PPXV5025G6T1_技术文档

M OT O RO LA

SEMICONDUCTOR TECHNICAL DATA

Order this document

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Motorola’s PPXV5025G series sensor integrates on–chip, bipolar op amp circuitry and

thin film resistor networks to provide a high output signal and temperature compensation.

The small form factor and high reliability of on–chip integration make the Motorola pressure

sensor a logical and economical choice for the system designer.

The PPXV5025G series piezoresistive transducer is a state–of–the–art, monolithic,

signal conditioned, silicon pressure sensor. This sensor combines advanced

micromachining techniques, thin film metallization, and bipolar semiconductor processing to

provide an accurate, high level analog output signal that is proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure

sensor chip.

INTEGRATED

PRESSURE SENSOR

0 to 25 kPa (0 to 3.6 psi)

0.2 to 4.7 Volts Output

SMALL OUTLINE PACKAGE

SURFACE MOUNT

Features

•

2.5% Maximum Error over 0° to 85°C

Ideally suited for Microprocessor or Microcontroller–Based Systems

Temperature Compensated from –40° to +125°C

Durable Thermoplastic (PPS) Surface Mount Package

PPXV5025G6U

CASE 482

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SMALL OUTLINE PACKAGE

DIP LEAD FORM

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PPXV5025GC6U

CASE 482A

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A

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N

S

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1

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1

,

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6

,

7

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8

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Figure 1. Fully Integrated Pressure Sensor

Schematic

PPXV5025G7U

CASE 482B

PPXV5025GP

CASE 1369

PPXV5025GC7U

CASE 482C

PPXV5025DP

CASE 1351

PIN NUMBER

1

2

N/C

Gnd

5

6

N/C

7

8

N/C

3

4

V

S

V

out

NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not

connect to external circuitry or ground. Pin 1 is denoted by the notch in the

lead.

REV 0

Motorola Sensor Device Data

1

Motorola, Inc. 2002

P

PX

V

5

0

2

5

G

S

E

R

I

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S

MAXIMUM RATINGS⁽¹⁾

Parametrics

Symbol

Value

100

Units

kPa

Maximum Pressure (P1 u P2)

Storage Temperature

P

max

T

stg

–40° to +125°

0.5

°C

Operating Temperature

T

A

°C

(2)

Output Source Current @ Full Scale Output

I +

o

mAdc

(2)

Output Sink Current @ Minimum Pressure Offset

NOTES:

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2. Maximum Output Current is controlled by effective impedance from V to Gnd or V to V in the application circuit.

I –

o

–0.5

out

S

OPERATING CHARACTERISTICS (V = 5.0 Vdc, T = 25°C unless otherwise noted, P1 u P2.)

S

A

Characteristic

Symbol

Min

Typ

—

Max

25

Unit

kPa

Vdc

Pressure Range

P

OP

0

(1)

Supply Voltage

Supply Current

Full Scale Output

V

4.75

—

5.0

6.0

4.7

5.25

10

S

I

o

mAdc

Vdc

(2)

(0 to 85°C)

V

FSO

4.588

4.813

@ V = 5.0 Volts

(P = 0 kPa)

diff

S

(3)

Full Scale Span

(0 to 85°C)

V

FSS

—

4.5

—

Vdc

@ V = 5.0 Volts

S

(4)

Accuracy

(0 to 85°C)

—

0.18

1.0

±2.5

—

%V

FSS

Sensitivity

V/P

V/kPa

ms

(5)

Response Time

t

R

—

(6)

Warm–Up Time

—

20

—

ms

(7)

Offset Stability

±ā0.5

—

%V

FSS

NOTES:

1. Device is ratiometric within this specified excitation range.

2. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure.

FSO

3. Full Scale Span (V

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

minimum rated pressure.

4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span

at 25°C due to all sources of error including the following:

•

Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

cycled to and from the minimum or maximum operating temperature points, with zero differential

pressure applied.

•

Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from

minimum or maximum rated pressure at 25°C.

•

TcSpan:

TcOffset:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative

to 25°C.

5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

6. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

7. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

2

Motorola Sensor Device Data

P

X

V

5

0

2

5

G

S

E

R

I

E

S

D

I

E

S TA I NL ES S

F LU O R O SI LI CO NE

S

T

E

L

C

A

P

G

E

L

D

I

E

C OAT

P

1

W

I

R

E

BO ND

T

H

E

R

M

O

P

L

A

S

T

I

C

A

S

E

L EAD

F

R

A

M

E

+

5

.

