(ENABLE) 0.9 V

V_I(ENABLE) 0.3 V

no jammer

1.8

5.1

I_CC

A

dBm

G_p

power gain

0.9

7

RL_in

RL_out

ISL

input return loss

output return loss

isolation

[1]

[2]

noise figure

no jammer

P_i(1dB)

input power at 1 dB

gain compression

f = 1575 MHz

IP3_i

input third-order intercept point

f = 1575 MHz

dBm

BGU6009_N2

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Product data sheet

Rev. 4 — 18 January 2017

3 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

Table 7.

Characteristics at V_CC= 1.8 V …continued

f = 1559 MHz to 1610 MHz; V_CC= 1.8 V; V_I(ENABLE) 0.9 V; P_i< 40 dBm; T_amb= 25 C; input matched to 50  using a

6.8 nH inductor; unless otherwise specified.

Symbol

Parameter

Conditions

Min Typ Max Unit

[3]

t_on

t_off

turn-on time

s

turn-off time

Rollett stability factor

[1] PCB losses are subtracted.

[2] f₁= 1713 MHz; f₂= 1851 MHz; P_i= 20 dBm at f₁; P_i= 65 dBm at f₂.

[3] Within 10 % of the final gain.

Table 8.

Characteristics at V_CC= 2.85 V

f = 1559 MHz to 1610 MHz; V_CC= 2.85 V; V_I(ENABLE) 0.9 V; P_i< 40 dBm; T_amb= 25 C; input matched to 50  using a

6.8 nH inductor; unless otherwise specified.

Symbol

V_CC

Parameter

Conditions

Min Typ Max Unit

supply voltage

supply current

RF input AC coupled

V_I(ENABLE) 0.9 V

V_I(ENABLE) 0.3 V

no jammer

2.85 -

I_CC

5.5

A

dBm

G_p

power gain

17.5 -

RL_in

RL_out

ISL

input return loss

output return loss

isolation

[1]

noise figure

no jammer

0.95 -

P_i(1dB)

input power at 1 dB

gain compression

f = 1575 MHz

4

[2]

[3]

IP3_i

t_on

t_off

input third-order intercept point

turn-on time

f = 1575 MHz

dBm

s

turn-off time

Rollett stability factor

[1] PCB losses are subtracted.

[2] f₁= 1713 MHz; f₂= 1851 MHz; P_i= 20 dBm at f₁; P_i= 65 dBm at f₂.

[3] Within 10 % of the final gain.

Table 9.

ENABLE (pin 6)

40 C  T_amb +85 C; 1.5 V  V_CC 3.1 V.

V_I(ENABLE)(V)

 0.3

State

OFF

 0.9

BGU6009_N2

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 18 January 2017

4 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

8. Application information

8.1 GNSS LNA

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/ꢄ

ꢂ

ꢁ

ꢃ

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ꢀ

ꢄ

DDDꢀꢁꢁꢂꢃꢁꢅ

For a list of components, see Table 10.

Fig 1. Schematics GNSS LNA evaluation board

Table 10. List of components

For schematics, see Figure 1.

Component

Description

Value

1 nF

Remarks

IC1

decoupling capacitor

BGU6009/N2

NXP Semiconductors

Murata LQW15A

high-quality matching inductor 6.8 nH

BGU6009_N2

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Product data sheet

Rev. 4 — 18 January 2017

5 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

9. Package outline

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Fig 2. Package outline SOT1230 (XSON6)

BGU6009_N2

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Product data sheet

Rev. 4 — 18 January 2017

6 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

10. Handling information

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling

electrostatic sensitive devices.

Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or

equivalent standards.

11. Abbreviations

Table 11. Abbreviations

Acronym

ATM

Description

Automated Teller Machine (cash dispenser)

ElectroStatic Discharge

ESD

GLONASS

GNSS

GPS

GLObal NAvigation Satellite System

Global Navigation Satellite System

Global Positioning System

HBM

Human Body Model

LNA

Low-Noise Amplifier

MMIC

PCB

Monolithic Microwave Integrated Circuit

Printed-Circuit Board

12. Revision history

Table 12. Revision history

Document ID

Release date

20170118

Data sheet status

Change notice

Supersedes

BGU6009_N2 v.4

Modifications:

Product data sheet

BGU6009_N2 v.3

• Section 1: added GPS1002M according to our new naming convention

BGU6009_N2 v.3

Modifications:

20160315

• Marking code F changed into W

20141106 Product data sheet

Product data sheet

BGU6009_N2 v.2

Modifications:

BGU6009_N2 v.1

• Table 1 on page 2: The value of the inductor has been corrected.

20141001 Product data sheet

BGU6009_N2 v.1

BGU6009_N2

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Product data sheet

Rev. 4 — 18 January 2017

7 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

13.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

BGU6009_N2

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 18 January 2017

8 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BGU6009_N2

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 18 January 2017

9 of 10

BGU6009/N2

NXP Semiconductors

Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS

15. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 2

1.1

1.2

1.3

1.4

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Application information. . . . . . . . . . . . . . . . . . . 5

GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

Handling information. . . . . . . . . . . . . . . . . . . . . 7

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

8.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 9

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 January 2017

Document identifier: BGU6009_N2

BGU6009/N2 [NXP]

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