54FCT273PCX [NSC]

Octal D Flip-Flop; 八路D触发器
54FCT273PCX
型号: 54FCT273PCX
厂家: National Semiconductor    National Semiconductor
描述:

Octal D Flip-Flop
八路D触发器

触发器
文件: 总8页 (文件大小:169K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
March 1993  
54FCT/74FCT273  
Octal D Flip-Flop  
General Description  
Features  
Y
CC  
I
reduced to 40.0 mA  
The ’FCT273 has eight edge-triggered D-type flip-flops with  
individual D inputs and Q outputs. The common buffered  
Clock (CP) and Master Reset (MR) input load and reset  
(clear) all flip-flops simultaneously.  
Y
Y
Y
Y
Y
Y
Y
Y
Ideal buffer for MOS microprocessor or memory  
Eight edge-triggered D flip-flops  
Buffered common clock  
The register is fully edge-triggered. The state of each D in-  
put, one setup time before the LOW-to-HIGH clock tran-  
sition, is transferred to the corresponding flip-flop’s Q out-  
put.  
Buffered, asynchronous master reset  
TTL input and output level compatible  
TTL levels accept CMOS levels  
e
I
48 mA (Com), 32 mA (Mil)  
OL  
All outputs will be forced LOW independently of Clock or  
Data inputs by a LOW voltage level on the MR input. The  
device is useful for applications where the true output only is  
required and the Clock and Master Reset are common to all  
storage elements.  
NSC 54/74FCT273 is pin and functionally equivalent to  
IDT 54/74FCT273  
Y
Military product compliant to MIL-STD-883 and  
Ý
Standard Military Drawing 5962-87656  
Logic Symbols  
Connection Diagrams  
Pin Assignment  
for DIP, Flatpak and SOIC  
IEEE/IEC  
TL/F/10146–1  
TL/F/10146–2  
TL/F/10146–3  
Pin Names  
Description  
Pin Assignment  
for LCC  
D D  
0
Data Inputs  
7
MR  
CP  
Master Reset  
Clock Pulse Input  
Data Outputs  
Q Q  
0
7
TL/F/10146–4  
FACTTM is a trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/10146  
RRD-B30M105/Printed in U. S. A.  
Mode Select-Function Table  
Inputs  
Outputs  
Operating Mode  
MR  
L
CP  
X
D
Q
n
n
e
e
e
Reset (Clear)  
Load ‘1’  
X
L
H
L
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
H
L
L
H
L
H
L
X
e
L
LOW-to-HIGH Transition  
Load ‘0’  
H
Logic Diagram  
TL/F/10146–5  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
2
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Supply Voltage (V  
54FCT  
74FCT  
)
CC  
4.5V to 5.5V  
4.75 to 5.25V  
Terminal Voltage with Respect to GND  
)
(V  
TERM  
54FCT  
74FCT  
Input Voltage  
0V to V  
CC  
CC  
b
b
a
0.5 to 7.0V  
a
0.5 to 7.0V  
Output Voltage  
0V to V  
Operating Temperature (T )  
A
54FCT  
74FCT  
Temperature Under Bias (T  
74FCT  
54FCT  
)
BIAS  
b
a
55 C to 125 C  
§
0 C to 70 C  
§
b
b
a
55 C to 125 C  
§
§
a
§
§
a
65 C to 135 C  
§
§
Junction Temperature (T )  
J
Storage Temperature (T  
74FCT  
54FCT  
)
STG  
CDIP  
PDIP  
175 C  
§
b
b
a
55 C to 125 C  
§
§
§
140 C  
§
Note: All commercial packaging is not recommended for applications requir-  
a
65 C to 150 C  
§
120 mA  
DC Output Current (I  
OUT  
)
b
a
ing greater than 2000 temperature cycles from 40 C to 125 C.  
§
§
Note 1: Absolute maximum ratings are those values beyond which damage  
to the device may occur. The databook specifications should be met, without  
exception, to ensure that the system design is reliable over its power supply,  
temperature, and output/input loading variables. National does not recom-  
mend operation of FACTTM FCT circuits outside databook specifications.  
