LM12L458 [NSC]
12-Bit Sign Data Acquisition System with Self-Calibration; 12位注册数据采集系统具有自校准型号: | LM12L458 |
厂家: | National Semiconductor |
描述: | 12-Bit Sign Data Acquisition System with Self-Calibration |
文件: | 总36页 (文件大小:697K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
July 1999
LM12L458
12-Bit + Sign Data Acquisition System with
Self-Calibration
General Description
The LM12L458 is a highly integrated 3.3V Data Acquisition
System. It combines a fully-differential self-calibrating (cor-
Key Specifications
=
(fCLK 6 MHz)
n Resolution
12-bit + sign or 8-bit + sign
7.3 µs
recting linearity and zero errors) 13-bit (12-bit
+ sign)
n 13-bit conversion time
n 9-bit conversion time
n 13-bit Through-put rate
analog-to-digital converter (ADC) and sample-and-hold
(S/H) with extensive analog functions and digital functional-
ity. Up to 32 consecutive conversions, using two’s comple-
ment format, can be stored in an internal 32-word (16-bit
wide) FIFO data buffer. An internal 8-word RAM can store
the conversion sequence for up to eight acquisitions through
the LM12L458’s eight-input multiplexer. The LM12L458 can
also operate with 8-bit + sign resolution and in a supervisory
“watchdog” mode that compares an input signal against two
programmable limits. Programmable acquisition times and
conversion rates are possible through the use of internal
clock-driven timers.
3.5 µs
106k samples/s (min)
n Comparison time (“watchdog” mode)
n ILE
1.8 µs (max)
1 LSB (max)
GND to VA
±
+
n VIN range
n Power dissipation
n Stand-by mode
n Single supply
15 mW (max)
5 µW (typ)
3V to 5.5V
Features
n Three operating modes: 12-bit + sign, 8-bit + sign, and
“watchdog”
n Single-ended or differential inputs
n Built-in Sample-and-Hold
n Instruction RAM and event sequencer
n 8-channel multiplexer
All registers, RAM, and FIFO are directly addressable
through the high speed microprocessor interface to either an
8-bit or 16-bit databus. The LM12L458 includes a direct
memory access (DMA) interface for high-speed conversion
data transfer.
n 32-word conversion FIFO
Applications
n Data Logging
n Process Control
n Energy Management
n Medical Instrumentation
n Programmable acquisition times and conversion rates
n Self-calibration and diagnostic mode
n 8- or 16-bit wide databus microprocessor or DSP
interface
n CMOS compatible I/O
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
AT® is a registered trademark of International Business Machines Corporation.
© 1999 National Semiconductor Corporation
DS011711
www.national.com
Connection Diagram
DS011711-1
*
Pin names in ( ) apply to the LM12L454.
Order Number LM12L458CIV
See NS Package Number V44A
Functional Diagram
LM12L458
DS011711-3
Ordering Information
Guaranteed
Clock Freq (min)
6 MHz
Guaranteed
Order
See NS
Package Number
V44A
Linearity Error (max)
Part Number
±
1.0 LSB
LM12L458CIV
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2
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Operating Ratings (Notes 1, 2)
Supply Voltage (VA+ and VD+)
Voltage at Input and Output Pins
except IN0–IN7 (LM12L458)
Voltage at Analog Inputs
IN0–IN7 (LM12L458)
6.0V
Temperature Range
(Tmin ≤ TA ≤ Tmax
LM12L458CIV
Supply Voltage
VA+, VD+
)
−0.3V to V+ + 0.3V
−40˚C ≤ TA ≤ 85˚C
GND − 5V to V+ + 5V
300 mV
3.0V to 5.5V
≤100 mV
|VA+ − VD+|
|VA+ − VD+|
±
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
5 mA
VIN+ Input Range
VIN− Input Range
GND ≤ VIN+ ≤ VA+
GND ≤ VIN− ≤ VA+
1V ≤ VREF+ ≤ VA+
0V ≤ VREF− ≤ VREF+ − 1V
1V ≤ VREF ≤ VA+
±
20 mA
=
Power Dissipation (TA 25˚C)
VREF+ Input Voltage
VREF− Input Voltage
VREF+ − VREF−
V Package (Note 4)
Storage Temperature
875 mW
−65˚C to +150˚C
Lead Temperature
VREF Common Mode
Range (Note 16)
V Package, Infrared, 15 sec.
ESD Susceptibility (Note 5)
+300˚C
1.5 kV
+
+
0.1 VA ≤ VREFCM ≤ 0.6 VA
Converter Characteristics
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK
=
6.0 MHz, RS 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed 1.25V common-mode volt-
=
=
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other
=
=
limits TA TJ 25˚C. (Notes 6, 7, 8, 9)
Symbol
Parameter
Conditions
Typical
Limits
Unit
(Note 10)
(Note 11)
(Limit)
ILE
Positive and Negative Integral
Linearity Error
After Auto-Cal (Notes 12, 17)
LSB (max)
±
±
1
1/2
±
TUE
DNL
Total Unadjusted Error
Resolution with No Missing Codes
Differential Non-Linearity
Zero Error
After Auto-Cal (Note 12)
After Auto-Cal (Note 12)
After Auto-Cal
1
LSB
13
Bits (max)
LSB (max)
LSB (max)
LSB (max)
LSB (max)
LSB (max)
±
±
±
±
±
1
1
3
3
4
±
±
±
After Auto-Cal (Notes 13, 17)
After Auto-Cal (Notes 12, 17)
After Auto-Cal (Notes 12, 17)
(Note 14)
1/4
1/2
1/2
Positive Full-Scale Error
Negative Full-Scale Error
DC Common Mode Error
±
2
ILE
8-Bit + Sign and “Watchdog” Mode
Positive and Negative Integral
Linearity Error
(Note 12)
±
±
1/2
LSB (max)
LSB (max)
Bits (max)
LSB (max)
LSB (max)
LSB (max)
LSB
TUE
8-Bit + Sign and “Watchdog” Mode
Total Unadjusted Error
After Auto-Zero
After Auto-Zero
±
1/2
3/4
9
8-Bit + Sign and “Watchdog” Mode
Resolution with No Missing Codes
DNL
8-Bit + Sign and “Watchdog” Mode
Differential Non-Linearity
±
1
8-Bit + Sign and “Watchdog” Mode
Zero Error
±
±
1/2
1/2
8-Bit + Sign and “Watchdog” Positive
and Negative Full-Scale Error
8-Bit + Sign and “Watchdog” Mode DC
Common Mode Error
±
1/8
Multiplexer Channel-to-Channel
Matching
LSB
±
0.05
VIN+
Non-Inverting Input Range
GND
VA+
V (min)
V (max)
3
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Converter Characteristics (Continued)
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK
=
6.0 MHz, RS 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed 1.25V common-mode volt-
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other
=
=
=
=
limits TA TJ 25˚C. (Notes 6, 7, 8, 9)
Symbol Parameter
Conditions
Typical
Limits
(Note 11)
GND
Unit
(Limit)
V (min)
V (max)
V (min)
V (max)
V (min)
V (max)
LSB (max)
LSB (max)
LSB
(Note 10)
VIN−
Inverting Input Range
VA+
+
VIN+ − VIN−
Differential Input Voltage Range
−VA
VA+
GND
VA+
Common Mode Input Voltage Range
=
=
±
±
±
±
±
1.75
PSS
Power Supply
Sensitivity
Zero Error
VA+ VD+ 3.3V 10%
0.2
0.4
0.2
=
=
±
2
Full-Scale Error
Linearity Error
VREF+ 2.5V, VREF− GND
(Note 15)
CREF
CIN
VREF+/VREF− Input Capacitance
Selected Multiplexer Channel Input
Capacitance
85
pF
pF
75
Converter AC Characteristics
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK 6.0
=
MHz, RS 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed 1.25V common-mode voltage,
=
=
and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits
=
=
TA TJ 25˚C. (Notes 6, 7, 8, 9)
Symbol
Parameter
Clock Duty Cycle
Conditions
Typical
(Note 10)
50
Limits
Unit
(Limit)
%
(Note 11)
40
60
% (min)
% (max)
(max)
tC
Conversion Time
Acquisition Time
13-Bit Resolution,
44 (tCLK
)
)
44 (tCLK) + 50 ns
21 (tCLK) + 50 ns
9 (tCLK) + 50 ns
2 (tCLK) + 50 ns
Sequencer State S5 (Figure 15)
9-Bit Resolution,
(max)
(max)
(max)
21 (tCLK
Sequencer State S5 (Figure 15)
Sequencer State S7 (Figure 15)
Built-in minimum for 13-Bits
Built-in minimum for 9-Bits and
“Watchdog” mode
tA
9 (tCLK
)
2 (tCLK
)
tZ
Auto-Zero Time
Full Calibration Time
Throughput Rate
(Note 18)
Sequencer State S2 (Figure 15)
Sequencer State S2 (Figure 15)
76 (tCLK
)
76 (tCLK) + 50 ns
(max)
(max)
kHz
tCAL
4944 (tCLK
)
4944 (tCLK) + 50 ns
107
106
(min)
(max)
tWD
“Watchdog” Mode
Comparison Time
Power-Up Time
Wake-Up Time
Sequencer States S6, S4,
and S5 (Figure 15)
11 (tCLK
)
11 (tCLK) + 50 ns
tPU
10
10
ms
ms
tWU
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4
DC Characteristics
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, fCLK 6.0 MHz and minimum acquisition
=
=
=
=
time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6,
7, 8)
Symbol
Parameter
Conditions
Typical
(Note 10)
0.4
Limits
(Note 11)
1.0
Unit
(Limit)
=
ID+
IA+
IST
VD+ Supply Current
VA+ Supply Current
Stand-By Supply Current
(ID+ + IA+)
CS “1”
mA (max)
mA (max)
=
CS “1”
Power-Down Mode Selected
Clock Stopped
6 MHz Clock
2.25
3.5
1.5
30
4.5
µA (max)
µA (max)
=
VA+ 3.6V
Multiplexer ON-Channel
Leakage Current
=
ON-Channel 3.6V
=
OFF-Channel 0V
0.1
0.1
0.3
0.3
µA (max)
µA (max)
=
ON-Channel 0V
=
OFF-Channel 3.6V
=
VA+ 3.6V
Multiplexer OFF-Channel
Leakage Current
=
ON-Channel 3.6V
=
OFF-Channel 0V
0.1
0.3
µA (max)
=
ON-Channel 0V
=
OFF-Channel 3.6V
0.1
850
0.3
µA (max)
=
RON
Multiplexer ON-Resistance
VIN 3.3V
