74AVCH16T245BX [NXP]
IC AVC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PBCC60, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60, Bus Driver/Transceiver;型号: | 74AVCH16T245BX |
厂家: | NXP |
描述: | IC AVC SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PBCC60, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60, Bus Driver/Transceiver 输出元件 |
文件: | 总29页 (文件大小:279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74AVCH16T245
16-bit dual supply translating transceiver with configurable
voltage translation; 3-state
Rev. 5 — 1 March 2012
Product data sheet
1. General description
The 74AVCH16T245 is a 16-bit transceiver with bidirectional level voltage translation and
3-state outputs.The device can be used as two 8-bit transceivers or as a 16-bit
transceiver. It has dual supplies (VCC(A) and VCC(B)) for voltage translation and four 8-bit
input-output ports (nAn, nBn) each with its own output enable (nOE) and send/receive
(nDIR) input for direction control. VCC(A) and VCC(B) can be independently supplied at any
voltage between 0.8 V and 3.6 V making the device suitable for low voltage translation
between any of the following voltages: 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V. A HIGH
on nDIR selects transmission from nAn to nBn while a LOW on nDIR selects transmission
from nBn to nAn. A HIGH on nOE causes the outputs to assume a high-impedance
OFF-state
The device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing any damaging backflow current through the
device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at
GND level, both A and B outputs are in the high-impedance OFF-state. The bus-hold
circuitry on the powered-up side always stays active.
The 74AVCH16T245 has active bus hold circuitry which is provided to hold unused or
floating data inputs at a valid logic level. This feature eliminates the need for external
pull-up or pull-down resistors.
2. Features and benefits
Wide supply voltage range:
VCC(A): 0.8 V to 3.6 V
VCC(B): 0.8 V to 3.6 V
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3B exceeds 8000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101D exceeds 1000 V
Maximum data rates:
380 Mbit/s ( 1.8 V to 3.3 V translation)
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
200 Mbit/s ( 1.1 V to 3.3 V translation)
200 Mbit/s ( 1.1 V to 2.5 V translation)
200 Mbit/s ( 1.1 V to 1.8 V translation)
150 Mbit/s ( 1.1 V to 1.5 V translation)
100 Mbit/s ( 1.1 V to 1.2 V translation)
Suspend mode
Bus hold on data inputs
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AVCH16T245DGG 40 C to +125 C
TSSOP48
plastic thin shrink small outline package; 48 leads; SOT362-1
body width 6.1 mm
74AVCH16T245DGV 40 C to +125 C
TSSOP48[1] plastic thin shrink small outline package; 48 leads; SOT480-1
body width 4.4 mm; lead pitch 0.4 mm
74AVCH16T245EV
74AVCH16T245BX
40 C to +125 C
40 C to +125 C
VFBGA56
plastic very thin fine-pitch ball grid array package; SOT702-1
56 balls; body 4.5 7 0.65 mm
HXQFN60
plastic compatible thermal enhanced extremely
thin quad flat package; no leads; 60 terminals;
body 4 6 0.5 mm
SOT1134-2
[1] Also known as TVSOP48.
4. Functional diagram
1DIR
1A1
2DIR
1OE
2OE
2A1
1B1
2B1
V
V
V
V
CC(B)
CC(A)
CC(B)
CC(A)
to other seven channels
to other seven channels
001aak426
Fig 1. Logic diagram
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
2 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1B8
V
V
CC(B)
CC(A)
1OE
1DIR
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1A8
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2B8
V
V
CC(B)
CC(A)
2OE
2DIR
2A1
2A2
2A3
2A4
2A5
2A6
2A7
2A8
001aak425
Fig 2. Logic symbol
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
3 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
5. Pinning information
5.1 Pinning
74AVCH16T245
1
2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1DIR
1B1
1B2
GND
1B3
1B4
1OE
1A1
1A2
GND
1A3
1A4
3
4
5
6
7
V
V
CC(A)
CC(B)
8
1B5
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
9
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
ball A1
index area
74AVCH16T245
1
2 3 4 5 6
A
B
C
D
E
F
V
V
CC(A)
CC(B)
2B5
2A5
2A6
GND
2A7
2A8
2OE
2B6
GND
2B7
G
H
J
2B8
K
2DIR
001aak431
Transparent top view
001aak430
Fig 3. Pin configuration SOT362-1 and SOT480-1
(TSSOP48)
Fig 4. Pin configuration SOT702-1 (VFBGA56)
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
4 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
terminal 1
index area
D1
A32
D5
A31
A30
A29
A28
A27
D8
D4
B20
B19
B18
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A26
A25
A24
A23
A22
A21
A20
A19
A18
A17
B1
B2
B3
B4
B5
B6
B7
B17
B16
B15
B14
B13
B12
B11
74AVCH16T245
(1)
GND
D6
B8
B9
B10
D7
D2
A11
A12
A13
A14
A15
A16
D3
001aak432
Transparent top view
(1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or
mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to
GND.
