LP38693SD-3.3/NOPB [NSC]

IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, DSO6, LLP-6, Fixed Positive Single Output LDO Regulator;
LP38693SD-3.3/NOPB
型号: LP38693SD-3.3/NOPB
厂家: National Semiconductor    National Semiconductor
描述:

IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, DSO6, LLP-6, Fixed Positive Single Output LDO Regulator

输出元件 调节器
文件: 总16页 (文件大小:367K)
中文:  中文翻译
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August 25, 2009  
LP38691  
LP38693  
500mA Low Dropout CMOS Linear Regulators  
Stable with Ceramic Output Capacitors  
General Description  
Features  
The LP38691/3 low dropout CMOS linear regulators provide  
tight output tolerance (2.0% typical), extremely low dropout  
voltage (250 mV @ 500mA load current, VOUT = 5V), and ex-  
cellent AC performance utilizing ultra low ESR ceramic output  
capacitors.  
2.0% output accuracy (25°C)  
Low dropout voltage: 250 mV @ 500mA (typ, 5V out)  
Wide input voltage range (2.7V to 10V)  
Precision (trimmed) bandgap reference  
Guaranteed specs for -40°C to +125°C  
1µA off-state quiescent current  
The low thermal resistance of the LLP, SOT-223 and TO-252  
packages allow the full operating current to be used even in  
high ambient temperature environments.  
Thermal overload protection  
The use of a PMOS power transistor means that no DC base  
drive current is required to bias it allowing ground pin current  
to remain below 100 µA regardless of load current, input volt-  
age, or operating temperature.  
Foldback current limiting  
T0-252, SOT-223 and 6-Lead LLP packages  
Enable pin (LP38693)  
Dropout Voltage: 250 mV (typ) @ 500mA (typ. 5V out).  
Ground Pin Current: 55 µA (typ) at full load.  
Precision Output Voltage: 2.0% (25°C) accuracy.  
Applications  
Hard Disk Drives  
Notebook Computers  
Battery Powered Devices  
Portable Instrumentation  
Typical Application Circuits  
20126501  
20126502  
Note: * Minimum value required for stability.  
**LLP package devices only.  
© 2009 National Semiconductor Corporation  
201265  
www.national.com  
Connection Diagrams  
20126504  
SOT-223, Top View  
LP38693MP-X.X  
20126503  
TO-252, Top View  
LP38691DT-X.X  
20126505  
20126506  
6-Lead LLP, Bottom View  
LP38691SD-X.X  
6-Lead LLP, Bottom View  
LP38693SD-X.X  
Pin Descriptions  
Pin  
Description  
VIN  
This is the input supply voltage to the regulator. For LLP devices, both VIN pins must be tied together  
for full current operation (250mA maximum per pin).  
GND  
SNS  
Circuit ground for the regulator. This is connected to the die through the lead frame, and also functions  
as the heat sink when the large ground pad is soldered down to a copper plane.  
Output sense pin allows remote sensing at the load which will eliminate the error in output voltage  
due to voltage drops caused by the resistance in the traces between the regulator and the load. This  
pin must be tied to VOUT  
.
VEN  
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.  