1500
2000
1500
Ω
Ω
Ω
Ω
Ω
Ω
=
VIN 1.65V
1300
830
=
VIN 0V
=
±
±
±
±
±
±
Multiplexer
VIN 3.3V
1.0%
1.0%
1.0%
3.0%
3.0%
3.0%
Channel-to-Channel
RON matching
=
VIN 1.65V
=
VIN 0V
Digital Characteristics
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, unless otherwise specified. Boldface limits apply for TA TJ
=
=
TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6, 7, 8)
Symbol
Parameter
Conditions
Typical
Limits
(Note 11)
2.0
Unit
(Note 10)
(Limit)
V (min)
V (max)
= =
VA+ VD+ 3.6V
VIN(1)
VIN(0)
Logical “1” Input Voltage
Logical “0” Input Voltage
=
=
VA+ VD+ 3.0V
0.7
ALE, Pin 22
0.6
=
IIN(1)
Logical “1” Input Current
Logical “0” Input Current
VIN 3.3V
0.005
−0.005
6
1.0
µA (max)
µA (max)
pF
2.0
=
IIN(0)
VIN 0V
−1.0
−2.0
CIN
D0–D15 Input Capacitance
Logical “1” Output Voltage
= =
VA+ VD+ 3.0V
VOUT(1)
=
IOUT −360 µA
2.4
V (min)
V (min)
=
IOUT −10 µA
2.85
= =
VA+ VD+ 3.0V
VOUT(0)
Logical “0” Output Voltage
=
IOUT 1.6 mA
0.4
0.1
V (max)
=
IOUT 10 µA
TRI-STATE® Output Leakage Current
−0.01
0.01
−3.0
3.0
µA (max)
µA (max)
=
VOUT 0V
IOUT
=
VOUT 3.3V
5
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Digital Timing Characteristics
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, tr tf 3 ns, and CL 100 pF on data I/O, INT and DMARQ lines
=
=
=
=
unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6, 7, 8)
Symbol
Typical
Limits
Unit
(See Figures 10,
11, 12)
Parameter
Conditions
(Note 10)
(Note 11)
(Limit)
1, 3
CS or Address Valid to ALE Low
Set-Up Time
ns (min)
ns (min)
40
20
2, 4
CS or Address Valid to ALE Low
Hold Time
5
6
ALE Pulse Width
45
35
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (min)
ns (max)
ns (min)
ns (max)
ns (min)
ns (max)
ns (min)
ns (min)
ns (min)
RD High to Next ALE High
ALE Low to RD Low
7
20
8
RD Pulse Width
100
100
20
9
RD High to Next RD or WR Low
ALE Low to WR Low
10
11
12
13
14
15
16
WR Pulse Width
60
WR High to Next ALE High
WR High to Next RD or WR Low
Data Valid to WR High Set-Up Time
Data Valid to WR High Hold Time
RD Low to Data Bus Out of TRI-STATE
75
140
40
30
30
30
30
10
70
=
17
18
RD High to TRI-STATE
RL 1 kΩ
10
110
10
RD Low to Data Valid (Access Time)
95
20
21
19
Address Valid or CS Low to RD Low
Address Valid or CS Low to WR Low
Address Invalid
20
20
10
from RD or WR High
22
23
INT High from RD Low
30
30
10
60
10
60
ns (min)
ns (max)
ns (min)
ns (max)
DMARQ Low from RD Low
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-
fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
<
>
(V + or V +)), the current at that pin should be limited to 5 mA.
Note 3: When the input voltage (V ) at any pin exceeds the power supply rails (V
IN
GND or V
IN
IN
A
D
The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current of 5 mA, to simultaneously exceed the power supply volt-
ages.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
(maximum junction temperature), θ (package junction
Jmax
to ambient thermal resistance), and T (ambient temperature). The maximum allowable power dissipation at any temperature is PD
JA
− T )/θ or the num-
=
(T
A
max
Jmax
A
JA
=
ber given in the Absolute Maximum Ratings, whichever is lower. For this device, T
LM12L458 in the V package, when board mounted, is 47˚C/W.
150˚C, and the typical thermal resistance (θ ) of the LM12L454 and
JA
Jmax
Note 5: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6: Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above V + or 5V below GND
A
will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward biased by more than 100 mV. As an example, if V + is
A
3.0 V , full-scale input voltage must be ≤3.1 V
to ensure accurate conversions.
DC
DC
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6
Digital Timing Characteristics (Continued)
DS011711-4
+
Note 7:
V + and V + must be connected together to the same power supply voltage and bypassed with separate capacitors at each V pin to assure conversion/
A D
comparison accuracy.
=
Note 8: Accuracy is guaranteed when operating at f
6 MHz.
CLK
=
Note 9: With the test condition for V
REF
V
− V given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.
REF−
REF+
=
Note 10: Typicals are at T
25˚C and represent most likely parametric norm.
A
Note 11: Limits are guaranteed to National’s AOQL (Average Output Quality Level).
Note 12: Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive
full-scale and zero. For negative integral linearity error the straight line passes through negative full-scale and zero. (See Figures 6, 7).
Note 13: Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the code transitions
between −1 to 0 and 0 to +1 (see Figure 8).
Note 14: The DC common-mode error is measured with both inputs shorted together and driven from 0V to 2.5V. The measured value is referred to the resulting
output value when the inputs are driven with a 1.25V signal.
Note 15: Power Supply Sensitivity is measured after Auto-Zero and/or Auto-Calibration cycle has been completed with V + and V + at the specified extremes.
A
D
Note 16:
V
(Reference Voltage Common Mode Range) is defined as (V
REF+
+ V
)/2.
REFCM
REF−
Note 17: The LM12L458’s self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will result in
±
a repeatability uncertainty of 0.10 LSB.
Note 18: The Throughput Rate is for a single instruction repeated continuously. Sequencer states 0 (1 clock cycle), 1 (1 clock cycle), 7 (9 clock cycles) and 5 (44
clock cycles) are used (see Figure 15). One additional clock cycle is used to read the conversion result stored in the FIFO, for a total of 56 clock cycles per con-
version. The Throughput Rate is f
CLK
(MHz)/N, where N is the number of clock cycles/conversion.
7
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Digital Timing Characteristics (Continued)
DS011711-5
=
V
V
V
− V
IN−
REF
REF+
− V
REF−
=
V
IN
IN+
GND ≤ V
GND ≤ V
≤ V
≤ V
+
+
IN+
IN−
A
A
FIGURE 1. The General Case of Output Digital Code vs the Operating Input Voltage Range
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8
Digital Timing Characteristics (Continued)
DS011711-6
=
V
V
− V
REF−
2.5V
REF+
=
V
− V
IN−
IN
IN+
GND ≤ V
GND ≤ V
≤ V
≤ V
+
+
IN+
A
A
IN−
=
FIGURE 2. Specific Case of Output Digital Code vs the Operating Input Voltage Range for VREF 2.5V
9
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Digital Timing Characteristics (Continued)
DS011711-7
FIGURE 3. The General Case of the VREF Operating Range
DS011711-8
=
FIGURE 4. The Specific Case of the VREF Operating Range for VA+ 3.3V
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10
Digital Timing Characteristics (Continued)
DS011711-9
FIGURE 5. Transfer Characteristic
DS011711-10
FIGURE 6. Simplified Error Curve vs Output Code without Auto-Calibration or Auto-Zero Cycles
11
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Digital Timing Characteristics (Continued)
DS011711-11
FIGURE 7. Simplified Error Curve vs Output Code after Auto-Calibration Cycle
DS011711-12
FIGURE 8. Offset or Zero Error Voltage
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9)
Linearity Error Change
vs Clock Frequency
Linearity Error Change
vs Temperature
Linearity Error Change
vs Reference Voltage
DS011711-34
DS011711-35
DS011711-36
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12
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)
Linearity Error Change
vs Supply Voltage
Full-Scale Error Change
vs Clock Frequency
Full-Scale Error Change
vs Temperature
DS011711-37
DS011711-40
DS011711-43
DS011711-38
DS011711-41
DS011711-44
DS011711-39
Full-Scale Error Change
vs Reference Voltage
Full-Scale Error
vs Supply Voltage
Zero Error Change
vs Clock Frequency
DS011711-42
Zero Error Change
vs Temperature
Zero Error Change
vs Reference Voltage
Zero Error Change
vs Supply Voltage
DS011711-45
13
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Typical Performance Characteristics The following curves apply for 12-bit + sign mode after
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)
Analog Supply Current
vs Temperature
Digital Supply Current
vs Clock Frequency
Digital Supply Current
vs Temperature
DS011711-46
DS011711-47
DS011711-48
Test Circuits and Waveforms
DS011711-16
DS011711-15
DS011711-18
DS011711-17
FIGURE 9. TRI-STATE Test Circuits and Waveforms
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14
=
=
=
=
=
Timing Diagrams VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15 outputs.
