LM12L458_06 [NSC]

12-Bit + Sign Data Acquisition System with Self-Calibration; 12位+符号位数据采集系统具有自校准
LM12L458_06
型号: LM12L458_06
厂家: National Semiconductor    National Semiconductor
描述:

12-Bit + Sign Data Acquisition System with Self-Calibration
12位+符号位数据采集系统具有自校准

文件: 总29页 (文件大小:885K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
February 2006  
LM12L458  
12-Bit + Sign Data Acquisition System with  
Self-Calibration  
General Description  
Key Specifications  
The LM12L458 is a highly integrated 3.3V Data Acquisition  
System. It combines a fully-differential self-calibrating (cor-  
recting linearity and zero errors) 13-bit (12-bit + sign) analog-  
to-digital converter (ADC) and sample-and-hold (S/H) with  
extensive analog functions and digital functionality. Up to 32  
consecutive conversions, using two’s complement format,  
can be stored in an internal 32-word (16-bit wide) FIFO data  
buffer. An internal 8-word RAM can store the conversion  
sequence for up to eight acquisitions through the  
LM12L458’s eight-input multiplexer. The LM12L458 can also  
operate with 8-bit + sign resolution and in a supervisory  
“watchdog” mode that compares an input signal against two  
programmable limits. Programmable acquisition times and  
conversion rates are possible through the use of internal  
clock-driven timers.  
(fCLK = 6 MHz)  
n Resolution  
n Single supply  
12-bit + sign or 8-bit + sign  
+3V to +5.5V  
n 13-bit conversion time  
n 9-bit conversion time  
n 13-bit Through-put rate  
n Comparison time (“watchdog” mode)  
n ILE  
7.3 µs  
3.5 µs  
106k samples/s (min)  
1.8 µs (max)  
1 LSB (max)  
15 mW (max)  
5 µW (typ)  
n Power Consumption  
n Stand-by mode  
Features  
n Three operating modes: 12-bit + sign, 8-bit + sign, and  
“watchdog”  
All registers, RAM, and FIFO are directly addressable  
through the high speed microprocessor interface to either an  
8-bit or 16-bit data bus. The LM12L458 includes a direct  
memory access (DMA) interface for high-speed conversion  
data transfer.  
n Single-ended or differential inputs  
n Built-in Sample-and-Hold  
n Instruction RAM and event sequencer  
n 8-channel multiplexer  
n 32-word conversion FIFO  
Additional applications information can be found in applica-  
tions notes AN-906, AN-947 and AN-949.  
n Programmable acquisition times and conversion rates  
n Self-calibration and diagnostic mode  
n 8- or 16-bit wide data bus microprocessor or DSP  
interface  
n CMOS compatible I/O  
Applications  
n Data Logging  
n Process Control  
n Energy Management  
n Medical Instrumentation  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2006 National Semiconductor Corporation  
DS011711  
www.national.com  
Connection Diagram  
01171101  
*Pin names in ( ) apply to the obsolete LM12L454, shown for reference only.  
Order Number LM12L458CIV See NS Package Number V44A  
Functional Diagram  
LM12L458  
01171103  
Ordering Information  
Guaranteed  
Clock Freq  
6 MHz  
Guaranteed  
Order  
See NS  
Linearity Error (max)  
Part Number  
LM12L458CIV  
Package Number  
V44A (PLCC)  
1.0 LSB  
www.national.com  
2
Absolute Maximum Ratings  
Operating Ratings (Notes 1, 2)  
(Notes 1, 2)  
Temperature Range  
Supply Voltage - VA+, VD+  
|VA+ − VD+|  
−40˚C TA 85˚C  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
+3.0V to +5.5V  
100 mV  
VIN+ Input Range  
VIN− Input Range  
VREF+ Input Voltage  
VREF− Input Voltage  
VREF+ − VREF−  
GND VIN+ VA+  
GND VIN− VA+  
1V VREF+ VA+  
0V VREF− VREF+ − 1V  
1V VREF VA+  
Supply Voltage (VA+ and VD+)  
Voltage at Input and Output Pins,  
except analog inputs  
6.0V  
−0.3V to (V+ + 0.3V)  
− 5V to (V+ + 5V)  
300 mV  
Voltage at Analog Inputs  
|(VA+) − (VD+)|  
VREF Common Mode  
Range (Note 16)  
TJ(MAX)  
Input Current at Any Pin (Note 3)  
Package Input Current (Note 3)  
Power Consumption (TA = 25˚C)  
(Note 4)  
5 mA  
+
+
0.1 VA VREFCM 0.6 VA  
150˚C  
20 mA  
875 mW  
Storage Temperature  
−65˚C to +150˚C  
Lead Temperature,  
Reliability Information - Transistor  
Count  
Infrared, 15 sec.  
+300˚C  
1.5 kV  
ESD Susceptibility (Note 5)  
Device  
Number  
12,232  
15,457  
4
See AN-450 “Surface Mounting Methods and Their Effect on  
Product Reliability” for other methods of soldering surface  
mount devices.  
P-Chan MOS Transistor  
N-Chan MOS Transistor  
Parasitic Vertical Bipolar Junction Transistor  
Parasitic Lateral Bipolar Junction Transistor  
TOTAL Transistors  
2
Package Thermal Resistances  
27,695  
Package  
θJA  
44-Lead PLCC  
50˚C / W  
Converter Characteristics  
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK  
=
6.0 MHz, RS = 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed 1.25V common-mode volt-  
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other  
limits TA = TJ = 25˚C. (Notes 6, 7, 8, 9)  
Typical  
(Note 10)  
1/2  
Limits  
(Note 11)  
1
Symbol  
Parameter  
Integral Linearity Error  
Conditions  
Units  
ILE  
After Auto-Cal (Notes 12, 17)  
After Auto-Cal (Note 12)  
After Auto-Cal (Note 12)  
After Auto-Cal  
LSB (max)  
LSB  
TUE  
Total Unadjusted Error  
1
Resolution with No Missing Codes  
Differential Non-Linearity  
Zero Error  
13  
1
Bits (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
DNL  
After Auto-Cal (Notes 13, 17)  
After Auto-Cal (Notes 12, 17)  
After Auto-Cal (Notes 12, 17)  
(Note 14)  
1/4  
1/2  
1/2  
2
1
Positive Full-Scale Error  
Negative Full-Scale Error  
DC Common Mode Error  
8-Bit + Sign and “Watchdog” Mode  
Integral Linearity Error  
3
3
4
ILE  
(Note 12)  
1/2  
3/4  
9
LSB (max)  
LSB (max)  
Bits (max)  
LSB (max)  
LSB (max)  
LSB (max)  
8-Bit + Sign and “Watchdog” Mode  
Total Unadjusted Error  
TUE  
After Auto-Zero  
1/2  
8-Bit + Sign and “Watchdog” Mode  
Resolution with No Missing Codes  
8-Bit + Sign and “Watchdog” Mode  
Differential Non-Linearity  
8-Bit + Sign and “Watchdog” Mode  
Zero Error  
DNL  
1
After Auto-Zero  
1/2  
1/2  
8-Bit + Sign and “Watchdog” Full-Scale  
Error  
3
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Converter Characteristics (Continued)  
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK  
=
6.0 MHz, RS = 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed 1.25V common-mode volt-  
age, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other  
limits TA = TJ = 25˚C. (Notes 6, 7, 8, 9)  
Typical  
(Note 10)  
Limits  
(Note 11)  
Symbol  
Parameter  
Conditions  
Units  
LSB  
8-Bit + Sign and “Watchdog” Mode DC  
Common Mode Error  
1/8  
Multiplexer Channel-to-Channel  
Matching  
0.05  
LSB  
GND  
VA+  
V (min)  
V (max)  
V (min)  
V (max)  
V (min)  
V (max)  
V (min)  
V (max)  
LSB (max)  
LSB (max)  
LSB  
VIN+  
Non-Inverting Input Range  
GND  
VA+  
VIN−  
Inverting Input Range  
+
−VA  
VIN+ − VIN−  
Differential Input Voltage Range  
Common Mode Input Voltage Range  
VA+  
GND  
VA+  
1.75  
2
Zero Error  
VA+ = VD+ = +3.3V 10%  
VREF+ = 2.5V, VREF− = GND  
0.2  
0.4  
0.2  
85  
Power Supply  
Sensitivity  
PSS  
Full-Scale Error  
Linearity Error  
(Note 15)  
CREF  
CIN  
VREF+/VREF− Input Capacitance  
Selected Multiplexer Channel Input  
Capacitance  
pF  
75  
pF  
Converter AC Characteristics  
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK  
=
6.0 MHz, RS = 25, source impedance for VREF+ and VREF− 25, fully-differential input with fixed +1.25V common-mode  
voltage, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other  
limits TA = TJ = 25˚C. (Notes 6, 7, 8, 9)  
Typical  
(Note 10)  
Limits  
(Note 11)  
40  
Symbol  
Parameter  
Clock Duty Cycle  
Conditions  
Units  
% (min)  
% (max)  
50  
60  
13-Bit Resolution, Sequencer  
State S5 (Figure 15)  
44 (tCLK  
)
)
44 (tCLK) + 50 ns  
21 (tCLK) + 50 ns  
9 (tCLK) + 50 ns  
2 (tCLK) + 50 ns  
(max)  
(max)  
(max)  
(max)  
tC  
Conversion Time  
Acquisition Time  
9-Bit Resolution, Sequencer State  
S5 (Figure 15)  
21 (tCLK  
Sequencer State S7 (Figure 15)  
Built-in minimum for 13-Bits  
Built-in minimum for 9-Bits and  
“Watchdog” mode  
9 (tCLK  
2 (tCLK  
)
tA  
)
tZ  
Auto-Zero Time  
Sequencer State S2 (Figure 15)  
Sequencer State S2 (Figure 15)  
76 (tCLK  
)
76 (tCLK) + 50 ns  
4944 (tCLK) + 50 ns  
106  
(max)  
(max)  
tCAL  
Full Calibration Time  
Throughput Rate (Note 18)  
“Watchdog” Mode Comparison  
Time  
4944 (tCLK  
107  
)
kHz (min)  
tWD  
Sequencer States S6, S4, and S5  
11 (tCLK  
)
11 (tCLK) + 50 ns  
(max)  
(Figure 15)  
tPU  
Power-Up Time  
10  
10  
ms  
ms  
tWU  
Wake-Up Time  
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4
DC Characteristics  