Fig 5. Pin configuration SOT1134-2 (HXQFN60)
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
5 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
SOT362-1 and
SOT480-1
SOT702-1
SOT1134-2
1DIR, 2DIR 1, 24
A1, K1
A30, A13
direction control
1B1 to 1B8 2, 3, 5, 6, 8, 9, 11, 12 B2, B1, C2, C1,
D2, D1, E2, E1
B20, A31, D5, D1,
A2, B2, B3, A5
data input or output
2B1 to 2B8 13, 14, 16, 17, 19, 20, F1, F2, G1, G2,
A6, B5, B6, A9, D2, data input or output
D6, A12, B8
22, 23
H1, H2, J1, J2
GND[1]
4, 10, 15, 21, 28, 34, B3, D3, G3, J3, J4, A32, A3, A8, A11,
ground (0 V)
39, 45
G4, D4, B4
A16, A19, A24, A27
VCC(B)
7, 18
C3, H3
A1, A10
supply voltage B (nBn inputs are
referenced to VCC(B)
)
1OE, 2OE
48, 25
A6, K6
A29, A14
output enable input (active LOW)
data input or output
1A1 to 1A8 47, 46, 44, 43, 41, 40, B5, B6, C5, C6,
38, 37 D5, D6, E5, E6
B18, A28, D8, D4,
A25, B16, B15, A22
2A1 to 2A8 36, 35, 33, 32, 30, 29, F6, F5, G6, G5,
A21, B13, B12, A18, data input or output
D3, D7, A15, B10
27, 26
H6, H5, J6, J5
VCC(A)
n.c.
31, 42
C4, H4
A17, A26
supply voltage A (nAn, nOE and nDIR
inputs are referenced to VCC(A)
)
-
A2, A3, A4, A5, K2, A4, A7, A20, A23,
not connected
K3, K4, K5
B1, B4, B7, B9, B11,
B14, B17, B19
[1] All GND pins must be connected to ground (0 V).
6. Functional description
Table 3.
Function table[1]
Supply voltage
VCC(A), VCC(B)
0.8 V to 3.6 V
0.8 V to 3.6 V
0.8 V to 3.6 V
GND[3]
Input
nOE[2]
Input/output[3]
nAn[2]
nDIR[2]
nBn[2]
L
L
nAn = nBn
input
L
H
X
X
input
Z
nBn = nAn
H
X
Z
Z
Z
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2] The nAn, nDIR and nOE input circuit is referenced to VCC(A); The nBn input circuit is referenced to VCC(B)
[3] If at least one of VCC(A) or VCC(B) is at GND level, the device goes into suspend mode.
.
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
6 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC(A)
VCC(B)
IIK
Parameter
Conditions
Min
0.5
0.5
50
0.5
50
0.5
0.5
-
Max
Unit
V
supply voltage A
supply voltage B
input clamping current
input voltage
+4.6
+4.6
V
VI < 0 V
-
mA
V
[1]
VI
+4.6
IOK
output clamping current
output voltage
VO < 0 V
-
mA
V
[1][2][3]
[1]
VO
Active mode
VCCO + 0.5
+4.6
50
Suspend or 3-state mode
VO = 0 V to VCC
ICC(A) or ICC(B)
V
[2]
IO
output current
mA
mA
mA
C
ICC
IGND
Tstg
Ptot
supply current
-
100
ground current
100
65
-
storage temperature
total power dissipation
+150
Tamb = 40 C to +125 C;
TSSOP48 package
VFBGA56 package
HXQFN60 package
[4]
[5]
[5]
-
-
-
500
mW
mW
mW
1000
1000
[1] The minimum input voltage ratings and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] CCO is the supply voltage associated with the output port.
V
[3] VCCO + 0.5 V should not exceed 4.6 V.
[4] Above 60 C the value of Ptot derates linearly with 5.5 mW/K.
[5] Above 70 C the value of Ptot derates linearly with 1.8 mW/K.
8. Recommended operating conditions
Table 5.
Symbol
VCC(A)
VCC(B)
VI
Recommended operating conditions
Parameter
Conditions
Min
0.8
0.8
0
Max
3.6
Unit
V
supply voltage A
supply voltage B
input voltage
3.6
V
3.6
V
[1]
[2]
VO
output voltage
Active mode
0
VCCO
3.6
V
Suspend or 3-state mode
0
V
Tamb
ambient temperature
40
-
+125
5
C
ns/V
t/V
input transition rise and fall rate
VCCI = 0.8 V to 3.6 V
[1] VCCO is the supply voltage associated with the output port.
[2] CCI is the supply voltage associated with the input port.
V
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
7 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
9. Static characteristics
Table 6.
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Typical static characteristics at Tamb = 25 C[1][2]
Symbol Parameter Conditions
HIGH-level output voltage VI = VIH or VIL
IO = 1.5 mA; VCC(A) = VCC(B) = 0.8 V
LOW-level output voltage VI = VIH or VIL
IO = 1.5 mA; VCC(A) = VCC(B) = 0.8 V
Min
Typ
0.69
0.07
Max
Unit
V
VOH
VOL
II
-
-
-
-
-
V
input leakage current
nDIR, nOE input; VI = 0 V or 3.6 V;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
0.025 0.25 A
[3]
[4]
[5]
IBHL
bus hold LOW current
bus hold HIGH current
A or B port; VI = 0.42 V; VCC(A) = VCC(B) = 1.2 V
A or B port; VI = 0.78 V; VCC(A) = VCC(B) = 1.2 V
A or B port; VCC(A) = VCC(B) = 1.2 V
-
-
-
26
-
-
-
A
A
A
IBHH
IBHLO
24
27
bus hold LOW overdrive
current
[6]
[7]
[7]
[7]
IBHHO
IOZ
bus hold HIGH overdrive
current
A or B port; VCC(A) = VCC(B) = 1.2 V
-
-
-
-
-
-
-
-
26
0.5
0.5
0.5
0.1
0.1
2.0
-
A
A
A
A
A
A
pF
pF
OFF-state output current
A or B port; VO = 0 V or VCCO
VCC(A) = VCC(B) = 3.6 V
;
2.5
2.5
2.5
1
1
-
suspend mode A port; VO = 0 V or VCCO
VCC(A) = 3.6 V; VCC(B) = 0 V
;
;
suspend mode B port; VO = 0 V or VCCO
VCC(A) = 0 V; VCC(B) = 3.6 V
IOFF
power-off leakage current A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0.8 V to 3.6 V
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0.8 V to 3.6 V
CI
input capacitance
nDIR, nOE input; VI = 0 V or 3.3 V;
VCC(A) = VCC(B) = 3.3 V
CI/O
input/output capacitance
A and B port; VO = 3.3 V or 0 V;
VCC(A) = VCC(B) = 3.3 V
4.5
-
[1] VCCO is the supply voltage associated with the output port.
