LM12L458 [NSC]

12-Bit Sign Data Acquisition System with Self-Calibration; 12位注册数据采集系统具有自校准
LM12L458
型号: LM12L458
厂家: National Semiconductor    National Semiconductor
描述:

12-Bit Sign Data Acquisition System with Self-Calibration
12位注册数据采集系统具有自校准

文件: 总36页 (文件大小:697K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
July 1999  
LM12L458  
12-Bit + Sign Data Acquisition System with  
Self-Calibration  
General Description  
The LM12L458 is a highly integrated 3.3V Data Acquisition  
System. It combines a fully-differential self-calibrating (cor-  
Key Specifications  
=
(fCLK 6 MHz)  
n Resolution  
12-bit + sign or 8-bit + sign  
7.3 µs  
recting linearity and zero errors) 13-bit (12-bit  
+ sign)  
n 13-bit conversion time  
n 9-bit conversion time  
n 13-bit Through-put rate  
analog-to-digital converter (ADC) and sample-and-hold  
(S/H) with extensive analog functions and digital functional-  
ity. Up to 32 consecutive conversions, using two’s comple-  
ment format, can be stored in an internal 32-word (16-bit  
wide) FIFO data buffer. An internal 8-word RAM can store  
the conversion sequence for up to eight acquisitions through  
the LM12L458’s eight-input multiplexer. The LM12L458 can  
also operate with 8-bit + sign resolution and in a supervisory  
“watchdog” mode that compares an input signal against two  
programmable limits. Programmable acquisition times and  
conversion rates are possible through the use of internal  
clock-driven timers.  
3.5 µs  
106k samples/s (min)  
n Comparison time (“watchdog” mode)  
n ILE  
1.8 µs (max)  
1 LSB (max)  
GND to VA  
±
+
n VIN range  
n Power dissipation  
n Stand-by mode  
n Single supply  
15 mW (max)  
5 µW (typ)  
3V to 5.5V  
Features  
n Three operating modes: 12-bit + sign, 8-bit + sign, and  
“watchdog”  
n Single-ended or differential inputs  
n Built-in Sample-and-Hold  
n Instruction RAM and event sequencer  
n 8-channel multiplexer  
All registers, RAM, and FIFO are directly addressable  
through the high speed microprocessor interface to either an  
8-bit or 16-bit databus. The LM12L458 includes a direct  
memory access (DMA) interface for high-speed conversion  
data transfer.  
n 32-word conversion FIFO  
Applications  
n Data Logging  
n Process Control  
n Energy Management  
n Medical Instrumentation  
n Programmable acquisition times and conversion rates  
n Self-calibration and diagnostic mode  
n 8- or 16-bit wide databus microprocessor or DSP  
interface  
n CMOS compatible I/O  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
AT® is a registered trademark of International Business Machines Corporation.  
© 1999 National Semiconductor Corporation  
DS011711  
www.national.com  
Connection Diagram  
DS011711-1  
*
Pin names in ( ) apply to the LM12L454.  
Order Number LM12L458CIV  
See NS Package Number V44A  
Functional Diagram  
LM12L458  
DS011711-3  
Ordering Information  
Guaranteed  
Clock Freq (min)  
6 MHz  
Guaranteed  
Order  
See NS  
Package Number  
V44A  
Linearity Error (max)  
Part Number  
±
1.0 LSB  
LM12L458CIV  
www.national.com  
2
Absolute Maximum Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
See AN-450 “Surface Mounting Methods and Their Effect  
on Product Reliability” for other methods of soldering  
surface mount devices.  
Operating Ratings (Notes 1, 2)  
Supply Voltage (VA+ and VD+)  
Voltage at Input and Output Pins  
except IN0–IN7 (LM12L458)  
Voltage at Analog Inputs  
IN0–IN7 (LM12L458)  
6.0V  
Temperature Range  
(Tmin TA Tmax  
LM12L458CIV  
Supply Voltage  
VA+, VD+  
)
−0.3V to V+ + 0.3V  
−40˚C TA 85˚C  
GND − 5V to V+ + 5V  
300 mV  
3.0V to 5.5V  
100 mV  
|VA+ − VD+|  
|VA+ − VD+|  
±
Input Current at Any Pin (Note 3)  
Package Input Current (Note 3)  
5 mA  
VIN+ Input Range  
VIN− Input Range  
GND VIN+ VA+  
GND VIN− VA+  
1V VREF+ VA+  
0V VREF− VREF+ − 1V  
1V VREF VA+  
±
20 mA  
=
Power Dissipation (TA 25˚C)  
VREF+ Input Voltage  
VREF− Input Voltage  
VREF+ − VREF−  
V Package (Note 4)  
Storage Temperature  
875 mW  
−65˚C to +150˚C  
Lead Temperature  
VREF Common Mode  
Range (Note 16)  
V Package, Infrared, 15 sec.  
ESD Susceptibility (Note 5)  
+300˚C  
1.5 kV  
+
+
0.1 VA VREFCM 0.6 VA  
Converter Characteristics  
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK  
=
6.0 MHz, RS 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed 1.25V common-mode volt-  
=
=
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other  
=
=
limits TA TJ 25˚C. (Notes 6, 7, 8, 9)  
Symbol  
Parameter  
Conditions  
Typical  
Limits  
Unit  
(Note 10)  
(Note 11)  
(Limit)  
ILE  
Positive and Negative Integral  
Linearity Error  
After Auto-Cal (Notes 12, 17)  
LSB (max)  
±
±
1
1/2  
±
TUE  
DNL  
Total Unadjusted Error  
Resolution with No Missing Codes  
Differential Non-Linearity  
Zero Error  
After Auto-Cal (Note 12)  
After Auto-Cal (Note 12)  
After Auto-Cal  
1
LSB  
13  
Bits (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
±
±
±
±
±
1
1
3
3
4
±
±
±
After Auto-Cal (Notes 13, 17)  
After Auto-Cal (Notes 12, 17)  
After Auto-Cal (Notes 12, 17)  
(Note 14)  
1/4  
1/2  
1/2  
Positive Full-Scale Error  
Negative Full-Scale Error  
DC Common Mode Error  
±
2
ILE  
8-Bit + Sign and “Watchdog” Mode  
Positive and Negative Integral  
Linearity Error  
(Note 12)  
±
±
1/2  
LSB (max)  
LSB (max)  
Bits (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB  
TUE  
8-Bit + Sign and “Watchdog” Mode  
Total Unadjusted Error  
After Auto-Zero  
After Auto-Zero  
±
1/2  
3/4  
9
8-Bit + Sign and “Watchdog” Mode  
Resolution with No Missing Codes  
DNL  
8-Bit + Sign and “Watchdog” Mode  
Differential Non-Linearity  
±
1
8-Bit + Sign and “Watchdog” Mode  
Zero Error  
±
±
1/2  
1/2  
8-Bit + Sign and “Watchdog” Positive  
and Negative Full-Scale Error  
8-Bit + Sign and “Watchdog” Mode DC  
Common Mode Error  
±
1/8  
Multiplexer Channel-to-Channel  
Matching  
LSB  
±
0.05  
VIN+  
Non-Inverting Input Range  
GND  
VA+  
V (min)  
V (max)  
3
www.national.com  
Converter Characteristics (Continued)  
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK  
=
6.0 MHz, RS 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed 1.25V common-mode volt-  
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other  
=
=
=
=
limits TA TJ 25˚C. (Notes 6, 7, 8, 9)  
Symbol Parameter  
Conditions  
Typical  
Limits  
(Note 11)  
GND  
Unit  
(Limit)  
V (min)  
V (max)  
V (min)  
V (max)  
V (min)  
V (max)  
LSB (max)  
LSB (max)  
LSB  
(Note 10)  
VIN−  
Inverting Input Range  
VA+  
+
VIN+ − VIN−  
Differential Input Voltage Range  
−VA  
VA+  
GND  
VA+  
Common Mode Input Voltage Range  
=
=
±
±
±
±
±
1.75  
PSS  
Power Supply  
Sensitivity  
Zero Error  
VA+ VD+ 3.3V 10%  
0.2  
0.4  
0.2  
=
=
±
2
Full-Scale Error  
Linearity Error  
VREF+ 2.5V, VREF− GND  
(Note 15)  
CREF  
CIN  
VREF+/VREF− Input Capacitance  
Selected Multiplexer Channel Input  
Capacitance  
85  
pF  
pF  
75  
Converter AC Characteristics  
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, 12-bit + sign conversion mode, fCLK 6.0  
=
MHz, RS 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed 1.25V common-mode voltage,  
=
=
and minimum acquisition time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits  
=
=
TA TJ 25˚C. (Notes 6, 7, 8, 9)  
Symbol  
Parameter  
Clock Duty Cycle  
Conditions  
Typical  
(Note 10)  
50  
Limits  
Unit  
(Limit)  
%
(Note 11)  
40  
60  
% (min)  
% (max)  
(max)  
tC  
Conversion Time  
Acquisition Time  
13-Bit Resolution,  
44 (tCLK  
)
)
44 (tCLK) + 50 ns  
21 (tCLK) + 50 ns  
9 (tCLK) + 50 ns  
2 (tCLK) + 50 ns  
Sequencer State S5 (Figure 15)  
9-Bit Resolution,  
(max)  
(max)  
(max)  
21 (tCLK  
Sequencer State S5 (Figure 15)  
Sequencer State S7 (Figure 15)  
Built-in minimum for 13-Bits  
Built-in minimum for 9-Bits and  
“Watchdog” mode  
tA  
9 (tCLK  
)
2 (tCLK  
)
tZ  
Auto-Zero Time  
Full Calibration Time  
Throughput Rate  
(Note 18)  
Sequencer State S2 (Figure 15)  
Sequencer State S2 (Figure 15)  
76 (tCLK  
)
76 (tCLK) + 50 ns  
(max)  
(max)  
kHz  
tCAL  
4944 (tCLK  
)
4944 (tCLK) + 50 ns  
107  
106  
(min)  
(max)  
tWD  
“Watchdog” Mode  
Comparison Time  
Power-Up Time  
Wake-Up Time  
Sequencer States S6, S4,  
and S5 (Figure 15)  
11 (tCLK  
)
11 (tCLK) + 50 ns  
tPU  
10  
10  
ms  
ms  
tWU  
www.national.com  
4
DC Characteristics  
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, fCLK 6.0 MHz and minimum acquisition  
=
=
=
=
time unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6,  
7, 8)  
Symbol  
Parameter  
Conditions  
Typical  
(Note 10)  
0.4  
Limits  
(Note 11)  
1.0  
Unit  
(Limit)  
=
ID+  
IA+  
IST  
VD+ Supply Current  
VA+ Supply Current  
Stand-By Supply Current  
(ID+ + IA+)  
CS “1”  
mA (max)  
mA (max)  
=
CS “1”  
Power-Down Mode Selected  
Clock Stopped  
6 MHz Clock  
2.25  
3.5  
1.5  
30  
4.5  
µA (max)  
µA (max)  
=
VA+ 3.6V  
Multiplexer ON-Channel  
Leakage Current  
=
ON-Channel 3.6V  
=
OFF-Channel 0V  
0.1  
0.1  
0.3  
0.3  
µA (max)  
µA (max)  
=
ON-Channel 0V  
=
OFF-Channel 3.6V  
=
VA+ 3.6V  
Multiplexer OFF-Channel  
Leakage Current  
=
ON-Channel 3.6V  
=
OFF-Channel 0V  
0.1  
0.3  
µA (max)  
=
ON-Channel 0V  
=
OFF-Channel 3.6V  
0.1  
850  
0.3  
µA (max)  
=
RON  
Multiplexer ON-Resistance  
VIN 3.3V  
1500  
2000  
1500  
=
VIN 1.65V  
1300  
830  
=
VIN 0V  
=
±
±
±
±
±
±
Multiplexer  
VIN 3.3V  
1.0%  
1.0%  
1.0%  
3.0%  
3.0%  
3.0%  
Channel-to-Channel  
RON matching  
=
VIN 1.65V  
=
VIN 0V  
Digital Characteristics  
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, unless otherwise specified. Boldface limits apply for TA TJ  
=
=
TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6, 7, 8)  
Symbol  
Parameter  
Conditions  
Typical  
Limits  
(Note 11)  
2.0  
Unit  
(Note 10)  
(Limit)  
V (min)  
V (max)  
= =  
VA+ VD+ 3.6V  
VIN(1)  
VIN(0)  
Logical “1” Input Voltage  
Logical “0” Input Voltage  
=
=