DS011711-19
FIGURE 10. Multiplexed Data Bus
1, 3: CS or Address valid to ALE low set-up time.
2, 4: CS or Address valid to ALE low hold time.
5: ALE pulse width
11: WR pulse width
12: WR high to next ALE high
13: WR high to next WR or RD low
14: Data valid to WR high set-up time
15: Data valid to WR high hold time
16: RD low to data bus out of TRI-STATE
17: RD high to TRI-STATE
6: RD high to next ALE high
7: ALE low to RD low
8: RD pulse width
9: RD high to next RD or WR low
10: ALE low to WR low
18: RD low to data valid (access time)
15
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=
=
=
=
=
Timing Diagrams VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15
outputs. (Continued)
DS011711-20
=
FIGURE 11. Non-Multiplexed Data Bus (ALE 1)
8: RD pulse width
16: RD low to data bus out of TRI-STATE
9: RD high to next RD or WR low
11: WR pulse width
17: RD high to TRI-STATE
18: RD low to data valid (access time)
19: Address invalid from RD or WR high (hold time)
20: CS low or address valid to RD low
21: CS low or address valid to WR low
13: WR high to next WR or RD low
14: Data valid to WR high set-up time
15: Data valid to WR high hold time
=
=
=
=
=
VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15 outputs.
DS011711-21
FIGURE 12. Interrupt and DMARQ
22: INT high from RD low
23: DMARQ low from RD low
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16
Pin Description
VA+, VD+ Analog and digital supply voltage pins. The
LM12L458’s supply voltage operating range is
+3.0V to +5.5V. Accuracy is guaranteed only if
VA+ and VD+ are connected to the same power
supply. Each pin should have a parallel combi-
nation of 10 µF (electrolytic or tantalum) and
0.1 µF (ceramic) bypass capacitors connected
between it and ground.
ing clock edge either starts a conversion or
makes a comparison to a programmable limit
depending on which function is requested by a
programming instruction. This pin will be an out-
put if “I/O Select” is set high. The SYNC output
goes high when a conversion or a comparison is
started and low when completed. (See Section
2.2). An internal reset after power is first applied
to the LM12L458 automatically sets this pin as
an input.
D0–D15
The internal data input/output TRI-STATE buff-
ers are connected to these pins. These buffers
are designed to drive capacitive loads of 100 pF
or less. External buffers are necessary for driv-
ing higher load capacitances. These pins allows
the user a means of instruction input and data
output. With a logic high applied to the BW pin,
data lines D8–D15 are placed in a high imped-
ance state and data lines D0–D7 are used for in-
struction input and data output when the
LM12L458 is connected to an 8-bit wide data
bus. A logic low on the BW pin allows the
LM12L458 to exchange information over a 16-bit
wide data bus.
BW
INT
Bus Width input pin. This input allows the
LM12L458 to interface directly with either an 8-
or 16-bit databus. A logic high sets the width to 8
bits and places D8–D15 in a high impedance
state. A logic low sets the width to 16 bits.
Active low interrupt output. This output is de-
signed to drive capacitive loads of 100 pF or
less. External buffers are necessary for driving
higher load capacitances. An interrupt signal is
generated any time a non-masked interrupt con-
dition takes place. There are eight different con-
ditions that can cause an interrupt. Any interrupt
is reset by reading the Interrupt Status register.
(See Section 2.3.)
RD
WR
CS
Input for the active low READ bus control signal.
The data input/output TRI-STATE buffers, as se-
lected by the logic signal applied to the BW pin,
are enabled when RD and CS are both low. This
allows the LM12L458 to transmit information
onto the databus.
DMARQ
Active high Direct Memory Access Request out-
put. This output is designed to drive capacitive
loads of 100 pF or less. External buffers are nec-
essary for driving higher load capacitances. It
goes high whenever the number of conversion
results in the conversion FIFO equals a pro-
grammable value stored in the Interrupt Enable
register. It returns to a logic low when the FIFO is
empty.
Input for the active low WRITE bus control sig-
nal. The data input/output TRI-STATE buffers, as
selected by the logic signal applied to the BW
pin, are enabled when WR and CS are both low.
This allows the LM12L458 to receive information
from the databus.
GND
Ground connection. It should be connected to a
low resistance and inductance analog ground re-
turn that connects directly to the system power
supply ground.
Input for the active low Chip Select control sig-
nal. A logic low should be applied to this pin only
during
a READ or WRITE access to the
LM12L458. The internal clocking is halted and
conversion stops while Chip Select is low. Con-
version resumes when the Chip Select input sig-
nal returns high.
IN0–IN7
These are the eight analog inputs. A given chan-
nel is selected through the instruction RAM. Any
of the channels can be configured as an inde-
pendent single-ended input. Any pair of chan-
nels, whether adjacent or non-adjacent, can op-
erate as a fully differential pair.
ALE
Address Latch Enable input. It is used in sys-
tems containing a multiplexed databus. When
ALE is asserted high, the LM12L458 accepts in-
formation on the databus as a valid address. A
high-to-low transition will latch the address data
on A0–A4 and the logic state on the CS input.
Any changes on A0–A4 and CS while ALE is low
will not affect the LM12L458. See Figure 10.
When a non-multiplexed bus is used, ALE is
continuously asserted high. See Figure 11.
VREF−
This is the negative reference input. The
LM12L458 operates with 0V ≤ VREF− ≤ VREF+
.
This pin should be bypassed to ground with a
parallel combination of 10 µF and 0.1 µF (ce-
ramic) capacitors.
VREF+
Positive reference input. The LM12L458 operate
with 0V ≤ VREF+ ≤ VA+. This pin should be by-
passed to ground with a parallel combination of
10 µF and 0.1 µF (ceramic) capacitors.
CLK
External clock input pin. The LM12L458 oper-
ates with an input clock frequency in the range of
0.05 MHz to 8 MHz.
N.C.
This is a no connect pin.
A0–A4
SYNC
The LM12L458’s address lines. They are used
to access all internal registers, Conversion
FIFO, and Instruction RAM.
Synchronization input/output. When used as an
output, it is designed to drive capacitive loads of
100 pF or less. External buffers are necessary
for driving higher load capacitances. SYNC is an
input if the Configuration register’s “I/O Select”
bit is low. A rising edge on this pin causes the in-
ternal S/H to hold the input signal. The next ris-
17
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Application Information
1.0 Functional Description
The LM12L458 is a multi-functional Data Acquisition System
that include a fully differential 12-bit-plus-sign self-calibrating
analog-to-digital converter (ADC) with a two’s-complement
erates in the single-ended mode. Fully differential analog in-
put channels are formed by pairing any two channels to-
gether.
The LM12L458’s internal S/H is designed to operate at its
minimum acquisition time (1.5 µs, 12 bits) when the source
output format, an 8-channel analog multiplexer,
a
<
impedance, RS, is ≤ 80Ω (fCLK ≤ 6 MHz). When 80Ω RS
5.56 kΩ, the internal S/H’s acquisition time can be increased
≤
first-in-first-out (FIFO) register that can store 32 conversion
results, and an Instruction RAM that can store as many as
eight instructions to be sequentially executed. All of this cir-
cuitry operates on only a single +3.3V power supply.
=
to a maximum of 6.5 µs (12 bits, fCLK 6 MHz). See Section
2.1 (Instruction RAM “00”) Bits 12–15 for more information.
Microprocessor overhead is reduced through the use of the
internal conversion FIFO. Thirty-two consecutive conver-
sions can be completed and stored in the FIFO without any
microprocessor intervention. The microprocessor can, at any
time, interrogate the FIFO and retrieve its contents. It can
also wait for the LM12L458 to issue an interrupt when the
FIFO is full or after any number (≤32) of conversions have
been stored.
The LM12L458 has three modes of operation:
12-bit + sign with correction
8-bit + sign without correction
8-bit + sign comparison mode (“watchdog” mode)
The fully differential 12-bit-plus-sign ADC uses a charge re-
distribution topology that includes calibration capabilities.
Charge re-distribution ADCs use a capacitor ladder in place
of a resistor ladder to form an internal DAC. The DAC is used
by a successive approximation register to generate interme-
diate voltages between the voltages applied to VREF− and
Conversion sequencing, internal timer interval, multiplexer
configuration, and many other operations are programmed
and set in the Instruction RAM.
V
REF+. These intermediate voltages are compared against
A diagnostic mode is available that allows verification of the
LM12L458’s operation. This mode internally connects the
voltages present at the VREF+, VREF−, and GND pins to the
internal VIN+ and VIN− S/H inputs. This mode is activated by
setting the Diagnostic bit (Bit 11) in the Configuration register
to a “1”. More information concerning this mode of operation
can be found in Section 2.2.
the sampled analog input voltage as each bit is generated.
The number of intermediate voltages and comparisons
equals the ADC’s resolution. The correction of each bit’s ac-
curacy is accomplished by calibrating the capacitor ladder
used in the ADC.
Two different calibration modes are available; one compen-
sates for offset voltage, or zero error, while the other corrects
both offset error and the ADC’s linearity error.
