BGA2031/1,115_技术文档

DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage

MBD128

BGA2031/1

MMIC variable gain amplifier

Product specification

2001 Feb 05

Supersedes data of 2000 Mar 02

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

FEATURES

PINNING

 High gain

DESCRIPTION

 Excellent adjacent channel power rejection

 Small SMD package

 Low dissipation.

1

2

3

4

5

6

RFin

CTRL

V_S1

V_S2+ RFout

GND

APPLICATIONS

GND

 General purpose variable gain amplifier for low voltage

and medium power

 Driver for power amplifiers in systems that require good

linearity, such as CDMA, both cellular band (850 MHz)

and PCS (1.9 GHz). This is because of the high output

power and good linearity.

handbook, halfpage

V

S1

6

5

4

RFin

V

+RFout

S2

GND

DESCRIPTION

CTRL

BIAS

CIRCUIT

Silicon Monolitic Microwave Integrated Circuit (MMIC)

2 stage variable gain amplifier in double polysilicon

technology in a 6-pin SOT363 SMD plastic package for low

voltage medium power applications.

1

2

3

MAM440

Top view

Marking code: A3

Fig.1 Simplified outline (SOT363) and symbol.

QUICK REFERENCE DATA

SYMBOL

V_S1

PARAMETER

supply voltage

CONDITIONS

TYP.

MAX.

3.3

UNIT

3

0

V

V_S2

I_S

supply voltage

3.3

10

63

37



supply current; pins 3 and 4

V_CTRL= 0

A

V_CTRL= 2.7 V; V_S= 3 V

V_CTRL= 2.4 V; V_S= 3 V

51

30

13

mA

dBm

P_L

load power

at 1 dB gain compression point;

f = 1.9 GHz

ACPR

adjacent channel power rejection

f = 1.9 GHz; P_L= 10 dBm

f = 836 MHz; P_L= 8 dBm

f = 1.9 GHz; P_L= 12 dBm

f = 836 MHz; P_L= 8 dBm

49

48

23

24

62



dBc

dB

G_p

power gain

dB

G

gain control range

dB

CAUTION

This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport

and handling.

2001 Feb 05

2

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134)

SYMBOL

V_S

PARAMETER

DC supply voltage

CONDITIONS

MIN.

MAX.

3.3

UNIT



V

V_CTRL

I_CTRL

I_S1

control voltage

< V_S

1.2

control current

mA

dBm

mW

C

supply current; pin 3

supply current; pin 4

drive power

27

I_S2

50

P_D

+10

200

+150

150

P_tot

T_stg

T_j

total power dissipation

storage temperature

operating junction temperature

T_s 80 C

65



C

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

VALUE

UNIT

R_{th j-s}

thermal resistance from junction to solder point

350

K/W

MLD490

300

handbook, halfpage

P

tot

(mW)

200

100

0

50

100

150

200

T

(°C)

s

Fig.2 Power derating.

2001 Feb 05

3

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

CHARACTERISTICS

T_j= 25 C; Z_S= Z_L= 50 ; V_S= 3 V; unless otherwise specified.

SYMBOL

PARAMETER

frequency range

supply voltage

CONDITIONS

MIN.

800

TYP.

MAX.

UNIT

MHz

f



3

0

2500

3.3

10

V_S1

V_S2

I_S

2.7



V

supply voltage

V

supply current;

pins 3 and 4

V_CTRL= 0; P_D= 0 mW

_CTRL= 2.7 V; V_S= 3 V; P_D= 0 mW

A

mA

V

37

23

0.7

51

63

V_CTRL= 2.4 V; V_S= 3 V; P_D= 0 mW

V_CTRL= 2.7 V

30

37

I_CTRL

control current

0.92

1.1

f = 1900 MHz

f

frequency range

power gain

1850



1950

MHz

dB

G_p

V_CTRL= 2.7 V; P_L= 12 dBm

0 < V_CTRL< 2.7 V

note 1



23

56

21

49



G

G_CS

ACPR

gain control range

gain control slope

dB

dB/V

dBc

adjacentchannelpower 1.23 MHz offset; BW_ACP= 30 kHz;

rejection

BW_carrier= 1.23 MHz; P_L= 10 dBm

1.98 MHz offset; BW_ACP= 30 kHz;



74



dBc

BW_carrier= 1.23 MHz; P_L= 10 dBm

P_L

load power

at 1 dB gain compression point

V_CTRL= 2.7 V



13



dBm

VSWR_IN

VSWR_OUT

input VSWR

output VSWR

1:3.5

1:1.3

V_CTRL= 2.7 V

f = 836 MHz

f

frequency range

power gain

824



849



MHz

dB

G_p

V_CTRL= 2.7 V; P_L= 8 dBm

0 < V_CTRL< 2.7 V

note 1

24

62

22

49

G

G_CS

ACPR

gain control range

gain control slope



dB



dB/V

dBc

adjacentchannelpower 885 kHz offset; BW_ACP= 30 kHz;



rejection

BW_carrier= 1.23 MHz; P_L= 8 dBm

1.98 MHz offset; BW_ACP= 30 kHz;



74



dBc

BW_carrier= 1.23 MHz; P_L= 8 dBm

P_L

load power

at 1 dB gain compression point

V_CTRL= 2.7 V



11



dBm

VSWR_IN

VSWR_OUT

input VSWR

output VSWR

1:2

V_CTRL= 2.7 V

1:1.4

Note

1. G_CS= (G at V_CTRL= 2.5 V  G at V_CTRL= 1.5 V) / (V_CTRL= 2.5 V  V_CTRL= 1.5V)

2001 Feb 05

4

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

MLD491

MLD492

60

16

handbook, halfpage

P

L

I

S

(dBm)

(mA)

40

8

836 MHz

1900 MHz

20

0

−8

1

2

3

−30

−26

−22

−18

−14

−10

(dBm)

V

(V)

CTRL

P

D

V_S= 3 V.