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, fCLK = 6.0 MHz and minimum acquisi-  
tion time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25˚C. (Notes  
6, 7, 8)  
Typical  
(Note 10)  
0.4  
Limits  
(Note 11)  
1.0  
Symbol  
ID+  
Parameter  
Conditions  
Units  
VD+ Supply Current  
VA+ Supply Current  
Stand-By Supply Current (ID+ +  
IA+)  
CS = “1”  
CS = “1”  
mA (max)  
mA (max)  
µA (max)  
µA (max)  
IA+  
2.25  
3.5  
Clock Stopped  
6 MHz Clock  
1.5  
4.5  
Power-Down  
IST  
Mode Selected  
30  
ON-Channel = 3.6V  
OFF-Channel = 0V  
ON-Channel = 0V  
OFF-Channel = 3.6V  
ON-Channel = 3.6V  
OFF-Channel = 0V  
ON-Channel = 0V  
OFF-Channel = 3.6V  
0.1  
0.1  
0.1  
0.3  
0.3  
0.3  
µA (max)  
µA (max)  
µA (max)  
Multiplexer ON-Channel  
Leakage Current  
VA+ = +3.6V  
VA+ = +3.6V  
Multiplexer OFF-Channel  
Leakage Current  
0.1  
0.3  
µA (max)  
VIN = +3.3V  
VIN = +1.65V  
VIN = 0V  
850  
1500  
2000  
1500  
3.0%  
3.0%  
3.0%  
RON  
Multiplexer ON-Resistance  
1300  
830  
VIN = +3.3V  
VIN = +1.65V  
VIN = 0V  
1.0%  
1.0%  
1.0%  
Multiplexer  
Channel-to-Channel  
RON matching  
Digital Characteristics  
The following specifications apply for VA+ = VD+ = +3.3V, unless otherwise specified. Boldface limits apply for TA = TJ  
TMIN to TMAX; all other limits TA = TJ = 25˚C. (Notes 6, 7, 8)  
=
Typical  
(Note 10)  
Limits  
(Note 11)  
2.0  
Symbol  
VIN(1)  
VIN(0)  
Parameter  
Logical “1” Input Voltage  
Logical “0” Input Voltage  
Conditions  
Units  
VA+ = VD+ = +3.6V  
VA+ = VD+ = +3.0V  
ALE, Pin 22  
V (min)  
V (max)  
0.7  
0.6  
1.0  
µA (max)  
µA (max)  
µA (max)  
µA (max)  
pF  
IIN(1)  
IIN(0)  
CIN  
Logical “1” Input Current  
VIN = +3.3V  
VIN = 0V  
0.005  
2.0  
−1.0  
−2.0  
Logical “0” Input Current  
−0.005  
6
D0–D15 Input Capacitance  
VA+ = VD+ = 3.0V  
IOUT = −360 µA  
IOUT = −10 µA  
VA+ = VD+ = +3.0V  
IOUT = 1.6 mA  
IOUT = 10 µA  
VOUT(1)  
Logical “1” Output Voltage  
2.4  
V (min)  
V (min)  
2.85  
VOUT(0)  
Logical “0” Output Voltage  
0.4  
0.1  
V (max)  
V (max)  
µA (max)  
µA (max)  
VOUT = 0V  
−0.01  
0.01  
−3.0  
3.0  
IOUT  
TRI-STATE® Output Leakage Current  
VOUT = +3.3V  
5
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Digital Timing Characteristics  
The following specifications apply for VA+ = VD+ = +3.3V, tr = tf = 3 ns, and CL = 100 pF on data I/O, INT and DMARQ lines  
unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25˚C. (Notes 6, 7, 8)  
Symbol (See  
Figures 10, 11, 12)  
Typical  
(Note 10)  
Limits  
(Note 11)  
Parameter  
Conditions  
Units  
CS or Address Valid to ALE Low Set-Up  
Time  
1, 3  
2, 4  
40  
20  
ns (min)  
ns (min)  
CS or Address Valid to ALE Low Hold  
Time  
5
6
ALE Pulse Width  
45  
35  
20  
100  
100  
20  
60  
75  
140  
40  
30  
10  
70  
10  
110  
10  
95  
20  
20  
10  
10  
60  
10  
60  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
ns (min)  
ns (min)  
ns (min)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
RD High to Next ALE High  
ALE Low to RD Low  
7
8
RD Pulse Width  
9
RD High to Next RD or WR Low  
ALE Low to WR Low  
10  
11  
12  
13  
14  
15  
WR Pulse Width  
WR High to Next ALE High  
WR High to Next RD or WR Low  
Data Valid to WR High Set-Up Time  
Data Valid to WR High Hold Time  
16  
17  
18  
RD Low to Data Bus Out of TRI-STATE  
RD High to TRI-STATE  
30  
30  
30  
RL = 1 kΩ  
RD Low to Data Valid (Access Time)  
20  
21  
19  
Address Valid or CS Low to RD Low  
Address Valid or CS Low to WR Low  
Address Invalid from RD or WR High  
22  
23  
INT High from RD Low  
30  
30  
DMARQ Low from RD Low  
Electrical Characteristics  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed  
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test  
conditions.  
Note 2: All voltages are measured with respect to GND, unless otherwise specified.  
<
>
(V + or V +)), the current at that pin should be limited to 5 mA.  
Note 3: When the input voltage (V ) at any pin exceeds the power supply rails (V  
GND or V  
IN  
IN  
IN  
A
D
The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current of 5 mA, to simultaneously exceed the power supply  
voltages.  
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
(maximum junction temperature), θ (package junction  
JA  
Jmax  
to ambient thermal resistance), and T (ambient temperature). The maximum allowable power dissipation at any temperature is PD  
= (T  
− T )/θ or the  
A
max  
Jmax A JA  
number given in the Absolute Maximum Ratings, whichever is lower.  
Note 5: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 6: Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above V + or 5V below GND  
A
will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward biased by more than 100 mV. As an example, if V +  
A
is 3.0 V , full-scale input voltage must be 3.1 V  
to ensure accurate conversions.  
DC  
DC  
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6
Electrical Characteristics (Continued)  
01171104  
+
Note 7: V + and V + must be connected together to the same power supply voltage and bypassed with separate capacitors at each V pin to assure  
A
D
conversion/comparison accuracy.  
Note 8: Accuracy is guaranteed when operating at f  
= 6 MHz.  
CLK  
Note 9: With the test condition for V  
= V  
− V  
given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.  
REF−  
REF  
REF+  
Note 10: Typical figures are at T = 25˚C and represent most likely parametric norm.  
A
Note 11: Limits are guaranteed to National’s AOQL (Average Output Quality Level).  
Note 12: Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive  
full-scale and zero. For negative integral linearity error the straight line passes through negative full-scale and zero. (See Figures 7, 8).  
Note 13: Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the code transitions  
between −1 to 0 and 0 to +1 (see Figure 9).  
Note 14: The DC common-mode error is measured with both inputs shorted together and driven from 0V to +2.5V. The measured value is referred to the resulting  
output value when the inputs are driven with a 1.25V signal.  
Note 15: Power Supply Sensitivity is measured after Auto-Zero and/or Auto-Calibration cycle has been completed with V + and V + at the specified extremes.  
A
D
Note 16: V  
(Reference Voltage Common Mode Range) is defined as (V  
+ V  
)/2.  
REF−  
REFCM  
REF+  
Note 17: The LM12L458’s self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will result in  
a repeatability uncertainty of 0.10 LSB.  
Note 18: The Throughput Rate is for a single instruction repeated continuously. Sequencer states 0 (1 clock cycle), 1 (1 clock cycle), 7 (9 clock cycles) and 5 (44  
clock cycles) are used (see Figure 15). One additional clock cycle is used to read the conversion result stored in the FIFO, for a total of 56 clock cycles per  
conversion. The Throughput Rate is f  
(MHz)/N, where N is the number of clock cycles/conversion.  
CLK  
Test Circuits and Waveforms  
01171115  
01171117  
01171116  
01171118  
FIGURE 1. TRI-STATE Test Circuits and Waveforms  
7
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Input and Reference Range  
01171105  
V
V
= V  
− V  
IN−  
REF  
REF+  
REF−  
= V  
− V  
IN+  
IN  
GND V  
GND V  
V +  
IN+  
IN−  
A
V +  
A
FIGURE 2. The General Case of Output Digital Code vs. the Operating Input Voltage Range  
01171106  
V
V
− V  
= 2.5V  
REF−  
REF+  
= V  
− V  
IN−  
IN  
IN+  
GND V  
GND V  
V +  
IN+  
IN−  
A
V +  
A
FIGURE 3. Specific Case of Output Digital Code vs. the Operating Input Voltage Range for VREF = 2.5V  
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8
Input and Reference Range (Continued)  
01171107  
FIGURE 4. The General Case of the VREF Operating Range  
01171108  
FIGURE 5. The Specific Case of the VREF Operating Range for VA+ = 3.3V  
9
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Transfer Characteristic and Static  
Errors  
01171109  
FIGURE 6. Transfer Characteristic  
01171110  
FIGURE 7. Simplified Error Curve vs. Output Code without Auto-Calibration or Auto-Zero Cycles  
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10  
Transfer Characteristic and Static Errors (Continued)  
01171111  
FIGURE 8. Simplified Error Curve vs. Output Code after Auto-Calibration Cycle  
01171112  
FIGURE 9. Offset or Zero Error Voltage  
11  
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Typical Performance Characteristics The following curves apply for 12-bit + sign mode after auto-  
calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA = 25˚C, and fCLK = 6 MHz unless otherwise specified.  