2.0 Internal User-Programmable
Registers
When correcting offset only, the offset error is measured
once and a correction coefficient is created. During the full
calibration, the offset error is measured eight times, aver-
aged, and a correction coefficient is created. After comple-
tion of either calibration mode, the offset correction coeffi-
cient is stored in an internal offset correction register.
2.1 INSTRUCTION RAM
The instruction RAM holds up to eight sequentially execut-
able instructions. Each 48-bit long instruction is divided into
three 16-bit sections. READ and WRITE operations can be
issued to each 16-bit section using the instruction’s address
and the 2-bit “RAM pointer” in the Configuration register. The
eight instructions are located at addresses 0000 through
The LM12L458’s overall linearity correction is achieved by
correcting the internal DAC’s capacitor mismatch. Each ca-
pacitor is compared eight times against all remaining smaller
value capacitors and any errors are averaged. A correction
coefficient is then created and stored in one of the thirteen
internal linearity correction registers. An internal state ma-
chine, using patterns stored in an internal 16 x 8-bit ROM,
executes each calibration algorithm.
=
0111 (A4–A1, BW 0) when using a 16-bit wide data bus or
=
at addresses 00000 through 01111 (A4–A0, BW 1) when
using an 8-bit wide data bus. They can be accessed and pro-
grammed in random order.
Any Instruction RAM READ or WRITE can affect the se-
quencer’s operation:
Once calibrated, an internal arithmetic logic unit (ALU) uses
the offset correction coefficient and the 13 linearity correction
coefficients to reduce the conversion’s offset error and lin-
earity error, in the background, during the 12-bit + sign con-
version. The 8-bit + sign conversion and comparison modes
use only the offset coefficient. The 8-bit + sign mode per-
forms a conversion in less than half the time used by the
12-bit + sign conversion mode.
The Sequencer should be stopped by setting the RESET bit
to a “1” or by resetting the START bit in the Configuration
Register and waiting for the current instruction to finish ex-
ecution before any Instruction RAM READ or WRITE is initi-
ated.
A soft RESET should be issued by writing a “1” to the Con-
figuration Register’s RESET bit after any READ or WRITE to
the Instruction RAM.
The LM12L458’s “watchdog” mode is used to monitor a
single-ended or differential signal’s amplitude. Each
sampled signal has two limits. An interrupt can be generated
if the input signal is above or below either of the two limits.
This allows interrupts to be generated when analog voltage
inputs are “inside the window” or, alternatively, “outside the
window”. After a “watchdog” mode interrupt, the processor
can then request a conversion on the input signal and read
the signal’s magnitude.
The three sections in the Instruction RAM are selected by
the Configuration Register’s 2-bit “RAM Pointer”, bits D8 and
D9. The first 16-bit Instruction RAM section is selected with
the RAM Pointer equal to “00”. This section provides multi-
plexer channel selection, as well as resolution, acquisition
time, etc. The second 16-bit section holds “watchdog” limit
#1, its sign, and an indicator that shows that an interrupt can
be generated if the input signal is greater or less than the
programmed limit. The third 16-bit section holds “watchdog”
The analog input multiplexer can be configured for any com-
bination of single-ended or fully differential operation. Each
input is referenced to ground when a multiplexer channel op-
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18
Bit 8 is the SYNC bit. Setting Bit 8 to “1” causes the Se-
quencer to suspend operation at the end of the internal S/H’s
acquisition cycle and to wait until a rising edge appears at
the SYNC pin. When a rising edge appears, the S/H ac-
quires the input signal magnitude and the ADC performs a
conversion on the clock’s next rising edge. When the SYNC
pin is used as an input, the Configuration register’s “I/O Se-
lect” bit (Bit 7) must be set to a “0”. With SYNC configured as
an input, it is possible to synchronize the start of a conver-
sion to an external event. This is useful in applications such
as digital signal processing (DSP) where the exact timing of
conversions is important.
2.0 Internal User-Programmable
Registers (Continued)
limit #2, its sign, and an indicator that shows that an interrupt
can be generated if the input signal is greater or less than the
programmed limit.
Instruction RAM “00”
Bit 0 is the LOOP bit. It indicates the last instruction to be ex-
ecuted in any instruction sequence when it is set to a “1”.
The next instruction to be executed will be instruction 0.
Bit 1 is the PAUSE bit. This controls the Sequencer’s opera-
tion. When the PAUSE bit is set (“1”), the Sequencer will stop
after reading the current instruction, but before executing it
and the start bit, in the Configuration register, is automati-
cally reset to a “0”. Setting the PAUSE also causes an inter-
rupt to be issued. The Sequencer is restarted by placing a
“1” in the Configuration register’s Bit 0 (Start bit).
When the LM12L458 is used in the “watchdog” mode with
external synchronization, two rising edges on the SYNC in-
put are required to initiate two comparisons. The first rising
edge initiates the comparison of the selected analog input
signal with Limit #1 (found in Instruction RAM “01”) and the
second rising edge initiates the comparison of the same ana-
log input signal with Limit #2 (found in Instruction RAM “10”).
After the Instruction RAM has been programmed and the
RESET bit is set to “1”, the Sequencer retrieves Instruction
000, decodes it, and waits for a “1” to be placed in the Con-
figuration’s START bit. The START bit value of “0” “over-
rides” the action of Instruction 000’s PAUSE bit when the Se-
quencer is started. Once started, the Sequencer executes
Instruction 000 and retrieves, decodes, and executes each
of the remaining instructions. No PAUSE Interrupt (INT 5) is
generated the first time the Sequencer executes Instruction
000 having a PAUSE bit set to “1”. When the Sequencer en-
counters a LOOP bit or completes all eight instructions, In-
struction 000 is retrieved and decoded. A set PAUSE bit in
Instruction 000 now halts the Sequencer before the instruc-
tion is executed.
Bit 9 is the TIMER bit. When Bit 9 is set to “1”, the Se-
quencer will halt until the internal 16-bit Timer counts down
to zero. During this time interval, no “watchdog” comparisons
or analog-to-digital conversions will be performed.
Bit 10 selects the ADC conversion resolution. Setting Bit 10
to “1” selects 8-bit + sign and when reset to “0” selects 12-bit
+ sign.
Bit 11 is the “watchdog” comparison mode enable bit. When
operating in the “watchdog” comparison mode, the selected
analog input signal is compared with the programmable val-
ues stored in Limit #1 and Limit #2 (see Instruction RAM “01”
and Instruction RAM “10”). Setting Bit 11 to “1” causes two
comparisons of the selected analog input signal with the two
stored limits. When Bit 11 is reset to “0”, an 8-bit + sign or
12-bit + sign (depending on the state of Bit 10 of Instruction
RAM “00”) conversion of the input signal can take place.
Bits 2–4 select which of the eight input channels (“000” to
“111” for IN0–IN7) will be configured as non-inverting inputs
to the LM12L458’s ADC. (See Page 23, Table 1.)
Bits 5–7 select which of the seven input channels (“001” to
“111” for IN1 to IN7) will be configured as inverting inputs to
the LM12L458’s ADC. (See Table 1.) Fully differential opera-
tion is created by selecting two multiplexer channels, one op-
erating in the non-inverting mode and the other operating in
the inverting mode. A code of “000” selects ground as the in-
verting input for single ended operation.
19
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2.0 Internal User-Programmable Registers (Continued)
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20
2.0 Internal User-Programmable Registers (Continued)
A4 A3 A2 A1 A0
Purpose
Type
D7
D6
D5
D4
D3
D2
D1
D0
0
0
to
1
0
0
0
0
0
0
0
1
0
1
0
R/W
VIN−
VIN+
Pause
Loop
1
0
1
0
Instruction RAM
=
(RAM Pointer 00)
0
Watch-
dog
to
1
R/W
R/W
R/W
R/W
Acquisition Time
8/12
Timer
Sync
1
0
1
0
0
to
1
Comparison Limit #1
1
0
1
0
Instruction RAM
=
(RAM Pointer 01)
0
> <
/
to
1
Don’t Care
Sign
1
0
1
0
0
to
1
Comparison Limit #2
1
0
1
0
Instruction RAM
=
(RAM Pointer 10)
0
> <
/
0
1
to
1
1
0
R/W
R/W
R/W
Don’t Care
Sign
Start
1
0
1
0
0
I/O
Sel
Auto
Chan
Stand-
by
Full
Cal
Auto-
Zero
Reset
Configuration
Register
Zeroec
Mask
1
1
0
0
0
0
0
1
1
0
Test
= 0
Don’t Care
DIAG
INT3
RAM Pointer
Don’t
Care
R/W
R/W
INT7
INT5
INT4
INT2
INT1
INT0
Interrupt Enable
Register
1
0
0
1
1
Number of Conversions in Conversion
FIFO to Generate INT2
Sequencer Address to
Generate INT1
1
1
0
0
1
1
0
0
0
1
R
R
INST7
“0”
INST5
INST4
INST3
INST2
INST1
Address of Sequencer
Instruction
INST0
Interrupt Status
Register
Actual Number of Conversions Results in Conversion
FIFO
being Executed
1
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
Timer
R/W
R/W
R
Timer Preset: Low Byte
Timer Preset: High Byte
Conversion Data: LSBs
Register
Conversion
FIFO
R
Address or Sign
Sign
Conversion Data: MSBs
Limit Status
Register
R
Limit #1 Status
Limit #2 Status
R
=
=
FIGURE 14. LM12L458 Memory Map for 8-Bit Wide Databus (BW “1” and Test Bit “0”)
>
Bits 12–15 are used to store the user-programmable acqui-
sition time. The Sequencer keeps the internal S/H in the ac-
quisition mode for a fixed number of clock cycles (nine clock
cycles, for 12-bit + sign conversions and two clock cycles for
8-bit + sign conversions or “watchdog” comparisons) plus a
variable number of clock cycles equal to twice the value
stored in Bits 12–15. Thus, the S/H’s acquisition time is (9 +
2D) clock cycles for 12-bit + sign conversions and (2 + 2D)
clock cycles for 8-bit + sign conversions or “watchdog” com-
parisons, where D is the value stored in Bits 12–15. The
minimum acquisition time compensates for the typical inter-
nal multiplexer series resistance of 2 kΩ, and any additional
delay created by Bits 12–15 compensates for source resis-
tances greater than 80Ω. (For this acquisition time discus-
sion, numbers in ( ) are shown for the LM12L458 operating
at 6 MHz. The necessary acquisition time is determined by
the source impedance at the multiplexer input. If the source
value stored in bits 12–15 (D) can be 0000. If RS 80Ω, the
following equations determine the value that should be
stored in bits 12–15.