[2] VCCI is the supply voltage associated with the data input port.
[3] The bus hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VI to GND
and then raising it to VIL max.
[4] The bus hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VI to VCC
and then lowering it to VIH min.
[5] An external driver must source at least IBHLO to switch this node from LOW to HIGH.
[6] An external driver must sink at least IBHHO to switch this node from HIGH to LOW.
[7] For I/O ports, the parameter IOZ includes the input leakage current.
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
8 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
Table 7.
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Static characteristics [1][2]
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Unit
Min
Max
Min
Max
VIH
HIGH-level
data input
input voltage
VCCI = 0.8 V
0.70VCCI
0.65VCCI
1.6
-
-
-
-
0.70VCCI
0.65VCCI
1.6
-
-
-
-
V
V
V
V
VCCI = 1.1 V to 1.95 V
VCCI = 2.3 V to 2.7 V
VCCI = 3.0 V to 3.6 V
nDIR, nOE input
2
2
VCC(A) = 0.8 V
0.70VCC(A)
-
-
-
-
0.70VCC(A)
-
-
-
-
V
V
V
V
VCC(A) = 1.1 V to 1.95 V
VCC(A) = 2.3 V to 2.7 V
VCC(A) = 3.0 V to 3.6 V
data input
0.65VCC(A)
0.65VCC(A)
1.6
2
1.6
2
VIL
LOW-level
input voltage
VCCI = 0.8 V
-
-
-
-
0.30VCCI
0.35VCCI
0.7
-
-
-
-
0.30VCCI
0.35VCCI
0.7
V
V
V
V
VCCI = 1.1 V to 1.95 V
VCCI = 2.3 V to 2.7 V
VCCI = 3.0 V to 3.6 V
nDIR, nOE input
0.8
0.8
VCC(A) = 0.8 V
-
-
-
-
0.30VCC(A)
0.35VCC(A)
0.7
-
-
-
-
0.30VCC(A)
0.35VCC(A)
0.7
V
V
V
V
VCC(A) = 1.1 V to 1.95 V
VCC(A) = 2.3 V to 2.7 V
VCC(A) = 3.0 V to 3.6 V
VI = VIH or VIL
0.8
0.8
VOH
HIGH-level
output
IO = 100 A;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
VCCO 0.1
-
VCCO 0.1
-
V
voltage
IO = 3 mA; VCC(A) = VCC(B) = 1.1 V
IO = 6 mA; VCC(A) = VCC(B) = 1.4 V
0.85
1.05
1.2
-
-
-
0.85
1.05
1.2
-
-
-
V
V
V
IO = 8 mA;
VCC(A) = VCC(B) = 1.65 V
IO = 9 mA; VCC(A) = VCC(B) = 2.3 V
IO = 12 mA;
1.75
2.3
-
-
1.75
2.3
-
-
V
V
VCC(A) = VCC(B) = 3.0 V
VOL
LOW-level
output
voltage
VI = VIH or VIL
IO = 100 A;
VCC(A) = VCC(B) = 0.8 V to 3.6 V
-
0.1
-
0.1
V
IO = 3 mA; VCC(A) = VCC(B) = 1.1 V
IO = 6 mA; VCC(A) = VCC(B) = 1.4 V
IO = 8 mA; VCC(A) = VCC(B) = 1.65 V
IO = 9 mA; VCC(A) = VCC(B) = 2.3 V
IO = 12 mA; VCC(A) = VCC(B) = 3.0 V
-
-
-
-
-
-
0.25
0.35
0.45
0.55
0.7
-
-
-
-
-
-
0.25
0.35
0.45
0.55
0.7
V
V
V
V
V
II
inputleakage nDIR, nOE input; VI = 0 V or 3.6 V;
current VCC(A) = VCC(B) = 0.8 V to 3.6 V
1
5
A
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
9 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
[1][2]
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Unit
Min
Max
Min
Max
[3]
IBHL
bus hold
A or B port
LOW current
VI = 0.49 V; VCC(A) = VCC(B) = 1.4 V
15
25
-
-
15
25
-
-
A
A
VI = 0.58 V;
VCC(A) = VCC(B) = 1.65 V
VI = 0.70 V; VCC(A) = VCC(B) = 2.3 V
VI = 0.80 V; VCC(A) = VCC(B) = 3.0 V
A or B port
45
-
-
45
90
-
-
A
A
100
[4]
IBHH
bus hold
HIGH current
VI = 0.91 V; VCC(A) = VCC(B) = 1.4 V
15
25
-
-
15
25
-
-
A
A
VI = 1.07 V;
VCC(A) = VCC(B) = 1.65 V
VI = 1.60 V; VCC(A) = VCC(B) = 2.3 V
VI = 2.00 V; VCC(A) = VCC(B) = 3.0 V
A or B port
45
-
-
45
-
-
A
A
100
100
[5]
IBHLO
IBHHO
IOZ
bus hold
LOW
overdrive
current
VCC(A) = VCC(B) = 1.6 V
VCC(A) = VCC(B) = 1.95 V
VCC(A) = VCC(B) = 2.7 V
VCC(A) = VCC(B) = 3.6 V
A or B port
125
200
300
500
-
-
-
-
125
200
300
500
-
-
-
-
A
A
A
A
[6]
bus hold
HIGH
overdrive
current
VCC(A) = VCC(B) = 1.6 V
VCC(A) = VCC(B) = 1.95 V
VCC(A) = VCC(B) = 2.7 V
VCC(A) = VCC(B) = 3.6 V
125
200
300
500
-
-
-
125
200
300
500
-
-
A
A
A
A
A
-
-
-
-
-
