2SJ603-ZJ-AZ [NEC]

Power Field-Effect Transistor, 25A I(D), 60V, 0.075ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, MP-25ZJ, 3 PIN;
2SJ603-ZJ-AZ
型号: 2SJ603-ZJ-AZ
厂家: NEC    NEC
描述:

Power Field-Effect Transistor, 25A I(D), 60V, 0.075ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, MP-25ZJ, 3 PIN

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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SJ603  
SWITCHING  
P-CHANNEL POWER MOS FET  
ORDERING INFORMATION  
DESCRIPTION  
The 2SJ603 is P-channel MOS Field Effect Transistor designed  
for solenoid, motor and lamp driver.  
PART NUMBER  
2SJ603  
PACKAGE  
TO-220AB  
TO-262  
2SJ603-S  
FEATURES  
2SJ603-ZJ  
TO-263  
Super low on-state resistance:  
RDS(on)1 = 48 mMAX. (VGS = 10 V, ID = 13 A)  
RDS(on)2 = 75 mMAX. (VGS = 4.0 V, ID = 13 A)  
Low input capacitance:  
Note  
TO-220SMD  
2SJ603-Z  
Note TO-220SMD package is produced only in  
Japan.  
Ciss = 1900 pF TYP. (VDS = 10 V, VGS = 0 V)  
Built-in gate protection diode  
(TO-220AB)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC) (TC = 25°C)  
Drain Current (pulse) Note1  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT  
60  
V
V
20  
25  
70  
m
m
m
A
A
Total Power Dissipation (TC = 25°C)  
Total Power Dissipation (TA = 25°C)  
Channel Temperature  
50  
W
PT  
1.5  
150  
W
(TO-262)  
Tch  
°C  
°C  
A
Storage Temperature  
Single Avalanche Current Note2  
Tstg  
55 to +150  
25  
IAS  
Single Avalanche Energy Note2  
EAS  
62.5  
mJ  
Notes 1. PW 10 µs, Duty cycle 1%  
2. Starting Tch = 25°C, VDD = 30 V, RG = 25 , VGS = 20 0 V  
(TO-263, TO-220SMD)  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No.  
Date Published July 2002 NS CP(K)  
Printed in Japan  
D14648EJ3V0DS00 (3rd edition)  
The mark shows major revised points.  
2000, 2001  
©
2SJ603  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP. MAX. UNIT  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
IDSS  
IGSS  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
VDS = 60 V, VGS = 0 V  
VGS = 20 V, VDS = 0 V  
10  
µA  
µA  
V
10  
m
m
Gate Cut-off Voltage  
VDS = 10 V, ID = 1 mA  
VDS = 10 V, ID = 13 A  
VGS = 10 V, ID = 13 A  
VGS = 4.0 V, ID = 13 A  
VDS = 10 V  
1.5  
2.0  
21  
2.5  
Forward Transfer Admittance  
Drain to Source On-state Resistance  
10  
S
38  
48  
75  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
53  
Input Capacitance  
1900  
350  
140  
10  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
Coss  
Crss  
VGS = 0 V  
f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
VDD = 30 V, ID = 13 A  
VGS = 10 V  
11  
Turn-off Delay Time  
Fall Time  
RG = 0 Ω  
66  
20  
Total Gate Charge  
QG  
VDD = 48 V  
38  
Gate to Source Charge  
Gate to Drain Charge  
Body Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
QGS  
QGD  
VF(S-D)  
trr  
VGS = 10 V  
7
ID = 25 A  
10  
IF = 25 A, VGS = 0 V  
IF = 25 A, VGS = 0 V  
di/dt = 100 A/ µs  
1.0  
49  
ns  
nC  
Qrr  
100  
TEST CIRCUIT 2 SWITCHING TIME  
TEST CIRCUIT 1 AVALANCHE CAPABILITY  
D.U.T.  
D.U.T.  