V_S= 3 V; V_CTRL= 2.7 V.

Fig.3 Total supply current as a function of control

voltage; typical values.

Fig.4 Load power as a function of drive power;

typical values.

MLD494

MLD493

40

handbook, halfpage

G

p

G

p

(dB)

20

0

−20

−40

−60

0

−20

−40

0

1

2

3

0

1

2

3

V

(V)

V

(V)

CTRL

V_S= 3 V; P_D= 14 dBm; f = 1.9 GHz.

V_S= 3 V; P_D= 14 dBm; f = 836 MHz.

Fig.5 Power gain as a function of control voltage;

typical values.

Fig.6 Power gain as a function of control voltage;

typical values.

2001 Feb 05

5

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

MLD495

MLD496

0

handbook, halfpage

ACPR

(dBc)

ACPR

(dBc)

−20

−40

−60

−20

offset = 1.23 MHz

offset = 1.98 MHz

offset = 0.885 MHz

−40

offset = 1.98 MHz

−60

−80

−20

−10

0

10

−20

−10

0

10

P

(dBm)

P (dBm)

L

V_S= 3 V; f = 1.9 GHz; P_D= 12.8 dBm.

V_S= 3.6 V; f = 836 MHz; P_D= 16 dBm.

Fig.7 Adjacent channel power rejection as a

function of load power; typical values.

Fig.8 Adjacent channel power rejection as a

function of load power; typical values.

MLD497

160

handbook, halfpage

G

CS

(dB/V)

120

80

40

836 MHz

1900 MHz

0

−40

0

1

2

3

V

(V)

CTRL

V_S= 3 V; P_D= 14 dBm.

Fig.9 Gain control slope as a function of control

voltage; typical values.

2001 Feb 05

6

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

ELECTRICAL BLOCK DIAGRAM

V

R2

S2

handbook, full pagewidth

V

S1

C2

C3

RF input

RF output

L1

L2

Bias-T

DC-block

R1

BIAS

CIRCUIT

V

CTRL

C1

MGU298

Fig.10 Test diagram.

List of components (see Fig.10)

COMPONENT

DESCRIPTION

VALUE

DIMENSIONS

C1

multilayer ceramic chip capacitor

stripline; note 1

10 nF

22 nF

1.5 nF

50 

0603

C2

0603

C3

L1, L2

R1

SMD resistor

22 ; 0.16 W

2.4 ; 0.16 W

0603

R2

SMD resistor

Note

1. The striplines are on a gold plated double copper-clad printed-circuit board (_r= 6.15), board thickness = 0.64 mm,

copper thickness = 35 m, gold thickness = 5 m.

2001 Feb 05

7

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

PACKAGE OUTLINE

Plastic surface-mounted package; 6 leads

SOT363

D

B

E

A

X

y

H

v

M

A

E

6

5

4

Q

pin 1

index

A

1

2

3

c

e

1

b

L

p

w

M B

p

e

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

1

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

p

1

E

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

mm

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

04-11-08

06-03-16

SOT363

SC-88

2001 Feb 05

8

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DEFINITIONS

Right to make changes  NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Product specification  The information and data

provided in a Product data sheet shall define the

specification of the product as agreed between NXP

Semiconductors and its customer, unless NXP

Semiconductors and customer have explicitly agreed

otherwise in writing. In no event however, shall an

agreement be valid in which the NXP Semiconductors

product is deemed to offer functions and qualities beyond

those described in the Product data sheet.

Suitability for use  NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

DISCLAIMERS

Limited warranty and liability  Information in this

document is believed to be accurate and reliable.

However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

Applications  Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as

for the planned application and use of customer’s third

party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks

associated with their applications and products.

2001 Feb 05

9

NXP Semiconductors

Product specification

MMIC variable gain amplifier

BGA2031/1

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications

or products, or the application or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applications and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

Export control  This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data  The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Non-automotive qualified products  Unless this data

sheet expressly states that this specific NXP

Semiconductors product is automotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor tested in accordance with automotive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified products in automotive equipment or

applications.

Limiting values  Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions above those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own risk, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed

product claims resulting from customer design and use of

the product for automotive applications beyond NXP

Semiconductors’ standard warranty and NXP

Terms and conditions of commercial sale  NXP

Semiconductors products are sold subject to the general

terms and conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an

individual agreement is concluded only the terms and

conditions of the respective agreement shall apply. NXP

Semiconductors hereby expressly objects to applying the

customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Semiconductors’ product specifications.

No offer to sell or license  Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

2001 Feb 05

10

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimers. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R77/02/pp11

Date of release: 2001 Feb 05


型号：	BGA2031/1,115
厂家：	NXP
描述：	BGA2031 - MMIC variable gain amplifier TSSOP 6-Pin 射频微波
文件：	总11页 (文件大小：92K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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