Regulated output voltage  
VOUT  
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2
Ordering Information  
Order Number  
LP38691SD-1.8  
LP38691SD-2.5  
LP38691SD-3.3  
LP38691SD-5.0  
LP38691DT-1.8  
LP38691DT-2.5  
LP38691DT-3.3  
LP38691DT-5.0  
LP38693SD-1.8  
LP38693SD-2.5  
LP38693SD-3.3  
LP38693SD-5.0  
LP38693MP-1.8  
LP38693MP-2.5  
LP38693MP-3.3  
LP38693MP-5.0  
LP38691SDX-1.8  
LP38691SDX-2.5  
LP38691SDX-3.3  
LP38691SDX-5.0  
LP38691DTX-1.8  
LP38691DTX-2.5  
LP38691DTX-3.3  
LP38691DTX-5.0  
LP38693SDX-1.8  
LP38693SDX-2.5  
LP38693SDX-3.3  
LP38693SDX-5.0  
LP38693MPX-1.8  
LP38693MPX-2.5  
LP38693MPX-3.3  
LP38693MPX-5.0  
Package Marking  
Package Type  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
TO-252  
Package Drawing  
SDE06A  
SDE06A  
SDE06A  
SDE06A  
TD03B  
Supplied As  
L118B  
L119B  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
75 Units per Rail  
L120B  
L121B  
LP38691DT-1.8  
LP38691DT-2.5  
LP38691DT-3.3  
LP38691DT-5.0  
L128B  
TO-252  
TD03B  
75 Units per Rail  
TO-252  
TD03B  
75 Units per Rail  
TO-252  
TD03B  
75 Units per Rail  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
SOT-223  
SDE06A  
SDE06A  
SDE06A  
SDE06A  
MP05A  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
1000 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
2500 Units Tape and Reel  
2500 Units Tape and Reel  
2500 Units Tape and Reel  
2500 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
4500 Units Tape and Reel  
2000 Units Tape and Reel  
2000 Units Tape and Reel  
2000 Units Tape and Reel  
2000 Units Tape and Reel  
L129B  
L130B  
L131B  
LJVB  
LJXB  
SOT-223  
MP05A  
LJYB  
SOT-223  
MP05A  
LJZB  
SOT-223  
MP05A  
L118B  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
TO-252  
SDE06A  
SDE06A  
SDE06A  
SDE06A  
TD03B  
L119B  
L120B  
L121B  
LP38691DT-1.8  
LP38691DT-2.5  
LP38691DT-3.3  
LP38691DT-5.0  
L128B  
TO-252  
TD03B  
TO-252  
TD03B  
TO-252  
TD03B  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
6-Lead LLP  
SOT-223  
SDE06A  
SDE06A  
SDE06A  
SDE06A  
MP05A  
L129B  
L130B  
L131B  
LJVB  
LJXB  
SOT-223  
MP05A  
LJYB  
SOT-223  
MP05A  
LJZB  
SOT-223  
MP05A  
3
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V(max) All pins (with respect to GND)  
IOUT  
-0.3V to 12V  
Internally Limited  
−40°C to +150°C  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Junction Temperature  
Operating Ratings  
Storage Temperature Range  
Lead Temp. (Soldering, 5 seconds)  
ESD Rating (Note 3)  
−65°C to +150°C  
260°C  
2 kV  
Internally Limited  
VIN Supply Voltage  
2.7V to 10V  
Operating Junction  
Temperature Range  
−40°C to +125°C  
Power Dissipation (Note 2)  
Electrical Characteristics Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over  
the full operating temperature range. Unless otherwise specified: VIN = VOUT + 1V, CIN = COUT = 10 µF, ILOAD = 10mA. Min/Max  
limits are guaranteed through testing, statistical correlation, or design.  