0

V

P

2

D

I

F

E

R

EN

T

I

A

L

S

E

N

SI

N

G

D

I

E

B

O

N

D

E

L

E

M

E

N

T

V

S

P

i

n

2

P

X

V

5

0

2

5

G

s

e

r

i

e

s

Figure 2. Cross Sectional Diagram SOP

(Not to Scale)

1

00

n

F

V

ou t

P

i

n

4

t

o

A

D

C

4

7

p

F

5

1

K

G

N

D

P

i

n

3

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 2 illustrates the absolute sensing chip in the basic

Small Outline chip carrier (Case 482).

Figure 3 shows a typical application circuit (output source

current operation).

5

.

0

T

R

A

N

SF

E

R

F

U

N

C

T

I

O

N

:

4. 5

4. 0

3. 5

3. 0

2. 5

2. 0

1. 5

1. 0

0. 5

0

V

= * ( 0V

S

.

0

3

6

*

P

+

0

.

0

4

c

) ±

E

R

RO R

o

u

t

V

S

=

±5

.

0

.

2

5

V

d

T

E

M

P

=

0

°

Ct

o

8

5

T

Y

P

I

C

A

L

MI N

M AX

0

5

1

0

1

5

2

0

2

5

D

I

F

E

R

E

N

T

I

A

L

P

R

E

S

SU

R

E

(

k

P

a

)

Figure 4. Output versus Pressure Differential

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical minimum and maximum output curves

are shown for operation over 0 to 85°C temperature range.

The output will saturate outside of the rated pressure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the silicon diaphragm. The

PPXV5025G series pressure sensor operating characteris-

tics, internal reliability and qualification tests are based on

use of dry air as the pressure media. Media other than dry

air may have adverse effects on sensor performance and

long–term reliability. Contact the factory for information re-

garding media compatibility in your application.

Motorola Sensor Device Data

3

P

PX

V

5

0

25

G

SE R IE S

Transfer Function

Nominal Transfer Value: V_out= V_S(P x 0.036 + 0.04)

+/– (Pressure Error x Temp. Factor x 0.036 x V_S)

V_S= 5.0 V ± 0.25 Vdc

Temperature Error Band

4

.

0

T

e

m

p

Mu lt i pl ie r

3. 0

2. 0

1. 0

0. 0

-

0

+

4

0

3

T

e

m

p

e

r

a

t

u

r

e

t

o

8

5

1

Er r or

F act o r

1

2

5

3

-

4

0

-

2

0

2

0

4

0

6

0

8

0

1

00

1

2

0

1

4

0

T

e

m

p

e

r

a

tu

r

e

i°nC

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Pressure Error Band

E

r

or

L

i

m

i

t

s

f

o

r

P

r

e

s

u

r

e

0

.

7

5

0

.

5

0

5

0

.

2

0

.

P

r

e

s

u

r

e

(

i

n

kP a)

0

5

1

0

1

5

2

0

2

5

3

0

-

0

.

2

-

Ă

0

.

5

-

Ă

0

.

7

P

0

r

e

s

u

r

e

E

r

o

r

(

M

a

x

)

t

o

2

5

k

P

a

±

0

.

6

2

5

k

Pa

4

Motorola Sensor Device Data

P

X

V

5

0

2

5

G

SE R I ES

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing silicone gel which

isolates the die from the environment. The Motorola pressure

sensor is designed to operate with positive differential pres-

sure applied, P1 > P2.

The Pressure (P1) side may be identified by using the table

below:

Part Number

PPXV5025GC6U/T1

Case Type

482A

Pressure (P1) Side Identifier

Side with Port Attached

Stainless Steel Cap

PPXV5025G6U/T1

PPXV5025GC7U

PPXV5025G7U

PPXV5025GP

482

482C

482B

Side with Port Attached

Stainless Steel Cap

1369

Side with Port Attached

Side with Port Marking

PPXV5025DP

1351

ORDERING INFORMATION

PPXV5025G series pressure sensors are available in the basic element package or with pressure ports. Two packing options

are offered for Case 482 and 482A configurations.