VA+ VD+ 3.0V  
0.7  
ALE, Pin 22  
0.6  
=
IIN(1)  
Logical “1” Input Current  
Logical “0” Input Current  
VIN 3.3V  
0.005  
−0.005  
6
1.0  
µA (max)  
µA (max)  
pF  
2.0  
=
IIN(0)  
VIN 0V  
−1.0  
−2.0  
CIN  
D0–D15 Input Capacitance  
Logical “1” Output Voltage  
= =  
VA+ VD+ 3.0V  
VOUT(1)  
=
IOUT −360 µA  
2.4  
V (min)  
V (min)  
=
IOUT −10 µA  
2.85  
= =  
VA+ VD+ 3.0V  
VOUT(0)  
Logical “0” Output Voltage  
=
IOUT 1.6 mA  
0.4  
0.1  
V (max)  
=
IOUT 10 µA  
TRI-STATE® Output Leakage Current  
−0.01  
0.01  
−3.0  
3.0  
µA (max)  
µA (max)  
=
VOUT 0V  
IOUT  
=
VOUT 3.3V  
5
www.national.com  
Digital Timing Characteristics  
=
=
=
=
=
The following specifications apply for VA+ VD+ 3.3V, tr tf 3 ns, and CL 100 pF on data I/O, INT and DMARQ lines  
=
=
=
=
unless otherwise specified. Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C. (Notes 6, 7, 8)  
Symbol  
Typical  
Limits  
Unit  
(See Figures 10,  
11, 12)  
Parameter  
Conditions  
(Note 10)  
(Note 11)  
(Limit)  
1, 3  
CS or Address Valid to ALE Low  
Set-Up Time  
ns (min)  
ns (min)  
40  
20  
2, 4  
CS or Address Valid to ALE Low  
Hold Time  
5
6
ALE Pulse Width  
45  
35  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
ns (min)  
ns (min)  
ns (min)  
RD High to Next ALE High  
ALE Low to RD Low  
7
20  
8
RD Pulse Width  
100  
100  
20  
9
RD High to Next RD or WR Low  
ALE Low to WR Low  
10  
11  
12  
13  
14  
15  
16  
WR Pulse Width  
60  
WR High to Next ALE High  
WR High to Next RD or WR Low  
Data Valid to WR High Set-Up Time  
Data Valid to WR High Hold Time  
RD Low to Data Bus Out of TRI-STATE  
75  
140  
40  
30  
30  
30  
30  
10  
70  
=
17  
18  
RD High to TRI-STATE  
RL 1 kΩ  
10  
110  
10  
RD Low to Data Valid (Access Time)  
95  
20  
21  
19  
Address Valid or CS Low to RD Low  
Address Valid or CS Low to WR Low  
Address Invalid  
20  
20  
10  
from RD or WR High  
22  
23  
INT High from RD Low  
30  
30  
10  
60  
10  
60  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
DMARQ Low from RD Low  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-  
tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-  
fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.  
Note 2: All voltages are measured with respect to GND, unless otherwise specified.  
<
>
(V + or V +)), the current at that pin should be limited to 5 mA.  
Note 3: When the input voltage (V ) at any pin exceeds the power supply rails (V  
IN  
GND or V  
IN  
IN  
A
D
The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current of 5 mA, to simultaneously exceed the power supply volt-  
ages.  
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
(maximum junction temperature), θ (package junction  
Jmax  
to ambient thermal resistance), and T (ambient temperature). The maximum allowable power dissipation at any temperature is PD  
JA  
− T )/θ or the num-  
=
(T  
A
max  
Jmax  
A
JA  
=
ber given in the Absolute Maximum Ratings, whichever is lower. For this device, T  
LM12L458 in the V package, when board mounted, is 47˚C/W.  
150˚C, and the typical thermal resistance (θ ) of the LM12L454 and  
JA  
Jmax  
Note 5: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 6: Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above V + or 5V below GND  
A
will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward biased by more than 100 mV. As an example, if V + is  
A
3.0 V , full-scale input voltage must be 3.1 V  
to ensure accurate conversions.  
DC  
DC  
www.national.com  
6
Digital Timing Characteristics (Continued)  
DS011711-4  
+
Note 7:  
V + and V + must be connected together to the same power supply voltage and bypassed with separate capacitors at each V pin to assure conversion/  
A D  
comparison accuracy.  
=
Note 8: Accuracy is guaranteed when operating at f  
6 MHz.  
CLK  
=
Note 9: With the test condition for V  
REF  
V
− V given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.  
REF−  
REF+  
=
Note 10: Typicals are at T  
25˚C and represent most likely parametric norm.  
A
Note 11: Limits are guaranteed to National’s AOQL (Average Output Quality Level).  
Note 12: Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive  
full-scale and zero. For negative integral linearity error the straight line passes through negative full-scale and zero. (See Figures 6, 7).  
Note 13: Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the code transitions  
between −1 to 0 and 0 to +1 (see Figure 8).  
Note 14: The DC common-mode error is measured with both inputs shorted together and driven from 0V to 2.5V. The measured value is referred to the resulting  
output value when the inputs are driven with a 1.25V signal.  
Note 15: Power Supply Sensitivity is measured after Auto-Zero and/or Auto-Calibration cycle has been completed with V + and V + at the specified extremes.  
A
D
Note 16:  
V
(Reference Voltage Common Mode Range) is defined as (V  
REF+  
+ V  
)/2.  
REFCM  
REF−  
Note 17: The LM12L458’s self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will result in  
±
a repeatability uncertainty of 0.10 LSB.  
Note 18: The Throughput Rate is for a single instruction repeated continuously. Sequencer states 0 (1 clock cycle), 1 (1 clock cycle), 7 (9 clock cycles) and 5 (44  
clock cycles) are used (see Figure 15). One additional clock cycle is used to read the conversion result stored in the FIFO, for a total of 56 clock cycles per con-  
version. The Throughput Rate is f  
CLK  
(MHz)/N, where N is the number of clock cycles/conversion.  
7
www.national.com  
Digital Timing Characteristics (Continued)  
DS011711-5  
=
V
V
V
− V  
IN−  
REF  
REF+  
− V  
REF−  
=
V
IN  
IN+  
GND V  
GND V  
V  
V  
+
+
IN+  
IN−  
A
A
FIGURE 1. The General Case of Output Digital Code vs the Operating Input Voltage Range  
www.national.com  
8
Digital Timing Characteristics (Continued)  
DS011711-6  
=
V
V
− V  
REF−  
2.5V  
REF+  
=
V
− V  
IN−  
IN  
IN+  
GND V  
GND V  
V  
V  
+
+
IN+  
A
A
IN−  
=
FIGURE 2. Specific Case of Output Digital Code vs the Operating Input Voltage Range for VREF 2.5V  
9
www.national.com  
Digital Timing Characteristics (Continued)  
DS011711-7  
FIGURE 3. The General Case of the VREF Operating Range  
DS011711-8  
=
FIGURE 4. The Specific Case of the VREF Operating Range for VA+ 3.3V  
www.national.com  
10  
Digital Timing Characteristics (Continued)  
DS011711-9  
FIGURE 5. Transfer Characteristic  
DS011711-10  
FIGURE 6. Simplified Error Curve vs Output Code without Auto-Calibration or Auto-Zero Cycles  
11  
www.national.com  
Digital Timing Characteristics (Continued)  
DS011711-11  
FIGURE 7. Simplified Error Curve vs Output Code after Auto-Calibration Cycle  
DS011711-12  
FIGURE 8. Offset or Zero Error Voltage  
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after  
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.  
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9)  
Linearity Error Change  
vs Clock Frequency  
Linearity Error Change  
vs Temperature  
Linearity Error Change  
vs Reference Voltage  
DS011711-34  
DS011711-35  
DS011711-36  
www.national.com  
12  
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after  
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.  
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)  
Linearity Error Change  
vs Supply Voltage  
Full-Scale Error Change  
vs Clock Frequency  
Full-Scale Error Change  
vs Temperature  
DS011711-37  
DS011711-40  
DS011711-43  
DS011711-38  
DS011711-41  
DS011711-44  
DS011711-39  
Full-Scale Error Change  
vs Reference Voltage  
Full-Scale Error  
vs Supply Voltage  
Zero Error Change  
vs Clock Frequency  
DS011711-42  
Zero Error Change  
vs Temperature  
Zero Error Change  
vs Reference Voltage  
Zero Error Change  
vs Supply Voltage  
DS011711-45  
13  
www.national.com  
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after  
=
=
=
=
=
=
auto-calibration with VA+ VD+ 3.3V, VREF+ 2.5V, VREF− 0V, TA 25˚C, and fCLK 6 MHz unless otherwise specified.  
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)  
Analog Supply Current  
vs Temperature  
Digital Supply Current  
vs Clock Frequency  
Digital Supply Current  
vs Temperature  
DS011711-46  
DS011711-47  
DS011711-48  
Test Circuits and Waveforms  
DS011711-16  
DS011711-15  
DS011711-18  
DS011711-17  
FIGURE 9. TRI-STATE Test Circuits and Waveforms  
www.national.com  
14  
=
=
=
=
=
Timing Diagrams VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15 outputs.  
DS011711-19  
FIGURE 10. Multiplexed Data Bus  
1, 3: CS or Address valid to ALE low set-up time.  
2, 4: CS or Address valid to ALE low hold time.  
5: ALE pulse width  
11: WR pulse width  
12: WR high to next ALE high  
13: WR high to next WR or RD low  
14: Data valid to WR high set-up time  
15: Data valid to WR high hold time  
16: RD low to data bus out of TRI-STATE  
17: RD high to TRI-STATE  
6: RD high to next ALE high  
7: ALE low to RD low  
8: RD pulse width  
9: RD high to next RD or WR low  
10: ALE low to WR low  
18: RD low to data valid (access time)  
15  
www.national.com  
=
=
=
=
=
Timing Diagrams VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15  
outputs. (Continued)  
DS011711-20  
=
FIGURE 11. Non-Multiplexed Data Bus (ALE 1)  
8: RD pulse width  
16: RD low to data bus out of TRI-STATE  
9: RD high to next RD or WR low  
11: WR pulse width  
17: RD high to TRI-STATE  
18: RD low to data valid (access time)  
19: Address invalid from RD or WR high (hold time)  
20: CS low or address valid to RD low  
21: CS low or address valid to WR low  
13: WR high to next WR or RD low  
14: Data valid to WR high set-up time  
15: Data valid to WR high hold time  
=
=
=
=
=
VA+ VD+ +3.3V, tR tF 3 ns, CL 100 pF for the INT, DMARQ, D0–D15 outputs.  
DS011711-21  
FIGURE 12. Interrupt and DMARQ  
22: INT high from RD low  
23: DMARQ low from RD low  
www.national.com  
16  
Pin Description  