=
D
0.45 x RS x fCLK
for 12-bits + sign
=
D
0.36 x RS x fCLK
for 8-bits + sign and “watchdog”
RS is in kΩ and fCLK is in MHz. Round the result to the next
higher integer value. If D is greater than 15, it is advisable to
lower the source impedance by using an analog buffer be-
tween the signal source and the LM12L458’s multiplexer in-
puts.
Instruction RAM “01”
The second Instruction RAM section is selected by placing a
“01” in Bits 8 and 9 of the Configuration register.
<
resistance (RS) 80Ω and the clock frequency is 6 MHz, the
21
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efficient). If the Sequencer is running when Bit 2 is set to “1”,
an auto-zero starts immediately after the conclusion of the
currently running instruction. Bit 2 is reset automatically to a
“0” and an interrupt flag (Bit 3, in the Interrupt Status register)
is set at the end of the auto-zero (76 clock cycles). After
completion of an auto-zero calibration, the Sequencer
fetches the next instruction as pointed to by the Instruction
RAM’s pointer and resumes execution. If the Sequencer is
stopped, an auto-zero is performed immediately at the time
requested.
2.0 Internal User-Programmable
Registers (Continued)
Bits 0–7 hold “watchdog” limit #1. When Bit 11 of Instruction
RAM “00” is set to a “1”, the LM12L458 performs a “watch-
dog” comparison of the sampled analog input signal with the
limit #1 value first, followed by a comparison of the same
sampled analog input signal with the value found in limit #2
(Instruction RAM “10”).
Bit 8 holds limit #1’s sign.
Writing a “1” to Bit 3 initiates a complete calibration process
that includes a “long” auto-zero offset voltage correction (this
calibration averages eight samples of the comparator offset
voltage when creating a correction coefficient) followed by
an ADC linearity calibration. This complete calibration is
started after the currently running instruction is completed if
the Sequencer is running when Bit 3 is set to “1”. Bit 3 is re-
set automatically to a “0” and an interrupt flag (Bit 4, in the In-
terrupt Status register) will be generated at the end of the
calibration procedure (4944 clock cycles). After completion
of a full auto-zero and linearity calibration, the Sequencer
fetches the next instruction as pointed to by the Instruction
RAM’s pointer and resumes execution. If the Sequencer is
stopped, a full calibration is performed immediately at the
time requested.
Bit 9’s state determines the limit condition that generates a
“watchdog” interrupt. A “1” causes a voltage greater than
limit #1 to generate an interrupt, while a “0” causes a voltage
less than limit #1 to generate an interrupt.
Bits 10–15 are not used.
Instruction RAM “10”
The third Instruction RAM section is selected by placing a
“10” in Bits 8 and 9 of the Configuration register.
Bits 0–7 hold “watchdog” limit #2. When Bit 11 of Instruction
RAM “00” is set to a “1”, the LM12L458 performs a “watch-
dog” comparison of the sampled analog input signal with the
limit #1 value first (Instruction RAM “01”), followed by a com-
parison of the same sampled analog input signal with the
value found in limit #2.
Bit 4 is the Standby bit. Writing a “1” to Bit 4 immediately
places the LM12L458 in Standby mode. Normal operation
returns when Bit 4 is reset to a “0”. The Standby command
(“1”) disconnects the external clock from the internal circuitry,
decreases the LM12L458’s internal analog circuitry power
supply current, and preserves all internal RAM contents. Af-
ter writing a “0” to the Standby bit, the LM12L458 returns to
an operating state identical to that caused by exercising the
RESET bit. A Standby completion interrupt is issued after a
power-up completion delay that allows the analog circuitry to
settle. The Sequencer should be restarted only after the
Standby completion is issued. The Instruction RAM can still
be accessed through read and write operations while the
LM12L458 are in Standby Mode.
Bit 8 holds limit #2’s sign.
Bit 9’s state determines the limit condition that generates a
“watchdog” interrupt. A “1” causes a voltage greater than
limit #2 to generate an interrupt, while a “0” causes a voltage
less than limit #2 to generate an interrupt.
Bits 10–15 are not used.
2.2 CONFIGURATION REGISTER
=
The Configuration register, 1000 (A4–A1, BW 0) or 1000x
=
(A4–A0, BW 1) is a 16-bit control register with read/write
capability. It acts as the LM12L458’s “control panel” holding
global information as well as start/stop, reset,
self-calibration, and stand-by commands.
Bit 5 is the Channel Address Mask. If Bit 5 is set to a “1”, Bits
13–15 in the conversion FIFO will be equal to the sign bit (Bit
12) of the conversion data. Resetting Bit 5 to a “0” causes
conversion data Bits 13 through 15 to hold the instruction
pointer value of the instruction to which the conversion data
belongs.
Bit 0 is the START/STOP bit. Reading Bit 0 returns an indi-
cation of the Sequencer’s status. A “0” indicates that the Se-
quencer is stopped and waiting to execute the next instruc-
tion. A “1” shows that the Sequencer is running. Writing a “0”
halts the Sequencer when the current instruction has fin-
ished execution. The next instruction to be executed is
pointed to by the instruction pointer found in the status reg-
ister. A “1” restarts the Sequencer with the instruction cur-
rently pointed to by the instruction pointer. (See Bits 8–10 in
the Interrupt Status register.)
Bit 6 is used to select a “short” auto-zero correction for every
conversion. The Sequencer automatically inserts an
auto-zero before every conversion or “watchdog” compari-
son if Bit 6 is set to “1”. No automatic correction will be per-
formed if Bit 6 is reset to “0”.
Bit 1 is the LM12L458’s system RESET bit. Writing a “1” to
Bit 1 stops the Sequencer (resetting the Configuration regis-
ter’s START/STOP bit), resets the Instruction pointer to “000”
(found in the Interrupt Status register), clears the Conversion
FIFO, and resets all interrupt flags. The RESET bit will return
to “0” after two clock cycles unless it is forced high by writing
a “1” into the Configuration register’s Standby bit. A reset sig-
nal is internally generated when power is first applied to the
part. No operation should be started until the RESET bit is
“0”.
The LM12L458’s offset voltage, after calibration, has a typi-
cal drift of 0.1 LSB over a temperature range of −40˚C to
+85˚C. This small drift is less than the variability of the
change in offset that can occur when using the auto-zero
correction with each conversion. This variability is the result
of using only one sample of the offset voltage to create a cor-
rection value. This variability decreases when using the full
calibration mode because eight samples of the offset voltage
are taken, averaged, and used to create a correction value.
Bit 7 is used to program the SYNC pin (29) to operate as ei-
ther an input or an output. The SYNC pin becomes an output
when Bit 7 is a “1” and an input when Bit 7 is a “0”. With
SYNC programmed as an input, the rising edge of any logic
signal applied to pin 29 will start a conversion or “watchdog”
comparison. Programmed as an output, the logic level at pin
Writing a “1” to Bit 2 initiates an auto-zero offset voltage cali-
bration. Unlike the eight-sample auto-zero calibration per-
formed during the full calibration procedure, Bit 2 initiates a
“short” auto-zero by sampling the offset once and creating a
correction coefficient (full calibration averages eight samples
of the converter offset voltage when creating a correction co-
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22
Interrupt 1 is generated when the Sequencer reaches the
instruction counter value specified in the Interrupt Enable
register’s bits 8–10. This flag appears before the instruc-
tion’s execution.
2.0 Internal User-Programmable
Registers (Continued)
29 will go high at the start of a conversion or “watchdog”
comparison and remain high until either have finished. See
Instruction RAM “00”, Bit 8.
Interrupt 2 is activated when the Conversion FIFO holds a
number of conversions equal to the programmable value
stored in the Interrupt Enable register’s Bits 11–15. This
value ranges from 0001 to 1111, representing 1 to 31 conver-
sions stored in the FIFO. A user-programmed value of 0000
has no meaning. See Section 3.0 for more FIFO information.
Bits 8 and 9 form the RAM Pointer that is used to select
each of a 48-bit instruction’s three 16-bit sections during
read or write actions. A “00” selects Instruction RAM section
one, “01” selects section two, and “10” selects section three.
The completion of the short, single-sampled auto-zero cali-
bration generates Interrupt 3.
Bit 10 activates the Test mode that is used only during pro-
duction testing. Leave this bit reset to “0”.