DC Characteristics for ’FCT Family Devices  
CC  
e
specified for the appropriate device type: Com: V  
Typical values are at V  
5.0V, 25 C ambient and maximum loading. For test conditions shown as Max, use the value  
§
e
e
a
0 C to 70 C; Mil: V  
e
e b  
5.0V 10%, T 55 C  
A
g
5.0V 5%, T  
g
§
§
§
CC  
A
CC  
a
to 125 C, V  
e
b
V
CC  
0.2V  
§
HC  
54FCT/74FCT  
Typ  
Symbol  
Parameter  
Units  
Conditions  
Min  
Max  
V
Minimum High Level  
Input Voltage  
IH  
IL  
2.0  
V
V
V
Maximum Low Level  
Input Voltage  
0.8  
e
e
e
e
I
I
Input High Current  
5.0  
5.0  
V
V
Max  
V
V
V
CC  
IH  
CC  
I
mA  
mA  
2.7V (Note 2)  
I
b
b
e
e
Input Low Current  
5.0  
5.0  
Max  
V
V
0.5V (Note 2)  
GND  
IL  
CC  
I
I
b
b
e
e
e
e b  
Min; I 18 mA  
N
V
Clamp Diode Voltage  
Short Circuit Current  
0.7  
1.2  
V
V
V
V
IK  
CC  
CC  
CC  
b
b
e
Max (Note 1); V GND  
O
I
60  
120  
mA  
OS  
e
V
OH  
Minimum High Level  
Output Voltage  
2.8  
3.0  
3V; V  
0.2V or V ;  
HC  
IN  
e b  
I
32 mA  
OL  
V
e
e b  
e b  
e b  
V
V
V
V
Min  
I
I
I
300 mA  
HC  
CC  
CC  
OH  
OH  
OH  
e
2.4  
2.4  
4.3  
V
or V  
IL  
12 mA (Mil)  
15 mA (Com)  
IN  
IH  
4.3  
3
DC Characteristics for ’FCT Family Devices (Continued)  
e
specified for the appropriate device type: Com: V  
Typical values are at V  
5.0V, 25 C ambient and maximum loading. For test conditions shown as Max, use the value  
e
§
CC  
e
e
a
0 C to 70 C; Mil: V  
e b  
55 C  
g
5.0V 5%, T  
g
5.0V 10%, T  
§
§
§
CC  
A
CC  
A
a
to 125 C, V  
e
b
V
CC  
0.2V  
§
HC  
54FCT/74FCT  
Symbol  
Parameter  
Units  
Conditions  
Min  
Typ  
Max  
e
CC  
e
0.2V or V  
HC  
V
OL  
Maximum Low Level  
Output Voltage  
GND  
0.2  
V
3V; V  
IN  
;
e
I
300 mA  
OL  
V
e
e
e
e
GND  
0.3  
0.2  
0.5  
0.5  
V
V
Min  
I
I
I
300 mA  
CC  
OL  
OL  
OL  
e
V
or V  
IL  
48 mA (Mil)  
IN  
IH  
0.3  
32 mA (Com)  
e
I
Maximum Quiescent  
Supply Current  
V
V
Max  
CC  
CC  
t
s
0.2V  
1.0  
0.5  
40.0  
2.0  
mA  
V
, V  
HC IN  
IN  
e
f
I
0
e
DI  
Quiescent Supply Current;  
TTL Inputs HIGH  
V
V
Max  
CC  
CC  
mA  
e
3.4V (Note 3)  
IN  
t
s
I
Dynamic Power  
V
Max  
V
V
V
HC  
0.2V  
CCD  
CC  
IN  
Supply Current (Note 4)  
Outputs Open  
IN  
e
V
CC  
0.25  
0.40  
mA/MHz  
mV  
MR  
One Input Toggling  
50% Duty Cycle  
V
H
Input Hysteresis  
on Clock Only  
200  
1.5  
t
s
e
Outputs Open  
I
Total Power  
V
CC  
Max  
V
V
V
HC  
C
IN  
Supply Current (Note 6)  
4.0  
6.0  
7.8  
0.2V  
IN  
e
MR  
V
CC  
e
e
e
f
I
10 MHz  
V
V
3.4V  
GND  
IN  
1.8  
3.0  
One Bit Toggling  
50% Duty Cycle  
IN  
mA  
t
s
(Note 5)  
e
Outputs Open  
V
V
V
HC  
IN  
V
Max  
0.2V  
CC  
IN  
e
MR  
V
CC  
e
e
e
f
I
2.5 MHz  
V
V
3.4V  
GND  
IN  
5.0  
16.8  
Eight Bits Toggling  
50% Duty Cycle  
IN  
V
H
Input Hysteresis on Clock Only  
200  
mV  
Note 1: Maximum test duration not to exceed one second, not more than one output shorted at one time.  
Note 2: This parameter guaranteed but not tested.  
e
Note 3: Per TTL driven input (V  
3.4V); all other inputs at V  
or GND.  
CC  
IN  
Note 4: This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
Note 5: Values for these conditions are examples of the I formula. These limits are guaranteed but not tested.  