Device Type / Order No.

PPXV5025G6U

Case No.

482

Packing Options

Device Marking

PPXV5025G

Rails

PPXV5025G6T1

PPXV5025GC6U

PPXV5025GC6T1

PPXV5025GC7U

PPXV5025G7U

482

Tape and Reel

Rails

PPXV5025G

482A

482C

482B

1369

1351

Tape and Reel

Rails

PPXV5025GP

Trays

PPXV5025DP

Trays

INFORMATION FOR USING THE SMALL OUTLINE PACKAGES

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

fottprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

0

.

1

0

ꢀ

T

Y

P

ꢀ

8

X

2

.

5

4

0

1

.

6

7

0

6

.

0

.

0

6

0

ꢀ

T

Y

P

ꢀ

8

X

0 . 30 0

1. 52

7

.

6

2

i

n

c

h

0

.

1

0

ꢀ

T

Y

P

ꢀ

8

X

m

S

C

A

L

E

ꢀ

2

:

1

2 . 54

Figure 5. SOP Footprint

Motorola Sensor Device Data

5

P

PX

V

5

0

25

G

SE R IE S

SMALL OUTLINE PACKAGE DIMENSIONS

–A–

D 8 PL

N O TE S :

4

M

S

A

0

.

2

5

ꢀ

(

0

.

01

0

)

T

B

1. D I MEN S IO N I N G A ND TO LE R AN C I N G P ER AN S I

Y 14. 5M, 198 2.

2. C O N TR O LL IN G D I MEN S I ON : I N CH .

5

3. D I MEN S IO N

P R OT R U SI O N .

A

N

D

B

D

O

N

O

T

I

N

C

L

U

D

E

M

O

L

D

–B–

4. MA XI MU M MO LD P RO T R U SI O N 0. 15 ( 0.00 6 ).

5. A LL V ERT IC A L S U RFA C E_S T5YP IC A L D R AF T.

G

8

1

I N CH E S

D I M MI N MA X

MI LL I ME TE R S

MI N

10. 54

5. 38

MA X

10. 79

5. 84

S

N

A

B

C

D

G

H

J

0. 415

0. 212

0. 038

0. 425

0. 230

0. 042

0. 96

1. 07

0

.

1

0

ꢀ

B

S

C

2

.

5

4

ꢀ

B

S

C

0. 002

0. 009

0. 061

0ꢀ ꢀ

0. 010

0. 011

0. 071

7ꢀ ꢀ

0. 05

0. 23

1. 55

0ꢀ ꢀ

0. 25

0. 28

1. 80

7ꢀ ꢀ

K

M

N

S

H

C

_

J

–T–

0. 405

0. 709

0. 415

0. 725

10. 29

18. 01

10. 54

18. 41

S EAT IN G

P LA N E

PIN 1 IDENTIFIER

M

K

CASE 482–01

ISSUE O

–A–

D 8 PL

N O TE S :

1. D I MEN S IO N I N G A ND TO LE R AN C I N G P E R AN S I

Y 14. 5M, 198 2.

2. C O N TR O LL IN G D I MEN S I ON : I N CH .

4

M

S

A

0

.

2

5

ꢀ

(

0

.

0

1

0

)

T

B

5

3. D I MEN S IO N

P R OT R U SI O N .

4. MA XI MU M MO LD P RO T R U SI O N 0. 15 ( 0. 00 6 ).

5. A LL V ERT IC A L S U RFA C E_S T5YP IC A L D RA FT.

A

N

D

B

D O N O T I N C LU D E M O LD

N

–B–

G

I N CH E S

MI LL I ME TE R S

8

1

D I M MI N MA X

MI N

10. 54

12. 70

0. 96

MA X

10. 79

13. 21

1. 07

A

B

C

D

G

H

J

0. 415

0. 500

0. 038

0. 425

0. 520

0. 042

S

W

0. 100 ꢀB SC

2

.

5

4

ꢀ

B

S

C

0. 002

0. 009

0. 061

0ꢀ ꢀ

0. 010

0. 011

0. 071

7ꢀ ꢀ

0. 05

0. 23

1. 55

0ꢀ ꢀ

0. 25

0. 28

1. 80

7ꢀ ꢀ

K

M

N

S

V

_

0. 444

0. 709

0. 245

0. 115

0. 448

0. 725

0. 255

0. 125

11. 28

18. 01

6. 22

11. 38

18. 41

6. 48

C

V

W

2

.