VA+, VD+ Analog and digital supply voltage pins. The  
LM12L458’s supply voltage operating range is  
+3.0V to +5.5V. Accuracy is guaranteed only if  
VA+ and VD+ are connected to the same power  
supply. Each pin should have a parallel combi-  
nation of 10 µF (electrolytic or tantalum) and  
0.1 µF (ceramic) bypass capacitors connected  
between it and ground.  
ing clock edge either starts a conversion or  
makes a comparison to a programmable limit  
depending on which function is requested by a  
programming instruction. This pin will be an out-  
put if “I/O Select” is set high. The SYNC output  
goes high when a conversion or a comparison is  
started and low when completed. (See Section  
2.2). An internal reset after power is first applied  
to the LM12L458 automatically sets this pin as  
an input.  
D0–D15  
The internal data input/output TRI-STATE buff-  
ers are connected to these pins. These buffers  
are designed to drive capacitive loads of 100 pF  
or less. External buffers are necessary for driv-  
ing higher load capacitances. These pins allows  
the user a means of instruction input and data  
output. With a logic high applied to the BW pin,  
data lines D8–D15 are placed in a high imped-  
ance state and data lines D0–D7 are used for in-  
struction input and data output when the  
LM12L458 is connected to an 8-bit wide data  
bus. A logic low on the BW pin allows the  
LM12L458 to exchange information over a 16-bit  
wide data bus.  
BW  
INT  
Bus Width input pin. This input allows the  
LM12L458 to interface directly with either an 8-  
or 16-bit databus. A logic high sets the width to 8  
bits and places D8–D15 in a high impedance  
state. A logic low sets the width to 16 bits.  
Active low interrupt output. This output is de-  
signed to drive capacitive loads of 100 pF or  
less. External buffers are necessary for driving  
higher load capacitances. An interrupt signal is  
generated any time a non-masked interrupt con-  
dition takes place. There are eight different con-  
ditions that can cause an interrupt. Any interrupt  
is reset by reading the Interrupt Status register.  
(See Section 2.3.)  
RD  
WR  
CS  
Input for the active low READ bus control signal.  
The data input/output TRI-STATE buffers, as se-  
lected by the logic signal applied to the BW pin,  
are enabled when RD and CS are both low. This  
allows the LM12L458 to transmit information  
onto the databus.  
DMARQ  
Active high Direct Memory Access Request out-  
put. This output is designed to drive capacitive  
loads of 100 pF or less. External buffers are nec-  
essary for driving higher load capacitances. It  
goes high whenever the number of conversion  
results in the conversion FIFO equals a pro-  
grammable value stored in the Interrupt Enable  
register. It returns to a logic low when the FIFO is  
empty.  
Input for the active low WRITE bus control sig-  
nal. The data input/output TRI-STATE buffers, as  
selected by the logic signal applied to the BW  
pin, are enabled when WR and CS are both low.  
This allows the LM12L458 to receive information  
from the databus.  
GND  
Ground connection. It should be connected to a  
low resistance and inductance analog ground re-  
turn that connects directly to the system power  
supply ground.  
Input for the active low Chip Select control sig-  
nal. A logic low should be applied to this pin only  
during  
a READ or WRITE access to the  
LM12L458. The internal clocking is halted and  
conversion stops while Chip Select is low. Con-  
version resumes when the Chip Select input sig-  
nal returns high.  
IN0–IN7  
These are the eight analog inputs. A given chan-  
nel is selected through the instruction RAM. Any  
of the channels can be configured as an inde-  
pendent single-ended input. Any pair of chan-  
nels, whether adjacent or non-adjacent, can op-  
erate as a fully differential pair.  
ALE  
Address Latch Enable input. It is used in sys-  
tems containing a multiplexed databus. When  
ALE is asserted high, the LM12L458 accepts in-  
formation on the databus as a valid address. A  
high-to-low transition will latch the address data  
on A0–A4 and the logic state on the CS input.  
Any changes on A0–A4 and CS while ALE is low  
will not affect the LM12L458. See Figure 10.  
When a non-multiplexed bus is used, ALE is  
continuously asserted high. See Figure 11.  
VREF−  
This is the negative reference input. The  
LM12L458 operates with 0V VREF− VREF+  
.
This pin should be bypassed to ground with a  
parallel combination of 10 µF and 0.1 µF (ce-  
ramic) capacitors.  
VREF+  
Positive reference input. The LM12L458 operate  
with 0V VREF+ VA+. This pin should be by-  
passed to ground with a parallel combination of  
10 µF and 0.1 µF (ceramic) capacitors.  
CLK  
External clock input pin. The LM12L458 oper-  
ates with an input clock frequency in the range of  
0.05 MHz to 8 MHz.  
N.C.  
This is a no connect pin.  
A0–A4  
SYNC  
The LM12L458’s address lines. They are used  
to access all internal registers, Conversion  
FIFO, and Instruction RAM.  
Synchronization input/output. When used as an  
output, it is designed to drive capacitive loads of  
100 pF or less. External buffers are necessary  
for driving higher load capacitances. SYNC is an  
input if the Configuration register’s “I/O Select”  
bit is low. A rising edge on this pin causes the in-  
ternal S/H to hold the input signal. The next ris-  
17  
www.national.com  
Application Information  
1.0 Functional Description  
The LM12L458 is a multi-functional Data Acquisition System  
that include a fully differential 12-bit-plus-sign self-calibrating  
analog-to-digital converter (ADC) with a two’s-complement  
erates in the single-ended mode. Fully differential analog in-  
put channels are formed by pairing any two channels to-  
gether.  
The LM12L458’s internal S/H is designed to operate at its  
minimum acquisition time (1.5 µs, 12 bits) when the source  
output format, an 8-channel analog multiplexer,  
a
<
impedance, RS, is 80(fCLK 6 MHz). When 80RS  
5.56 k, the internal S/H’s acquisition time can be increased  
first-in-first-out (FIFO) register that can store 32 conversion  
results, and an Instruction RAM that can store as many as  
eight instructions to be sequentially executed. All of this cir-  
cuitry operates on only a single +3.3V power supply.  
=
to a maximum of 6.5 µs (12 bits, fCLK 6 MHz). See Section  
2.1 (Instruction RAM “00”) Bits 12–15 for more information.  
Microprocessor overhead is reduced through the use of the  
internal conversion FIFO. Thirty-two consecutive conver-  
sions can be completed and stored in the FIFO without any  
microprocessor intervention. The microprocessor can, at any  
time, interrogate the FIFO and retrieve its contents. It can  
also wait for the LM12L458 to issue an interrupt when the  
FIFO is full or after any number (32) of conversions have  
been stored.  
The LM12L458 has three modes of operation:  
12-bit + sign with correction  
8-bit + sign without correction  
8-bit + sign comparison mode (“watchdog” mode)  
The fully differential 12-bit-plus-sign ADC uses a charge re-  
distribution topology that includes calibration capabilities.  
Charge re-distribution ADCs use a capacitor ladder in place  
of a resistor ladder to form an internal DAC. The DAC is used  
by a successive approximation register to generate interme-  
diate voltages between the voltages applied to VREF− and  
Conversion sequencing, internal timer interval, multiplexer  
configuration, and many other operations are programmed  
and set in the Instruction RAM.  
V
REF+. These intermediate voltages are compared against  
A diagnostic mode is available that allows verification of the  
LM12L458’s operation. This mode internally connects the  
voltages present at the VREF+, VREF−, and GND pins to the  
internal VIN+ and VIN− S/H inputs. This mode is activated by  
setting the Diagnostic bit (Bit 11) in the Configuration register  
to a “1”. More information concerning this mode of operation  
can be found in Section 2.2.  
the sampled analog input voltage as each bit is generated.  
The number of intermediate voltages and comparisons  
equals the ADC’s resolution. The correction of each bit’s ac-  
curacy is accomplished by calibrating the capacitor ladder  
used in the ADC.  
Two different calibration modes are available; one compen-  
sates for offset voltage, or zero error, while the other corrects  
both offset error and the ADC’s linearity error.  
2.0 Internal User-Programmable  
Registers  
When correcting offset only, the offset error is measured  
once and a correction coefficient is created. During the full  
calibration, the offset error is measured eight times, aver-  
aged, and a correction coefficient is created. After comple-  
tion of either calibration mode, the offset correction coeffi-  
cient is stored in an internal offset correction register.  
2.1 INSTRUCTION RAM  
The instruction RAM holds up to eight sequentially execut-  
able instructions. Each 48-bit long instruction is divided into  
three 16-bit sections. READ and WRITE operations can be  
issued to each 16-bit section using the instruction’s address  
and the 2-bit “RAM pointer” in the Configuration register. The  
eight instructions are located at addresses 0000 through  
The LM12L458’s overall linearity correction is achieved by  
correcting the internal DAC’s capacitor mismatch. Each ca-  
pacitor is compared eight times against all remaining smaller  
value capacitors and any errors are averaged. A correction  
coefficient is then created and stored in one of the thirteen  
internal linearity correction registers. An internal state ma-  
chine, using patterns stored in an internal 16 x 8-bit ROM,  
executes each calibration algorithm.  
=
0111 (A4–A1, BW 0) when using a 16-bit wide data bus or  
=
at addresses 00000 through 01111 (A4–A0, BW 1) when  