The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9)  
Linearity Error Change  
vs. Clock Frequency  
Linearity Error Change  
vs. Temperature  
01171134  
01171136  
01171138  
01171135  
01171137  
01171139  
Linearity Error Change  
vs. Reference Voltage  
Linearity Error Change  
vs. Supply Voltage  
Full-Scale Error Change  
vs. Clock Frequency  
Full-Scale Error Change  
vs. Temperature  
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12  
Typical Performance Characteristics The following curves apply for 12-bit + sign mode after  
auto-calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA = 25˚C, and fCLK = 6 MHz unless otherwise  
specified. The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)  
Full-Scale Error Change  
vs. Reference Voltage  
Full-Scale Error  
vs. Supply Voltage  
01171140  
01171142  
01171144  
01171141  
01171143  
01171145  
Zero Error Change  
vs. Clock Frequency  
Zero Error Change  
vs. Temperature  
Zero Error Change  
vs. Reference Voltage  
Zero Error Change  
vs. Supply Voltage  
13  
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Typical Performance Characteristics The following curves apply for 12-bit + sign mode after  
auto-calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA = 25˚C, and fCLK = 6 MHz unless otherwise  
specified. The performance for 8-bit + sign and “watchdog” modes is equal to or better than shown. (Note 9) (Continued)  
Analog Supply Current  
vs. Temperature  
Digital Supply Current  
vs. Clock Frequency  
01171146  
01171147  
Digital Supply Current  
vs. Temperature  
01171148  
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14  
Timing Diagrams VA+ = VD+ = +3.3V, tR = tF  
= 3 ns, CL = 100 pF for the INT, DMARQ, D0–D15  
outputs.  
01171119  
FIGURE 10. Multiplexed Data Bus  
1, 3: CS or Address valid to ALE low set-up time.  
2, 4: CS or Address valid to ALE low hold time.  
5: ALE pulse width  
11: WR pulse width  
12: WR high to next ALE high  
13: WR high to next WR or RD low  
14: Data valid to WR high set-up time  
15: Data valid to WR high hold time  
16: RD low to data bus out of TRI-STATE  
17: RD high to TRI-STATE  
6: RD high to next ALE high  
7: ALE low to RD low  
8: RD pulse width  
9: RD high to next RD or WR low  
10: ALE low to WR low  
18: RD low to data valid (access time)  
15  
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Timing Diagrams VA+ = VD+ = +3.3V, tR = tF = 3 ns, CL = 100 pF for the INT, DMARQ, D0–D15  
outputs. (Continued)  
01171120  
FIGURE 11. Non-Multiplexed Data Bus (ALE = 1)  
8: RD pulse width  
16: RD low to data bus out of TRI-STATE  
17: RD high to TRI-STATE  
9: RD high to next RD or WR low  
11: WR pulse width  
18: RD low to data valid (access time)  
13: WR high to next WR or RD low  
14: Data valid to WR high set-up time  
15: Data valid to WR high hold time  
19: Address invalid from RD or WR high (hold time)  
20: CS low or address valid to RD low  
21: CS low or address valid to WR low  
VA+ = VD+ = +3.3V, tR = tF = 3 ns, CL = 100 pF for the INT,  
DMARQ, D0–D15 outputs.  
01171121  
FIGURE 12. Interrupt and DMARQ  
22: INT high from RD low  
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23: DMARQ low from RD low  
16  
SYNC  
Synchronization input/output. When used as an  
output, it is designed to drive capacitive loads of  
100 pF or less. External buffers are necessary for  
driving higher load capacitances. SYNC is an  
input if the Configuration register’s “I/O Select” bit  
is low. A rising edge on this pin causes the inter-  
nal S/H to hold the input signal. The next rising  
clock edge either starts a conversion or makes a  
comparison to a programmable limit depending  
on which function is requested by a programming  
instruction. This pin will be an output if “I/O Se-  
lect” is set high. The SYNC output goes high  
when a conversion or a comparison is started and  
low when completed. (See Section 2.2). An inter-  
nal reset after power is first applied to the  
LM12L458 automatically sets this pin as an input.  
Pin Descriptions  
VA+, VD+ Analog and digital supply voltage pins. The  
LM12L458’s supply voltage operating range is  
+3.0V to +5.5V. Accuracy is guaranteed only if  
VA+ and VD+ are connected to the same power  
supply. Each pin should have a parallel combina-  
tion of 10 µF (electrolytic or tantalum) and 0.1 µF  
(ceramic) bypass capacitors connected between  
it and ground.  
D0–D15 The internal data input/output TRI-STATE buffers  
are connected to these pins. These buffers are  
designed to drive capacitive loads of 100 pF or  
less. External buffers are necessary for driving  
higher load capacitances. These pins allows the  
user a means of instruction input and data output.  
With a logic high applied to the BW pin, data lines  
D8–D15 are placed in a high impedance state  
and data lines D0–D7 are used for instruction  
input and data output when the LM12L458 is  
connected to an 8-bit wide data bus. A logic low  
on the BW pin allows the LM12L458 to exchange  
information over a 16-bit wide data bus.  
BW  
INT  
Bus Width input pin. This input allows the  
LM12L458 to interface directly with either an 8- or  
16-bit data bus. A logic high sets the width to 8  
bits and places D8–D15 in a high impedance  
state. A logic low sets the width to 16 bits.  
Active low interrupt output. This output is de-  
signed to drive capacitive loads of 100 pF or less.  
External buffers are necessary for driving higher  
load capacitances. An interrupt signal is gener-  
ated any time a non-masked interrupt condition  
takes place. There are eight different conditions  
that can cause an interrupt. Any interrupt is reset  
by reading the Interrupt Status register. (See Sec-  
tion 2.3.)  
RD  
WR  
CS  
Input for the active low READ bus control signal.  
The data input/output TRI-STATE buffers, as se-  
lected by the logic signal applied to the BW pin,  
are enabled when RD and CS are both low. This  
allows the LM12L458 to transmit information onto  
the data bus.  
Input for the active low WRITE bus control signal.  
The data input/output TRI-STATE buffers, as se-  
lected by the logic signal applied to the BW pin,  
are enabled when WR and CS are both low. This  
allows the LM12L458 to receive information from  
the data bus.  
DMARQ Active high Direct Memory Access Request out-  
put. This output is designed to drive capacitive  
loads of 100 pF or less. External buffers are  
necessary for driving higher load capacitances. It  
goes high whenever the number of conversion  
results in the conversion FIFO equals a program-  
mable value stored in the Interrupt Enable regis-  
ter. It returns to a logic low when the FIFO is  
empty.  
Input for the active low Chip Select control signal.  
A logic low should be applied to this pin only  
during  
a READ or WRITE access to the  
LM12L458. The internal clocking is halted and  
conversion stops while Chip Select is low. Con-  
version resumes when the Chip Select input sig-  
nal returns high.  
GND  
Ground connection. It should be connected to a  
low resistance and inductance analog ground re-  
turn that connects directly to the system power  
supply ground.  
ALE  
Address Latch Enable input. It is used in systems  
containing a multiplexed data bus. When ALE is  
asserted high, the LM12L458 accepts informa-  
tion on the data bus as a valid address. A high-  
to-low transition will latch the address data on  
A0–A4 and the logic state on the CS input. Any  
changes on A0–A4 and CS while ALE is low will  
not affect the LM12L458. See Figure 10. When a  
non-multiplexed bus is used, ALE is continuously  
asserted high. See Figure 11.  
IN0–IN7 These are the eight analog inputs. A given chan-  
nel is selected through the instruction RAM. Any  
of the channels can be configured as an indepen-  
dent single-ended input. Any pair of channels,  
whether adjacent or non-adjacent, can operate as  
a fully differential pair.  
VREF−  
This is the negative reference input. The  
LM12L458 operates with 0V VREF− VREF+  
.
This pin should be bypassed to ground with a  
parallel combination of 10 µF and 0.1 µF (ce-  
ramic) capacitors.  
CLK  
External clock input pin. The LM12L458 operates  
with an input clock frequency in the range of  
0.05 MHz to 8 MHz.  
VREF+  
Positive reference input. The LM12L458 operate  
with 0V VREF+ VA+. This pin should be by-  
passed to ground with a parallel combination of  
10 µF and 0.1 µF (ceramic) capacitors.  
A0–A4  
The LM12L458’s address lines. They are used to  
access all internal registers, Conversion FIFO,  
and Instruction RAM.  
N.C.  
This is a no connect pin.  
17  
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operates in the single-ended mode. Fully differential analog  
input channels are formed by pairing any two channels  
together.  