The completion of
a
full auto-zero and linearity
Bit 11 is the Diagnostic bit and is available only in the
LM12L458. It can be activated by setting it to a “1” (the Test
bit must be reset to a “0”). The Diagnostic mode, along with
a correctly chosen instruction, allows verification that the
LM12L458’s ADC is performing correctly. When activated,
the inverting and non-inverting inputs are connected as
shown in Table 1. As an example, an instruction with “001”
for both VIN+ and VIN− while using the Diagnostic mode typi-
cally results in a full-scale output.
self-calibration generates Interrupt 4.
Interrupt 5 is generated when the Sequencer encounters an
instruction that has its Pause bit (Bit 1 in Instruction RAM
“00”) set to “1”.
Interrupt 7 is issued after a short delay (10 ms typ) while the
LM12L458 returns from Standby mode to active operation
using the Configuration register’s Bit 4. This short delay al-
lows the internal analog circuitry to settle sufficiently, ensur-
ing accurate conversion results.
2.3 INTERRUPTS
2.4 INTERRUPT ENABLE REGISTER
The LM12L458 has eight possible interrupts, all with the
same priority. Any of these interrupts will cause a hardware
interrupt to appear on the INT pin (31) if they are not masked
(by the Interrupt Enable register). The Interrupt Status regis-
ter is then read to determine which of the eight interrupts has
been issued.
The Interrupt Enable register at address location 1001
=
=
(A4–A1, BW
0) or 1001x (A4–A0, BW
1) has READ/
WRITE capability. An individual interrupt’s ability to produce
an external interrupt at pin 31 (INT) is accomplished by plac-
ing a “1” in the appropriate bit location. Any of the internal
interrupt-producing operations will set their corresponding
bits to “1” in the Interrupt Status register regardless of the
state of the associated bit in the Interrupt Enable register.
See Section 2.3 for more information about each of the eight
internal interrupts.
TABLE 1. LM12L458 Input Multiplexer
Channel Configuration Showing Normal
Mode and Diagnostic Mode
Channel
Selection
Data
Normal
Mode
Diagnostic
Mode
Bit 0 enables an external interrupt when an internal “watch-
dog” comparison limit interrupt has taken place.
Bit 1 enables an external interrupt when the Sequencer has
reached the address stored in Bits 8–10 of the Interrupt En-
able register.
VIN+
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
VIN−
GND
IN1
IN2
IN3
IN4
IN5
IN6
IN7
VIN+
VIN−
000
001
010
011
100
101
110
111
VREF+
IN2
VREF−
IN2
Bit 2 enables an external interrupt when the Conversion
FIFO’s limit, stored in Bits 11–15 of the Interrupt Enable reg-
ister, has been reached.
IN3
IN3
Bit 3 enables an external interrupt when the single-sampled
auto-zero calibration has been completed.
IN4
IN4
IN5
IN5
Bit 4 enables an external interrupt when a full auto-zero and
linearity self-calibration has been completed.
IN6
IN6
IN7
IN7
Bit 5 enables an external interrupt when an internal Pause
interrupt has been generated.
=
The Interrupt Status register, 1010 (A4–A1, BW
0) or
=
1010x (A4–A0, BW 1) must be cleared by reading it after
writing to the Interrupt Enable register. This removes any
spurious interrupts on the INT pin generated during an Inter-
rupt Enable register access.
Bit 6 is a “Don’t Care”.
Bit 7 enables an external interrupt when the LM12L458 re-
turn from power-down to active mode.
Bits 8–10 form the storage location of the
user-programmable value against which the Sequencer’s
address is compared. When the Sequencer reaches an ad-
dress that is equal to the value stored in Bits 8–10, an inter-
nal interrupt is generated and appears in Bit 1 of the Interrupt
Status register. If Bit 1 of the Interrupt Enable register is set
to “1”, an external interrupt will appear at pin 31 (INT).
Interrupt 0 is generated whenever the analog input voltage
on a selected multiplexer channel crosses a limit while the
LM12L458 are operating in the “watchdog” comparison
mode. Two sequential comparisons are made when the
LM12L458 are executing a “watchdog” instruction. Depend-
ing on the logic state of Bit 9 in the Instruction RAM’s second
and third sections, an interrupt will be generated either when
the input signal’s magnitude is greater than or less than the
programmable limits. (See the Instruction RAM, Bit 9 de-
scription.) The Limit Status register will indicate which pre-
programmed limit, #1 or #2 and which instruction was ex-
ecuting when the limit was crossed.
The value stored in bits 8–10 ranges from 000 to 111, repre-
senting 0 to 7 instructions stored in the Instruction RAM. Af-
ter the Instruction RAM has been programmed and the RE-
SET bit is set to “1”, the Sequencer is started by placing a “1”
in the Configuration register’s START bit. Setting the INT 1
trigger value to 000 does not generate an INT 1 the first
23
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ceeds the threshold stored in the instruction’s Limit #1 regis-
ter. When, for example, instruction 3 is a “watchdog” opera-
tion (Bit 11 is set high) and the input for instruction 3 meets
the magnitude and/or polarity data stored in instruction 3’s
Limit #1 register, Bit 3 in the Limit Status register will be set
to a “1”.
2.0 Internal User-Programmable
Registers (Continued)
time the Sequencer retrieves and decodes Instruction 000.
The Sequencer generates INT 1 (by placing a “1” in the In-
terrupt Status register’s Bit 1) the second time and after the
Sequencer encounters Instruction 000. It is important to re-
member that the Sequencer continues to operate even if an
Instruction interrupt (INT 1) is internally or externally gener-
ated. The only mechanisms that stop the Sequencer are an
instruction with the PAUSE bit set to “1” (halts before instruc-
tion execution), placing a “0” in the Configuration register’s
START bit, or placing a “1” in the Configuration register’s RE-
SET bit.
Bits 8–15 show the Limit #2 status. Each bit will be set high
(“1”) when the corresponding instruction’s input voltage ex-
ceeds the threshold stored in the instruction’s Limit #2 regis-
ter. When, for example, the input to instruction 6 meets the
value stored in instruction 6’s Limit #2 register, Bit 14 in the
Limit Status register will be set to a “1”.
2.7 TIMER
The LM12L458 have an on-board 16-bit timer that includes a
5-bit pre-scaler. It uses the clock signal applied to pin 23 as
its input. It can generate time intervals of 0 through 221 clock
cycles in steps of 25. This time interval can be used to delay
the execution of instructions. It can also be used to slow the
conversion rate when converting slowly changing signals.
This can reduce the amount of redundant data stored in the
FIFO and retrieved by the controller.
Bits 11–15 hold the number of conversions that must be
stored in the Conversion FIFO in order to generate an inter-
nal interrupt. This internal interrupt appears in Bit 2 of the In-
terrupt Status register. If Bit 2 of the Interrupt Enable register
is set to “1”, an external interrupt will appear at pin 31 (INT).
2.5 INTERRUPT STATUS REGISTER
This read-only register is located at address 1010 (A4–A1,
The user-defined timing value used by the Timer is stored in
the 16-bit READ/WRITE Timer register at location 1011
=
=
BW 0) or 1010x (A4–A0, BW 1). The corresponding flag
in the Interrupt Status register goes high (“1”) any time that
an interrupt condition takes place, whether an interrupt is en-
abled or disabled in the Interrupt Enable register. Any of the
active (“1”) Interrupt Status register flags are reset to “0”
whenever this register is read or a device reset is issued
(see Bit 1 in the Configuration Register).
=
=
(A4–A1, BW
0) or 1011x (A4–A0, BW
1) and is
pre-loaded automatically. Bits 0–7 hold the preset value’s
low byte and Bits 8–15 hold the high byte. The Timer is ac-
tivated by the Sequencer only if the current instruction’s Bit 9
is set (“1”). If the equivalent decimal value “N” (0 ≤ N ≤ 216
−
1) is written inside the 16-bit Timer register and the Timer is
enabled by setting an instruction’s bit 9 to a “1”, the Se-
quencer will delay the same instruction’s execution by halt-
ing at state 3 (S3), as shown in Figure 15, for 32 x N + 2
clock cycles.
Bit 0 is set to “1” when a “watchdog” comparison limit inter-
rupt has taken place.
Bit 1 is set to “1” when the Sequencer has reached the ad-
dress stored in Bits 8–10 of the Interrupt Enable register.
Bit 2 is set to “1” when the Conversion FIFO’s limit, stored in
Bits 11–15 of the Interrupt Enable register, has been
reached.
2.8 DMA
The DMA works in tandem with Interrupt 2. An active DMA
Request on pin 32 (DMARQ) requires that the FIFO interrupt
be enabled. The voltage on the DMARQ pin goes high when
the number of conversions in the FIFO equals the 5-bit value
stored in the Interrupt Enable register (bits 11–15). The volt-
age on the INT pin goes low at the same time as the voltage
on the DMARQ pin goes high. The voltage on the DMARQ
pin goes low when the FIFO is emptied. The Interrupt Status
register must be read to clear the FIFO interrupt flag in order
to enable the next DMA request.
Bit 3 is set to “1” when the single-sampled auto-zero has
been completed.
Bit 4 is set to “1” when an auto-zero and full linearity
self-calibration has been completed.
Bit 5 is set to “1” when a Pause interrupt has been gener-
ated.
Bit 6 is a “Don’t Care”.
Bit
7 is set to “1” when the LM12L458 return from
power-down to active mode.