using an 8-bit wide data bus. They can be accessed and pro-  
grammed in random order.  
Any Instruction RAM READ or WRITE can affect the se-  
quencer’s operation:  
Once calibrated, an internal arithmetic logic unit (ALU) uses  
the offset correction coefficient and the 13 linearity correction  
coefficients to reduce the conversion’s offset error and lin-  
earity error, in the background, during the 12-bit + sign con-  
version. The 8-bit + sign conversion and comparison modes  
use only the offset coefficient. The 8-bit + sign mode per-  
forms a conversion in less than half the time used by the  
12-bit + sign conversion mode.  
The Sequencer should be stopped by setting the RESET bit  
to a “1” or by resetting the START bit in the Configuration  
Register and waiting for the current instruction to finish ex-  
ecution before any Instruction RAM READ or WRITE is initi-  
ated.  
A soft RESET should be issued by writing a “1” to the Con-  
figuration Register’s RESET bit after any READ or WRITE to  
the Instruction RAM.  
The LM12L458’s “watchdog” mode is used to monitor a  
single-ended or differential signal’s amplitude. Each  
sampled signal has two limits. An interrupt can be generated  
if the input signal is above or below either of the two limits.  
This allows interrupts to be generated when analog voltage  
inputs are “inside the window” or, alternatively, “outside the  
window”. After a “watchdog” mode interrupt, the processor  
can then request a conversion on the input signal and read  
the signal’s magnitude.  
The three sections in the Instruction RAM are selected by  
the Configuration Register’s 2-bit “RAM Pointer”, bits D8 and  
D9. The first 16-bit Instruction RAM section is selected with  
the RAM Pointer equal to “00”. This section provides multi-  
plexer channel selection, as well as resolution, acquisition  
time, etc. The second 16-bit section holds “watchdog” limit  
#1, its sign, and an indicator that shows that an interrupt can  
be generated if the input signal is greater or less than the  
programmed limit. The third 16-bit section holds “watchdog”  
The analog input multiplexer can be configured for any com-  
bination of single-ended or fully differential operation. Each  
input is referenced to ground when a multiplexer channel op-  
www.national.com  
18  
Bit 8 is the SYNC bit. Setting Bit 8 to “1” causes the Se-  
quencer to suspend operation at the end of the internal S/H’s  
acquisition cycle and to wait until a rising edge appears at  
the SYNC pin. When a rising edge appears, the S/H ac-  
quires the input signal magnitude and the ADC performs a  
conversion on the clock’s next rising edge. When the SYNC  
pin is used as an input, the Configuration register’s “I/O Se-  
lect” bit (Bit 7) must be set to a “0”. With SYNC configured as  
an input, it is possible to synchronize the start of a conver-  
sion to an external event. This is useful in applications such  
as digital signal processing (DSP) where the exact timing of  
conversions is important.  
2.0 Internal User-Programmable  
Registers (Continued)  
limit #2, its sign, and an indicator that shows that an interrupt  
can be generated if the input signal is greater or less than the  
programmed limit.  
Instruction RAM “00”  
Bit 0 is the LOOP bit. It indicates the last instruction to be ex-  
ecuted in any instruction sequence when it is set to a “1”.  
The next instruction to be executed will be instruction 0.  
Bit 1 is the PAUSE bit. This controls the Sequencer’s opera-  
tion. When the PAUSE bit is set (“1”), the Sequencer will stop  
after reading the current instruction, but before executing it  
and the start bit, in the Configuration register, is automati-  
cally reset to a “0”. Setting the PAUSE also causes an inter-  
rupt to be issued. The Sequencer is restarted by placing a  
“1” in the Configuration register’s Bit 0 (Start bit).  
When the LM12L458 is used in the “watchdog” mode with  
external synchronization, two rising edges on the SYNC in-  
put are required to initiate two comparisons. The first rising  
edge initiates the comparison of the selected analog input  
signal with Limit #1 (found in Instruction RAM “01”) and the  
second rising edge initiates the comparison of the same ana-  
log input signal with Limit #2 (found in Instruction RAM “10”).  
After the Instruction RAM has been programmed and the  
RESET bit is set to “1”, the Sequencer retrieves Instruction  
000, decodes it, and waits for a “1” to be placed in the Con-  
figuration’s START bit. The START bit value of “0” “over-  
rides” the action of Instruction 000’s PAUSE bit when the Se-  
quencer is started. Once started, the Sequencer executes  
Instruction 000 and retrieves, decodes, and executes each  
of the remaining instructions. No PAUSE Interrupt (INT 5) is  
generated the first time the Sequencer executes Instruction  
000 having a PAUSE bit set to “1”. When the Sequencer en-  
counters a LOOP bit or completes all eight instructions, In-  
struction 000 is retrieved and decoded. A set PAUSE bit in  
Instruction 000 now halts the Sequencer before the instruc-  
tion is executed.  
Bit 9 is the TIMER bit. When Bit 9 is set to “1”, the Se-  
quencer will halt until the internal 16-bit Timer counts down  
to zero. During this time interval, no “watchdog” comparisons  
or analog-to-digital conversions will be performed.  
Bit 10 selects the ADC conversion resolution. Setting Bit 10  
to “1” selects 8-bit + sign and when reset to “0” selects 12-bit  
+ sign.  
Bit 11 is the “watchdog” comparison mode enable bit. When  
operating in the “watchdog” comparison mode, the selected  
analog input signal is compared with the programmable val-  
ues stored in Limit #1 and Limit #2 (see Instruction RAM “01”  
and Instruction RAM “10”). Setting Bit 11 to “1” causes two  
comparisons of the selected analog input signal with the two  
stored limits. When Bit 11 is reset to “0”, an 8-bit + sign or  
12-bit + sign (depending on the state of Bit 10 of Instruction  
RAM “00”) conversion of the input signal can take place.  
Bits 2–4 select which of the eight input channels (“000” to  
“111” for IN0–IN7) will be configured as non-inverting inputs  
to the LM12L458’s ADC. (See Page 23, Table 1.)  
Bits 5–7 select which of the seven input channels (“001” to  
“111” for IN1 to IN7) will be configured as inverting inputs to  
the LM12L458’s ADC. (See Table 1.) Fully differential opera-  
tion is created by selecting two multiplexer channels, one op-  
erating in the non-inverting mode and the other operating in  
the inverting mode. A code of “000” selects ground as the in-  
verting input for single ended operation.  
19  
www.national.com  
2.0 Internal User-Programmable Registers (Continued)  
www.national.com  
20  
2.0 Internal User-Programmable Registers (Continued)  
A4 A3 A2 A1 A0  
Purpose  
Type  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
to  
1
0
0
0
0
0
0
0
1
0
1
0
R/W  
VIN−  
VIN+  
Pause  
Loop  
1
0
1
0
Instruction RAM  
=
(RAM Pointer 00)  
0
Watch-  
dog  
to  
1
R/W  
R/W  
R/W  
R/W  
Acquisition Time  
8/12  
Timer  
Sync  
1
0
1
0
0
to  
1
Comparison Limit #1  
1
0
1
0
Instruction RAM  
=
(RAM Pointer 01)  
0
> <  
/
to  
1
Don’t Care  
Sign  
1
0
1
0
0
to  
1
Comparison Limit #2  
1
0
1
0
Instruction RAM  
=
(RAM Pointer 10)  
0
> <  
/
0
1
to  
1
1
0
R/W  
R/W  
R/W  
Don’t Care  
Sign  
Start  
1
0
1
0
0
I/O  
Sel  
Auto  
Chan  
Stand-  
by  
Full  
Cal  
Auto-  
Zero  
Reset  
Configuration  
Register  
Zeroec  
Mask  
1
1
0
0
0
0
0
1
1
0
Test  
= 0  
Don’t Care  
DIAG  
INT3  
RAM Pointer  
Don’t  
Care  
R/W  
R/W  
INT7  
INT5  
INT4  
INT2  
INT1  
INT0  
Interrupt Enable  
Register  
1
0
0
1
1
Number of Conversions in Conversion  
FIFO to Generate INT2  
Sequencer Address to  
Generate INT1  
1
1
0
0
1
1
0
0
0
1
R
R
INST7  
“0”  
INST5  
INST4  
INST3  
INST2  
INST1  
Address of Sequencer  
Instruction  
INST0  
Interrupt Status  
Register  
Actual Number of Conversions Results in Conversion  
FIFO  
being Executed  
1
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
Timer  
R/W  
R/W  
R
Timer Preset: Low Byte  
Timer Preset: High Byte  
Conversion Data: LSBs  
Register  
Conversion  
FIFO  
R
Address or Sign  
Sign  
Conversion Data: MSBs  
Limit Status  
Register  
R
Limit #1 Status  
Limit #2 Status  
R
=
=
FIGURE 14. LM12L458 Memory Map for 8-Bit Wide Databus (BW “1” and Test Bit “0”)  
>
Bits 12–15 are used to store the user-programmable acqui-  
sition time. The Sequencer keeps the internal S/H in the ac-  
quisition mode for a fixed number of clock cycles (nine clock  
cycles, for 12-bit + sign conversions and two clock cycles for  
8-bit + sign conversions or “watchdog” comparisons) plus a  
variable number of clock cycles equal to twice the value  
stored in Bits 12–15. Thus, the S/H’s acquisition time is (9 +  
2D) clock cycles for 12-bit + sign conversions and (2 + 2D)  
clock cycles for 8-bit + sign conversions or “watchdog” com-  
parisons, where D is the value stored in Bits 12–15. The  
minimum acquisition time compensates for the typical inter-  
nal multiplexer series resistance of 2 k, and any additional  
delay created by Bits 12–15 compensates for source resis-  
tances greater than 80. (For this acquisition time discus-  
sion, numbers in ( ) are shown for the LM12L458 operating  
at 6 MHz. The necessary acquisition time is determined by  
the source impedance at the multiplexer input. If the source  
value stored in bits 12–15 (D) can be 0000. If RS 80, the  
following equations determine the value that should be  
stored in bits 12–15.  
=
D
0.45 x RS x fCLK  
for 12-bits + sign  
=
D
0.36 x RS x fCLK  
for 8-bits + sign and “watchdog”  
RS is in kand fCLK is in MHz. Round the result to the next  
higher integer value. If D is greater than 15, it is advisable to  
lower the source impedance by using an analog buffer be-  