1.0 Functional Description  
The LM12L458 is a multi-functional Data Acquisition System  
that includes  
a fully differential 12-bit-plus-sign self-  
The LM12L458’s internal S/H is designed to operate at its  
minimum acquisition time (1.5 µs, 12 bits) when the source  
calibrating analog-to-digital converter (ADC) with a two’s-  
complement output format, an 8-channel analog multiplexer,  
a first-in-first-out (FIFO) register that can store 32 conversion  
results, and an Instruction RAM that can store as many as  
eight instructions to be sequentially executed. All of this  
circuitry operates on only a single +3.3V power supply.  
<
impedance, RS, is 80(fCLK 6 MHz). When 80RS  
5.56 k, the internal S/H’s acquisition time can be increased  
to a maximum of 6.5 µs (12 bits, fCLK = 6 MHz). See Section  
2.1 (Instruction RAM “00”) Bits 12–15 for more information.  
Microprocessor overhead is reduced through the use of the  
internal conversion FIFO. Thirty-two consecutive conver-  
sions can be completed and stored in the FIFO without any  
microprocessor intervention. The microprocessor can, at any  
time, interrogate the FIFO and retrieve its contents. It can  
also wait for the LM12L458 to issue an interrupt when the  
FIFO is full or after any number (32) of conversions have  
been stored.  
The LM12L458 has three modes of operation:  
12-bit + sign with correction  
8-bit + sign without correction  
8-bit + sign comparison mode (“watchdog” mode)  
The fully differential 12-bit-plus-sign ADC uses a charge  
redistribution topology that includes calibration capabilities.  
Charge re-distribution ADCs use a capacitor ladder in place  
of a resistor ladder to form an internal DAC. The DAC is used  
by a successive approximation register to generate interme-  
diate voltages between the voltages applied to VREF− and  
VREF+. These intermediate voltages are compared against  
the sampled analog input voltage as each bit is generated.  
The number of intermediate voltages and comparisons  
equals the ADC’s resolution. The correction of each bit’s  
accuracy is accomplished by calibrating the capacitor ladder  
used in the ADC.  
Conversion sequencing, internal timer interval, multiplexer  
configuration, and many other operations are programmed  
and set in the Instruction RAM.  
A diagnostic mode is available that allows verification of the  
LM12L458’s operation. This mode internally connects the  
voltages present at the VREF+, VREF−, and GND pins to the  
internal VIN+ and VIN− S/H inputs. This mode is activated by  
setting the Diagnostic bit (Bit 11) in the Configuration register  
to a “1”. More information concerning this mode of operation  
can be found in Section 2.2.  
Two different calibration modes are available; one compen-  
sates for offset voltage, or zero error, while the other corrects  
both offset error and the ADC’s linearity error.  
2.0 Internal User-Programmable  
Registers  
When correcting offset only, the offset error is measured  
once and a correction coefficient is created. During the full  
calibration, the offset error is measured eight times, aver-  
aged, and a correction coefficient is created. After comple-  
tion of either calibration mode, the offset correction coeffi-  
cient is stored in an internal offset correction register.  
2.1 INSTRUCTION RAM  
The instruction RAM holds up to eight sequentially execut-  
able instructions. Each 48-bit long instruction is divided into  
three 16-bit sections. READ and WRITE operations can be  
issued to each 16-bit section using the instruction’s address  
and the 2-bit “RAM pointer” in the Configuration register. The  
eight instructions are located at addresses 0000 through  
0111 (A4–A1, BW = 0) when using a 16-bit wide data bus or  
at addresses 00000 through 01111 (A4–A0, BW = 1) when  
using an 8-bit wide data bus. They can be accessed and  
programmed in random order.  
The LM12L458’s overall linearity correction is achieved by  
correcting the internal DAC’s capacitor mismatch. Each ca-  
pacitor is compared eight times against all remaining smaller  
value capacitors and any errors are averaged. A correction  
coefficient is then created and stored in one of the thirteen  
internal linearity correction registers. An internal state ma-  
chine, using patterns stored in an internal 16 x 8-bit ROM,  
executes each calibration algorithm.  
Any Instruction RAM READ or WRITE can affect the se-  
quencer’s operation:  
Once calibrated, an internal arithmetic logic unit (ALU) uses  
the offset correction coefficient and the 13 linearity correction  
coefficients to reduce the conversion’s offset error and lin-  
earity error, in the background, during the 12-bit + sign  
conversion. The 8-bit + sign conversion and comparison  
modes use only the offset coefficient. The 8-bit + sign mode  
performs a conversion in less than half the time used by the  
12-bit + sign conversion mode.  
The Sequencer should be stopped by setting the RESET bit  
to a “1” or by resetting the START bit in the Configuration  
Register and waiting for the current instruction to finish ex-  
ecution before any Instruction RAM READ or WRITE is  
initiated. Bit 0 of the Configuration Register indicates the  
Sequencer Status. See paragraph 2.2 for information on the  
Configuration Register.  
The LM12L458’s “watchdog” mode is used to monitor a  
single-ended or differential signal’s amplitude. Each  
sampled signal has two limits. An interrupt can be generated  
if the input signal is above or below either of the two limits.  
This allows interrupts to be generated when analog voltage  
inputs are “inside the window” or, alternatively, “outside the  
window”. After a “watchdog” mode interrupt, the processor  
can then request a conversion on the input signal and read  
the signal’s magnitude.  
A soft RESET should be issued by writing a “1” to the  
Configuration Register’s RESET bit after any READ or  
WRITE to the Instruction RAM.  
The three sections in the Instruction RAM are selected by  
the Configuration Register’s 2-bit “RAM Pointer”, bits D8 and  
D9. The first 16-bit Instruction RAM section is selected with  
the RAM Pointer equal to “00”. This section provides multi-  
plexer channel selection, as well as resolution, acquisition  
time, etc. The second 16-bit section holds “watchdog” limit  
#1, its sign, and an indicator that shows that an interrupt can  
be generated if the input signal is greater or less than the  
programmed limit. The third 16-bit section holds “watchdog”  
The analog input multiplexer can be configured for any com-  
bination of single-ended or fully differential operation. Each  
input is referenced to ground when a multiplexer channel  
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18  
in the inverting mode. A code of “000” selects ground as the  
inverting input for single ended operation.  
2.0 Internal User-Programmable  
Registers (Continued)  
limit #2, its sign, and an indicator that shows that an interrupt  
can be generated if the input signal is greater or less than the  
programmed limit.  
Bit 8 is the SYNC bit. Setting Bit 8 to “1” causes the Se-  
quencer to suspend operation at the end of the internal S/H’s  
acquisition cycle and to wait until a rising edge appears at  
the SYNC pin. When a rising edge appears, the S/H ac-  
quires the input signal magnitude and the ADC performs a  
conversion on the clock’s next rising edge. When the SYNC  
pin is used as an input, the Configuration register’s “I/O  
Select” bit (Bit 7) must be set to a “0”. With SYNC configured  
as an input, it is possible to synchronize the start of a  
conversion to an external event. This is useful in applications  
such as digital signal processing (DSP) where the exact  
timing of conversions is important.  
Instruction RAM “00”  
Bit 0 is the LOOP bit. It indicates the last instruction to be  
executed in any instruction sequence when it is set to a “1”.  
The next instruction to be executed will be instruction 0.  
Bit 1 is the PAUSE bit. This controls the Sequencer’s opera-  
tion. When the PAUSE bit is set (“1”), the Sequencer will stop  
after reading the current instruction, but before executing it  
and the start bit, in the Configuration register, is automati-  
cally reset to a “0”. Setting the PAUSE also causes an  
interrupt to be issued. The Sequencer is restarted by placing  
a “1” in the Configuration register’s Bit 0 (Start bit).  
When the LM12L458 is used in the “watchdog” mode with  
external synchronization, two rising edges on the SYNC  
input are required to initiate two comparisons. The first rising  
edge initiates the comparison of the selected analog input  
signal with Limit #1 (found in Instruction RAM “01”) and the  
second rising edge initiates the comparison of the same  
analog input signal with Limit #2 (found in Instruction RAM  
“10”).  
After the Instruction RAM has been programmed and the  
RESET bit is set to “1”, the Sequencer retrieves Instruction  
000, decodes it, and waits for a “1” to be placed in the  
Configuration’s START bit. The START bit value of “0” “over-  
rides” the action of Instruction 000’s PAUSE bit when the  
Sequencer is started. Once started, the Sequencer executes  
Instruction 000 and retrieves, decodes, and executes each  
of the remaining instructions. No PAUSE Interrupt (INT 5) is  
generated the first time the Sequencer executes Instruction  
000 having a PAUSE bit set to “1”. When the Sequencer  
encounters a LOOP bit or completes all eight instructions,  
Instruction 000 is retrieved and decoded. A set PAUSE bit in  
Instruction 000 now halts the Sequencer before the instruc-  
tion is executed.  
Bit 9 is the TIMER bit. When Bit 9 is set to “1”, the Se-  
quencer will halt until the internal 16-bit Timer counts down  
to zero. During this time interval, no “watchdog” comparisons  
or analog-to-digital conversions will be performed.  
Bit 10 selects the ADC conversion resolution. Setting Bit 10  
to “1” selects 8-bit + sign and when reset to “0” selects 12-bit  
+ sign.  
Bit 11 is the “watchdog” comparison mode enable bit. When  
operating in the “watchdog” comparison mode, the selected  
analog input signal is compared with the programmable  
values stored in Limit #1 and Limit #2 (see Instruction RAM  
“01” and Instruction RAM “10”). Setting Bit 11 to “1” causes  
two comparisons of the selected analog input signal with the  
two stored limits. When Bit 11 is reset to “0”, an 8-bit + sign  
or 12-bit + sign (depending on the state of Bit 10 of Instruc-  
tion RAM “00”) conversion of the input signal can take place.  
