LM2781 [NSC]

Ultra-Low Ripple Switched Capacitor Voltage Inverter; 超低纹波开关电容电压型逆变器
LM2781
型号: LM2781
厂家: National Semiconductor    National Semiconductor
描述:

Ultra-Low Ripple Switched Capacitor Voltage Inverter
超低纹波开关电容电压型逆变器

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March 2003  
LM2781  
Ultra-Low Ripple Switched Capacitor Voltage Inverter  
General Description  
Features  
n Inverts Input Voltage  
The LM2781 is a charge pump that inverts an input voltage  
in the range of 1.8V to 5.5V to the corresponding output  
voltage of -1.8V to -5.5V. With use of three or four low-cost  
external ceramic capacitors, the LM2781 can provide up to  
50mA of output current.  
n Ultra-Low Voltage Ripple and 8Typical Output  
Resistance with Two Flying Capacitors  
n Output Resistance of 18Using One Flying Capacitor  
n 210kHz (typ.) Switching Frequency  
The LM2781 operates at a 210kHz typical switching fre-  
quency to minimize supply current (0.7mA typ.). Two charge  
pumps operate 180˚ out of phase to significantly reduce the  
output voltage ripple compared to that of traditional single-  
phase charge pump circuits. If larger output ripple can be  
tolerated, optional capacitor C2 may be omitted to reduce  
the cost and size of the solution. The LM2781 is available in  
an 8-pin Micro SMD chip-scale package.  
n 8-pin micro SMD Package (1.4mm x 1.4mm x 0.5mm)  
Applications  
n Cellular Phones  
n Pagers  
n PDAs  
n Op-Amp Power Supplies  
n Interface Power Supplies  
n Handheld Instruments  
See also: LM2780, a slow clock (12kHz typ) version of this  
topology with extremely low supply current.  
Typical Application Circuit  
20044701  
© 2003 National Semiconductor Corporation  
DS200447  
www.national.com  
Connection Diagram  
8-Bump Thin Micro SMD Package  
NS Package Number TPA08  
20044702  
Pin Description  
Pin  
A1  
B1  
C1  
A2  
C2  
A3  
B3  
C3  
Name  
C2+  
VIN  
Description  
Secondary flying-capacitor connection  
Input voltage. Input range: 1.8V to 5.5V  
Primary flying-capacitor connection  
C1+  
SD  
Shutdown pin logic input. Low = on, High = shutdown  
Ground  
GND  
C2-  
Secondary flying-capacitor connection  
Output voltage. VOUT = -VIN  
VOUT  
C1-  
Primary flying capacitor connection  
Ordering Information  
Order Number  
Package Description  
Package  
Marking  
12  
Supplied as  
LM2781TP  
TPA08: Thin Micro SMD  
TPA08: Thin Micro SMD  
Tape and reel, 250 pcs.  
Tape and reel, 3000 pcs.  
LM2781TPX  
12  
www.national.com  
2
Absolute Maximum Ratings (Notes 1,  
ESD Rating (Note 4)  
Human-body model  
Machine model  
2kV  
2)  
200V  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Ratings (Notes 1, 2)  
Input Voltage Range  
VIN pin: Voltage to GND  
SD pin: Voltage to GND  
−0.3V to 5.8V  
-0.3V to  
1.8V to 5.5V  
-40˚C to +90˚C  
-40˚C to +85˚C  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
(Note 5)  
(VIN + 0.3V), with  
5.8V max  
Output Short-to-GND Duration  
(Note 3)  
1 sec.  
Thermal Properties  
Junction-to-Ambient Thermal  
Resistance (θJA), TPA08 Package  
(Note 6)  
Maximum Junction Temperature  
(TJ-MAX  
)
150˚C  
220˚C/W  
Storage Temperature Range  
Pad Temperature  
-65˚C to +150˚C  
(Soldering, 10 sec.)  