tween the signal source and the LM12L458’s multiplexer in-  
puts.  
Instruction RAM “01”  
The second Instruction RAM section is selected by placing a  
“01” in Bits 8 and 9 of the Configuration register.  
<
resistance (RS) 80and the clock frequency is 6 MHz, the  
21  
www.national.com  
efficient). If the Sequencer is running when Bit 2 is set to “1”,  
an auto-zero starts immediately after the conclusion of the  
currently running instruction. Bit 2 is reset automatically to a  
“0” and an interrupt flag (Bit 3, in the Interrupt Status register)  
is set at the end of the auto-zero (76 clock cycles). After  
completion of an auto-zero calibration, the Sequencer  
fetches the next instruction as pointed to by the Instruction  
RAM’s pointer and resumes execution. If the Sequencer is  
stopped, an auto-zero is performed immediately at the time  
requested.  
2.0 Internal User-Programmable  
Registers (Continued)  
Bits 0–7 hold “watchdog” limit #1. When Bit 11 of Instruction  
RAM “00” is set to a “1”, the LM12L458 performs a “watch-  
dog” comparison of the sampled analog input signal with the  
limit #1 value first, followed by a comparison of the same  
sampled analog input signal with the value found in limit #2  
(Instruction RAM “10”).  
Bit 8 holds limit #1’s sign.  
Writing a “1” to Bit 3 initiates a complete calibration process  
that includes a “long” auto-zero offset voltage correction (this  
calibration averages eight samples of the comparator offset  
voltage when creating a correction coefficient) followed by  
an ADC linearity calibration. This complete calibration is  
started after the currently running instruction is completed if  
the Sequencer is running when Bit 3 is set to “1”. Bit 3 is re-  
set automatically to a “0” and an interrupt flag (Bit 4, in the In-  
terrupt Status register) will be generated at the end of the  
calibration procedure (4944 clock cycles). After completion  
of a full auto-zero and linearity calibration, the Sequencer  
fetches the next instruction as pointed to by the Instruction  
RAM’s pointer and resumes execution. If the Sequencer is  
stopped, a full calibration is performed immediately at the  
time requested.  
Bit 9’s state determines the limit condition that generates a  
“watchdog” interrupt. A “1” causes a voltage greater than  
limit #1 to generate an interrupt, while a “0” causes a voltage  
less than limit #1 to generate an interrupt.  
Bits 10–15 are not used.  
Instruction RAM “10”  
The third Instruction RAM section is selected by placing a  
“10” in Bits 8 and 9 of the Configuration register.  
Bits 0–7 hold “watchdog” limit #2. When Bit 11 of Instruction  
RAM “00” is set to a “1”, the LM12L458 performs a “watch-  
dog” comparison of the sampled analog input signal with the  
limit #1 value first (Instruction RAM “01”), followed by a com-  
parison of the same sampled analog input signal with the  
value found in limit #2.  
Bit 4 is the Standby bit. Writing a “1” to Bit 4 immediately  
places the LM12L458 in Standby mode. Normal operation  
returns when Bit 4 is reset to a “0”. The Standby command  
(“1”) disconnects the external clock from the internal circuitry,  
decreases the LM12L458’s internal analog circuitry power  
supply current, and preserves all internal RAM contents. Af-  
ter writing a “0” to the Standby bit, the LM12L458 returns to  
an operating state identical to that caused by exercising the  
RESET bit. A Standby completion interrupt is issued after a  
power-up completion delay that allows the analog circuitry to  
settle. The Sequencer should be restarted only after the  
Standby completion is issued. The Instruction RAM can still  
be accessed through read and write operations while the  
LM12L458 are in Standby Mode.  
Bit 8 holds limit #2’s sign.  
Bit 9’s state determines the limit condition that generates a  
“watchdog” interrupt. A “1” causes a voltage greater than  
limit #2 to generate an interrupt, while a “0” causes a voltage  
less than limit #2 to generate an interrupt.  
Bits 10–15 are not used.  
2.2 CONFIGURATION REGISTER  
=
The Configuration register, 1000 (A4–A1, BW 0) or 1000x  
=
(A4–A0, BW 1) is a 16-bit control register with read/write  
capability. It acts as the LM12L458’s “control panel” holding  
global information as well as start/stop, reset,  
self-calibration, and stand-by commands.  
Bit 5 is the Channel Address Mask. If Bit 5 is set to a “1”, Bits  
13–15 in the conversion FIFO will be equal to the sign bit (Bit  
12) of the conversion data. Resetting Bit 5 to a “0” causes  
conversion data Bits 13 through 15 to hold the instruction  
pointer value of the instruction to which the conversion data  
belongs.  
Bit 0 is the START/STOP bit. Reading Bit 0 returns an indi-  
cation of the Sequencer’s status. A “0” indicates that the Se-  
quencer is stopped and waiting to execute the next instruc-  
tion. A “1” shows that the Sequencer is running. Writing a “0”  
halts the Sequencer when the current instruction has fin-  
ished execution. The next instruction to be executed is  
pointed to by the instruction pointer found in the status reg-  
ister. A “1” restarts the Sequencer with the instruction cur-  
rently pointed to by the instruction pointer. (See Bits 8–10 in  
the Interrupt Status register.)  
Bit 6 is used to select a “short” auto-zero correction for every  
conversion. The Sequencer automatically inserts an  
auto-zero before every conversion or “watchdog” compari-  
son if Bit 6 is set to “1”. No automatic correction will be per-  
formed if Bit 6 is reset to “0”.  
Bit 1 is the LM12L458’s system RESET bit. Writing a “1” to  
Bit 1 stops the Sequencer (resetting the Configuration regis-  
ter’s START/STOP bit), resets the Instruction pointer to “000”  
(found in the Interrupt Status register), clears the Conversion  
FIFO, and resets all interrupt flags. The RESET bit will return  
to “0” after two clock cycles unless it is forced high by writing  
a “1” into the Configuration register’s Standby bit. A reset sig-  
nal is internally generated when power is first applied to the  
part. No operation should be started until the RESET bit is  
“0”.  
The LM12L458’s offset voltage, after calibration, has a typi-  
cal drift of 0.1 LSB over a temperature range of −40˚C to  
+85˚C. This small drift is less than the variability of the  
change in offset that can occur when using the auto-zero  
correction with each conversion. This variability is the result  
of using only one sample of the offset voltage to create a cor-  
rection value. This variability decreases when using the full  
calibration mode because eight samples of the offset voltage  
are taken, averaged, and used to create a correction value.  
Bit 7 is used to program the SYNC pin (29) to operate as ei-  
ther an input or an output. The SYNC pin becomes an output  
when Bit 7 is a “1” and an input when Bit 7 is a “0”. With  
SYNC programmed as an input, the rising edge of any logic  
signal applied to pin 29 will start a conversion or “watchdog”  
comparison. Programmed as an output, the logic level at pin  
Writing a “1” to Bit 2 initiates an auto-zero offset voltage cali-  
bration. Unlike the eight-sample auto-zero calibration per-  
formed during the full calibration procedure, Bit 2 initiates a  
“short” auto-zero by sampling the offset once and creating a  
correction coefficient (full calibration averages eight samples  
of the converter offset voltage when creating a correction co-  
www.national.com  
22  
Interrupt 1 is generated when the Sequencer reaches the  
instruction counter value specified in the Interrupt Enable  
register’s bits 8–10. This flag appears before the instruc-  
tion’s execution.  
2.0 Internal User-Programmable  
Registers (Continued)  
29 will go high at the start of a conversion or “watchdog”  
comparison and remain high until either have finished. See  
Instruction RAM “00”, Bit 8.  
Interrupt 2 is activated when the Conversion FIFO holds a  
number of conversions equal to the programmable value  
stored in the Interrupt Enable register’s Bits 11–15. This  
value ranges from 0001 to 1111, representing 1 to 31 conver-  
sions stored in the FIFO. A user-programmed value of 0000  
has no meaning. See Section 3.0 for more FIFO information.  
Bits 8 and 9 form the RAM Pointer that is used to select  
each of a 48-bit instruction’s three 16-bit sections during  
read or write actions. A “00” selects Instruction RAM section  
one, “01” selects section two, and “10” selects section three.  
The completion of the short, single-sampled auto-zero cali-  
bration generates Interrupt 3.  
Bit 10 activates the Test mode that is used only during pro-  
duction testing. Leave this bit reset to “0”.  
The completion of  
a
full auto-zero and linearity  
Bit 11 is the Diagnostic bit and is available only in the  
LM12L458. It can be activated by setting it to a “1” (the Test  
bit must be reset to a “0”). The Diagnostic mode, along with  
a correctly chosen instruction, allows verification that the  
LM12L458’s ADC is performing correctly. When activated,  
the inverting and non-inverting inputs are connected as  
shown in Table 1. As an example, an instruction with “001”  
for both VIN+ and VIN− while using the Diagnostic mode typi-  
cally results in a full-scale output.  
self-calibration generates Interrupt 4.  
Interrupt 5 is generated when the Sequencer encounters an  
instruction that has its Pause bit (Bit 1 in Instruction RAM  
“00”) set to “1”.  
Interrupt 7 is issued after a short delay (10 ms typ) while the  
LM12L458 returns from Standby mode to active operation  
using the Configuration register’s Bit 4. This short delay al-  
lows the internal analog circuitry to settle sufficiently, ensur-  
ing accurate conversion results.  
2.3 INTERRUPTS  
2.4 INTERRUPT ENABLE REGISTER  
The LM12L458 has eight possible interrupts, all with the  