[7]
[7]
OFF-state
output
current
A or B port; VO = 0 V or VCCO
VCC(A) = VCC(B) = 3.6 V
;
5
30
suspend mode A port;
VO = 0 V or VCCO; VCC(A) = 3.6 V;
VCC(B) = 0 V
-
-
5
5
-
-
30
30
A
A
[7]
suspend mode B port;
VO = 0 V or VCCO; VCC(A) = 0 V;
V
CC(B) = 3.6 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0.8 V to 3.6 V
-
-
5
5
-
-
30
30
A
A
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0.8 V to 3.6 V
74AVCH16T245
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Product data sheet
Rev. 5 — 1 March 2012
10 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
[1][2]
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Unit
Min
Max
Min
Max
ICC
supply
current
A port; VI = 0 V or VCCI; IO = 0 A
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
-
-
30
25
-
-
125
100
A
A
VCC(A) = 1.1 V to 3.6 V;
V
CC(B) = 1.1 V to 3.6 V
VCC(A) = 3.6 V; VCC(B) = 0 V
VCC(A) = 0 V; VCC(B) = 3.6 V
B port; VI = 0 V or VCCI; IO = 0 A
-
25
-
-
100
-
A
A
5
20
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
-
-
30
25
-
-
125
100
A
A
VCC(A) = 1.1 V to 3.6 V;
VCC(B) = 1.1 V to 3.6 V
VCC(A) = 3.6 V; VCC(B) = 0 V
VCC(A) = 0 V; VCC(B) = 3.6 V
A plus B port (ICC(A) + ICC(B));
5
-
-
20
-
A
A
A
25
55
-
-
100
185
-
IO = 0 A; VI = 0 V or VCCI
VCC(A) = 0.8 V to 3.6 V;
VCC(B) = 0.8 V to 3.6 V
;
A plus B port (ICC(A) + ICC(B));
-
45
-
150
A
IO = 0 A; VI = 0 V or VCCI
VCC(A) = 1.1 V to 3.6 V;
VCC(B) = 1.1 V to 3.6 V
;
[1] VCCO is the supply voltage associated with the output port.
[2] VCCI is the supply voltage associated with the data input port.
[3] The bus hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VI to GND
and then raising it to VIL max.
[4] The bus hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VI to VCC
and then lowering it to VIH min.
[5] An external driver must source at least IBHLO to switch this node from LOW to HIGH.
[6] An external driver must sink at least IBHHO to switch this node from HIGH to LOW.
[7] For I/O ports, the parameter IOZ includes the input leakage current.
Table 8.
VCC(A)
Typical total supply current (ICC(A) + ICC(B)
)
VCC(B)
Unit
0 V
0
0.8 V
0.1
0.1
0.1
0.1
0.1
0.3
1.6
1.2 V
0.1
0.1
0.1
0.1
0.1
0.1
0.8
1.5 V
0.1
0.1
0.1
0.1
0.1
0.1
0.4
1.8 V
0.1
0.1
0.1
0.1
0.1
0.1
0.2
2.5 V
0.1
0.3
0.1
0.1
0.1
0.1
0.1
3.3 V
0.1
1.6
0.8
0.4
0.2
0.1
0.1
0 V
A
A
A
A
A
A
A
0.8 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.1
0.1
0.1
0.1
0.1
0.1
74AVCH16T245
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Product data sheet
Rev. 5 — 1 March 2012
11 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
10. Dynamic characteristics
Table 9.
Typical power dissipation capacitance at VCC(A) = VCC(B) and Tamb = 25 C [1][2]
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
VCC(A) = VCC(B)
Unit
0.8 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
CPD
power dissipation A port: (direction nAn to
0.2
0.2
0.2
0.2
0.3
0.4
pF
pF
pF
pF
pF
pF
pF
pF
capacitance
nBn); output enabled
A port: (direction nAn to
nBn); output disabled
0.2
9
0.2
9.7
0.6
9.7
0.6
0.2
0.2
0.2
9.8
0.6
9.8
0.6
0.2
0.2
0.2
10.3
0.7
0.3
11.7
0.7
0.4
13.7
0.7
A port: (direction nBn to
nAn); output enabled
A port: (direction nBn to
nAn); output disabled
0.6
9
B port: (direction nAn to
nBn); output enabled
10.3
0.7
11.7
0.7
13.7
0.7
B port: (direction nAn to
nBn); output disabled
0.6
0.2
0.2
B port: (direction nBn to
nAn); output enabled
0.2
0.3
0.4
B port: (direction nBn to
nAn); output disabled
0.2
0.3
0.4
[1] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of the outputs.