DMA operation is optimized through the use of the 16-bit
databus connection (a logic “0” applied to the BW pin). Using
this bus width allows DMA controllers that have single ad-
dress Read/Write capability to easily unload the FIFO. Using
DMA on an 8-bit databus is more difficult. Two read opera-
tions (low byte, high byte) are needed to retrieve each con-
version result from the FIFO. Therefore, the DMA controller
must be able to repeatedly access two constant addresses
when transferring data from the LM12L458 to the host sys-
tem.
Bits 8–10 hold the Sequencer’s actual instruction address
while it is running.
Bits 11–15 hold the actual number of conversions stored in
the Conversion FIFO while the Sequencer is running.
2.6 LIMIT STATUS REGISTER
The read-only register is located at address 1101 (A4–A1,
=
=
BW 0) or 1101x (A4–A0, BW 1). This register is used in
tandem with the Limit #1 and Limit #2 registers in the Instruc-
tion RAM. Whenever a given instruction’s input voltage ex-
ceeds the limit set in its corresponding Limit register (#1 or
#2), a bit, corresponding to the instruction number, is set in
the Limit Status register. Any of the active (“1”) Limit Status
flags are reset to “0” whenever this register is read or a de-
vice reset is issued (see Bit 1 in the Configuration register).
This register holds the status of limits #1 and #2 for each of
the eight instructions.
3.0 FIFO
The result of each conversion stored in an internal read-only
FIFO (First-In, First-Out) register. It is located at 1100
=
=
(A4–A1, BW 0) or 1100x (A4–A0, BW 1). This register
has 32 16-bit wide locations. Each location holds 13-bit data.
Bits 0–3 hold the four LSB’s in the 12 bits + sign mode or
“1110” in the 8 bits + sign mode. Bits 4–11 hold the eight
MSB’s and Bit 12 holds the sign bit. Bits 13–15 can hold ei-
ther the sign bit, extending the register’s two’s complement
Bits 0–7 show the Limit #1 status. Each bit will be set high
(“1”) when the corresponding instruction’s input voltage ex-
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24
set high (“1”). It increments at the end of the currently ex-
ecuted instruction and points to the next instruction. It will
continue to increment up to 111 unless an instruction’s Loop
bit is set. If this bit is set, the counter resets to “000” and ex-
ecution begins again with the first instruction. If all instruc-
tions have their Loop bit reset to “0”, the Sequencer will ex-
ecute all eight instructions continuously. Therefore, it is
important to realize that if less than eight instructions are
programmed, the Loop bit on the last instruction must be set.
Leaving this bit reset to “0” allows the Sequencer to execute
“unprogrammed” instructions, the results of which may be
unpredictable.
3.0 FIFO (Continued)
data format to a full sixteen bits or the instruction address
that generated the conversion and the resulting data. These
modes are selected according to the logic state of the Con-
figuration register’s Bit 5.
The FIFO status should be read in the Interrupt Status regis-
ter (Bits 11–15) to determine the number of conversion re-
sults that are held in the FIFO before retrieving them. This
will help prevent conversion data corruption that may take
place if the number of reads are greater than the number of
conversion results contained in the FIFO. Trying to read the
FIFO when it is empty may corrupt new data being written
into the FIFO. Writing more than 32 conversion data into the
FIFO by the ADC results in loss of the first conversion data.
Therefore, to prevent data loss, it is recommended that the
LM12L458’s interrupt capability be used to inform the sys-
tem controller that the FIFO is full.
The Sequencer’s Instruction Pointer value is readable at any
time and is found in the Status register at Bits 8–10. The Se-
quencer can go through eight states during instruction ex-
ecution:
State 0: The current instruction’s first 16 bits are read from
the Instruction RAM “00”. This state is one clock cycle long.
=
The lower portion (A0 0) of the data word (Bits 0–7) should
State 1: Checks the state of the Calibration and Start bits.
This is the “rest” state whenever the Sequencer is stopped
using the reset, a Pause command, or the Start bit is reset
low (“0”). When the Start bit is set to a “1”, this state is one
clock cycle long.
=
be read first followed by a read of the upper portion (A0 1)
when using the 8-bit bus width (BW 1). Reading the upper
portion first causes the data to shift down, which results in
loss of the lower byte.
=
Bits 0–12 hold 12-bit + sign conversion data. Bits 0–3 will
be 1110 (LSB) when using 8-bit plus sign resolution.
State 2: Perform calibration. If bit 2 or bit 6 of the Configu-
ration register is set to a “1”, state 2 is 76 clock cycles long.
If the Configuration register’s bit 3 is set to a “1”, state 2 is
4944 clock cycles long.
Bits 13–15 hold either the instruction responsible for the as-
sociated conversion data or the sign bit. Either mode is se-
lected with Bit 5 in the Configuration register.
State 3: Run the internal 16-bit Timer. The number of
clock cycles for this state varies according to the value
stored in the Timer register. The number of clock cycles is
found by using the expression below
Using the FIFO’s full depth is achieved as follows. Set the
value of the Interrupt Enable registers’s Bits 11–15 to 1111
and the Interrupt Enable register’s Bit 2 to a “1”. This gener-
ates an external interrupt when the 31st conversion is stored
in the FIFO. This gives the host processor a chance to send
a “0” to the LM12L458’s Start bit (Configuration register) and
halt the ADC before it completes the 32nd conversion. The
Sequencer halts after the current (32) conversion is com-
pleted. The conversion data is then transferred to the FIFO
and occupies the 32nd location. FIFO overflow is avoided if
the Sequencer is halted before the start of the 32nd conver-
sion by placing a “0” in the Start bit (Configuration register).
It is important to remember that the Sequencer continues to
operate even if a FIFO interrupt (INT 2) is internally or ex-
ternally generated. The only mechanisms that stop the Se-
quencer are an instruction with the PAUSE bit set to “1”
(halts before instruction execution), placing a “0” in the Con-
figuration register’s START bit, or placing a “1” in the Con-
figuration register’s RESET bit.
32T + 2
where 0 ≤ T ≤ 216 −1.
State 7: Run the acquisition delay and read Limit #1’s
value if needed. The number of clock cycles for 12-bit + sign
mode varies according to
9 + 2D
where D is the user-programmable 4-bit value stored in bits
12–15 of Instruction RAM “00” and is limited to 0 ≤ D ≤ 15.
The number of clock cycles for 8-bit + sign or “watchdog”
mode varies according to
2 + 2D
where D is the user-programmable 4-bit value stored in bits
12–15 of Instruction RAM “00” and is limited to 0 ≤ D ≤ 15.
State 6: Perform first comparison. This state is 5 clock
cycles long.
4.0 Sequencer
State 4: Read Limit #2. This state is 1 clock cycle long.
State 5: Perform a conversion or second comparison. This
state takes 44 clock cycles when using the 12-bit + sign
mode or 21 clock cycles when using the 8-bit + sign mode.
The “watchdog” mode takes 5 clock cycles.
The Sequencer uses a 3-bit counter (Instruction Pointer, or
IP, in Figure 9) to retrieve the programmable conversion in-
structions stored in the Instruction RAM. The 3-bit counter is
reset to 000 during chip reset or if the current executed in-
struction has its Loop bit (Bit 1 in any Instruction RAM “00”)
25
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4.0 Sequencer (Continued)
DS011711-22
=
FIGURE 15. Sequencer Logic Flow Chart (IP Instruction Pointer)
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26
5.0 Analog Considerations
5.1 REFERENCE VOLTAGE
5.5 INPUT BYPASS CAPACITANCE
The difference in the voltages applied to the VREF+ and
VREF− defines the analog input voltage span (the difference
between the voltages applied between two multiplexer inputs
or the voltage applied to one of the multiplexer inputs and
analog ground), over which 4095 positive and 4096 negative
codes exist. The voltage sources driving VREF+ or VREF−
must have very low output impedance and noise.
External capacitors (0.01 µF–0.1 µF) can be connected be-
tween the analog input pins, IN0–IN7, and analog ground to
filter any noise caused by inductive pickup associated with
long input leads. It will not degrade the conversion accuracy.
5.6 NOISE
The leads to each of the analog multiplexer input pins should
be kept as short as possible. This will minimize input noise
and clock frequency coupling that can cause conversion er-
rors. Input filtering can be used to reduce the effects of the
noise sources.
The ADC can be used in either ratiometric or absolute refer-
ence applications. In ratiometric systems, the analog input
voltage is proportional to the voltage used for the ADC’s ref-
erence voltage. When this voltage is the system power sup-
ply, the VREF+ pin is connected to VA+ and VREF− is con-
nected to GND. This technique relaxes the system reference
stability requirements because the analog input voltage and
the ADC reference voltage move together. This maintains
the same output code for given input conditions.
5.7 POWER SUPPLIES
Noise spikes on the VA+ and VD+ supply lines can cause
conversion errors; the comparator will respond to the noise.
The ADC is especially sensitive to any power supply spikes
that occur during the auto-zero or linearity correction. Low in-
ductance tantalum capacitors of 10 µF or greater paralleled
with 0.1 µF monolithic ceramic capacitors are recommended
for supply bypassing. Separate bypass capacitors should be
used for the VA+ and VD+ supplies and placed as close as
possible to these pins.
For absolute accuracy, where the analog input voltage varies
between very specific voltage limits, a time and temperature
stable voltage source can be connected to the reference in-
puts. Typically, the reference voltage’s magnitude will require
an initial adjustment to null reference voltage induced
full-scale errors.
5.8 GROUNDING
5.2 INPUT RANGE
The LM12L458’s nominal high resolution performance can
be maximized through proper grounding techniques. These
include the use of separate analog and digital ground
planes. The digital ground plane is placed under all compo-
nents that handle digital signals, while the analog ground
plane is placed under all analog signal handling circuitry. The
digital and analog ground planes are connected at only one
point, the power supply ground. This greatly reduces the oc-
currence of ground loops and noise.