265˚C  
Electrical Characteristics (Notes 2, 7)  
Limits in standard typface are for TJ = 25˚C, and limits in boldface type apply over the full operating junction temperature  
range (-40˚C TJ +90˚C). Unless otherwise noted: specifications apply to the LM2781 Typical Application Circuit (pg. 1) with  
VIN = 5.0V, V(SD) = 0V, and CIN = COUT = C1 = C2 = 1µF. (Note 8)  
Symbol  
Parameter  
Output Resistance  
(Note 9)  
Conditions  
IOUT = 10mA, C2 = 1µF  
Min  
Typ  
8
Max  
30  
Units  
ROUT  
IOUT = 10mA, C2 removed  
No load  
18  
40  
IQ  
Supply Current  
0.7  
0.1  
210  
1.4  
0.5  
400  
mA  
µA  
ISD  
FSW  
VSD  
Shutdown Supply Current  
Switching Frequency  
V(SD) = 5.0V  
100  
0
kHz  
Shutdown Pin Logic Levels Normal Operation  
1.8V VIN 5.5V  
0.5  
VIN  
V
Shutdown Mode  
0.5xVIN  
1.8V VIN 5.5V  
VOUTp-p  
PEFF  
Output Voltage Ripple  
Power Efficiency  
VIN = 5.0V, IOUT = 10mA  
VIN = 5.0V, IOUT = 10mA  
10  
92  
mV  
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of  
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the  
Electrical Characteristics table.  
Note 2: All voltages are with respect to the potential at the GND pin.  
Note 3: V  
may be shorted to GND for one second without damage when the ambient temperature is at or below 85˚C. Prolonged or repeated shorts of V  
OUT  
OUT  
to GND may damage the device, and should be avoided.  
Note 4: The human-body model is a 100pF capacitor discharged through a 1.5kresistor into each pin. The machine model is a 200pF capacitor discharged  
directly into each pin.  
Note 5: Maximum ambient temperature (T  
) is dependent on the maximum operating junction temperature (T  
= 90˚C), the maximum power dissipation  
J-MAX-OP  
A-MAX  
of the device in the application (P  
), and the junction-to-ambient thermal resistance of the part in the application (θ ), as given by the following equation: T  
D-MAX  
JA A-MAX  
= T  
- (θ x P  
).  
J-MAX-OP  
JA  
D-MAX  
Note 6: Junction-to-ambient thermal resistance of the micro SMD package is highly application and board-layout dependent.  
Note 7: Max and Min limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.  
Note 8: C , C , C1, and C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.  
IN  
OUT  
Note 9: Output resistance is a model for the voltage drop at the output, resulting from internal switch resistance, capacitor ESR, and charge pump charge transfer  
characteristics. Output voltage can be predicted with the following equation: V  
= -[V - (I  
x R  
)]  
OUT  
IN  
OUT  
OUT  
3
www.national.com  
Typical Performance Characteristics  
Unless otherwise specified, TA = 25˚C, CIN = COUT = C1 = C2 = 1µF.  
Output Voltage vs. Load Current  
Power Efficiency vs. Load Current  
20044703  
20044704  
Output Resistance vs. Temperature (IOUT = 10mA)  
Supply Current vs. Temperature (IOUT = 0)  
20044705  
20044706  
Switching Frequency vs. Temperature  
Output Voltage Ripple vs. Output Current  
20044707  
20044708  
www.national.com  
4
Block Diagram  
20044710  
flying capacitor transfers charge to the COUT, elevating both  
the voltage across the COUT and the magnitude of the output  
voltage.  
Operation Description  
The LM2781 is a switched capacitor voltage inverter that  
produces a negative output voltage from a positive input  
voltage. To minimize output voltage ripple, the LM2781 con-  
tains two charge pump inverters that operate 180˚ out of  
phase. These two charge pumps can be seen in the block  
diagram above.  
The LM2781 contains two charge pump inverters running  
180˚ out of phase. Notice in the block diagram that the clock  
connections on Charge Pump 2 are opposite of the clock  
connections to Charge Pump 1. Thus, when Charge Pump 1  
is in the charge phase, Charge Pump 2 is in the pump phase,  
and vice-versa. With this double-pump technology, there is  
always a flying capacitor connected to the output. This re-  
sults in significantly lower output voltage ripple than that of a  
single-pump inverter.  