L
RG  
= 25  
V
GS ()  
R
L
90%  
PG.  
GS = 20 0 V  
V
GS  
V
GS  
10%  
VDD  
50 Ω  
Wave Form  
0
RG  
V
PG.  
V
DD  
V
DS ()  
90%  
90%  
BVDSS  
V
DS  
I
AS  
V
GS ()  
10% 10%  
d(off)  
V
DS  
0
V
DS  
0
Wave Form  
I
D
t
d(on)  
t
t
f
t
r
VDD  
τ
t
on  
t
off  
µ
τ = 1 s  
Starting Tch  
Duty Cycle 1%  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
I
G
= 2 mA  
RL  
PG.  
V
DD  
50 Ω  
2
Data Sheet D14648EJ3V0DS  
2SJ603  
TYPICAL CHARACTERISTICS (TA = 25°C )  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
60  
50  
40  
30  
20  
10  
0
100  
80  
60  
40  
20  
0
0
20  
40 60  
80 100 120 140 160  
20 40  
60  
80 100 120 140 160  
0
T
ch - Channel Temperature - ˚C  
T
C
- Case Temperature - ˚C  
FORWARD BIAS SAFE OPERATING AREA  
100  
I
D(pulse)  
I
D(DC)  
10  
1  
T
C
= 25˚C  
Single Pulse  
0.1  
0.1  
1  
10  
100  
VDS - Drain to Source Voltage - V  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
Rth(j-A) = 83.3˚C/W  
10  
1
R
th(j-C) = 2.5˚C/W  
0.1  
Single Pulse  
100 1000  
0.01  
µ
10  
1 m  
10 m  
100 m  
1
10  
100  
µ
PW - Pulse Width - s  
3
Data Sheet D14648EJ3V0DS  
2SJ603  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
FORWARD TRANSFER CHARACTERISTICS  
100  
10  
80  
60  
40  
20  
0
V
GS = 10 V  
4.5 V  
4.0 V  
1  
T
A
= 55˚C  
25˚C  
75˚C  
125˚C  
0.1  
0.01  
V
DS = 10 V  
Pulsed  
4  
5  
Pulsed  
0
1  
2  
3  
5  
1  
2  
3  
4  
VDS - Drain to Source Voltage - V  
VGS - Gate to Source Voltage - V  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
100  
100  
10  
Pulsed  
80  
60  
40  
20  
0
I
D
= 25 A  
13 A  
5 A  
T
A
= 125˚C  
75˚C  
1
25˚C  
55˚C  
0.1  
VDS = 10 V  
Pulsed  
0.01  
0
5  
10  
15  
20  
0.01  
0.1  
1  
10  
100  
VGS - Gate to Source Voltage - V  
I
D
- Drain Current - A  
DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
4.0  
3.0  
2.0  
1.0  
0
Pulsed  
V
DS = 10 V  
I
D
= 1 mA  
V
GS = 4.0 V  
4.5 V  
10 V  
0.1  
1  
10  
100  
50  
0
50  
100  
150  
ID - Drain Current - A  
T
ch - Channel Temperature - ˚C  
4
Data Sheet D14648EJ3V0DS  
2SJ603  
SOURCE TO DRAIN DIODE  
FORWARD VOLTAGE  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
100  
100  
10  
Pulsed  
Pulsed  
GS = 10 V  
80  
60  
40  
20  
0
V
4.5V  
V
GS = 4.0 V  
4.0 V  
1  
0 V  
10 V  
0.1  
0.01  
I
D
= 13 A  
0
1.5  
100  
150  
1.0  
0.5  
0
50  
50  
V
SD - Source to Drain Voltage - V  
T
ch - Channel Temperature - ˚C  
CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
SWITCHING CHARACTERISTICS  
1000  
100  
10  
10000  
1000  
V
V
R
DD = 30 V  
GS = 10 V  
= 0 Ω  
V
GS = 0 V  
f = 1 MHz  
G
C
iss  
t
d(off)  
t
f
C
oss  
rss  
t
d(on)  
100  
10  
C
t
r
1
0.1  
0.1  
1  
10  
100  
1  
10  
100  
ID - Drain Current - A  
V
DS - Drain to Source Voltage - V  
REVERSE RECOVERY TIME vs.  