Typ  
(Note 4)  
Symbol  
Parameter  
Conditions  
Min  
Max  
Units  
-2.0  
2.0  
100 µA < IL < 0.5A  
VO  
%VOUT  
Output Voltage Tolerance  
-4.0  
4.0  
0.1  
5
VO + 1V VIN 10V  
Output Voltage Line Regulation  
(Note 6)  
ΔVOVIN  
ΔVOIL  
VO + 0.5V VIN 10V  
IL = 25mA  
0.03  
1.8  
%/V  
%/A  
Output Voltage Load Regulation  
(Note 7)  
1 mA < IL < 0.5A  
VIN = VO + 1V  
(VO = 2.5V)  
IL = 0.1A  
80  
430  
145  
725  
IL = 0.5A  
(VO = 3.3V)  
IL = 0.1A  
65  
330  
110  
550  
VIN - VOUT  
Dropout Voltage (Note 8)  
mV  
IL = 0.5A  
(VO = 5V)  
IL = 0.1A  
IL = 0.5A  
45  
250  
100  
450  
IQ  
Quiescent Current  
55  
100  
1
VIN 10V, IL =100 µA - 0.5A  
VEN 0.4V, (LP38693 Only)  
0.001  
µA  
IL(MIN)  
IFB  
Minimum Load Current  
Foldback Current Limit  
100  
VIN - VO 4V  
VIN - VO > 5V  
VIN - VO < 4V  
350  
850  
mA  
dB  
PSRR  
Ripple Rejection  
VIN = VO + 2V(DC), with 1V(p-p) /  
120Hz Ripple  
55  
160  
10  
TSD  
Thermal Shutdown Activation  
(Junction Temp)  
°C  
TSD (HYST)  
Thermal Shutdown Hysteresis  
(Junction Temp)  
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4
Typ  
(Note 4)  
Symbol  
Parameter  
Output Noise  
Conditions  
Min  
Max  
Units  
en  
BW = 10Hz to 10kHz  
VO = 3.3V  
0.7  
0.5  
µV/  
µA  
VO (LEAK)  
VEN  
Output Leakage Current  
VO = VO(NOM) + 1V @ 10VIN  
Output = OFF  
12  
Enable Voltage (LP38693 Only)  
0.4  
Output = ON, VIN = 4V  
Output = ON, VIN = 6V  
Output = ON, VIN = 10V  
VEN = 0V or 10V, VIN = 10V  
1.8  
3.0  
4.0  
-1  
V
IEN  
Enable Pin Leakage (LP38693  
Only)  
0.001  
1
µA  
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for which the device  
is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics. Specifications do not  
apply when operating the device outside of its rated operating conditions.  
Note 2: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a heatsink is used).  
The junction-to-ambient thermal resistance ( θJ-A) for the TO-252 is approximately 90°C/W for a PC board mounting with the device soldered down to minimum  
copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator for the TO-252, the θJ-A drops to approximately 50°C/W. The  
SOT-223 package has a θJ-A of approximately 125°C/W when soldered down to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W  
when soldered to a copper area of one square inch. The θJ-A values for the LLP package are also dependent on trace area, copper thickness, and the number  
of thermal vias used (refer to application note AN-1187). If power disspation causes the junction temperature to exceed specified limits, the device will go into  
thermal shutdown.  
Note 3: ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.  
Note 4: Typical numbers represent the most likely parametric norm for 25°C operation.  
Note 5: If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to ground.  
Note 6: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.  
Note 7: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to full load.  
Note 8: Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.  
5
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Block Diagrams  
20126507  
FIGURE 1. LP38691 Functional Diagram (LLP)  
20126508  
FIGURE 2. LP38691 Functional Diagram (TO-252)  
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20126509  
FIGURE 3. LP38693 Functional Diagram (LLP)  
20126510  
FIGURE 4. LP38693 Functional Diagram (SOT-223)  
7
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Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable  
pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT +1V, IL = 10mA.  
Noise vs Frequency  
Noise vs Frequency  
Ripple Rejection  
Noise vs Frequency  
Ripple Rejection  
Ripple Rejection  
20126536  
20126535  
20126518  
20126537  
20126520  
20126522  
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8
Line Transient Response  
Line Transient Response  
Load Transient Response  
Line Transient Response  
Load Transient Response  
VOUT vs Temperature (5.0V)  
20126524  
20126526  
20126528  
20126542  
20126544  
20126530  
9
www.national.com  
VOUT vs Temperature (3.3V)  
VOUT vs Temperature (2.5V)  
20126532  
20126531  
VOUT vs Temperature (1.8V)  
VOUT vs VIN (1.8V)  
20126533  
20126559  
VOUT vs VIN, Power-Up  
VOUT vs VEN, ON (LP38693 Only)  
20126560  
20126561  
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10  
VOUT vs VEN, OFF (LP38693 Only)  
Load Regulation vs Temperature  
MIN VIN vs IOUT  
Enable Voltage vs Temperature  
Line Regulation vs Temperature  
Dropout Voltage vs IOUT  
20126552  
20126562  
20126553  
20126554  
20126556  
20126557  
11  
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ratings of temperature and voltage. Of course, they are typi-  
cally larger and more costly than Z5U/Y5U types for a given  
voltage and capacitance.  