Bits 2–4 select which of the eight input channels (“000” to  
“111” for IN0–IN7) will be configured as non-inverting inputs  
to the LM12L458’s ADC. (See Table 1.)  
Bits 5–7 select which of the seven input channels (“001” to  
“111” for IN1 to IN7) will be configured as inverting inputs to  
the LM12L458’s ADC. (See Table 1.) Fully differential opera-  
tion is created by selecting two multiplexer channels, one  
operating in the non-inverting mode and the other operating  
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20  
A4 A3 A2 A1 A0  
Purpose  
Type  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
to  
1
0
0
0
0
0
0
0
0
1
0
1
0
1
R/W  
VIN−  
VIN+  
Pause Loop  
1
0
1
0
Instruction RAM  
(RAM Pointer = 00)  
0
Watch-  
dog  
to  
1
R/W  
R/W  
R/W  
R/W  
R/W  
Acquisition Time  
8/12  
Timer  
Sync  
Sign  
1
0
1
0
0
to  
1
Comparison Limit #1  
1
0
1
0
Instruction RAM  
(RAM Pointer = 01)  
0
> <  
/
to  
1
Don’t Care  
1
0
1
0
0
to  
1
Comparison Limit #2  
1
0
1
0
Instruction RAM  
(RAM Pointer = 10)  
0
> <  
to  
1
Don’t Care  
/
Sign  
Start  
1
0
1
0
Auto  
Chan  
Mask  
Stand-  
by  
Auto-  
Zero  
Test  
= 0  
1
1
1
0
0
0
0
1
0
R/W I/O Sel  
R/W  
Full Cal  
DIAG  
INT3  
Reset  
Zeroec  
Configuration  
Register  
0
0
0
1
Don’t Care  
RAM Pointer  
INT1 INT0  
Don’t  
Care  
R/W  
INT7  
INT5  
INT4  
INT2  
Interrupt Enable  
Register  
Number of Conversions in Conversion FIFO to  
Generate INT2  
Sequencer Address to  
Generate INT1  
1
1
0
0
0
1
1
0
1
0
R/W  
R
INST7  
“0”  
INST5  
INST4  
INST3  
INST2 INST1 INST0  
Address of Sequencer  
Instruction being  
Interrupt Status  
Register  
Actual Number of Conversions Results in  
Conversion FIFO  
1
0
1
0
1
R
Executed  
1
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
Timer  
R/W  
R/W  
R
Timer Preset: Low Byte  
Timer Preset: High Byte  
Conversion Data: LSBs  
Register  
Conversion  
FIFO  
R
Address or Sign  
Sign  
Conversion Data: MSBs  
R
Limit #1 Status  
Limit #2 Status  
Limit Status  
Register  
R
FIGURE 14. LM12L458 Memory Map for 8-Bit Wide Data Bus (BW = “1” and Test Bit = “0”)  
Bits 12–15 are used to store the user-programmable acqui-  
sition time. The Sequencer keeps the internal S/H in the  
acquisition mode for a fixed number of clock cycles (nine  
clock cycles, for 12-bit + sign conversions and two clock  
cycles for 8-bit + sign conversions or “watchdog” compari-  
sons) plus a variable number of clock cycles equal to twice  
the value stored in Bits 12–15. Thus, the S/H’s acquisition  
time is (9 + 2D) clock cycles for 12-bit + sign conversions  
and (2 + 2D) clock cycles for 8-bit + sign conversions or  
“watchdog” comparisons, where D is the value stored in Bits  
12–15. The minimum acquisition time compensates for the  
typical internal multiplexer series resistance of 2 k, and any  
additional delay created by Bits 12–15 compensates for  
source resistances greater than 80. (For this acquisition  
time discussion, numbers in ( ) are shown for the LM12L458  
operating at 6 MHz.) The necessary acquisition time is de-  
termined by the source impedance at the multiplexer input. If  
<
the source resistance (RS) 80and the clock frequency is  
6 MHz, the value stored in bits 12–15 (D) can be 0000. If RS  
>
80, the following equations determine the value that  
should be stored in bits 12–15.  
D = 0.45 x RS x fCLK  
for 12-bits + sign  
D = 0.36 x RS x fCLK  
for 8-bits + sign and “watchdog”  
21  
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A reset signal is internally generated when power is first  
applied to the part. No operation should be started until the  
RESET bit is “0”.  
2.0 Internal User-Programmable  
Registers (Continued)  
Writing a “1” to Bit 2 initiates an auto-zero offset voltage  
calibration. Unlike the eight-sample auto-zero calibration  
performed during the full calibration procedure, Bit 2 initiates  
a “short” auto-zero by sampling the offset once and creating  
RS is in kand fCLK is in MHz. Round the result to the next  
higher integer value. If D is greater than 15, it is advisable to  
lower the source impedance by using an analog buffer be-  
tween the signal source and the LM12L458’s multiplexer  
inputs.  
a
correction coefficient (full calibration averages eight  
samples of the converter offset voltage when creating a  
correction coefficient). If the Sequencer is running when Bit 2  
is set to “1”, an auto-zero starts immediately after the con-  
clusion of the currently running instruction. Bit 2 is reset  
automatically to a “0” and an interrupt flag (Bit 3, in the  
Interrupt Status register) is set at the end of the auto-zero  
(76 clock cycles). After completion of an auto-zero calibra-  
tion, the Sequencer fetches the next instruction as pointed to  
by the Instruction RAM’s pointer and resumes execution. If  
the Sequencer is stopped, an auto-zero is performed imme-  
diately at the time requested.  
Instruction RAM “01”  
The second Instruction RAM section is selected by placing a  
“01” in Bits 8 and 9 of the Configuration register.  
Bits 0–7 hold “watchdog” limit #1. When Bit 11 of Instruction  
RAM “00” is set to a “1”, the LM12L458 performs a “watch-  
dog” comparison of the sampled analog input signal with the  
limit #1 value first, followed by a comparison of the same  
sampled analog input signal with the value found in limit #2  
(Instruction RAM “10”).  
Bit 8 holds limit #1’s sign.  
Writing a “1” to Bit 3 initiates a complete calibration process  
that includes a “long” auto-zero offset voltage correction (this  
calibration averages eight samples of the comparator offset  
voltage when creating a correction coefficient) followed by  
an ADC linearity calibration. This complete calibration is  
started after the currently running instruction is completed if  
the Sequencer is running when Bit 3 is set to “1”. Bit 3 is  
reset automatically to a “0” and an interrupt flag (Bit 4, in the  
Interrupt Status register) will be generated at the end of the  
calibration procedure (4944 clock cycles). After completion  
of a full auto-zero and linearity calibration, the Sequencer  
fetches the next instruction as pointed to by the Instruction  
RAM’s pointer and resumes execution. If the Sequencer is  
stopped, a full calibration is performed immediately at the  
time requested.  
Bit 9’s state determines the limit condition that generates a  
“watchdog” interrupt. A “1” causes a voltage greater than  
limit #1 to generate an interrupt, while a “0” causes a voltage  
less than limit #1 to generate an interrupt.  
Bits 10–15 are not used.  
Instruction RAM “10”  
The third Instruction RAM section is selected by placing a  
“10” in Bits 8 and 9 of the Configuration register.  
Bits 0–7 hold “watchdog” limit #2. When Bit 11 of Instruction  
RAM “00” is set to a “1”, the LM12L458 performs a “watch-  
dog” comparison of the sampled analog input signal with the  
limit #1 value first (Instruction RAM “01”), followed by a  
comparison of the same sampled analog input signal with  
the value found in limit #2.  
Bit 4 is the Standby bit. Writing a “1” to Bit 4 immediately  
places the LM12L458 in Standby mode. Normal operation  
returns when Bit 4 is reset to a “0”. The Standby command  
(“1”) disconnects the external clock from the internal circuitry,  
decreases the LM12L458’s internal analog circuitry power  
supply current, and preserves all internal RAM contents.  
After writing a “0” to the Standby bit, the LM12L458 returns  
to an operating state identical to that caused by exercising  
the RESET bit. A Standby completion interrupt is issued after  
a power-up completion delay that allows the analog circuitry  
to settle. The Sequencer should be restarted only after the  
Standby completion is issued. The Instruction RAM can still  
be accessed through read and write operations while the  
LM12L458 are in Standby Mode.  
Bit 8 holds limit #2’s sign.  
Bit 9’s state determines the limit condition that generates a  
“watchdog” interrupt. A “1” causes a voltage greater than  
limit #2 to generate an interrupt, while a “0” causes a voltage  
less than limit #2 to generate an interrupt.  
Bits 10–15 are not used.  
2.2 CONFIGURATION REGISTER  
The Configuration register, 1000 (A4–A1, BW = 0) or 1000x  
(A4–A0, BW = 1) is a 16-bit control register with read/write  
capability. It acts as the LM12L458’s “control panel” holding  
global information as well as start/stop, reset, self-  
calibration, and stand-by commands.  
Bit 5 is the Channel Address Mask. If Bit 5 is set to a “1”, Bits  
13–15 in the conversion FIFO will be equal to the sign bit (Bit  
12) of the conversion data. Resetting Bit 5 to a “0” causes  
conversion data Bits 13 through 15 to hold the instruction  
pointer value of the instruction to which the conversion data  
belongs.  
Bit 0 is the START/STOP bit. Reading Bit 0 returns an  
indication of the Sequencer’s status. A “0” indicates that the  
Sequencer is stopped and waiting to execute the next in-  
struction. A “1” shows that the Sequencer is running. Writing  
a “0” halts the Sequencer when the current instruction has  
finished execution. The next instruction to be executed is  
pointed to by the instruction pointer found in the status  
register. A “1” restarts the Sequencer with the instruction  
currently pointed to by the instruction pointer. (See Bits 8–10  
in the Interrupt Status register.)  