CC  
e
e
a
a
I
INPUTS DYNAMIC  
Note 6: I  
I
I
C
QUIESCENT  
a
a
a
I (f /2 f  
CCD CP I  
I
I
I
DI  
D
H
N
N )  
I
C
CC  
CC  
T
e
Quiescent Current  
CC  
e
e
3.4V)  
DI  
CC  
Power Supply Curent for a TTL High Input (V  
IN  
e
e
D
Duty Cycle for TTL inputs High  
H
T
N
Number of Inputs at D  
H
e
I
Dynamic Current Caused by an Input Transition Pair (HLH or LHL)  
Clock Frequency for Register Devices (Zero for Non-Register Devices)  
CCD  
e
f
CP  
e
f
I
Input Frequency  
e
N
Number of Inputs at f  
I
I
All currents are in milliamps and all frequencies are in megahertz.  
4
AC Electrical Characteristics  
54FCT/74FCT  
74FCT  
54FCT  
e
e
Mil  
T
, V  
Com  
T , V  
A CC  
A
CC  
e
e
e a  
e
T
25 C  
§
5.0V  
A
e
e
Symbol  
Parameter  
R
500X  
R
500X  
Units  
L
L
L
V
CC  
C
50 pF  
C
50 pF  
L
Typ  
Min  
Max  
Min  
Max  
t
t
Propagation Delay  
Clock to Output  
PHL  
7.0  
2.0  
13.0  
13.0  
1.5  
1.5  
3.5  
2.0  
5.0  
5.0  
9.5  
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
t
t
Propagation Delay  
MR to Output  
PLH  
8.0  
1.5  
1.0  
4.0  
4.0  
3.0  
2.0  
3.0  
2.0  
7.0  
7.0  
4.0  
10.5  
PHL  
t
t
t
t
t
f
Setup Time HIGH  
or LOW Data to CP  
SU  
Hold Time HIGH  
h
or LOW Data to CP  
Clock Pulse Width  
HIGH or LOW  
w
MR Pulse Width  
HIGH or LOW  
w
Recovery Time  
MR to CP  
rec  
4.0  
90  
ns  
Maximum Clock Frequency  
MHz  
max  
Note 1: Minimum limits are guaranteed but not tested on Propagation Delays.  
e
e
Capacitance T  
25 C, f  
§
1.0 MHz  
A
Symbol  
Parameter  
Conditions Typ Max Unit  
e
C
C
Input Capacitance  
Output Capacitance  
V
V
0V  
6
8
10  
12  
pF  
pF  
IN  
IN  
e
0V  
OUT  
OUT  
Note: This parameter is guaranteed by characterization data and not tested.  
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
74FCT 273  
P
C
QR  
Temperature Range Family  
Special Variations  
e
e
e
e
74FCT  
54FCT  
Commercial TTL-Compatible  
Military TTL-Compatible  
X
QR  
Devices shipped in 13 reels  
×
Commercial grade device with  
burn-in  
Military grade with  
Device Type  
e
QB  
environmental and burn-in  
processing shipped in tubes.  
Package Code  
e
e
e
e
e
P
D
F
L
Plastic DIP  
Ceramic DIP  
Flatpak  
Leadless Ceramic Chip Carrier (LCC)  
Small Outline (SOIC)  
Temperature Range  
e
e
a
C
M
Commercial (0 C to 70 C)  
§
§
b a  
Military ( 55 C to 125 C)  
§
§
S
5
Physical Dimensions inches (millimeters)  
20-Terminal Ceramic Leadless Chip Carrier (L)  
NS Package Number E20A  
20-Lead Ceramic Dual-In-Line Package (D)  
NS Package Number J20A  
6
Physical Dimensions inches (millimeters) (Continued)  
20-Lead Small Outline Integrated Circuit (S)  
NS Package Number M20B  
20-Lead Plastic Dual-In-Line Package (P)  
NS Package Number N20B  
7
Ý
Lit. 114706  
Physical Dimensions inches (millimeters) (Continued)  
20-Lead Ceramic Flatpak (F)  
NS Package Number W20A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
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Corporation  
National Semiconductor  
Europe  
National Semiconductor  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
a
1111 West Bardin Road  
Arlington, TX 76017  
Tel: 1(800) 272-9959  
Fax: 1(800) 737-7018  
Fax:  
(
49) 0-180-530 85 86  
@
13th Floor, Straight Block,  
Ocean Centre, 5 Canton Rd.  
Tsimshatsui, Kowloon  
Hong Kong  
Tel: (852) 2737-1600  
Fax: (852) 2736-9960  
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a
a
a
a
Deutsch Tel:  
English Tel:  
Fran3ais Tel:  
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(
(
(
(
49) 0-180-530 85 85  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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