BGA2869,115 [NXP]
BGA2869 - MMIC wideband amplifier TSSOP 6-Pin;
| 型号： | BGA2869,115 |
| 厂家： | 
NXP |
| 描述： | BGA2869 - MMIC wideband amplifier TSSOP 6-Pin |
| 文件： | 总13页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BGA2869
MMIC wideband amplifier
Rev. 3 — 10 July 2015
Product data sheet
1. Product profile
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 plastic SMD package.
1.2 Features and benefits
Internally matched to 50
A gain of 31.7 dB at 950 MHz
Output power at 1 dB gain compression = 10 dBm at 950 MHz
Supply current = 24.0 mA at a supply voltage of 5.0 V
Reverse isolation > 39 dB up to 2150 MHz
Good linearity with low second order and third order products
Noise figure = 3.1 dB at 950 MHz
Unconditionally stable (K > 1)
No output inductor required
1.3 Applications
LNB IF amplifiers
General purpose low noise wideband amplifier for frequencies between
DC and 2.2 GHz
2. Pinning information
Table 1.
Pinning
Pin
1
Description
VCC
Simplified outline
Graphic symbol
1
6
5
4
2, 5
3
GND2
6
3
RF_OUT
GND1
4
4
2, 5
1
2
3
6
RF_IN
sym052
BGA2869
NXP Semiconductors
MMIC wideband amplifier
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
-
Description
plastic surface-mounted package; 6 leads
Version
BGA2869
SOT363
4. Marking
Table 3.
Marking
Type number
BGA2869
Marking code
MD*
Description
* = - : made in Hong Kong
* = p : made in Hong Kong
* = W : made in China
* = t : made in Malaysia
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
ICC
Parameter
Conditions
Min
Max
Unit
supply voltage
RF input AC coupled
0.5 +7.0
V
supply current
-
36
mA
mW
Ptot
total power dissipation
storage temperature
junction temperature
drive power
Tsp = 90 C
-
200
Tstg
40
+125 C
Tj
-
-
125
+10
C
Pdrive
dBm
6. Thermal characteristics
Table 5.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Typ
300
Unit
K/W
thermal resistance from junction to Ptot = 200 mW; Tsp = 90 C
solder point
7. Characteristics
Table 6.
Characteristics
VCC = 5.0 V; ZS = ZL = 50 ; Pi = 34 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
5.5
VCC
ICC
supply voltage
supply current
4.5
5.0
V
21.8 24.0 26.0 mA
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
2 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
Table 6.
Characteristics …continued
VCC = 5.0 V; ZS = ZL = 50 ; Pi = 34 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Gp
power gain
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
3 dB below gain at 1 GHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
30.5 31.1 31.7 dB
31.0 31.7 32.4 dB
30.7 32.2 33.6 dB
RLin
RLout
ISL
NF
input return loss
output return loss
isolation
12
16
7
14
18
13
15
21
10
61
47
39
3.1
3.1
3.2
3.0
14
3
16
20
20
19
22
13
81
49
42
3.6
3.5
3.6
3.2
19
4
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
GHz
10
20
8
41
46
37
2.6
2.6
2.8
2.8
9
noise figure
B3dB
K
3 dB bandwidth
Rollett stability factor
2
1
1
2
PL(sat)
saturated output power
12
10
9
12
12
10
10
10
9
13
13
11
11
11
10
dBm
dBm
dBm
dBm
dBm
dBm
PL(1dB) output power at 1 dB gain compression f = 250 MHz
9
f = 950 MHz
9
f = 2150 MHz
8
IP3I
input third-order intercept point
output third-order intercept point
second harmonic output power
Pdrive = 41 dBm (for each tone)
f1 = 250 MHz; f2 = 251 MHz
f1 = 950 MHz; f2 = 951 MHz
f1 = 2150 MHz; f2 = 2151 MHz
Pdrive = 41 dBm (for each tone)
f1 = 250 MHz; f2 = 251 MHz
f1 = 950 MHz; f2 = 951 MHz
f1 = 2150 MHz; f2 = 2151 MHz
Pdrive = 38 dBm
11
11
16
9
6
dBm
dBm
dBm
9
7
13
10
IP3O
20
20
16
23
23
19
25
25
22
dBm
dBm
dBm
PL(2H)
f1H = 250 MHz; f2H = 500 MHz
f1H = 950 MHz; f2H = 1900 MHz
69
53
67
51
65
49
dBm
dBm
IM2
second-order intermodulation distance Pdrive = 38 dBm (for each tone)
f1 = 250 MHz; f2 = 251 MHz
40
34
42
36
44
38
dBc
dBc
f1 = 950 MHz; f2 = 951 MHz
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
3 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
8. Application information
Figure 1 shows a typical application circuit for the BGA2869 MMIC. The device is
internally matched to 50 , and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C1 and C2 should not be more than 470 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The location of the 470 pF supply decoupling capacitor (Cdec) can be precisely chosen for
optimum performance.
The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to
the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes
as close as possible to the MMIC.
9
6
&
GHF
9
6
&ꢁ
&ꢀ
5)B,1
5)B287
5)ꢂLQSXW
5)ꢂRXWSXW
*1'ꢁ
*1'ꢀ
DDDꢀꢁꢁꢂꢃꢄꢃ
Fig 1. Typical application circuit
8.1 Application examples
wideband
amplifier
wideband
amplifier
LNA
mixer
mixer
to IF circuit
or demodulator
from RF
circuit
to IF circuit
or demodulator
antenna
oscillator
oscillator
001aaf762
001aaf763
The MMIC is very suitable as IF amplifier in e.g. LNB’s.