The LM12L458’s fully differential ADC and reference voltage
inputs generate a two’s-complement output that is found by
using the equation below.
It is recommended that stray capacitance between the ana-
log inputs (IN0–IN7, VREF+, and VREF−) be reduced by in-
creasing the clearance (+1/16th inch) between the analog
signal and reference pins and the ground plane.
Round up to the next integer value between −4096 to 4095
for 12-bit resolution and between −256 to 255 for 8-bit reso-
lution if the result of the above equation is not a whole num-
=
=
=
5.9 CLOCK SIGNAL LINE ISOLATION
ber. As an example, VREF+ 2.5V, VREF− 1V, VIN+ 1.5V
=
and VIN− GND. The 12-bit + sign output code is positive
The LM12L458’s performance is optimized by routing the
analog input/output and reference signal conductors (pins
34–44) as far as possible from the conductor that carries the
clock signal to pin 23. Ground traces parallel to the clock sig-
nal trace can be used on printed circuit boards to reduce
clock signal interference on the analog input/output pins.
=
=
full-scale, or 0,1111,1111,1111. If VREF+ 3.3V, VREF− 1V,
VIN+ 3V, and VIN− GND, the 12-bit + sign output code is
0,1100,0000,0000.
=
=
5.3 INPUT CURRENT
A charging current flows into or out of (depending on the in-
put voltage polarity) the analog input pins, IN0–IN7 at the
start of the analog input acquisition time (tACQ). This cur-
rent’s peak value will depend on the actual input voltage ap-
plied.
6.0 Application Circuits
6.1 PC EVALUATION/INTERFACE BOARD
Figure 16 is the schematic of an evaluation/interface board
designed to interface the LM12454 or LM12(H)458 with an
XT or AT® style computer. The LM12(H)454/8 is the 5V ver-
sion of the Data Acquisition System. It is functionally equiva-
lent to the LM12L458. See the LM12(H)454/8 datasheet for
further information. The board can be used to develop both
software and hardware for applications using the LM12L458.
The board hardwires the BW (Bus Width) pin to a logic high,
selecting an 8-bit wide databus. Therefore, it is designed for
an 8-bit expansion slot on the computer’s motherboard.
5.4 INPUT SOURCE RESISTANCE
<
For low impedance voltage sources ( 80Ω for 6 MHz opera-
tion) the input charging current will decay, before the end of
the S/H’s acquisition time, to a value that will not introduce
any conversion errors. For higher source impedances, the
S/H’s acquisition time can be increased. As an example, op-
erating with a 6 MHz clock frequency and maximum acquisi-
tion time, the LM12L458’s analog inputs can handle source
impedance as high as 5.56 kΩ. Refer to Section 2.1, Instruc-
tion RAM “00”, Bits 12–15 for further information.
The circuit operates on a single +5V supply derived from the
computer’s +12V supply using an LM340 regulator. This
27
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6.0 Application Circuits (Continued)
Hexidecimal
I/O Memory
Base
Address
140
SW DIP-8
greatly attenuates noise that may be present on the comput-
er’s power supply lines. However, your application may only
need an LC filter.
SW1
(SEL0)
ON
SW2
SW3
(SEL2)
ON
SW4
(SEL3)
ON
(SEL1)
OFF
OFF
ON
Figure 16 also shows the recommended supply (VA+ and
VD+) and reference input (VREF+ and VREF−) bypassing. The
digital and analog supply pins can be connected together to
the same supply voltage. However, they need separate, mul-
tiple bypass capacitors. Multiple capacitors on the supply
pins and the reference inputs ensures a low impedance by-
pass path over a wide frequency range.
160
OFF
ON
ON
ON
180
OFF
OFF
OFF
OFF
ON
ON
1A0
OFF
ON
ON
ON
1C0
OFF
OFF
ON
ON
300
OFF
ON
ON
All digital interface control signals (IOR, IOW, and AEN),
data lines (DB0–DB7), address lines (A0–A9), and IRQ (in-
terrupt request) lines (IRQ2, IRQ3, and IRQ5) connections
are made through the motherboard slot connector. All analog
signals applied to, or received by, the input multiplexer
(IN0–IN7 for the LM12(H)458 and IN0–IN3, MUXOUT+,
340
OFF
OFF
OFF
280
OFF
ON
ON
ON
2A0
OFF
ON
The board allows the use of one of three Interrupt Request
(IRQ) lines IRQ2, IRQ3, and IRQ5. The individual IRQ line
can be selected using switches 5, 6, and 7 of SW DIP-8.
When using any of these three IRQs, the user needs to en-
sure that there are no conflicts between the evaluation board
and any other boards attached to the computer’s mother-
board.
MUXOUT−, S/H IN+ and S/H IN− for the LM12454), VREF+
,
V
REF−, VREFOUT, and the SYNC signal input/ output are ap-
plied through a DB-37 connector on the rear side of the
board. Figure 16 shows that there are numerous analog
ground connections available on the DB-37 connector.
The voltage applied to VREF− and VREF+ is selected using
two jumpers, JP1 and JP2. JP1 selects between the voltage
applied to the DB-37’s pin 24 or GND and applies it to the
LM12(H)454/8’s VREF− input. JP2 selects between the
LM12(H)454/8’s internal reference output, VREFOUT, and the
voltage applied to the DB-37’s pin 22 and applies it to the
LM12(H)454/8’s VREF+ input.
Switches 1–4, along with address lines A5–A9 are used as
inputs to GAL16V8 Programmable Gate Array (U2). This de-
vice forms the interface between the computer’s control and
address lines and generates the control signals used by the
LM12(H)454/8 for CS, WR, and RD. It also generates the
signal that controls the data buffers. Several address ranges
within the computer’s I/O memory map are available. Refer
to Table 2 for the switch settings that gives the desired I/O
memory address range. Selection of an address range must
be done so that there are no conflicts between the evaluation
board and any other boards attached to the computer’s
motherboard. The GAL equations are shown in Figure 17.
The GAL functional block diagram is shown in Figure 18.
TABLE 2. LM12(H)454/8 Evaluation/Interface
Board SW DIP-8 Switch Settings
for Available I/O Memory Locations
Hexidecimal
I/O Memory
Base
SW DIP-8
Figures 19, 20, 21, 22 show the layout of each layer in the
3-layer evaluation/interface board plus the silk-screen layout
showing parts placement. Figure 20 is the top or component
side, Figure 21 is the middle or ground plane layer, Figure 22
is the circuit side, and Figure 19 is the parts layout.
SW1
(SEL0)
ON
SW2
SW3
(SEL2)
ON
SW4
(SEL3)
ON
Address
100
(SEL1)
ON
120
OFF
ON
ON
ON
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28
6.0 Application Circuits (Continued)
DS011711-24
Note: The layout utilizes a split ground plane. The analog ground plane is placed under all analog signals and U5 pins 1, 34–44. The remaining signals and
pins are placed over the digital ground. The single point ground connection is at U6, pin 2, and this is connected to the motherboard pin B1.
FIGURE 16. Schematic and Parts List for the LM12(H)454/8 Evaluation/Interface
Board for XT and AT Style Computers, Order Number LM12458EVAL
Parts List:
Y1
D1
L1
HC49U, 8 MHz crystal
1N4002
33 µH
P1
R1
R2
RN1
DB37F; parallel connector
1
10 MΩ, 5%,
⁄4W
1
2 kΩ, 5%,
⁄4W
1
10 kΩ, 6 resistor SIP, 5%,
⁄8W
JP1, JP2 HX3, 3-pin jumper
S1 SW DIP-8; 8 SPST switches
C1–3, C6, C9–11,
C19, C22
C4
0.1 µF, 50V, monolithic ceramic
68 pF, 50V, ceramic disk
15 pF, 50V, ceramic disk
100 µF, 25V, electrolytic
C5
C7, C21
C8, C12, C20 10 µF, 35V, electrolytic
C13, C16 0.01 µF, 50V, monolithic ceramic
29
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6.0 Application Circuits (Continued)
C14, C18
C15, C17
U1
1 µF, 35V, tantalum
100 µF, 50V, ceramic disk
MM74HCT244N
U2
GAL16V8-20LNC
MM74HCT245N
U3
U4
MM74HCU04N
U5
LM12H458CIV
U6
LM340AT-5.0
SK1
A1
44-pin PLCC socket
LM12H458/4 Rev. D PC Board
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30
6.0 Application Circuits (Continued)
DS011711-26
FIGURE 17. Logic Equations Used to Program the GAL16V8
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6.0 Application Circuits (Continued)
DS011711-27
FIGURE 18. GAL Functional Block Diagram
DS011711-28
FIGURE 19. Silk-Screen Layout Showing Parts Placement on the LM12(H)454/8 Evaluation/Interface Board
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32
6.0 Application Circuits (Continued)
DS011711-29
FIGURE 20. LM12(H)454/8 Evaluation/Interface Board Component-Side Layout Positive
33
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6.0 Application Circuits (Continued)
DS011711-30
FIGURE 21. LM12(H)454/8 Evaluation/Interface Board Ground-Plane Layout Negative
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34
6.0 Application Circuits (Continued)
DS011711-31
FIGURE 22. LM12(H)454/8 Evaluation/Interface Circuit-Side Layout Positive
35
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Physical Dimensions inches (millimeters) unless otherwise noted
Order Number LM12L458CIV
NS Package Number V44A
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