LP38693SD-3.3/NOPB [NSC]
IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, DSO6, LLP-6, Fixed Positive Single Output LDO Regulator;型号: | LP38693SD-3.3/NOPB |
厂家: | National Semiconductor |
描述: | IC VREG 3.3 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, DSO6, LLP-6, Fixed Positive Single Output LDO Regulator 输出元件 调节器 |
文件: | 总16页 (文件大小:367K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
August 25, 2009
LP38691
LP38693
500mA Low Dropout CMOS Linear Regulators
Stable with Ceramic Output Capacitors
General Description
Features
The LP38691/3 low dropout CMOS linear regulators provide
tight output tolerance (2.0% typical), extremely low dropout
voltage (250 mV @ 500mA load current, VOUT = 5V), and ex-
cellent AC performance utilizing ultra low ESR ceramic output
capacitors.
2.0% output accuracy (25°C)
■
Low dropout voltage: 250 mV @ 500mA (typ, 5V out)
Wide input voltage range (2.7V to 10V)
Precision (trimmed) bandgap reference
Guaranteed specs for -40°C to +125°C
1µA off-state quiescent current
■
■
■
■
■
■
■
■
■
The low thermal resistance of the LLP, SOT-223 and TO-252
packages allow the full operating current to be used even in
high ambient temperature environments.
Thermal overload protection
The use of a PMOS power transistor means that no DC base
drive current is required to bias it allowing ground pin current
to remain below 100 µA regardless of load current, input volt-
age, or operating temperature.
Foldback current limiting
T0-252, SOT-223 and 6-Lead LLP packages
Enable pin (LP38693)
Dropout Voltage: 250 mV (typ) @ 500mA (typ. 5V out).
Ground Pin Current: 55 µA (typ) at full load.
Precision Output Voltage: 2.0% (25°C) accuracy.
Applications
Hard Disk Drives
■
■
■
Notebook Computers
Battery Powered Devices
Portable Instrumentation
■
Typical Application Circuits
20126501
20126502
Note: * Minimum value required for stability.
**LLP package devices only.
© 2009 National Semiconductor Corporation
201265
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Connection Diagrams
20126504
SOT-223, Top View
LP38693MP-X.X
20126503
TO-252, Top View
LP38691DT-X.X
20126505
20126506
6-Lead LLP, Bottom View
LP38691SD-X.X
6-Lead LLP, Bottom View
LP38693SD-X.X
Pin Descriptions
Pin
Description
VIN
This is the input supply voltage to the regulator. For LLP devices, both VIN pins must be tied together
for full current operation (250mA maximum per pin).
GND
SNS
Circuit ground for the regulator. This is connected to the die through the lead frame, and also functions
as the heat sink when the large ground pad is soldered down to a copper plane.
Output sense pin allows remote sensing at the load which will eliminate the error in output voltage
due to voltage drops caused by the resistance in the traces between the regulator and the load. This
pin must be tied to VOUT
.
VEN
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
Regulated output voltage
VOUT
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2
Ordering Information
Order Number
LP38691SD-1.8
LP38691SD-2.5
LP38691SD-3.3
LP38691SD-5.0
LP38691DT-1.8
LP38691DT-2.5
LP38691DT-3.3
LP38691DT-5.0
LP38693SD-1.8
LP38693SD-2.5
LP38693SD-3.3
LP38693SD-5.0
LP38693MP-1.8
LP38693MP-2.5
LP38693MP-3.3
LP38693MP-5.0
LP38691SDX-1.8
LP38691SDX-2.5
LP38691SDX-3.3
LP38691SDX-5.0
LP38691DTX-1.8
LP38691DTX-2.5
LP38691DTX-3.3
LP38691DTX-5.0
LP38693SDX-1.8
LP38693SDX-2.5
LP38693SDX-3.3
LP38693SDX-5.0
LP38693MPX-1.8
LP38693MPX-2.5
LP38693MPX-3.3
LP38693MPX-5.0
Package Marking
Package Type
6-Lead LLP
6-Lead LLP
6-Lead LLP
6-Lead LLP
TO-252
Package Drawing