[2] fi = 10 MHz; VI = GND to VCC; tr = tf = 1 ns; CL = 0 pF; RL = .
74AVCH16T245
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
12 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
Table 10. Typical dynamic characteristics at VCC(A) = 0.8 V and Tamb = 25 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter
Conditions
VCC(B)
1.5 V
Unit
0.8 V
14.4
14.4
16.2
17.6
21.9
22.2
1.2 V
7.0
1.8 V
6.0
2.5 V
5.9
3.3 V
6.0
tpd
tdis
ten
propagation delay nAn to nBn
nBn to nAn
6.2
12.1
16.2
9.0
ns
ns
ns
ns
ns
ns
12.4
16.2
10.0
21.9
11.1
11.9
16.2
9.1
11.8
16.2
8.7
11.8
16.2
9.3
disable time
nOE to nAn
nOE to nBn
nOE to nAn
nOE to nBn
enable time
21.9
9.8
21.9
9.4
21.9
9.4
21.9
9.6
[1] tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH
.
Table 11. Typical dynamic characteristics at VCC(B) = 0.8 V and Tamb = 25 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter Conditions VCC(A)
1.5 V
Unit
0.8 V
14.4
14.4
16.2
17.6
21.9
22.2
1.2 V
12.4
7.0
1.8 V
11.9
6.0
2.5 V
11.8
5.9
3.3 V
11.8
6.0
tpd
tdis
ten
propagation delay nAn to nBn
nBn to nAn
12.1
6.2
ns
ns
ns
ns
ns
ns
disable time
nOE to nAn
nOE to nBn
nOE to nAn
nOE to nBn
5.9
4.4
4.2
3.1
3.5
14.2
6.4
13.7
4.4
13.6
3.5
13.3
2.6
13.1
2.3
enable time
17.7
17.2
17.0
16.8
16.7
[1] tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH
.
74AVCH16T245
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
13 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
Table 12. Dynamic characteristics for temperature range 40 C to +85 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
1.2 V 0.1 V 1.5 V 0.1 V 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.1 V to 1.3 V
tpd
tdis
ten
propagation nAn to nBn
0.5
0.5
1.5
1.5
1.0
1.1
9.2
9.2
0.5
0.5
1.5
1.5
1.0
1.1
6.9
8.7
0.5
0.5
1.5
1.5
1.0
1.1
6.0
8.5
0.5
0.5
1.5
1.0
1.0
1.0
5.1
8.2
0.5
0.5
1.5
1.0
1.0
1.0
4.9 ns
8.0 ns
11.6 ns
8.9 ns
14.5 ns
7.7 ns
delay
nBn to nAn
disable time nOE to nAn
nOE to nBn
11.6
12.5
14.5
14.9
11.6
9.7
11.6
9.5
11.6
8.1
enable time nOE to nAn
nOE to nBn
14.5
11.0
14.5
9.6
14.5
8.1
VCC(A) = 1.4 V to 1.6 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.5
1.5
1.0
1.0
8.7
6.9
0.5
0.5
1.5
1.5
1.0
1.0
6.2
6.2
0.5
0.5
1.5
1.5
1.0
0.5
5.2
5.9
9.1
7.5
10.1
8.1
0.5
0.5
1.5
1.0
1.0
0.5
4.1
5.6
9.1
6.5
10.1
5.9
0.5
0.5
1.5
1.0
1.0
0.5
3.7 ns
5.5 ns
9.1 ns
6.3 ns
10.1 ns
5.2 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
9.1
9.1
11.4
10.1
13.5
8.7
enable time nOE to nAn
nOE to nBn
10.1
10.1
VCC(A) = 1.65 V to 1.95 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.5
1.5
1.0
1.0
8.5
6.0
0.5
0.5
1.5
1.5
1.0
1.0
5.9
5.2
7.7
8.4
7.8
9.2
0.5
0.5
1.5
1.5
1.0
0.5
4.8
4.8
7.7
7.1
7.8
7.4
0.5
0.5
1.5
1.0
1.0
0.5
3.7
4.5
7.7
5.9
7.8
5.3
0.5
0.5
1.5
1.0
1.0
0.5
3.3 ns
4.4 ns
7.7 ns
5.7 ns
7.8 ns
4.5 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
7.7
11.1
7.8
enable time nOE to nAn
nOE to nBn
13.0
VCC(A) = 2.3 V to 2.7 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.0
1.0
0.5
0.5
8.2
5.1
0.5
0.5
1.0
1.0
0.5
0.5
5.6
4.1
6.1
7.9
5.3
9.4
0.5
0.5
1.0
1.0
0.5
0.5
4.6
3.7
6.1
6.6
5.3
7.3
0.5
0.5
1.0
1.0
0.5
0.5
3.3
3.4
6.1
6.1
5.3
5.1
0.5
0.5
1.0
1.0
0.5
0.5
2.8 ns
3.2 ns
6.1 ns
5.2 ns
5.3 ns
4.5 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
6.1
10.6
5.3
enable time nOE to nAn
nOE to nBn
12.5
VCC(A) = 3.0 V to 3.6 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
0.5
1.0
0.5
0.5
8.0
4.9
0.5
0.5
0.5
1.0
0.5
0.5
5.5
3.7
5.0
7.7
4.3
9.3
0.5
0.5
0.5
1.0
0.5
0.5
4.4
3.3
5.0
6.5
4.2
7.2
0.5
0.5
0.5
1.0
0.5
0.5
3.2
2.9
5.0
5.2
4.1
4.9
0.5
0.5
0.5
0.5
0.5
0.5
2.7 ns
2.7 ns
5.0 ns
5.0 ns
4.0 ns
4.0 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
5.0
10.3
4.3
enable time nOE to nAn
nOE to nBn
12.4
[1] tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH
.