Bit 6 is used to select a “short” auto-zero correction for every  
conversion. The Sequencer automatically inserts an auto-  
zero before every conversion or “watchdog” comparison if  
Bit 6 is set to “1”. No automatic correction will be performed  
if Bit 6 is reset to “0”.  
The LM12L458’s offset voltage, after calibration, has a typi-  
cal drift of 0.1 LSB over a temperature range of −40˚C to  
+85˚C. This small drift is less than the variability of the  
change in offset that can occur when using the auto-zero  
correction with each conversion. This variability is the result  
of using only one sample of the offset voltage to create a  
correction value. This variability decreases when using the  
Bit 1 is the LM12L458’s system RESET bit. Writing a “1” to  
Bit 1 stops the Sequencer (resetting the Configuration reg-  
ister’s START/STOP bit), resets the Instruction pointer to  
“000” (found in the Interrupt Status register), clears the Con-  
version FIFO, and resets all interrupt flags. The RESET bit  
will return to “0” after two clock cycles unless it is forced high  
by writing a “1” into the Configuration register’s Standby bit.  
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22  
mode. Two sequential comparisons are made when the  
LM12L458 are executing a “watchdog” instruction. Depend-  
ing on the logic state of Bit 9 in the Instruction RAM’s second  
and third sections, an interrupt will be generated either when  
the input signal’s magnitude is greater than or less than the  
programmable limits. (See the Instruction RAM, Bit 9 de-  
scription.) The Limit Status register will indicate which pro-  
grammed limit, #1 or #2 and which instruction was executing  
when the limit was crossed.  
2.0 Internal User-Programmable  
Registers (Continued)  
full calibration mode because eight samples of the offset  
voltage are taken, averaged, and used to create a correction  
value.  
Bit 7 is used to program the SYNC pin (29) to operate as  
either an input or an output. The SYNC pin becomes an  
output when Bit 7 is a “1” and an input when Bit 7 is a “0”.  
With SYNC programmed as an input, the rising edge of any  
logic signal applied to pin 29 will start a conversion or  
“watchdog” comparison. Programmed as an output, the logic  
level at pin 29 will go high at the start of a conversion or  
“watchdog” comparison and remain high until either have  
finished. See Instruction RAM “00”, Bit 8.  
Interrupt 1 is generated when the Sequencer reaches the  
instruction counter value specified in the Interrupt Enable  
register’s bits 8–10. This flag appears before the instruc-  
tion’s execution.  
Interrupt 2 is activated when the Conversion FIFO holds a  
number of conversions equal to the programmable value  
stored in the Interrupt Enable register’s Bits 11–15. This  
value ranges from 0001 to 1111, representing 1 to 31 con-  
versions stored in the FIFO. A user-programmed value of  
0000 has no meaning. See Section 3.0 for more FIFO infor-  
mation.  
Bits 8 and 9 form the RAM Pointer that is used to select  
each of a 48-bit instruction’s three 16-bit sections during  
read or write actions. A “00” selects Instruction RAM section  
one, “01” selects section two, and “10” selects section three.  
Bit 10 activates the Test mode that is used only during  
production testing. Leave this bit reset to “0”.  
The completion of the short, single-sampled auto-zero cali-  
bration generates Interrupt 3.  
Bit 11 is the Diagnostic bit and is available only in the  
LM12L458. It can be activated by setting it to a “1” (the Test  
bit must be reset to a “0”). The Diagnostic mode, along with  
a correctly chosen instruction, allows verification that the  
LM12L458’s ADC is performing correctly. When activated,  
the inverting and non-inverting inputs are connected as  
shown in Table 1. As an example, an instruction with “001”  
for both VIN+ and VIN− while using the Diagnostic mode  
typically results in a full-scale output.  
The completion of  
calibration generates Interrupt 4.  
a full auto-zero and linearity self-  
Interrupt 5 is generated when the Sequencer encounters an  
instruction that has its Pause bit (Bit 1 in Instruction RAM  
“00”) set to “1”.  
Interrupt 7 is issued after a short delay (10 ms typ) while the  
LM12L458 returns from Standby mode to active operation  
using the Configuration register’s Bit 4. This short delay  
allows the internal analog circuitry to settle sufficiently, en-  
suring accurate conversion results.  
2.3 INTERRUPTS  
The LM12L458 has eight possible interrupts, all with the  
same priority. Any of these interrupts will cause a hardware  
interrupt to appear on the INT pin (31) if they are not masked  
(by the Interrupt Enable register). The Interrupt Status reg-  
ister is then read to determine which of the eight interrupts  
has been issued.  
2.4 INTERRUPT ENABLE REGISTER  
The Interrupt Enable register at address location 1001  
(A4–A1, BW = 0) or 1001x (A4–A0, BW = 1) has READ/  
WRITE capability. An individual interrupt’s ability to produce  
an external interrupt at pin 31 (INT) is accomplished by  
placing a “1” in the appropriate bit location. Any of the  
internal interrupt-producing operations will set their corre-  
sponding bits to “1” in the Interrupt Status register regardless  
of the state of the associated bit in the Interrupt Enable  
register. See Section 2.3 for more information about each of  
the eight internal interrupts.  
TABLE 1. LM12L458 Input Multiplexer  
Channel Configuration Showing Normal  
Mode and Diagnostic Mode  
Channel  
Normal Mode  
Diagnostic Mode  
Selection  
Data  
000  
Bit 0 enables an external interrupt when an internal “watch-  
dog” comparison limit interrupt has taken place.  
VIN+  
VIN−  
VIN+  
VIN−  
Bit 1 enables an external interrupt when the Sequencer has  
reached the address stored in Bits 8–10 of the Interrupt  
Enable register.  
IN0  
IN1  
IN2  
IN3  
IN4  
IN5  
IN6  
IN7  
GND  
IN1  
IN2  
IN3  
IN4  
IN5  
IN6  
IN7  
001  
VREF+  
IN2  
VREF−  
IN2  
010  
Bit 2 enables an external interrupt when the Conversion  
FIFO’s limit, stored in Bits 11–15 of the Interrupt Enable  
register, has been reached.  
011  
IN3  
IN3  
100  
IN4  
IN4  
Bit 3 enables an external interrupt when the single-sampled  
auto-zero calibration has been completed.  
101  
IN5  
IN5  
110  
IN6  
IN6  
Bit 4 enables an external interrupt when a full auto-zero and  
linearity self-calibration has been completed.  
111  
IN7  
IN7  
Bit 5 enables an external interrupt when an internal Pause  
interrupt has been generated.  
The Interrupt Status register, 1010 (A4–A1, BW = 0) or  
1010x (A4–A0, BW = 1) must be cleared by reading it after  
writing to the Interrupt Enable register. This removes any  
spurious interrupts on the INT pin generated during an Inter-  
rupt Enable register access.  
Bit 6 is a “Don’t Care”.  
Bit 7 enables an external interrupt when the LM12L458  
return from power-down to active mode.  
Interrupt 0 is generated whenever the analog input voltage  
on a selected multiplexer channel crosses a limit while the  
LM12L458 are operating in the “watchdog” comparison  
Bits 8–10 form the storage location of the user-  
programmable value against which the Sequencer’s address  
is compared. When the Sequencer reaches an address that  
23  
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3.2 LIMIT STATUS REGISTER  
2.0 Internal User-Programmable  
Registers (Continued)  
is equal to the value stored in Bits 8–10, an internal interrupt  
is generated and appears in Bit 1 of the Interrupt Status  
register. If Bit 1 of the Interrupt Enable register is set to “1”,  
an external interrupt will appear at pin 31 (INT).  
The read-only register is located at address 1101 (A4–A1,  
BW = 0) or 1101x (A4–A0, BW = 1). This register is used in  
tandem with the Limit #1 and Limit #2 registers in the Instruc-  
tion RAM. Whenever a given instruction’s input voltage ex-  
ceeds the limit set in its corresponding Limit register (#1 or  
#2), a bit, corresponding to the instruction number, is set in  
the Limit Status register. Any of the active (“1”) Limit Status  
flags are reset to “0” whenever this register is read or a  
device reset is issued (see Bit 1 in the Configuration regis-  
ter). This register holds the status of limits #1 and #2 for each  
of the eight instructions.  
The value stored in bits 8–10 ranges from 000 to 111,  
representing 0 to 7 instructions stored in the Instruction  
RAM. After the Instruction RAM has been programmed and  
the RESET bit is set to “1”, the Sequencer is started by  
placing a “1” in the Configuration register’s START bit. Set-  
ting the INT 1 trigger value to 000 does not generate an  
INT 1 the first time the Sequencer retrieves and decodes  
Instruction 000. The Sequencer generates INT 1 (by placing  
a “1” in the Interrupt Status register’s Bit 1) the second time  
and after the Sequencer encounters Instruction 000. It is  
important to remember that the Sequencer continues to  
operate even if an Instruction interrupt (INT 1) is internally or  
externally generated. The only mechanisms that stop the  
Sequencer are an instruction with the PAUSE bit set to “1”  
(halts before instruction execution), placing a “0” in the Con-  
figuration register’s START bit, or placing a “1” in the Con-  
figuration register’s RESET bit.  
Bits 0–7 show the Limit #1 status. Each bit will be set high  
(“1”) when the corresponding instruction’s input voltage ex-  
ceeds the threshold stored in the instruction’s Limit #1 reg-  
ister. When, for example, instruction 3 is a “watchdog” op-  
eration (Bit 11 is set high) and the input for instruction 3  
meets the magnitude and/or polarity data stored in instruc-  
tion 3’s Limit #1 register, Bit 3 in the Limit Status register will  
be set to a “1”.  