SDE06A
SDE06A
SDE06A
SDE06A
TD03B
Supplied As
L118B
L119B
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
75 Units per Rail
L120B
L121B
LP38691DT-1.8
LP38691DT-2.5
LP38691DT-3.3
LP38691DT-5.0
L128B
TO-252
TD03B
75 Units per Rail
TO-252
TD03B
75 Units per Rail
TO-252
TD03B
75 Units per Rail
6-Lead LLP
6-Lead LLP
6-Lead LLP
6-Lead LLP
SOT-223
SDE06A
SDE06A
SDE06A
SDE06A
MP05A
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
1000 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
2500 Units Tape and Reel
2500 Units Tape and Reel
2500 Units Tape and Reel
2500 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
4500 Units Tape and Reel
2000 Units Tape and Reel
2000 Units Tape and Reel
2000 Units Tape and Reel
2000 Units Tape and Reel
L129B
L130B
L131B
LJVB
LJXB
SOT-223
MP05A
LJYB
SOT-223
MP05A
LJZB
SOT-223
MP05A
L118B
6-Lead LLP
6-Lead LLP
6-Lead LLP
6-Lead LLP
TO-252
SDE06A
SDE06A
SDE06A
SDE06A
TD03B
L119B
L120B
L121B
LP38691DT-1.8
LP38691DT-2.5
LP38691DT-3.3
LP38691DT-5.0
L128B
TO-252
TD03B
TO-252
TD03B
TO-252
TD03B
6-Lead LLP
6-Lead LLP
6-Lead LLP
6-Lead LLP
SOT-223
SDE06A
SDE06A
SDE06A
SDE06A
MP05A
L129B
L130B
L131B
LJVB
LJXB
SOT-223
MP05A
LJYB
SOT-223
MP05A
LJZB
SOT-223
MP05A
3
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V(max) All pins (with respect to GND)
IOUT
-0.3V to 12V
Internally Limited
−40°C to +150°C
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Junction Temperature
Operating Ratings
Storage Temperature Range
Lead Temp. (Soldering, 5 seconds)
ESD Rating (Note 3)
−65°C to +150°C
260°C
2 kV
Internally Limited
VIN Supply Voltage
2.7V to 10V
Operating Junction
Temperature Range
−40°C to +125°C
Power Dissipation (Note 2)
Electrical Characteristics Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over
the full operating temperature range. Unless otherwise specified: VIN = VOUT + 1V, CIN = COUT = 10 µF, ILOAD = 10mA. Min/Max
limits are guaranteed through testing, statistical correlation, or design.
Typ
(Note 4)
Symbol
Parameter
Conditions
Min
Max
Units
-2.0
2.0
100 µA < IL < 0.5A
VO
%VOUT
Output Voltage Tolerance
-4.0
4.0
0.1
5
VO + 1V ≤ VIN ≤ 10V
Output Voltage Line Regulation
(Note 6)
ΔVO/ΔVIN
ΔVO/ΔIL
VO + 0.5V ≤ VIN ≤ 10V
IL = 25mA
0.03
1.8
%/V
%/A
Output Voltage Load Regulation
(Note 7)
1 mA < IL < 0.5A
VIN = VO + 1V
(VO = 2.5V)
IL = 0.1A
80
430
145
725
IL = 0.5A
(VO = 3.3V)
IL = 0.1A
65
330
110
550
VIN - VOUT
Dropout Voltage (Note 8)
mV
IL = 0.5A
(VO = 5V)
IL = 0.1A
IL = 0.5A
45
250
100
450
IQ
Quiescent Current
55
100
1
VIN ≤ 10V, IL =100 µA - 0.5A
VEN ≤ 0.4V, (LP38693 Only)
0.001
µA
IL(MIN)
IFB
Minimum Load Current
Foldback Current Limit
100
VIN - VO ≤ 4V
VIN - VO > 5V
VIN - VO < 4V
350
850
mA
dB
PSRR
Ripple Rejection
VIN = VO + 2V(DC), with 1V(p-p) /
120Hz Ripple
55
160
10
TSD
Thermal Shutdown Activation
(Junction Temp)
°C
TSD (HYST)
Thermal Shutdown Hysteresis
(Junction Temp)
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Typ
(Note 4)
Symbol
Parameter
Output Noise
Conditions
Min
Max
Units
en
BW = 10Hz to 10kHz
VO = 3.3V
0.7
0.5
µV/
µA
VO (LEAK)
VEN
Output Leakage Current
VO = VO(NOM) + 1V @ 10VIN
Output = OFF
12
Enable Voltage (LP38693 Only)
0.4
Output = ON, VIN = 4V
Output = ON, VIN = 6V
Output = ON, VIN = 10V
VEN = 0V or 10V, VIN = 10V
1.8
3.0
4.0
-1
V
IEN
Enable Pin Leakage (LP38693
Only)
0.001
1
µA
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for which the device
is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics. Specifications do not
apply when operating the device outside of its rated operating conditions.