same priority. Any of these interrupts will cause a hardware  
interrupt to appear on the INT pin (31) if they are not masked  
(by the Interrupt Enable register). The Interrupt Status regis-  
ter is then read to determine which of the eight interrupts has  
been issued.  
The Interrupt Enable register at address location 1001  
=
=
(A4–A1, BW  
0) or 1001x (A4–A0, BW  
1) has READ/  
WRITE capability. An individual interrupt’s ability to produce  
an external interrupt at pin 31 (INT) is accomplished by plac-  
ing a “1” in the appropriate bit location. Any of the internal  
interrupt-producing operations will set their corresponding  
bits to “1” in the Interrupt Status register regardless of the  
state of the associated bit in the Interrupt Enable register.  
See Section 2.3 for more information about each of the eight  
internal interrupts.  
TABLE 1. LM12L458 Input Multiplexer  
Channel Configuration Showing Normal  
Mode and Diagnostic Mode  
Channel  
Selection  
Data  
Normal  
Mode  
Diagnostic  
Mode  
Bit 0 enables an external interrupt when an internal “watch-  
dog” comparison limit interrupt has taken place.  
Bit 1 enables an external interrupt when the Sequencer has  
reached the address stored in Bits 8–10 of the Interrupt En-  
able register.  
VIN+  
IN0  
IN1  
IN2  
IN3  
IN4  
IN5  
IN6  
IN7  
VIN−  
GND  
IN1  
IN2  
IN3  
IN4  
IN5  
IN6  
IN7  
VIN+  
VIN−  
000  
001  
010  
011  
100  
101  
110  
111  
VREF+  
IN2  
VREF−  
IN2  
Bit 2 enables an external interrupt when the Conversion  
FIFO’s limit, stored in Bits 11–15 of the Interrupt Enable reg-  
ister, has been reached.  
IN3  
IN3  
Bit 3 enables an external interrupt when the single-sampled  
auto-zero calibration has been completed.  
IN4  
IN4  
IN5  
IN5  
Bit 4 enables an external interrupt when a full auto-zero and  
linearity self-calibration has been completed.  
IN6  
IN6  
IN7  
IN7  
Bit 5 enables an external interrupt when an internal Pause  
interrupt has been generated.  
=
The Interrupt Status register, 1010 (A4–A1, BW  
0) or  
=
1010x (A4–A0, BW 1) must be cleared by reading it after  
writing to the Interrupt Enable register. This removes any  
spurious interrupts on the INT pin generated during an Inter-  
rupt Enable register access.  
Bit 6 is a “Don’t Care”.  
Bit 7 enables an external interrupt when the LM12L458 re-  
turn from power-down to active mode.  
Bits 8–10 form the storage location of the  
user-programmable value against which the Sequencer’s  
address is compared. When the Sequencer reaches an ad-  
dress that is equal to the value stored in Bits 8–10, an inter-  
nal interrupt is generated and appears in Bit 1 of the Interrupt  
Status register. If Bit 1 of the Interrupt Enable register is set  
to “1”, an external interrupt will appear at pin 31 (INT).  
Interrupt 0 is generated whenever the analog input voltage  
on a selected multiplexer channel crosses a limit while the  
LM12L458 are operating in the “watchdog” comparison  
mode. Two sequential comparisons are made when the  
LM12L458 are executing a “watchdog” instruction. Depend-  
ing on the logic state of Bit 9 in the Instruction RAM’s second  
and third sections, an interrupt will be generated either when  
the input signal’s magnitude is greater than or less than the  
programmable limits. (See the Instruction RAM, Bit 9 de-  
scription.) The Limit Status register will indicate which pre-  
programmed limit, #1 or #2 and which instruction was ex-  
ecuting when the limit was crossed.  
The value stored in bits 8–10 ranges from 000 to 111, repre-  
senting 0 to 7 instructions stored in the Instruction RAM. Af-  
ter the Instruction RAM has been programmed and the RE-  
SET bit is set to “1”, the Sequencer is started by placing a “1”  
in the Configuration register’s START bit. Setting the INT 1  
trigger value to 000 does not generate an INT 1 the first  
23  
www.national.com  
ceeds the threshold stored in the instruction’s Limit #1 regis-  
ter. When, for example, instruction 3 is a “watchdog” opera-  
tion (Bit 11 is set high) and the input for instruction 3 meets  
the magnitude and/or polarity data stored in instruction 3’s  
Limit #1 register, Bit 3 in the Limit Status register will be set  
to a “1”.  
2.0 Internal User-Programmable  
Registers (Continued)  
time the Sequencer retrieves and decodes Instruction 000.  
The Sequencer generates INT 1 (by placing a “1” in the In-  
terrupt Status register’s Bit 1) the second time and after the  
Sequencer encounters Instruction 000. It is important to re-  
member that the Sequencer continues to operate even if an  
Instruction interrupt (INT 1) is internally or externally gener-  
ated. The only mechanisms that stop the Sequencer are an  
instruction with the PAUSE bit set to “1” (halts before instruc-  
tion execution), placing a “0” in the Configuration register’s  
START bit, or placing a “1” in the Configuration register’s RE-  
SET bit.  
Bits 8–15 show the Limit #2 status. Each bit will be set high  
(“1”) when the corresponding instruction’s input voltage ex-  
ceeds the threshold stored in the instruction’s Limit #2 regis-  
ter. When, for example, the input to instruction 6 meets the  
value stored in instruction 6’s Limit #2 register, Bit 14 in the  
Limit Status register will be set to a “1”.  
2.7 TIMER  
The LM12L458 have an on-board 16-bit timer that includes a  
5-bit pre-scaler. It uses the clock signal applied to pin 23 as  
its input. It can generate time intervals of 0 through 221 clock  
cycles in steps of 25. This time interval can be used to delay  
the execution of instructions. It can also be used to slow the  
conversion rate when converting slowly changing signals.  
This can reduce the amount of redundant data stored in the  
FIFO and retrieved by the controller.  
Bits 11–15 hold the number of conversions that must be  
stored in the Conversion FIFO in order to generate an inter-  
nal interrupt. This internal interrupt appears in Bit 2 of the In-  
terrupt Status register. If Bit 2 of the Interrupt Enable register  
is set to “1”, an external interrupt will appear at pin 31 (INT).  
2.5 INTERRUPT STATUS REGISTER  
This read-only register is located at address 1010 (A4–A1,  
The user-defined timing value used by the Timer is stored in  
the 16-bit READ/WRITE Timer register at location 1011  
=
=
BW 0) or 1010x (A4–A0, BW 1). The corresponding flag  
in the Interrupt Status register goes high (“1”) any time that  
an interrupt condition takes place, whether an interrupt is en-  
abled or disabled in the Interrupt Enable register. Any of the  
active (“1”) Interrupt Status register flags are reset to “0”  
whenever this register is read or a device reset is issued  
(see Bit 1 in the Configuration Register).  
=
=
(A4–A1, BW  
0) or 1011x (A4–A0, BW  
1) and is  
pre-loaded automatically. Bits 0–7 hold the preset value’s  
low byte and Bits 8–15 hold the high byte. The Timer is ac-  
tivated by the Sequencer only if the current instruction’s Bit 9  
is set (“1”). If the equivalent decimal value “N” (0 N 216  
1) is written inside the 16-bit Timer register and the Timer is  
enabled by setting an instruction’s bit 9 to a “1”, the Se-  
quencer will delay the same instruction’s execution by halt-  
ing at state 3 (S3), as shown in Figure 15, for 32 x N + 2  
clock cycles.  
Bit 0 is set to “1” when a “watchdog” comparison limit inter-  
rupt has taken place.  
Bit 1 is set to “1” when the Sequencer has reached the ad-  
dress stored in Bits 8–10 of the Interrupt Enable register.  
Bit 2 is set to “1” when the Conversion FIFO’s limit, stored in  
Bits 11–15 of the Interrupt Enable register, has been  
reached.  
2.8 DMA  
The DMA works in tandem with Interrupt 2. An active DMA  
Request on pin 32 (DMARQ) requires that the FIFO interrupt  
be enabled. The voltage on the DMARQ pin goes high when  
the number of conversions in the FIFO equals the 5-bit value  
stored in the Interrupt Enable register (bits 11–15). The volt-  
age on the INT pin goes low at the same time as the voltage  
on the DMARQ pin goes high. The voltage on the DMARQ  
pin goes low when the FIFO is emptied. The Interrupt Status  
register must be read to clear the FIFO interrupt flag in order  
to enable the next DMA request.  
Bit 3 is set to “1” when the single-sampled auto-zero has  
been completed.  
Bit 4 is set to “1” when an auto-zero and full linearity  
self-calibration has been completed.  
Bit 5 is set to “1” when a Pause interrupt has been gener-  
ated.  
Bit 6 is a “Don’t Care”.  
Bit  
7 is set to “1” when the LM12L458 return from  
power-down to active mode.  
DMA operation is optimized through the use of the 16-bit  
databus connection (a logic “0” applied to the BW pin). Using  
this bus width allows DMA controllers that have single ad-  
dress Read/Write capability to easily unload the FIFO. Using  
DMA on an 8-bit databus is more difficult. Two read opera-  
tions (low byte, high byte) are needed to retrieve each con-  
version result from the FIFO. Therefore, the DMA controller  
must be able to repeatedly access two constant addresses  
when transferring data from the LM12L458 to the host sys-  
tem.  
Bits 8–10 hold the Sequencer’s actual instruction address  
while it is running.  
Bits 11–15 hold the actual number of conversions stored in  
the Conversion FIFO while the Sequencer is running.  
2.6 LIMIT STATUS REGISTER  
The read-only register is located at address 1101 (A4–A1,  
=
=
BW 0) or 1101x (A4–A0, BW 1). This register is used in  
tandem with the Limit #1 and Limit #2 registers in the Instruc-  
tion RAM. Whenever a given instruction’s input voltage ex-  
ceeds the limit set in its corresponding Limit register (#1 or  
#2), a bit, corresponding to the instruction number, is set in  
the Limit Status register. Any of the active (“1”) Limit Status  
flags are reset to “0” whenever this register is read or a de-  