Bits 8–15 show the Limit #2 status. Each bit will be set high  
(“1”) when the corresponding instruction’s input voltage ex-  
ceeds the threshold stored in the instruction’s Limit #2 reg-  
ister. When, for example, the input to instruction 6 meets the  
value stored in instruction 6’s Limit #2 register, Bit 14 in the  
Limit Status register will be set to a “1”.  
Bits 11–15 hold the number of conversions that must be  
stored in the Conversion FIFO in order to generate an inter-  
nal interrupt. This internal interrupt appears in Bit 2 of the  
Interrupt Status register. If Bit 2 of the Interrupt Enable  
register is set to “1”, an external interrupt will appear at pin  
31 (INT).  
3.3 TIMER  
The LM12L458 have an on-board 16-bit timer that includes a  
5-bit pre-scaler. It uses the clock signal applied to pin 23 as  
its input. It can generate time intervals of 0 through 221 clock  
cycles in steps of 25. This time interval can be used to delay  
the execution of instructions. It can also be used to slow the  
conversion rate when converting slowly changing signals.  
This can reduce the amount of redundant data stored in the  
FIFO and retrieved by the controller.  
3.0 Other Registers and Functions  
3.1 INTERRUPT STATUS REGISTER  
This read-only register is located at address 1010 (A4–A1,  
BW = 0) or 1010x (A4–A0, BW = 1). The corresponding flag  
in the Interrupt Status register goes high (“1”) any time that  
an interrupt condition takes place, whether an interrupt is  
enabled or disabled in the Interrupt Enable register. Any of  
the active (“1”) Interrupt Status register flags are reset to “0”  
whenever this register is read or a device reset is issued  
(see Bit 1 in the Configuration Register).  
The user-defined timing value used by the Timer is stored in  
the 16-bit READ/WRITE Timer register at location 1011  
(A4–A1, BW = 0) or 1011x (A4–A0, BW = 1) and is pre-  
loaded automatically. Bits 0–7 hold the preset value’s low  
byte and Bits 8–15 hold the high byte. The Timer is activated  
by the Sequencer only if the current instruction’s Bit 9 is set  
(“1”). If the equivalent decimal value “N” (0 N 216 − 1) is  
written inside the 16-bit Timer register and the Timer is  
enabled by setting an instruction’s bit 9 to a “1”, the Se-  
quencer will delay the same instruction’s execution by halt-  
ing at state 3 (S3), as shown in Figure 15, for 32 x N + 2  
clock cycles.  
Bit 0 is set to “1” when a “watchdog” comparison limit  
interrupt has taken place.  
Bit 1 is set to “1” when the Sequencer has reached the  
address stored in Bits 8–10 of the Interrupt Enable register.  
Bit 2 is set to “1” when the Conversion FIFO’s limit, stored in  
Bits 11–15 of the Interrupt Enable register, has been  
reached.  
3.4 DMA  
The DMA works in tandem with Interrupt 2. An active DMA  
Request on pin 32 (DMARQ) requires that the FIFO interrupt  
be enabled. The voltage on the DMARQ pin goes high when  
the number of conversions in the FIFO equals the 5-bit value  
stored in the Interrupt Enable register (bits 11–15). The  
voltage on the INT pin goes low at the same time as the  
voltage on the DMARQ pin goes high. The voltage on the  
DMARQ pin goes low when the FIFO is emptied. The Inter-  
rupt Status register must be read to clear the FIFO interrupt  
flag in order to enable the next DMA request.  
Bit 3 is set to “1” when the single-sampled auto-zero has  
been completed.  
Bit 4 is set to “1” when an auto-zero and full linearity self-  
calibration has been completed.  
Bit 5 is set to “1” when a Pause interrupt has been gener-  
ated.  
Bit 6 is a “Don’t Care”.  
Bit 7 is set to “1” when the LM12L458 return from power-  
down to active mode.  
DMA operation is optimized through the use of the 16-bit  
data bus connection (a logic “0” applied to the BW pin).  
Using this bus width allows DMA controllers that have single  
address Read/Write capability to easily unload the FIFO.  
Using DMA on an 8-bit data bus is more difficult. Two read  
operations (low byte, high byte) are needed to retrieve each  
Bits 8–10 hold the Sequencer’s actual instruction address  
while it is running.  
Bits 11–15 hold the actual number of conversions stored in  
the Conversion FIFO while the Sequencer is running.  
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24  
3.0 Other Registers and Functions  
5.0 Sequencer  
(Continued)  
The Sequencer uses a 3-bit counter (Instruction Pointer, or  
IP, in Figure 1) to retrieve the programmable conversion  
instructions stored in the Instruction RAM. The 3-bit counter  
is reset to 000 during chip reset or if the current executed  
instruction has its Loop bit (Bit 1 in any Instruction RAM “00”)  
set high (“1”). It increments at the end of the currently  
executed instruction and points to the next instruction. It will  
continue to increment up to 111 unless an instruction’s Loop  
bit is set. If this bit is set, the counter resets to “000” and  
execution begins again with the first instruction. If all instruc-  
tions have their Loop bit reset to “0”, the Sequencer will  
execute all eight instructions continuously. Therefore, it is  
important to realize that if less than eight instructions are  
programmed, the Loop bit on the last instruction must be set.  
Leaving this bit reset to “0” allows the Sequencer to execute  
“unprogrammed” instructions, the results of which may be  
unpredictable.  
conversion result from the FIFO. Therefore, the DMA con-  
troller must be able to repeatedly access two constant ad-  
dresses when transferring data from the LM12L458 to the  
host system.  
4.0 FIFO  
The result of each conversion stored in an internal read-only  
FIFO (First-In, First-Out) register. It is located at 1100  
(A4–A1, BW = 0) or 1100x (A4–A0, BW = 1). This register  
has 32 16-bit wide locations. Each location holds 13-bit data.  
Bits 0–3 hold the four LSB’s in the 12 bits + sign mode or  
“1110” in the 8 bits + sign mode. Bits 4–11 hold the eight  
MSB’s and Bit 12 holds the sign bit. Bits 13–15 can hold  
either the sign bit, extending the register’s two’s complement  
data format to a full sixteen bits or the instruction address  
that generated the conversion and the resulting data. These  
modes are selected according to the logic state of the Con-  
figuration register’s Bit 5.  
The Sequencer’s Instruction Pointer value is readable at any  
time and is found in the Status register at Bits 8–10. The  
Sequencer can go through eight states during instruction  
execution:  
The FIFO status should be read in the Interrupt Status  
register (Bits 11–15) to determine the number of conversion  
results that are held in the FIFO before retrieving them. This  
will help prevent conversion data corruption that may take  
place if the number of reads are greater than the number of  
conversion results contained in the FIFO. Trying to read the  
FIFO when it is empty may corrupt new data being written  
into the FIFO. Writing more than 32 conversion data into the  
FIFO by the ADC results in loss of the first conversion data.  
Therefore, to prevent data loss, it is recommended that the  
LM12L458’s interrupt capability be used to inform the system  
controller that the FIFO is full.  
State 0: The current instruction’s first 16 bits are read from  
the Instruction RAM “00”. This state is one clock cycle long.  
State 1: Checks the state of the Calibration and Start bits.  
This is the “rest” state whenever the Sequencer is stopped  
using the reset, a Pause command, or the Start bit is reset  
low (“0”). When the Start bit is set to a “1”, this state is one  
clock cycle long.  
State 2: Perform calibration. If bit 2 or bit 6 of the Con-  
figuration register is set to a “1”, state 2 is 76 clock cycles  
long. If the Configuration register’s bit 3 is set to a “1”, state  
2 is 4944 clock cycles long.  
The lower portion (A0 = 0) of the data word (Bits 0–7) should  
be read first followed by a read of the upper portion (A0 = 1)  
when using the 8-bit bus width (BW = 1). Reading the upper  
portion first causes the data to shift down, which results in  
loss of the lower byte.  
State 3: Run the internal 16-bit Timer. The number of  
clock cycles for this state varies according to the value  
stored in the Timer register. The number of clock cycles is  
found by using the expression below  
32T + 2  
Bits 0–12 hold 12-bit + sign conversion data. Bits 0–3 will  
be 1110 (LSB) when using 8-bit plus sign resolution.  
where 0 T 216 −1.  
State 7: Run the acquisition delay and read Limit #1’s  
value if needed. The number of clock cycles for 12-bit + sign  
mode varies according to  
Bits 13–15 hold either the instruction responsible for the  
associated conversion data or the sign bit. Either mode is  
selected with Bit 5 in the Configuration register.  
9 + 2D  
Using the FIFO’s full depth is achieved as follows. Set the  
value of the Interrupt Enable registers’s Bits 11–15 to 1111  
and the Interrupt Enable register’s Bit 2 to a “1”. This gener-  
ates an external interrupt when the 31st conversion is stored  
in the FIFO. This gives the host processor a chance to send  
a “0” to the LM12L458’s Start bit (Configuration register) and  
halt the ADC before it completes the 32nd conversion. The  
Sequencer halts after the current (32) conversion is com-  
pleted. The conversion data is then transferred to the FIFO  
and occupies the 32nd location. FIFO overflow is avoided if  
the Sequencer is halted before the start of the 32nd conver-  
sion by placing a “0” in the Start bit (Configuration register).  