Note 2: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a heatsink is used).
The junction-to-ambient thermal resistance ( θJ-A) for the TO-252 is approximately 90°C/W for a PC board mounting with the device soldered down to minimum
copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator for the TO-252, the θJ-A drops to approximately 50°C/W. The
SOT-223 package has a θJ-A of approximately 125°C/W when soldered down to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W
when soldered to a copper area of one square inch. The θJ-A values for the LLP package are also dependent on trace area, copper thickness, and the number
of thermal vias used (refer to application note AN-1187). If power disspation causes the junction temperature to exceed specified limits, the device will go into
thermal shutdown.
Note 3: ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.
Note 4: Typical numbers represent the most likely parametric norm for 25°C operation.
Note 5: If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to ground.
Note 6: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
Note 7: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to full load.
Note 8: Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.
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Block Diagrams
20126507
FIGURE 1. LP38691 Functional Diagram (LLP)
20126508
FIGURE 2. LP38691 Functional Diagram (TO-252)
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20126509
FIGURE 3. LP38693 Functional Diagram (LLP)
20126510
FIGURE 4. LP38693 Functional Diagram (SOT-223)
7
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Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable
pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT +1V, IL = 10mA.
Noise vs Frequency
Noise vs Frequency
Ripple Rejection
Noise vs Frequency
Ripple Rejection
Ripple Rejection
20126536
20126535
20126518
20126537
20126520
20126522
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Line Transient Response
Line Transient Response
Load Transient Response
Line Transient Response
Load Transient Response
VOUT vs Temperature (5.0V)
20126524
20126526
20126528
20126542
20126544
20126530
9
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VOUT vs Temperature (3.3V)
VOUT vs Temperature (2.5V)
20126532
20126531
VOUT vs Temperature (1.8V)
VOUT vs VIN (1.8V)
20126533
20126559
VOUT vs VIN, Power-Up
VOUT vs VEN, ON (LP38693 Only)
20126560
20126561
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VOUT vs VEN, OFF (LP38693 Only)
Load Regulation vs Temperature
MIN VIN vs IOUT
Enable Voltage vs Temperature
Line Regulation vs Temperature
Dropout Voltage vs IOUT
20126552
20126562
20126553
20126554
20126556
20126557
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ratings of temperature and voltage. Of course, they are typi-
cally larger and more costly than Z5U/Y5U types for a given
voltage and capacitance.
Application Hints
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are re-
quired to assure stability. These capacitors must be correctly
selected for proper performance.
TANTALUM
Solid Tantalum capacitors have good temperature stability: a
high quality Tantalum will typically show a capacitance value
that varies less than 10-15% across the full temperature
range of -40°C to +125°C. ESR will vary only about 2X going
from the high to low temperature limits.
INPUT CAPACITOR: An input capacitor of at least 1µF is re-
quired (ceramic recommended). The capacitor must be lo-
cated not more than one centimeter from the input pin and
returned to a clean analog ground.
PCB LAYOUT
OUTPUT CAPACITOR: An output capacitor is required for
loop stability. It must be located less than 1 centimeter from
the device and connected directly to the output and ground
pins using traces which have no other currents flowing
through them.
Good PC layout practices must be used or instability can be
induced because of ground loops and voltage drops. The in-
put and output capacitors must be directly connected to the
input, output, and ground pins of the regulator using traces
which do not have other currents flowing in them (Kelvin con-
nect).
The minimum amount of output capacitance that can be used
for stable operation is 1µF. Ceramic capacitors are recom-
mended (the LP38691/3 was designed for use with ultra low
ESR capacitors). The LP38691/3 is stable with any output
capacitor ESR between zero and 100 Ohms.
The best way to do this is to lay out CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins. The
regulator ground pin should be connected to the external cir-
cuit ground so that the regulator and its capacitors have a
"single point ground".
ENABLE PIN (LP38693 only): The LP38693 has an Enable
pin (EN) which allows an external control signal to turn the
regulator output On and Off. The Enable On/Off threshold has
no hysteresis. The voltage signal must rise and fall cleanly,
and promptly, through the ON and OFF voltage thresholds.
The Enable pin has no internal pull-up or pull-down to estab-
lish a default condition and, as a result, this pin must be
terminated either actively or passively. If the Enable pin is
driven from a source that actively pulls high and low, the drive
voltage should not be allowed to go below ground potential or
higher than VIN. If the application does not require the Enable
function, the pin should be connected directly to the VIN pin.