The excellent wideband characteristics make it an easy
building block.
As second amplifier after an LNA, the MMIC offers an
easy matching, low noise solution.
Fig 2. Application as IF amplifier
Fig 3. Application as RF amplifier
8.2 Tables
Table 7.
Supply current over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
Tamb (C)
40
Unit
+25
+85
ICC
supply current
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
23.60
25.80
27.80
21.80
24.00
26.00
20.30
22.40
24.50
mA
mA
mA
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
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BGA2869
NXP Semiconductors
MMIC wideband amplifier
Table 8.
Second harmonic output power over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
Unit
40 +25 +85
PL(2H)
second harmonic output power f = 250 MHz; Pdrive = 38 dBm
VCC = 4.5 V
VCC = 5.0 V
58 67 68 dBm
72 67 61 dBm
64 60 58 dBm
VCC = 5.5 V
f = 950 MHz; Pdrive = 38 dBm
VCC = 4.5 V
69 55 50 dBm
55 51 48 dBm
51 49 46 dBm
VCC = 5.0 V
VCC = 5.5 V
Table 9.
Input power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
Unit
40
+25
+85
Pi(1dB)
input power at 1 dB gain compression f = 250 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
f = 950 MHz
21
20
19
21
20
20
21
20
20
dBm
dBm
dBm
V
CC = 4.5 V
21
21
20
21
21
20
21
21
20
dBm
dBm
dBm
VCC = 5.0 V
VCC = 5.5 V
f = 2150 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
22
21
21
22
22
22
23
23
24
dBm
dBm
dBm
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
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BGA2869
NXP Semiconductors
MMIC wideband amplifier
Table 10. Output power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
40 +25
Unit
+85
PL(1dB)
output power at 1 dB gain compression
f = 250 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
f = 950 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
f = 2150 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
9
9
8
dBm
dBm
dBm
11
12
10
11
10
11
9
8
8
dBm
dBm
dBm
10
11
10
11
9
10
9
8
9
9
6
7
7
dBm
dBm
dBm
10
11
Table 11. Saturated output power over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
Tamb (C)
Unit
40
+25
+85
PL(sat)
saturated output power
f = 250 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
f = 950 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
f = 2150 MHz
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
11
13
14
11
12
13
10
12
13
dBm
dBm
dBm
11
12
14
11
12
13
11
12
13
dBm
dBm
dBm
10
11
12
9
8
8
9
dBm
dBm
dBm
10
10
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
6 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
Table 12. Second-order intermodulation distance over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
Unit
40 +25 +85
IM2
second-order intermodulation distance
f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 38 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
36 39
40 42
43 45
42
45
48
dBc
dBc
dBc
f1 = 950 MHz;
f2 = 951 MHz;
P
drive = 38 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
33 34
35 36
37 37
36
37
37
dBc
dBc
dBc
Table 13. Output third-order intercept point over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
Unit
40 +25 +85
IP3O
output third-order intercept point
f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 41 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
21
23
25
21
23
25
20
22
24
dBm
dBm
dBm
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = 41 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
21
23
25
21
23
24
20
22
23
dBm
dBm
dBm
f1 = 2150 MHz;
f2 = 2151 MHz;
Pdrive = 41 dBm
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
21
22
22
19
19
20
17
17
17
dBm
dBm
dBm
Table 14. 3 dB bandwidth over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
Tamb (C)
40
Unit
+25
+85
B3dB
3 dB bandwidth
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
3.15
2.98
2.96
2.95
2.80
2.79
2.77
GHz
GHz
GHz
3.14
3.12
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
7 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
9. Test information
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9
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For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The
results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on
position P22. The distance between the center of pin 1 and the center of position P22 is 7.43 mm.
Fig 4. PCB layout and demo board with components
Table 15. List of components used for the typical application
Component Description
C1, C2 multilayer ceramic chip
capacitor
Value Dimensions Remarks
470 pF 0603
X7R RF coupling capacitor
P5 to P24 [1] position for multilayer
ceramic chip capacitor Cdec
470 pF 0603
X7R RF decoupling capacitor
IC1
BGA2869 MMIC
-
SOT363
[1] For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results
mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22.
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
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BGA2869
NXP Semiconductors
MMIC wideband amplifier
10. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 5. Package outline SOT363
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
9 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
11. Abbreviations
Table 16. Abbreviations
Acronym
IF
Description
Intermediate Frequency
Low-Noise Amplifier
Low-Noise Block converter
Printed-Circuit Board
Surface Mounted Device
LNA
LNB
PCB
SMD
12. Revision history
Table 17. Revision history
Document ID
BGA2869 v.3
Modifications:
Release date
20150710
Data sheet status
Change notice
Supersedes
Product data sheet
-
BGA2869 v.2
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
BGA2869 v.2
BGA2869 v.1
20130826
Product data sheet
-
BGA2869 v.1
20120717
Product data sheet
-
-
BGA2869
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
10 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
13.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
BGA2869
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
11 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA2869
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 3 — 10 July 2015
12 of 13
BGA2869
NXP Semiconductors
MMIC wideband amplifier
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
8
8.1
8.2
Application information. . . . . . . . . . . . . . . . . . . 4
Application examples . . . . . . . . . . . . . . . . . . . . 4
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
9
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 July 2015
Document identifier: BGA2869
相关型号：
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