74AVCH16T245
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
14 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
Table 13. Dynamic characteristics for temperature range 40 C to +125 C [1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7
Symbol Parameter
Conditions
VCC(B)
Unit
1.2 V 0.1 V 1.5 V 0.1 V 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.1 V to 1.3 V
tpd
tdis
ten
propagation nAn to nBn
0.5
0.5
1.5
1.5
1.0
1.1
10.2
10.2
12.8
13.8
16.0
16.4
0.5
0.5
1.5
1.5
1.0
1.1
7.6
9.6
0.5
0.5
1.5
1.5
1.0
1.1
6.6
9.4
0.5
0.5
1.5
1.0
1.0
1.0
5.7
9.1
0.5
0.5
1.5
1.5
1.0
1.0
5.4 ns
8.8 ns
12.8 ns
9.8 ns
16.0 ns
8.5 ns
delay
nBn to nAn
disable time nOE to nAn
nOE to nBn
12.8
10.7
16.0
12.1
12.8
10.5
16.0
10.6
12.8
9.0
enable time nOE to nAn
nOE to nBn
16.0
9.0
VCC(A) = 1.4 V to 1.6 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.5
1.5
1.0
1.0
9.6
7.6
0.5
0.5
1.5
1.5
1.0
1.0
6.9
6.9
0.5
0.5
1.5
1.5
1.0
0.5
5.8
6.5
0.5
0.5
1.5
1.0
1.0
0.5
4.6
6.2
0.5
0.5
1.5
1.0
1.0
0.5
4.1 ns
6.1 ns
10.1 ns
7.0 ns
11.2 ns
5.8 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
10.1
12.6
11.2
14.9
10.1
9.6
10.1
8.3
10.1
7.2
enable time nOE to nAn
nOE to nBn
11.2
11.2
11.2
9.0
11.2
6.5
VCC(A) = 1.65 V to 1.95 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.5
1.5
1.0
1.0
9.4
6.6
0.5
0.5
1.5
1.5
1.0
1.0
6.5
5.8
0.5
0.5
1.5
1.5
1.0
0.5
5.3
5.3
8.5
7.9
8.6
8.2
0.5
0.5
1.5
1.0
1.0
0.5
4.1
5.0
8.5
6.5
8.6
5.9
0.5
0.5
1.5
1.0
1.0
0.5
3.7 ns
4.9 ns
8.5 ns
6.3 ns
8.6 ns
5.0 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
8.5
8.5
12.3
8.6
9.3
enable time nOE to nAn
nOE to nBn
8.6
14.3
10.2
VCC(A) = 2.3 V to 2.7 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
1.0
1.0
0.5
0.5
9.1
5.7
0.5
0.5
1.0
1.0
0.5
0.5
6.2
4.6
0.5
0.5
1.0
1.0
0.5
0.5
5.1
4.1
6.8
7.3
5.9
8.1
0.5
0.5
1.0
1.0
0.5
0.5
3.7
3.8
6.8
6.8
5.9
5.7
0.5
0.5
1.0
1.0
0.5
0.5
3.1 ns
3.6 ns
6.8 ns
5.8 ns
5.9 ns
5.0 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
6.8
6.8
11.7
5.9
8.7
5.9
enable time nOE to nAn
nOE to nBn
13.8
10.4
VCC(A) = 3.0 V to 3.6 V
tpd
tdis
ten
propagation nAn to nBn
delay
0.5
0.5
0.5
1.0
0.5
0.5
8.8
5.4
0.5
0.5
0.5
1.0
0.5
0.5
6.1
4.1
0.5
0.5
0.5
1.0
0.5
0.5
4.9
3.7
5.5
7.2
4.7
8.0
0.5
0.5
0.5
1.0
0.5
0.5
3.6
3.2
5.5
5.8
4.6
5.4
0.5
0.5
0.5
0.5
0.5
0.5
3.0 ns
3.0 ns
5.5 ns
5.5 ns
4.4 ns
4.4 ns
nBn to nAn
disable time nOE to nAn
nOE to nBn
5.5
5.5
11.4
4.8
8.5
4.8
enable time nOE to nAn
nOE to nBn
13.7
10.3
[1] tpd is the same as tPLH and tPHL; tdis is the same as tPLZ and tPHZ; ten is the same as tPZL and tPZH
.
74AVCH16T245
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
15 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
11. Waveforms
V
I
nAn, nBn input
GND
V
M
t
t
PLH
PHL
V
OH
nBn, nAn output
V
M
V
OL
001aak285
Measurement points are given in Table 14.
OL and VOH are typical output voltage levels that occur with the output load.
V
Fig 6. The data input (nAn, nBn) to output (nBn, nAn) propagation delay times
V
I
V
nOE input
M
GND
t
t
PLZ
PZL
V
CCO
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aak286
Measurement points are given in Table 14.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Enable and disable times
Table 14. Measurement points
Supply voltage
VCC(A), VCC(B)
0.8 V to 1.6 V
1.65 V to 2.7 V
3.0 V to 3.6 V
Input[1]
Output[2]
VM
VM
VX
VY
0.5VCCI
0.5VCCI
0.5VCCI
0.5VCCO
0.5VCCO
0.5VCCO
VOL + 0.1 V
VOH 0.1 V
VOH 0.15 V
VOH 0.3 V
VOL + 0.15 V
VOL + 0.3 V
[1] VCCI is the supply voltage associated with the data input port.