Application Hints  
EXTERNAL CAPACITORS  
Like any low-dropout regulator, external capacitors are re-  
quired to assure stability. These capacitors must be correctly  
selected for proper performance.  
TANTALUM  
Solid Tantalum capacitors have good temperature stability: a  
high quality Tantalum will typically show a capacitance value  
that varies less than 10-15% across the full temperature  
range of -40°C to +125°C. ESR will vary only about 2X going  
from the high to low temperature limits.  
INPUT CAPACITOR: An input capacitor of at least 1µF is re-  
quired (ceramic recommended). The capacitor must be lo-  
cated not more than one centimeter from the input pin and  
returned to a clean analog ground.  
PCB LAYOUT  
OUTPUT CAPACITOR: An output capacitor is required for  
loop stability. It must be located less than 1 centimeter from  
the device and connected directly to the output and ground  
pins using traces which have no other currents flowing  
through them.  
Good PC layout practices must be used or instability can be  
induced because of ground loops and voltage drops. The in-  
put and output capacitors must be directly connected to the  
input, output, and ground pins of the regulator using traces  
which do not have other currents flowing in them (Kelvin con-  
nect).  
The minimum amount of output capacitance that can be used  
for stable operation is 1µF. Ceramic capacitors are recom-  
mended (the LP38691/3 was designed for use with ultra low  
ESR capacitors). The LP38691/3 is stable with any output  
capacitor ESR between zero and 100 Ohms.  
The best way to do this is to lay out CIN and COUT near the  
device with short traces to the VIN, VOUT, and ground pins. The  
regulator ground pin should be connected to the external cir-  
cuit ground so that the regulator and its capacitors have a  
"single point ground".  
ENABLE PIN (LP38693 only): The LP38693 has an Enable  
pin (EN) which allows an external control signal to turn the  
regulator output On and Off. The Enable On/Off threshold has  
no hysteresis. The voltage signal must rise and fall cleanly,  
and promptly, through the ON and OFF voltage thresholds.  
The Enable pin has no internal pull-up or pull-down to estab-  
lish a default condition and, as a result, this pin must be  
terminated either actively or passively. If the Enable pin is  
driven from a source that actively pulls high and low, the drive  
voltage should not be allowed to go below ground potential or  
higher than VIN. If the application does not require the Enable  
function, the pin should be connected directly to the VIN pin.  
It should be noted that stability problems have been seen in  
applications where "vias" to an internal ground plane were  
used at the ground points of the IC and the input and output  
capacitors. This was caused by varying ground potentials at  
these nodes resulting from current flowing through the ground  
plane. Using a single point ground technique for the regulator  
and it’s capacitors fixed the problem. Since high current flows  
through the traces going into VIN and coming from VOUT  
Kelvin connect the capacitor leads to these pins so there is  
no voltage drop in series with the input and output capacitors.  
,
Foldback Current Limiting: Foldback current limiting is built  
into the LP38691/3 which reduces the amount of output cur-  
rent the part can deliver as the output voltage is reduced. The  
amount of load current is dependent on the differential voltage  
between VIN and VOUT. Typically, when this differential volt-  
age exceeds 5V, the load current will limit at about 350 mA.  
When the VIN - VOUT differential is reduced below 4V, load  
current is limited to about 850 mA.  