A basic switched capacitor inverter is a two-phase charge  
pump circuit that transfers charge from the input to the  
output using a flying capacitor. Charge Pump 1 in the block  
diagram will be used to illustrate the operation of a single  
charge pump. Disregard Charge Pump 2 in the diagram for  
now. In phase 1 (φ1), the CLK1A signal of Charge Pump 1 is  
high, and MOSFET switches S1A and S1B are ON. For  
Charge Pump 1, this is the charge phase, as the flying  
capacitor C1 is charged to the input voltage. In the second  
phase (φ2), the positive-charged plate of C1 is connected to  
GND through switch S1C, and the negative-charged plate is  
connected to the output through switch S1D. This results in  
the output voltage being approximately equal in magnitude  
OUTPUT VOLTAGE RIPPLE  
Several factors influence the magnitude of voltage ripple on  
the output of the LM2781. Primary influences are output  
capacitance, flying capacitance, load current, input voltage,  
and output capacitor ESR.  
The magnitude of the output voltage ripple is difficult to  
predict with equations when the LM2781 is double pumping.  
Refer to the Typical Performance Characteristic curves for  
this information. In general, ripple decreases with increased  
output capacitance, decreased load current, a lower input  
voltage, a smaller flying capacitance and/or a smaller output  
capacitor ESR.  
~
to the input voltage, but opposite in sign (VOUT = - VIN). In  
this pump phase, charge stored on the flying capacitor sup-  
plies the current to the load and transfers charge to the  
output capacitor.  
This basic inverter has ripple in the output voltage. During  
the charge phase, the load current is supplied by the charge  
on the output capacitor. As charge is pulled off COUT, the  
voltage across the capacitor drops, and the magnitude of the  
output voltage ( |VOUT| ) falls. During the pump phase, the  
When only one charge pump is active (C2 removed), the  
output ripple is more predictable, and can be estimated with  
the following equation:  
VRIPPLE = [(0.5xIOUT) / (fSWxCOUT) ] + (2xIOUTxESRCout  
)
5
www.national.com  
CAPACITOR SELECTION  
Operation Description (Continued)  
OUTPUT RESISTANCE  
Surface-mount multi-layer ceramic capacitors are recom-  
mended for use with the LM2781. These capacitors are  
small, inexpensive and have very low equivalent series re-  
Output resistance (ROUT) models the internal non-idealities  
of a charge pump that result in droop in the output voltage.  
The effect of output resistance on output voltage is ex-  
pressed in the following equation:  
<
sistance (ESR, 15mtyp.). Tantalum capacitors, OS-CON  
capacitors, and aluminum electrolytic capacitors generally  
are not recommended for use with the LM2781 due to their  
high ESR, as compared to ceramic capacitors.  
VOUT = - [VIN - ( |IOUT| x ROUT )]  
For most applications, ceramic capacitors with X7R or X5R  
temperature characteristic are preferred for use with the  
LM2781. These capacitors have tight capacitance tolerance  
(as good as 10%), hold their value over temperature (X7R:  
15% over -55˚C to 125˚C; X5R: 15% over -55˚C to 85˚C),  
and typically have little voltage coefficient.  
Output resistance is a function of the internal switch resis-  
tance (RSW) , flying capacitance (C1), flying capacitor  
equivalent series resistance (ESRC1), output capacitor ESR  
(ESRCout), and internal switching frequency (fSW). When the  
LM2781 operates as a single charge pump (C2 removed),  
the output resistance can be approximated by the following  
equation:  
Capacitors with Y5V and/or Z5U temperature characteristic  
are generally not recommended for use with the LM2781.  
These types of capacitors typically have wide capacitance  
tolerance (+80%, -20%), vary significantly over temperature  
(Y5V: +22%, -82% over -30˚C to +85˚C range; Z5U: +22%,  
-56% over +10˚C to +85˚C range), and have poor voltage  
coefficients. Under some conditions, a nominal 1µF Y5V or  
Z5U capacitor could have a capacitance of only 0.1µF. Such  
deviation would severely affect performance of the LM2781  
circuit.  
~
1 Fly Cap: ROUT1 = 2RSW1+[1/(fSW*C1)]+4ESRC1+ESRCout  
RSW1 is the sum of the ON resistance of the four internal  
MOSFET switches of Charge Pump 1.  
With both C1 and C2 in place, the double pumping topology  
of the LM2781 cuts the output resistance in half:  
~
2 Fly Caps: ROUT2 = 0.5xROUT1  
Recommendations for minimizing output resistance include  
increasing flying capacitance and minimizing output and fly-  
ing capacitor ESR.  
www.national.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted  
TPA08: 8-Bump Thin Micro SMD  
X1 = X2 = 1.361mm 0.030mm  
X3 = 0.500mm 0.075mm  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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