[2] VCCO is the supply voltage associated with the output port.
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NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
R
V
CC
L
V
V
O
I
G
DUT
R
T
C
L
R
L
001aae331
Test data is given in Table 15.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance.
VEXT = External voltage for measuring switching times.
Fig 8. Test circuit for measuring switching times
Table 15. Test data
Supply voltage
VCC(A), VCC(B)
0.8 V to 1.6 V
1.65 V to 2.7 V
3.0 V to 3.6 V
Input
VI[1]
Load
CL
VEXT
[3]
t/V[2]
RL
tPLH, tPHL
open
tPZH, tPHZ
GND
tPZL, tPLZ
2VCCO
VCCI
VCCI
VCCI
1.0 ns/V
1.0 ns/V
1.0 ns/V
15 pF
15 pF
15 pF
2 k
2 k
2 k
open
GND
2VCCO
open
GND
2VCCO
[1] VCCI is the supply voltage associated with the data input port.
[2] dV/dt 1.0 V/ns
[3]
VCCO is the supply voltage associated with the output port.
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16-bit dual supply translating transceiver; 3-state
12. Typical propagation delay characteristics
001aai476
001aai477
24
21
(1)
(2)
(3)
(4)
(5)
(6)
t
pd
(ns)
t
pd
(1)
(ns)
20
17
16
12
8
13
(2)
(3)
(4)
(5)
(6)
4
9
0
20
40
60
0
20
40
60
C
L
(pF)
C (pF)
L
a. Propagation delay (nAn to nBn); VCC(A) = 0.8 V
(1) VCC(B) = 0.8 V.
b. Propagation delay (nAn to nBn); VCC(B) = 0.8 V
(1)
(2)
V
CC(A) = 0.8 V.
CC(A) = 1.2 V.
(2)
VCC(B) = 1.2 V.
V
(3) VCC(B) = 1.5 V.
(4) VCC(B) = 1.8 V.
(3) VCC(A) = 1.5 V.
(4) VCC(A) = 1.8 V.
(5)
V
CC(B) = 2.5 V.
(5)
VCC(A) = 2.5 V.
(6) VCC(B) = 3.3 V.
(6) VCC(A) = 3.3 V.
Fig 9. Typical propagation delay versus load capacitance; Tamb = 25 C
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NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
001aai478
001aai491
7
7
(1)
t
t
PHL
PLH
(ns)
(ns)
(1)
(2)
(3)
5
3
1
5
3
1
(2)
(3)
(4)
(5)
(4)
(5)
0
20
40
60
0
20
40
60
C
L
(pF)
C
L
(pF)
a. LOW to HIGH propagation delay (nAn to nBn);
VCC(A) = 1.2 V
b. HIGH to LOW propagation delay (nAn to nBn);
VCC(A) = 1.2 V
001aai479
001aai480
7
7
(1)
t
t
PHL
PLH
(ns)
(ns)
(1)
5
3
1
5
3
1
(2)
(3)
(2)
(3)
(4)
(5)
(4)
(5)
0
20
40
60
0
20
40
60
C
L
(pF)
C
L
(pF)
c. LOW to HIGH propagation delay (nAn to nBn);
VCC(A) = 1.5 V
d. HIGH to LOW propagation delay (nAn to nBn);
CC(A) = 1.5 V
V
(1) VCC(B) = 1.2 V.
(2) VCC(B) = 1.5 V.
(3) VCC(B) = 1.8 V.
(4)
VCC(B) = 2.5 V.
(5) VCC(B) = 3.3 V.
Fig 10. Typical propagation delay versus load capacitance; Tamb = 25 C
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Product data sheet
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NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
001aai481
001aai482
7
7
(1)
t
t
PHL
PLH
(ns)
(ns)
(1)
5
3
1
5
3
1
(2)
(3)
(2)
(3)
(4)
(5)
(4)
(5)
0
20
40
60
0
20
40
60
C
L
(pF)
C
L
(pF)
a. LOW to HIGH propagation delay (nAn to nBn);
VCC(A) = 1.8 V
b. HIGH to LOW propagation delay (nAn to nBn);
VCC(A) = 1.8 V
001aai483
001aai486
7
7
t
t
PHL
(ns)
PLH
(1)
(ns)
(1)
5
3
1
5
3
1
(2)
(3)
(2)
(3)
(4)
(5)
(4)
(5)
0
20
40
60
0
20
40
60
C
L
(pF)
C
L
(pF)
c. LOW to HIGH propagation delay (nAn to nBn);
VCC(A) = 2.5 V
d. HIGH to LOW propagation delay (nAn to nBn);
CC(A) = 2.5 V
V
(1) VCC(B) = 1.2 V.
(2) VCC(B) = 1.5 V.
(3) VCC(B) = 1.8 V.
(4)
VCC(B) = 2.5 V.
(5) VCC(B) = 3.3 V.