RFI/EMI SUSCEPTIBILITY  
RFI (radio frequency interference) and EMI (electromagnetic  
interference) can degrade any integrated circuit’s perfor-  
mance because of the small dimensions of the geometries  
inside the device. In applications where circuit sources are  
present which generate signals with significant high frequen-  
cy energy content (> 1 MHz), care must be taken to ensure  
that this does not affect the IC regulator.  
SELECTING A CAPACITOR  
If RFI/EMI noise is present on the input side of the regulator  
(such as applications where the input source comes from the  
output of a switching regulator), good ceramic bypass capac-  
itors must be used at the input pin of the IC.  
It is important to note that capacitance tolerance and variation  
with temperature must be taken into consideration when se-  
lecting a capacitor so that the minimum required amount of  
capacitance is provided over the full operating temperature  
range.  
If a load is connected to the IC output which switches at high  
speed (such as a clock), the high-frequency current pulses  
required by the load must be supplied by the capacitors on  
the IC output. Since the bandwidth of the regulator loop is less  
than 100 kHz, the control circuitry cannot respond to load  
changes above that frequency. This means the effective out-  
put impedance of the IC at frequencies above 100 kHz is  
determined only by the output capacitor(s).  
Capacitor Characteristics  
CERAMIC  
For values of capacitance in the 10 to 100 µF range, ceramics  
are usually larger and more costly than tantalums but give  
superior AC performance for bypassing high frequency noise  
because of very low ESR (typically less than 10 m). How-  
ever, some dielectric types do not have good capacitance  
characteristics as a function of voltage and temperature.  
In applications where the load is switching at high speed, the  
output of the IC may need RF isolation from the load. It is  
recommended that some inductance be placed between the  
output capacitor and the load, and good RF bypass capacitors  
be placed directly across the load.  
Z5U and Y5V dielectric ceramics have capacitance that drops  
severely with applied voltage. A typical Z5U or Y5V capacitor  
can lose 60% of its rated capacitance with half of the rated  
voltage applied to it. The Z5U and Y5V also exhibit a severe  
temperature effect, losing more than 50% of nominal capac-  
itance at high and low limits of the temperature range.  
PCB layout is also critical in high noise environments, since  
RFI/EMI is easily radiated directly into PC traces. Noisy cir-  
cuitry should be isolated from "clean" circuits where possible,  
and grounded through a separate path. At MHz frequencies,  
ground planes begin to look inductive and RFI/ EMI can cause  
ground bounce across the ground plane. In multi-layer PCB  
applications, care should be taken in layout so that noisy  
X7R and X5R dielectric ceramic capacitors are strongly rec-  
ommended if ceramics are used, as they typically maintain a  
capacitance range within ±20% of nominal over full operating  
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12  
power and ground planes do not radiate directly into adjacent  
layers which carry analog power and ground.  
Attention should be paid to the units of measurement. Spot  
noise is measured in units µV/root-Hz or nV/root-Hz and total  
output noise is measured in µV(rms)  
OUTPUT NOISE  
The primary source of noise in low-dropout regulators is the  
internal reference. Noise can be reduced in two ways: by in-  
creasing the transistor area or by increasing the current drawn  
by the internal reference. Increasing the area will decrease  
the chance of fitting the die into a smaller package. Increasing  
the current drawn by the internal reference increases the total  
supply current (ground pin current).  
Noise is specified in two ways: Spot Noise or Output Noise  
Density is the RMS sum of all noise sources, measured at  
the regulator output, at a specific frequency (measured with  
a 1Hz bandwidth). This type of noise is usually plotted on a  
curve as a function of frequency. Total Output Noise or  
Broad-Band Noise is the RMS sum of spot noise over a  
specified bandwidth, usually several decades of frequencies.  
13  
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Physical Dimensions inches (millimeters) unless otherwise noted  
6-lead, LLP Package  
NS Package Number SDE06A  
TO-252 Package  
NS Package Number TD03B  
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14  
SOT-223 Package  
NS Package Number MP05A  
15  
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