vice reset is issued (see Bit 1 in the Configuration register).  
This register holds the status of limits #1 and #2 for each of  
the eight instructions.  
3.0 FIFO  
The result of each conversion stored in an internal read-only  
FIFO (First-In, First-Out) register. It is located at 1100  
=
=
(A4–A1, BW 0) or 1100x (A4–A0, BW 1). This register  
has 32 16-bit wide locations. Each location holds 13-bit data.  
Bits 0–3 hold the four LSB’s in the 12 bits + sign mode or  
“1110” in the 8 bits + sign mode. Bits 4–11 hold the eight  
MSB’s and Bit 12 holds the sign bit. Bits 13–15 can hold ei-  
ther the sign bit, extending the register’s two’s complement  
Bits 0–7 show the Limit #1 status. Each bit will be set high  
(“1”) when the corresponding instruction’s input voltage ex-  
www.national.com  
24  
set high (“1”). It increments at the end of the currently ex-  
ecuted instruction and points to the next instruction. It will  
continue to increment up to 111 unless an instruction’s Loop  
bit is set. If this bit is set, the counter resets to “000” and ex-  
ecution begins again with the first instruction. If all instruc-  
tions have their Loop bit reset to “0”, the Sequencer will ex-  
ecute all eight instructions continuously. Therefore, it is  
important to realize that if less than eight instructions are  
programmed, the Loop bit on the last instruction must be set.  
Leaving this bit reset to “0” allows the Sequencer to execute  
“unprogrammed” instructions, the results of which may be  
unpredictable.  
3.0 FIFO (Continued)  
data format to a full sixteen bits or the instruction address  
that generated the conversion and the resulting data. These  
modes are selected according to the logic state of the Con-  
figuration register’s Bit 5.  
The FIFO status should be read in the Interrupt Status regis-  
ter (Bits 11–15) to determine the number of conversion re-  
sults that are held in the FIFO before retrieving them. This  
will help prevent conversion data corruption that may take  
place if the number of reads are greater than the number of  
conversion results contained in the FIFO. Trying to read the  
FIFO when it is empty may corrupt new data being written  
into the FIFO. Writing more than 32 conversion data into the  
FIFO by the ADC results in loss of the first conversion data.  
Therefore, to prevent data loss, it is recommended that the  
LM12L458’s interrupt capability be used to inform the sys-  
tem controller that the FIFO is full.  
The Sequencer’s Instruction Pointer value is readable at any  
time and is found in the Status register at Bits 8–10. The Se-  
quencer can go through eight states during instruction ex-  
ecution:  
State 0: The current instruction’s first 16 bits are read from  
the Instruction RAM “00”. This state is one clock cycle long.  
=
The lower portion (A0 0) of the data word (Bits 0–7) should  
State 1: Checks the state of the Calibration and Start bits.  
This is the “rest” state whenever the Sequencer is stopped  
using the reset, a Pause command, or the Start bit is reset  
low (“0”). When the Start bit is set to a “1”, this state is one  
clock cycle long.  
=
be read first followed by a read of the upper portion (A0 1)  
when using the 8-bit bus width (BW 1). Reading the upper  
portion first causes the data to shift down, which results in  
loss of the lower byte.  
=
Bits 0–12 hold 12-bit + sign conversion data. Bits 0–3 will  
be 1110 (LSB) when using 8-bit plus sign resolution.  
State 2: Perform calibration. If bit 2 or bit 6 of the Configu-  
ration register is set to a “1”, state 2 is 76 clock cycles long.  
If the Configuration register’s bit 3 is set to a “1”, state 2 is  
4944 clock cycles long.  
Bits 13–15 hold either the instruction responsible for the as-  
sociated conversion data or the sign bit. Either mode is se-  
lected with Bit 5 in the Configuration register.  
State 3: Run the internal 16-bit Timer. The number of  
clock cycles for this state varies according to the value  
stored in the Timer register. The number of clock cycles is  
found by using the expression below  
Using the FIFO’s full depth is achieved as follows. Set the  
value of the Interrupt Enable registers’s Bits 11–15 to 1111  
and the Interrupt Enable register’s Bit 2 to a “1”. This gener-  
ates an external interrupt when the 31st conversion is stored  
in the FIFO. This gives the host processor a chance to send  
a “0” to the LM12L458’s Start bit (Configuration register) and  
halt the ADC before it completes the 32nd conversion. The  
Sequencer halts after the current (32) conversion is com-  
pleted. The conversion data is then transferred to the FIFO  
and occupies the 32nd location. FIFO overflow is avoided if  
the Sequencer is halted before the start of the 32nd conver-  
sion by placing a “0” in the Start bit (Configuration register).  
It is important to remember that the Sequencer continues to  
operate even if a FIFO interrupt (INT 2) is internally or ex-  
ternally generated. The only mechanisms that stop the Se-  
quencer are an instruction with the PAUSE bit set to “1”  
(halts before instruction execution), placing a “0” in the Con-  
figuration register’s START bit, or placing a “1” in the Con-  
figuration register’s RESET bit.  
32T + 2  
where 0 T 216 −1.  
State 7: Run the acquisition delay and read Limit #1’s  
value if needed. The number of clock cycles for 12-bit + sign  
mode varies according to  
9 + 2D  
where D is the user-programmable 4-bit value stored in bits  
12–15 of Instruction RAM “00” and is limited to 0 D 15.  
The number of clock cycles for 8-bit + sign or “watchdog”  
mode varies according to  
2 + 2D  
where D is the user-programmable 4-bit value stored in bits  
12–15 of Instruction RAM “00” and is limited to 0 D 15.  
State 6: Perform first comparison. This state is 5 clock  
cycles long.  
4.0 Sequencer  
State 4: Read Limit #2. This state is 1 clock cycle long.  
State 5: Perform a conversion or second comparison. This  
state takes 44 clock cycles when using the 12-bit + sign  
mode or 21 clock cycles when using the 8-bit + sign mode.  
The “watchdog” mode takes 5 clock cycles.  
The Sequencer uses a 3-bit counter (Instruction Pointer, or  
IP, in Figure 9) to retrieve the programmable conversion in-  
structions stored in the Instruction RAM. The 3-bit counter is  
reset to 000 during chip reset or if the current executed in-  
struction has its Loop bit (Bit 1 in any Instruction RAM “00”)  
25  
www.national.com  
4.0 Sequencer (Continued)  
DS011711-22  
=
FIGURE 15. Sequencer Logic Flow Chart (IP Instruction Pointer)  
www.national.com  
26  
5.0 Analog Considerations  
5.1 REFERENCE VOLTAGE  
5.5 INPUT BYPASS CAPACITANCE  
The difference in the voltages applied to the VREF+ and  
VREF− defines the analog input voltage span (the difference  
between the voltages applied between two multiplexer inputs  
or the voltage applied to one of the multiplexer inputs and  
analog ground), over which 4095 positive and 4096 negative  
codes exist. The voltage sources driving VREF+ or VREF−  
must have very low output impedance and noise.  
External capacitors (0.01 µF–0.1 µF) can be connected be-  
tween the analog input pins, IN0–IN7, and analog ground to  
filter any noise caused by inductive pickup associated with  
long input leads. It will not degrade the conversion accuracy.  
5.6 NOISE  
The leads to each of the analog multiplexer input pins should  
be kept as short as possible. This will minimize input noise  
and clock frequency coupling that can cause conversion er-  
rors. Input filtering can be used to reduce the effects of the  
noise sources.  
The ADC can be used in either ratiometric or absolute refer-  
ence applications. In ratiometric systems, the analog input  
voltage is proportional to the voltage used for the ADC’s ref-  
erence voltage. When this voltage is the system power sup-  
ply, the VREF+ pin is connected to VA+ and VREF− is con-  
nected to GND. This technique relaxes the system reference  
stability requirements because the analog input voltage and  
the ADC reference voltage move together. This maintains  
the same output code for given input conditions.  
5.7 POWER SUPPLIES  
Noise spikes on the VA+ and VD+ supply lines can cause  
conversion errors; the comparator will respond to the noise.  
The ADC is especially sensitive to any power supply spikes  
that occur during the auto-zero or linearity correction. Low in-  
ductance tantalum capacitors of 10 µF or greater paralleled  
with 0.1 µF monolithic ceramic capacitors are recommended  
for supply bypassing. Separate bypass capacitors should be  
used for the VA+ and VD+ supplies and placed as close as  
possible to these pins.  
For absolute accuracy, where the analog input voltage varies  
between very specific voltage limits, a time and temperature  
stable voltage source can be connected to the reference in-  
puts. Typically, the reference voltage’s magnitude will require  
an initial adjustment to null reference voltage induced  
full-scale errors.  
5.8 GROUNDING  
5.2 INPUT RANGE  
The LM12L458’s nominal high resolution performance can  
be maximized through proper grounding techniques. These  
include the use of separate analog and digital ground  
planes. The digital ground plane is placed under all compo-  
nents that handle digital signals, while the analog ground  
plane is placed under all analog signal handling circuitry. The  
digital and analog ground planes are connected at only one  
point, the power supply ground. This greatly reduces the oc-  
currence of ground loops and noise.  
The LM12L458’s fully differential ADC and reference voltage  
inputs generate a two’s-complement output that is found by  
using the equation below.  
It is recommended that stray capacitance between the ana-  
log inputs (IN0–IN7, VREF+, and VREF−) be reduced by in-  
creasing the clearance (+1/16th inch) between the analog  