It is important to remember that the Sequencer continues to  
operate even if a FIFO interrupt (INT 2) is internally or  
externally generated. The only mechanisms that stop the  
Sequencer are an instruction with the PAUSE bit set to “1”  
(halts before instruction execution), placing a “0” in the Con-  
figuration register’s START bit, or placing a “1” in the Con-  
figuration register’s RESET bit.  
where D is the user-programmable 4-bit value stored in bits  
12–15 of Instruction RAM “00” and is limited to 0 D 15.  
The number of clock cycles for 8-bit + sign or “watchdog”  
mode varies according to  
2 + 2D  
where D is the user-programmable 4-bit value stored in bits  
12–15 of Instruction RAM “00” and is limited to 0 D 15.  
State 6: Perform first comparison. This state is 5 clock  
cycles long.  
State 4: Read Limit #2. This state is 1 clock cycle long.  
State 5: Perform a conversion or second comparison. This  
state takes 44 clock cycles when using the 12-bit + sign  
mode or 21 clock cycles when using the 8-bit + sign mode.  
The “watchdog” mode takes 5 clock cycles.  
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5.0 Sequencer (Continued)  
01171122  
FIGURE 15. Sequencer Logic Flow Chart (IP = Instruction Pointer)  
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26  
quisition time, the LM12L458’s analog inputs can handle  
source impedance as high as 5.56 k. Refer to Section 2.1,  
Instruction RAM “00”, Bits 12–15 for further information.  
6.0 Analog Considerations  
6.1 REFERENCE VOLTAGE  
The difference in the voltages applied to the VREF+ and  
VREF− defines the analog input voltage span (the difference  
between the voltages applied between two multiplexer inputs  
or the voltage applied to one of the multiplexer inputs and  
analog ground), over which 4095 positive and 4096 negative  
codes exist. The voltage sources driving VREF+ or VREF−  
must have very low output impedance and noise.  
6.5 INPUT BYPASS CAPACITANCE  
External capacitors (0.01 µF to 0.1 µF) can be connected  
between the analog input pins, IN0–IN7, and analog ground  
to filter any noise caused by inductive pickup associated with  
long input leads. It will not degrade the conversion accuracy.  
6.6 NOISE  
The ADC can be used in either ratiometric or absolute refer-  
ence applications. In ratiometric systems, the analog input  
voltage is proportional to the voltage used for the ADC’s  
reference voltage. When this voltage is the system power  
supply, the VREF+ pin is connected to VA+ and VREF− is  
connected to GND. This technique relaxes the system refer-  
ence stability requirements because the analog input voltage  
and the ADC reference voltage move together. This main-  
tains the same output code for given input conditions.  
The leads to each of the analog multiplexer input pins should  
be kept as short as possible. This will minimize input noise  
and clock frequency coupling that can cause conversion  
errors. Input filtering can be used to reduce the effects of the  
noise sources.  
6.7 POWER SUPPLIES  
Noise spikes on the VA+ and VD+ supply lines can cause  
conversion errors; the comparator will respond to the noise.  
The ADC is especially sensitive to any power supply spikes  
that occur during the auto-zero or linearity correction. Low  
inductance tantalum capacitors of 10 µF or greater paral-  
leled with 0.1 µF monolithic ceramic capacitors are recom-  
mended for supply bypassing. Separate bypass capacitors  
should be used for the VA+ and VD+ supplies and placed as  
close as possible to these pins.  
For absolute accuracy, where the analog input voltage varies  
between very specific voltage limits, a time and temperature  
stable voltage source can be connected to the reference  
inputs. Typically, the reference voltage’s magnitude will re-  
quire an initial adjustment to null reference voltage induced  
full-scale errors.  
6.2 INPUT RANGE  
The LM12L458’s fully differential ADC and reference voltage  
inputs generate a two’s-complement output that is found by  
using the equation below.  
6.8 GROUNDING  
The LM12L458’s nominal performance can be maximized  
through proper grounding techniques. These include the use  
of a single ground plane and meticulously separating analog  
and digital areas of the board. The use of separate analog  
and digital digital planes within the same board area gener-  
ally provides best performance. All components that handle  
digital signals should be placed within the digital area of the  
board, as defined by the digital power plane, while all analog  
components should be placed in the analog area of the  
board. Such placement and the routing of analog and digital  
signal lines within their own respective board areas greatly  
reduces the occurrence of ground loops and noise. This will  
also minimize EMI/RFI radiation and susceptibility.  
Round up to the next integer value between −4096 to 4095  
for 12-bit resolution and between −256 to 255 for 8-bit reso-  
lution if the result of the above equation is not a whole  
It is recommended that stray capacitance between the ana-  
log inputs (IN0–IN7, VREF+, and VREF−) be reduced by in-  
creasing the clearance (+1/16th inch) between the analog  
signal and reference pins and the ground plane.  
number. As an example, VREF+ = 2.5V, VREF− = 1V, VIN+  
=
1.5V and VIN− = GND. The 12-bit + sign output code is  
positive full-scale, or 0,1111,1111,1111. If VREF+ = 3.3V,  
VREF− = 1V, VIN+ = 3V, and VIN− = GND, the 12-bit + sign  
output code is 0,1100,0000,0000.  
6.9 CLOCK SIGNAL CONSIDERATIONS  
The LM12L458’s performance is optimized by routing the  
analog input/output and reference signal conductors (pins  
34–44) as far as possible from the conductor that carries the  
clock signal to pin 23.  
6.3 INPUT CURRENT  
A charging current flows into or out of (depending on the  
input voltage polarity) the analog input pins, IN0–IN7 at the  
start of the analog input acquisition time (tACQ). This cur-  
rent’s peak value will depend on the actual input voltage  
applied. This charging current causes voltage spikes at the  
inputs. This voltage spikes will not corrupt the conversion  
results.  
Avoid overshoot and undershoot on the clock line by treating  
this line as a transmission line (use proper termination tech-  
niques). Failure to do so can result in erratic operation.  
Generally, a series 30to 50resistor in the clock line,  
located as close to the clock source as possible, will prevent  
most problems. The clock source should drive ONLY the  
LM12L458 clock pin.  
6.4 INPUT SOURCE RESISTANCE  
<
For low impedance voltage sources ( 80for 6 MHz opera-  
tion) the input charging current will decay, before the end of  
the S/H’s acquisition time, to a value that will not introduce  
any conversion errors. For higher source impedances, the  
S/H’s acquisition time can be increased. As an example,  
operating with a 6 MHz clock frequency and maximum ac-  
7.0 Common Application Problems  
Driving the analog inputs with op-amp(s) powered from  
supplies other than the supply used for the LM12L458.  
This practice allows for the possibility of the amplifier output  
(LM12L458 input) to reach potentials outside of the 0V to  
27  
www.national.com  
beyond the supply rails, unless the device is specifically  
designed to handle this situation, but the LM12L458 is more  
sensitive to this condition that most devices. Again, if any pin  
experiences a potential more than 100 mV below ground or  
above the supply voltage, even on a fast transient basis, the  
result could be erratic operation, missing codes, or a com-  
plete malfunction, depending upon how far the input is driven  
beyond the supply rails. The clock input is the most sensitive  
digital one. Generally, a 50series resistor, located very  
close to the signal source, will keep digital lines "clean".  
7.0 Common Application Problems  
(Continued)  
VA+ range. This could happen in normal operation if the  
amplifier use supply voltages outside of the range of the  
LM12L458 supply rails. This could also happen upon power  
up if the amplifier supply or supplies ramp up faster than the  
supply of the LM12L458. If any pin experiences a potential  
more than 100 mV below ground or above the supply volt-  
age, even on a fast transient basis, the result could be erratic  
operation, missing codes, one channel interacting with one  
or more of the others, skipping channels or a complete  
malfunction, depending upon how far the input is driven  
beyond the supply rails.  
Excessive output capacitance on the digital lines. The  
current required to charge the capacitance on the digital  
outputs can cause noise on the supply bus within the  
LM12L458, causing internal supply "bounce" even when the  
external supply pin is pretty stable. The current required to  
discharge the output capacitance can cause die ground  
"bounce". Either of these can cause noise to be induced at  
the analog inputs, resulting in conversion errors.  
Not performing a full calibration at power up. This can  
result in missing codes. The device needs to have a full  
calibration run and completed after power up and BEFORE  
attempting to perform even a single conversion or watchdog  
operation. The only way to recover if this is violated is to  
interrupt the power to the device.  
Output capacitance should be limited as much as possible. A  
series 100resistor in each digital output line, located very  
close to the output pin, will limit the charge and discharge  
current, minimizing the extent of the conversion errors.  
Not waiting for the calibration process to complete be-  
fore trying to write to the device. Once a calibration is  
requested, the ONLY read of the LM12L458 should be if the  
Interrupt Status Register to check for a completed calibra-  
tion. Attempting a write or any other read during calibration  
would cause a corruption of the calibration process, resulting  
in missing codes. The only way to recover would be to  
interrupt the power.  
Improper CS decoding. If address decoder is used, care  
must be exercised to ensure that no "runt" (very narrow)  
pulse is produced on the CS line when trying to address  
another device or memory. Even sub-nanosecond spikes on  
the CS line can cause the chip to be reprogrammed in  
accordance with what happens to be on the data lines at the  
time. The result is unexpected operation. The worst case  
result is that the device is put into the "Test" mode and the  
on-board EEPROM that corrects linearity is corrupted. If this  
happens, the only recourse is to replace the device.  
Improper termination of digital lines. Improper termination  
can result in energy reflections that build up to cause over-  
shoot that goes above the supply potential and undershoot  
that goes below ground. It is never good to drive a device  
www.national.com  
28  
Physical Dimensions inches (millimeters) unless otherwise noted  
Order Number LM12L458CIV  
NS Package Number V44A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
Leadfree products are RoHS compliant.  
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