54F377LM [NSC]
Octal D Flip-Flop with Clock Enable; 八路D触发器与时钟使能![54F377LM](http://pdffile.icpdf.com/pdf1/p00057/img/icpdf/54F377_297329_icpdf.jpg)
型号: | 54F377LM |
厂家: | ![]() |
描述: | Octal D Flip-Flop with Clock Enable |
文件: | 总8页 (文件大小:145K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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May 1995
54F/74F377
Octal D Flip-Flop with Clock Enable
General Description
Features
Y
Ideal for addressable register applications
The ’F377 has eight edge-triggered, D-type flip-flops with
individual D inputs and Q outputs. The common buffered
Clock (CP) input loads all flip-flops simultaneously, when the
Clock Enable (CE) is LOW.
Y
Clock enable for address and data synchronization
applications
Y
Y
Y
Y
Y
Y
Eight edge-triggered D flip-flops
Buffered common clock
The register is fully edge-triggered. The state of each D in-
put, one setup time before the LOW-to-HIGH clock tran-
sition, is transferred to the corresponding flip-flop’s Q out-
put. The CE input must be stable only one setup time prior
to the LOW-to-HIGH clock transition for predictable opera-
tion.
See ’F273 for master reset version
See ’F373 for transparent latch version
See ’F374 for TRI-STATE version
É
Guaranteed 4000V minimum ESD protection
Package
Commercial
74F377PC
Military
Package Description
Number
N20A
J20A
20-Lead (0.300 Wide) Molded Dual-In-Line
×
54F377DM (QB)
20-Lead Ceramic Dual-In-Line
74F377SC (Note 1)
74F377SJ (Note 1)
M20B
M20D
W20A
E20A
20-Lead (0.300 Wide) Molded Small Outline, JEDEC
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ
×
54F377FM (QB)
54F377LM (QB)
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 1: Devices also available in 13 reel. Use suffix
×
SCX and SJX.
Logic Symbols
IEEE/IEC
TL/F/9525–1
TL/F/9525–4
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9525
RRD-B30M75/Printed in U. S. A.
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9525–3
TL/F/9525–2
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
b
20 mA/ 0.6 mA
b
20 mA/ 0.6 mA
D –D
0
Data Inputs
1.0/1.0
1.0/1.0
1.0/1.0
50/33.3
7
CE
CP
Clock Enable (Active LOW)
Clock Pulse Input
b
20 mA/ 0.6 mA
b
Q –Q
0
Data Outputs
1 mA/20 mA
7
Mode Select-Function Table
e
e
Inputs
Output
H
h
HIGH Voltage Level
Operating Mode
HIGH Voltage Level one setup time prior to
CP
L
L
CE
D
Q
n
n
the LOW-to-HIGH Clock Transition
e
e
L
I
LOW Voltage Level
Load ‘‘1’’
Load ‘‘0’’
I
I
h
H
LOW Voltage Level one setup time prior to
the LOW-to-HIGH Clock Transition
e
L
I
L
X
Immaterial
e
LOW-to-HIGH Clock Transition
Hold
L
X
h
X
X
No Change
No Change
(Do Nothing)
H
Logic Diagram
TL/F/9525–5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
TRI-STATE Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
Current Applied to Output
in LOW State (Max)
ESD Last Passing Voltage (Min)
twice the rated I (mA)
OL
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Typ
Symbol
Parameter
Units
V
CC
Conditions
Min
Max
V
V
V
V
Input HIGH Voltage
2.0
V
V
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
Input LOW Voltage
0.8
IL
b
e b
18 mA
Input Clamp Diode Voltage
1.2
Min
Min
I
IN
CD
OH
e b
e b
e b
Output HIGH
Voltage
54F 10% V
2.5
2.5
2.7
I
I
I
1 mA
1 mA
1 mA
CC
OH
OH
OH
74F 10% V
74F 5% V
V
CC
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
0.5
I
I
20 mA
20 mA
OL
CC
OL
V
Min
Max
Max
0.5
CC
OL
e
e
I
I
Input HIGH Current
5.0
mA
mA
V
2.7V
7.0V
IH
IN
IN
Input HIGH Current
Breakdown Test
V
BVI
7.0
b
e
I
I
I
Input LOW Current
0.6
mA
mA
mA
Max
Max
Max
V
V
V
0.5V
IL
IN
b
b
e
e
Output Short-Circuit Current
Output HIGH Leakage Current
Input Leakage Test
60
150
0V
OS
CEX
OUT
50
V
CC
OUT
e
All Other Pins Grounded
V
I
ID
1.9 mA
ID
4.75
V
0.0
0.0
e
IOD
I
Output Leakage Circuit Current
Power Supply Current
V
150 mV
OD
3.75
mA
mA
All Other Pins Grounded
e
e
I
I
35
44
46
56
CP
L
MR
CCH
CCL
Max
e
HIGH
D
n
3
AC Electrical Characteristics
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
50 pF
e
50 pF
T
, V
CC
e
Mil
T
, V
A CC
Com
A
e a
Symbol
Parameter
V
Units
CC
e
C
C
L
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
f
Maximum Clock Frequency
Propagation Delay
130
85
105
MHz
ns
Max
t
t
3.0
4.0
7.0
9.0
2.0
3.0
8.5
2.5
3.5
7.5
9.0
PLH
CP to Q
10.5
PHL
n
AC Operating Requirements
74F
54F
74F
e a
e a
T
25 C
§
5.0V
A
e
e
Symbol
Parameter
T
, V
CC
Mil
Max
T
, V
A CC
Com
Max
Units
A
V
CC
Min
Max
Min
Min
t (H)
s
Setup Time, HIGH or LOW
3.0
3.5
3.5
4.0
3.0
3.5
ns
ns
ns
ns
ns
t (L)
s
D to CP
n
t (H)
h
Hold Time, HIGH or LOW
D to CP
n
0.5
1.0
1.0
1.0
0.5
1.0
t (L)
h
t (H)
s
Setup Time, HIGH or LOW
CE to CP
4.1
3.5
4.0
5.0
4.1
4.0
t (L)
s
t (H)
h
Hold Time, HIGH to LOW
CE to CP
0.5
2.0
1.5
2.5
0.5
2.0
t (L)
h
t
t
(H)
(L)
Clock Pulse Width,
HIGH or LOW
6.0
6.0
5.0
5.0
6.0
6.0
w
w
Ordering Information
The device number is used to form part of a simplified purchasing code where a package type and temperature range are
defined as follows:
74F 377
S
C
X
Temperature Range Family
Special Variations
e
e
e
e
74F
54F
Commercial
Military
X
QB
Devices shipped in 13 reels
×
Military grade with environmental
and burn-in processing shipped
in tubes
Device Type
Package Code
Temperature Range
e
e
e
P
D
S
Plastic DIP
Ceramic DIP
Small Outline SOIC JEDEC
Small Outline SOIC EIAJ
e
e
a
C
M
Commercial (0 C to 70 C)
§
§
b a
Military ( 55 C to 125 C)
§
§
e
SJ
4
5
Physical Dimensions inches (millimeters)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
20-Lead (0.300 Wide) Molded Small Outline Package, JEDEC (S)
×
NS Package Number M20B
6
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)
×
NS Package Number M20D
7
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N20A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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