It should be noted that stability problems have been seen in
applications where "vias" to an internal ground plane were
used at the ground points of the IC and the input and output
capacitors. This was caused by varying ground potentials at
these nodes resulting from current flowing through the ground
plane. Using a single point ground technique for the regulator
and it’s capacitors fixed the problem. Since high current flows
through the traces going into VIN and coming from VOUT
Kelvin connect the capacitor leads to these pins so there is
no voltage drop in series with the input and output capacitors.
,
Foldback Current Limiting: Foldback current limiting is built
into the LP38691/3 which reduces the amount of output cur-
rent the part can deliver as the output voltage is reduced. The
amount of load current is dependent on the differential voltage
between VIN and VOUT. Typically, when this differential volt-
age exceeds 5V, the load current will limit at about 350 mA.
When the VIN - VOUT differential is reduced below 4V, load
current is limited to about 850 mA.
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic
interference) can degrade any integrated circuit’s perfor-
mance because of the small dimensions of the geometries
inside the device. In applications where circuit sources are
present which generate signals with significant high frequen-
cy energy content (> 1 MHz), care must be taken to ensure
that this does not affect the IC regulator.
SELECTING A CAPACITOR
If RFI/EMI noise is present on the input side of the regulator
(such as applications where the input source comes from the
output of a switching regulator), good ceramic bypass capac-
itors must be used at the input pin of the IC.
It is important to note that capacitance tolerance and variation
with temperature must be taken into consideration when se-
lecting a capacitor so that the minimum required amount of
capacitance is provided over the full operating temperature
range.
If a load is connected to the IC output which switches at high
speed (such as a clock), the high-frequency current pulses
required by the load must be supplied by the capacitors on
the IC output. Since the bandwidth of the regulator loop is less
than 100 kHz, the control circuitry cannot respond to load
changes above that frequency. This means the effective out-
put impedance of the IC at frequencies above 100 kHz is
determined only by the output capacitor(s).
Capacitor Characteristics
CERAMIC
For values of capacitance in the 10 to 100 µF range, ceramics
are usually larger and more costly than tantalums but give
superior AC performance for bypassing high frequency noise
because of very low ESR (typically less than 10 mΩ). How-
ever, some dielectric types do not have good capacitance
characteristics as a function of voltage and temperature.
In applications where the load is switching at high speed, the
output of the IC may need RF isolation from the load. It is
recommended that some inductance be placed between the
output capacitor and the load, and good RF bypass capacitors
be placed directly across the load.
Z5U and Y5V dielectric ceramics have capacitance that drops
severely with applied voltage. A typical Z5U or Y5V capacitor
can lose 60% of its rated capacitance with half of the rated
voltage applied to it. The Z5U and Y5V also exhibit a severe
temperature effect, losing more than 50% of nominal capac-
itance at high and low limits of the temperature range.
PCB layout is also critical in high noise environments, since
RFI/EMI is easily radiated directly into PC traces. Noisy cir-
cuitry should be isolated from "clean" circuits where possible,
and grounded through a separate path. At MHz frequencies,
ground planes begin to look inductive and RFI/ EMI can cause
ground bounce across the ground plane. In multi-layer PCB
applications, care should be taken in layout so that noisy
X7R and X5R dielectric ceramic capacitors are strongly rec-
ommended if ceramics are used, as they typically maintain a
capacitance range within ±20% of nominal over full operating
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12
power and ground planes do not radiate directly into adjacent
layers which carry analog power and ground.
Attention should be paid to the units of measurement. Spot
noise is measured in units µV/root-Hz or nV/root-Hz and total
output noise is measured in µV(rms)
OUTPUT NOISE
The primary source of noise in low-dropout regulators is the
internal reference. Noise can be reduced in two ways: by in-
creasing the transistor area or by increasing the current drawn
by the internal reference. Increasing the area will decrease
the chance of fitting the die into a smaller package. Increasing
the current drawn by the internal reference increases the total
supply current (ground pin current).
Noise is specified in two ways: Spot Noise or Output Noise
Density is the RMS sum of all noise sources, measured at
the regulator output, at a specific frequency (measured with
a 1Hz bandwidth). This type of noise is usually plotted on a
curve as a function of frequency. Total Output Noise or
Broad-Band Noise is the RMS sum of spot noise over a
specified bandwidth, usually several decades of frequencies.
13
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Physical Dimensions inches (millimeters) unless otherwise noted
6-lead, LLP Package
NS Package Number SDE06A
TO-252 Package
NS Package Number TD03B
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14
SOT-223 Package
NS Package Number MP05A
15
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