signal and reference pins and the ground plane.  
Round up to the next integer value between −4096 to 4095  
for 12-bit resolution and between −256 to 255 for 8-bit reso-  
lution if the result of the above equation is not a whole num-  
=
=
=
5.9 CLOCK SIGNAL LINE ISOLATION  
ber. As an example, VREF+ 2.5V, VREF− 1V, VIN+ 1.5V  
=
and VIN− GND. The 12-bit + sign output code is positive  
The LM12L458’s performance is optimized by routing the  
analog input/output and reference signal conductors (pins  
34–44) as far as possible from the conductor that carries the  
clock signal to pin 23. Ground traces parallel to the clock sig-  
nal trace can be used on printed circuit boards to reduce  
clock signal interference on the analog input/output pins.  
=
=
full-scale, or 0,1111,1111,1111. If VREF+ 3.3V, VREF− 1V,  
VIN+ 3V, and VIN− GND, the 12-bit + sign output code is  
0,1100,0000,0000.  
=
=
5.3 INPUT CURRENT  
A charging current flows into or out of (depending on the in-  
put voltage polarity) the analog input pins, IN0–IN7 at the  
start of the analog input acquisition time (tACQ). This cur-  
rent’s peak value will depend on the actual input voltage ap-  
plied.  
6.0 Application Circuits  
6.1 PC EVALUATION/INTERFACE BOARD  
Figure 16 is the schematic of an evaluation/interface board  
designed to interface the LM12454 or LM12(H)458 with an  
XT or AT® style computer. The LM12(H)454/8 is the 5V ver-  
sion of the Data Acquisition System. It is functionally equiva-  
lent to the LM12L458. See the LM12(H)454/8 datasheet for  
further information. The board can be used to develop both  
software and hardware for applications using the LM12L458.  
The board hardwires the BW (Bus Width) pin to a logic high,  
selecting an 8-bit wide databus. Therefore, it is designed for  
an 8-bit expansion slot on the computer’s motherboard.  
5.4 INPUT SOURCE RESISTANCE  
<
For low impedance voltage sources ( 80for 6 MHz opera-  
tion) the input charging current will decay, before the end of  
the S/H’s acquisition time, to a value that will not introduce  
any conversion errors. For higher source impedances, the  
S/H’s acquisition time can be increased. As an example, op-  
erating with a 6 MHz clock frequency and maximum acquisi-  
tion time, the LM12L458’s analog inputs can handle source  
impedance as high as 5.56 k. Refer to Section 2.1, Instruc-  
tion RAM “00”, Bits 12–15 for further information.  
The circuit operates on a single +5V supply derived from the  
computer’s +12V supply using an LM340 regulator. This  
27  
www.national.com  
6.0 Application Circuits (Continued)  
Hexidecimal  
I/O Memory  
Base  
Address  
140  
SW DIP-8  
greatly attenuates noise that may be present on the comput-  
er’s power supply lines. However, your application may only  
need an LC filter.  
SW1  
(SEL0)  
ON  
SW2  
SW3  
(SEL2)  
ON  
SW4  
(SEL3)  
ON  
(SEL1)  
OFF  
OFF  
ON  
Figure 16 also shows the recommended supply (VA+ and  
VD+) and reference input (VREF+ and VREF−) bypassing. The  
digital and analog supply pins can be connected together to  
the same supply voltage. However, they need separate, mul-  
tiple bypass capacitors. Multiple capacitors on the supply  
pins and the reference inputs ensures a low impedance by-  
pass path over a wide frequency range.  
160  
OFF  
ON  
ON  
ON  
180  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
1A0  
OFF  
ON  
ON  
ON  
1C0  
OFF  
OFF  
ON  
ON  
300  
OFF  
ON  
ON  
All digital interface control signals (IOR, IOW, and AEN),  
data lines (DB0–DB7), address lines (A0–A9), and IRQ (in-  
terrupt request) lines (IRQ2, IRQ3, and IRQ5) connections  
are made through the motherboard slot connector. All analog  
signals applied to, or received by, the input multiplexer  
(IN0–IN7 for the LM12(H)458 and IN0–IN3, MUXOUT+,  
340  
OFF  
OFF  
OFF  
280  
OFF  
ON  
ON  
ON  
2A0  
OFF  
ON  
The board allows the use of one of three Interrupt Request  
(IRQ) lines IRQ2, IRQ3, and IRQ5. The individual IRQ line  
can be selected using switches 5, 6, and 7 of SW DIP-8.  
When using any of these three IRQs, the user needs to en-  
sure that there are no conflicts between the evaluation board  
and any other boards attached to the computer’s mother-  
board.  
MUXOUT−, S/H IN+ and S/H IN− for the LM12454), VREF+  
,
V
REF−, VREFOUT, and the SYNC signal input/ output are ap-  
plied through a DB-37 connector on the rear side of the  
board. Figure 16 shows that there are numerous analog  
ground connections available on the DB-37 connector.  
The voltage applied to VREF− and VREF+ is selected using  
two jumpers, JP1 and JP2. JP1 selects between the voltage  
applied to the DB-37’s pin 24 or GND and applies it to the  
LM12(H)454/8’s VREF− input. JP2 selects between the  
LM12(H)454/8’s internal reference output, VREFOUT, and the  
voltage applied to the DB-37’s pin 22 and applies it to the  
LM12(H)454/8’s VREF+ input.  
Switches 1–4, along with address lines A5–A9 are used as  
inputs to GAL16V8 Programmable Gate Array (U2). This de-  
vice forms the interface between the computer’s control and  
address lines and generates the control signals used by the  
LM12(H)454/8 for CS, WR, and RD. It also generates the  
signal that controls the data buffers. Several address ranges  
within the computer’s I/O memory map are available. Refer  
to Table 2 for the switch settings that gives the desired I/O  
memory address range. Selection of an address range must  
be done so that there are no conflicts between the evaluation  
board and any other boards attached to the computer’s  
motherboard. The GAL equations are shown in Figure 17.  
The GAL functional block diagram is shown in Figure 18.  
TABLE 2. LM12(H)454/8 Evaluation/Interface  
Board SW DIP-8 Switch Settings  
for Available I/O Memory Locations  
Hexidecimal  
I/O Memory  
Base  
SW DIP-8  
Figures 19, 20, 21, 22 show the layout of each layer in the  
3-layer evaluation/interface board plus the silk-screen layout  
showing parts placement. Figure 20 is the top or component  
side, Figure 21 is the middle or ground plane layer, Figure 22  
is the circuit side, and Figure 19 is the parts layout.  
SW1  
(SEL0)  
ON  
SW2  
SW3  
(SEL2)  
ON  
SW4  
(SEL3)  
ON  
Address  
100  
(SEL1)  
ON  
120  
OFF  
ON  
ON  
ON  
www.national.com  
28  
6.0 Application Circuits (Continued)  
DS011711-24  
Note: The layout utilizes a split ground plane. The analog ground plane is placed under all analog signals and U5 pins 1, 34–44. The remaining signals and  
pins are placed over the digital ground. The single point ground connection is at U6, pin 2, and this is connected to the motherboard pin B1.  
FIGURE 16. Schematic and Parts List for the LM12(H)454/8 Evaluation/Interface  
Board for XT and AT Style Computers, Order Number LM12458EVAL  
Parts List:  
Y1  
D1  
L1  
HC49U, 8 MHz crystal  
1N4002  
33 µH  
P1  
R1  
R2  
RN1  
DB37F; parallel connector  
1
10 M, 5%,  
4W  
1
2 k, 5%,  
4W  
1
10 k, 6 resistor SIP, 5%,  
8W  
JP1, JP2 HX3, 3-pin jumper  
S1 SW DIP-8; 8 SPST switches  
C1–3, C6, C9–11,  
C19, C22  
C4  
0.1 µF, 50V, monolithic ceramic  
68 pF, 50V, ceramic disk  
15 pF, 50V, ceramic disk  
100 µF, 25V, electrolytic  
C5  
C7, C21  
C8, C12, C20 10 µF, 35V, electrolytic  
C13, C16 0.01 µF, 50V, monolithic ceramic  
29  
www.national.com  
6.0 Application Circuits (Continued)  
C14, C18  
C15, C17  
U1  
1 µF, 35V, tantalum  
100 µF, 50V, ceramic disk  
MM74HCT244N  
U2  
GAL16V8-20LNC  
MM74HCT245N  
U3  
U4  
MM74HCU04N  
U5  
LM12H458CIV  
U6  
LM340AT-5.0  
SK1  
A1  
44-pin PLCC socket  
LM12H458/4 Rev. D PC Board  
www.national.com  
30  
6.0 Application Circuits (Continued)  
DS011711-26  
FIGURE 17. Logic Equations Used to Program the GAL16V8  
31  
www.national.com  
6.0 Application Circuits (Continued)  
DS011711-27  
FIGURE 18. GAL Functional Block Diagram  
DS011711-28  
FIGURE 19. Silk-Screen Layout Showing Parts Placement on the LM12(H)454/8 Evaluation/Interface Board  
www.national.com  
32  
6.0 Application Circuits (Continued)  
DS011711-29  
FIGURE 20. LM12(H)454/8 Evaluation/Interface Board Component-Side Layout Positive  
33  
www.national.com  
6.0 Application Circuits (Continued)  
DS011711-30  
FIGURE 21. LM12(H)454/8 Evaluation/Interface Board Ground-Plane Layout Negative  
www.national.com  
34  
6.0 Application Circuits (Continued)  
DS011711-31  
FIGURE 22. LM12(H)454/8 Evaluation/Interface Circuit-Side Layout Positive  
35  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
Order Number LM12L458CIV  
NS Package Number V44A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
National Semiconductor  
Corporation  
Americas  
Tel: 1-800-272-9959  
Fax: 1-800-737-7018  
Email: support@nsc.com  
National Semiconductor  
Europe  
National Semiconductor  
Asia Pacific Customer  
Response Group  
Tel: 65-2544466  
Fax: 65-2504466  
National Semiconductor  
Japan Ltd.  
Tel: 81-3-5639-7560  
Fax: 81-3-5639-7507  
Fax: +49 (0) 1 80-530 85 86  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 1 80-530 85 85  
English Tel: +49 (0) 1 80-532 78 32  
Français Tel: +49 (0) 1 80-532 93 58  
Italiano Tel: +49 (0) 1 80-534 16 80  
Email: sea.support@nsc.com  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

相关型号:

LM12L458CIV

12-Bit Sign Data Acquisition System with Self-Calibration
NSC

LM12L458CIVF

SPECIALTY ANALOG CIRCUIT, PQCC44, PACKAGE-44
ROCHESTER

LM12L458CIVX

SPECIALTY ANALOG CIRCUIT, PQCC44, PLASTIC, LCC-44
TI

LM12L458_06

12-Bit + Sign Data Acquisition System with Self-Calibration
NSC

LM12LK

IC OP-AMP, 7000 uV OFFSET-MAX, MBFM5, Operational Amplifier
NSC

LM12LK

Operational Amplifier, 1 Func, 7000uV Offset-Max, MBFM4, MILITARY
ROCHESTER

LM12S02

Color STN LCD Module
SHARP

LM12S40

Analog Circuit,
SHARP

LM12S402

Color STN-LCD Module
SHARP

LM12S44

Color STN-LCD Module
SHARP

LM12S47

Color STN-LCD Module
SHARP

LM12S48

Color STN-LCD Module
SHARP