Fig 11. Typical propagation delay versus load capacitance; Tamb = 25 C
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Product data sheet
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74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
001aai485
001aai484
7
7
t
t
PHL
(ns)
PLH
(1)
(ns)
(1)
5
3
1
5
3
1
(2)
(3)
(2)
(3)
(4)
(5)
(4)
(5)
0
20
40
60
0
20
40
60
C
L
(pF)
C
L
(pF)
a. LOW to HIGH propagation delay (nAn to nBn);
VCC(A) = 3.3 V
b. HIGH to LOW propagation delay (nAn to nBn);
VCC(A) = 3.3 V
(1) VCC(B) = 1.2 V.
(2) VCC(B) = 1.5 V.
(3) VCC(B) = 1.8 V.
(4)
VCC(B) = 2.5 V.
(5) VCC(B) = 3.3 V.
Fig 12. Typical propagation delay versus load capacitance; Tamb = 25 C
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Product data sheet
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74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
13. Package outline
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
E
D
A
X
c
H
v
M
A
y
E
Z
48
25
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
detail X
1
24
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
A
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
1.05
0.85
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
8.3
7.9
0.8
0.4
0.50
0.35
0.8
0.4
mm
1.2
0.5
1
0.25
0.25
0.08
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT362-1
MO-153
Fig 13. Package outline SOT362-1 (TSSOP48)
74AVCH16T245
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Product data sheet
Rev. 5 — 1 March 2012
22 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
TSSOP48: plastic thin shrink small outline package; 48 leads;
body width 4.4 mm; lead pitch 0.4 mm
SOT480-1
E
A
D
X
c
y
H
E
v
M
A
Z
25
48
Q
(A )
3
A
A
2
A
1
pin 1 index
θ
L
p
L
detail X
1
24
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.85
0.23
0.13
0.20
0.09
9.8
9.6
4.5
4.3
6.6
6.2
0.7
0.5
0.4
0.3
0.4
0.1
mm
1.1
0.4
0.25
1
0.2
0.07
0.08
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT480-1
MO-153
Fig 14. Package outline SOT480-1 (TSSOP48)
74AVCH16T245
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Product data sheet
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74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm
SOT702-1
B
A
D
ball A1
index area
A
2
A
E
A
1
detail X
e
1
C
∅ v M
∅ w M
C
C
A B
b
e
y
y
C
1
1/2 e
K
J
H
G
F
e
e
2
E
D
C
B
A
1/2 e
X
ball A1
index area
1
2
3
4
5
6
DIMENSIONS (mm are the original dimensions)
A
A
A
b
e
y
UNIT
D
E
e
e
v
w
y
1
1
2
0
2.5
5 mm
1
2
max.
0.3
0.2
0.7
0.6
0.45
0.35
4.6
4.4
7.1
6.9
scale
mm
1
3.25 5.85
0.08
0.1
0.65
0.15 0.08
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
02-08-08
03-07-01
SOT702-1
MO-225
Fig 15. Package outline SOT702-1 (VFBGA56)
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74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads;
60 terminals; body 4 x 6 x 0.5 mm
SOT1134-2
D
B
A
terminal 1
index area
A
A
2
E
A
1
detail X
e
2
b
v
C
C
A
B
w
e
1
eR
C
C
A
B
e
v
C
eT
1/2 e
B8 B10
w
y
y
C
1
L
1
D2
A11
A16
D3
D7
D6
L
A17
B11
A10
B7
e
eR
eT
E
h
e
3
e
4
1/2 e
B1
A1
B17
A26
terminal 1
index area
D5
D1
B20 B18
D8
D4
eT
eR
A32
A27
X
D
h
K
eT
eR
0
5 mm
Dimensions
Unit
A
A
1
A
2
b
D
D
h
E
E
e
e
e
2
e
3
e
eR eT
K
L
L
v
w
y
y
1
h
1
4
1
max 0.50 0.08 0.42 0.28 4.1 1.95 6.1 3.95
0.25 0.28 0.195
mm nom
min
0.05 0.40 0.23 4.0 1.85 6.0 3.85 0.5 1.0 2.5 3.0 4.5 0.5 0.49 0.20 0.23 0.145 0.1 0.05 0.08 0.1
0.02 0.38 0.18 3.9 1.75 5.9 3.75
0.15 0.18 0.095
sot1134-2_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
SOT1134-2
11-08-15
Fig 16. Package outline SOT1134-2 (HXQFN60)
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16-bit dual supply translating transceiver; 3-state
14. Abbreviations
Table 16. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ElectroStatic Discharge
Human Body Model
Machine Model
ESD
HBM
MM
15. Revision history
Table 17. Revision history
Document ID
Release date
20120301
Data sheet status
Change notice
Supersedes
74AVCH16T245 v.5
Modifications:
Product data sheet
-
74AVCH16T245 v.4
• For type number 74AVCH16T245BX the SOT code has changed to SOT1134-2.
74AVCH16T245 v.4
Modifications:
20111207
Product data sheet
-
74AVCH16T245 v.3
• Legal pages updated.
74AVCH16T245 v.3
74AVCH16T245 v.2
74AVCH16T245 v.1
20110616
20100329
20091014
Product data sheet
-
-
-
74AVCH16T245 v.2
Product data sheet
Product data sheet
74AVCH16T245 v.1
-
74AVCH16T245
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16-bit dual supply translating transceiver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74AVCH16T245
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 1 March 2012
28 of 29
74AVCH16T245
NXP Semiconductors
16-bit dual supply translating transceiver; 3-state
18. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
6
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Recommended operating conditions. . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Typical propagation delay characteristics . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 26
7
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 March 2012
Document identifier: 74AVCH16T245
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