DRAIN CURRENT  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
12  
10  
8  
6  
4  
2  
0
1000  
100  
10  
60  
50  
40  
30  
20  
10  
0
di/dt = 100 A/  
GS = 0 V  
µ
s
I = 25 A  
D
V
V
DD = 48 V  
30 V  
V
GS  
12 V  
VDS  
1
0.1  
1
10  
100  
0
5
10  
15  
20  
25  
30  
35  
40  
I
F
- Drain Current - A  
Q
G
- Gate Charge - nC  
5
Data Sheet D14648EJ3V0DS  
2SJ603  
SINGLE AVALANCHE ENERGY  
DERATING FACTOR  
SINGLE AVALANCHE CURRENT vs.  
INDUCTIVE LOAD  
160  
140  
120  
100  
80  
100  
10  
V
R
V
DD = 30 V  
= 25  
GS = 20 0 V  
G
I
AS = 25 A  
I
AS 25 A  
60  
1
40  
V
DD = 30V  
= 25  
GS = 20 0 V  
20  
R
G
V
0.1  
10  
0
µ
100  
µ
1m  
10m  
25  
50  
75  
100  
125  
150  
L - Inductive Load - H  
Starting Tch - Starting Channel Temperature - ˚C  
6
Data Sheet D14648EJ3V0DS  
2SJ603  
PACKAGE DRAWINGS (Unit: mm)  
1) TO-220AB (MP-25)  
10.6 MAX.  
2) TO-262 (MP-25 Fin Cut)  
4.8 MAX.  
1.3±0.2  
4.8 MAX.  
1.3±0.2  
φ
3.6±0.2  
10 TYP.  
10.0 TYP.  
4
1
2
3
4
1
2 3  
1.3±0.2  
1.3±0.2  
2.8±0.2  
0.5±0.2  
1.Gate  
0.75±0.3  
2.54 TYP.  
2.54 TYP.  
0.75±0.1  
2.54 TYP.  
0.5±0.2  
1.Gate  
2.Drain  
3.Source  
4.Fin (Drain)  
2.8±0.2  
2.54 TYP.  
2.Drain  
3.Source  
4.Fin (Drain)  
3) TO-263 (MP-25ZJ)  
4) TO-220SMD (MP-25Z) Note  
4.8 MAX.  
4.8 MAX.  
10 TYP.  
10 TYP.  
4
1.3±0.2  
1.3±0.2  
4
1
2
3
1
2
3
1.4±0.2  
1.4±0.2  
0.7±0.2  
0.75±0.3  
2.54 TYP.  
0.5±0.2  
0.5±0.2  
2.54 TYP.  
2.54 TYP.  
2.54 TYP.  
1.Gate  
1.Gate  
2.Drain  
3.Source  
2.Drain  
3.Source  
4.Fin (Drain)  
4.Fin (Drain)  
Note This package is produced only in Japan.  
EQUIVALENT CIRCUIT  
Drain  
Remark The diode connected between the gate and source of the transistor  
serves as a protector against ESD. When this device actually used,  
an additional protection circuit is externally required if a voltage  
exceeding the rated voltage may be applied to this device.  
Body  
Diode  
Gate  
Gate  
Protection  
Diode  
Source  
7
Data Sheet D14648EJ3V0DS  
2SJ603  
The information in this document is current as of July, 2002. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
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Customers must check the quality grade of each semiconductor product before using it in a particular  
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and industrial robots  
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
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(Note)  
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NEC (as defined above).  
M8E 00. 4  

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