9

2

3

.

1

7

H

J

–T–

S EAT IN G

P LA N E

PIN 1 IDENTIFIER

M

K

CASE 482A–01

ISSUE A

6

Motorola Sensor Device Data

P

X

V

5

0

2

5

G

SE R I ES

SMALL OUTLINE PACKAGE DIMENSIONS

–A–

N

O

T

E

S

:

4

1. D I MEN S I ON I N G A ND TO LE R AN C I NG PE R AN S I

Y 14. 5M, 198 2.

2. C O N TR O LL IN G D I MEN S I ON : I N CH .

5

3. D I MEN S I ON

P RO T R U SI O N .

A

N

D

B

D

O

N

O

T

I

N

C

L

U

D

E

M

O

L

D

–B–

4. MA XI MU M MO LD P R OT R U SI O N 0.1 5 (0 .0 06 ).

5. A LL V ERT IC A L S UR FA CE_S T5YP IC AL D R AF T.

F O RM ED PA RA LL EL.

G

8

6

.

D

I

M

E

N

S

I

O

N

S

T

O

C

E

N

T

E

R

O

F

L

E

A

D

W

H

E

N

D 8 PL

1

M

S

A

0

.

2

5

ꢀ

(

0.

0

10

)

T

B

I N CH E S

MI LL I ME TER S

D I M MI N

MA X

0. 425

0. 220

0. 034

MI N

10. 54

5. 33

MA X

10. 79

5 .5 9

DETAIL X

A

B

C

D

G

J

0. 415

0. 210

0. 026

S

N

PIN 1 IDENTIFIER

0

.

6

0

.

8

6

4

0

.

1

0

ꢀ

B

S

C

2. 54ꢀ B SC

0. 009

0. 100

0ꢀ ꢀ

0. 011

0. 120

15ꢀ ꢀ

0. 23

2. 54

0ꢀ ꢀ

0.2 8

3.0 5

15 ꢀꢀ

K

M

N

S

_

C

0. 405

0. 540

0. 415

0. 560

10. 29

13. 72

10 .5 4

14 .2 2

S EAT IN G

P LA N E

–T–

K

M

J

DETAIL X

CASE 482B–03

ISSUE B

N

O

T

E

S

:

1. D I MEN S IO N I N G A ND TO LE R AN C IN G PE R AN S I

Y 14. 5M, 198 2.

2. C O N TR O LL IN G D I MEN S I ON : I N C H .

–A–

4

3. D I MEN S IO N

P R OT R U SI O N .

A

N

D

B

D

O

N

O

T

I

N

C

L

U

D

E

M

O

L

D

5

4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).

5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.

F O RM ED PA RA LL EL.

N

–B–

6

.

D

I

M

E

N

S

I

O

N

S

TO C E NT E R OF L EAD W H EN

D 8 PL

G

M

S

A

I N CH E S

MI LL I ME TER S

8

0

.

2

5

ꢀ

(

0

.

01

0

)

T

B

1

D I M MI N

MA X

0. 425

0. 520

0. 034

MI N

10. 54

12. 70

0. 66

M A X

1 0. 79

1 3. 21

0 .8 64

A

B

C

D

G

J

0. 415

0. 500

0. 026

DETAIL X

S

W

0. 100 ꢀB SC

2

.

5

4

ꢀ

B

S

C

0. 009

0. 100

0ꢀ ꢀ

0. 011

0. 120

15ꢀ ꢀ

0. 23

2. 54

0ꢀ ꢀ

0 .2 8

3 .0 5

1 5ꢀ ꢀ

K

M

N

S

PIN 1

IDENTIFIER

V

_

0. 444

0. 540

0. 245

0. 115

0. 448

0. 560

0. 255

0. 125

11. 28

13. 72

6. 22

11 .3 8

1 4. 22

6 .4 8

C

V

W

2. 92

3

.

1

7

S EAT IN G

P LA N E

–T–

K

M

J

DETAIL X

CASE 482C–03

ISSUE B

Motorola Sensor Device Data

7

P

PX

V

5

0

25

G

S

E

R

I

E

S

SMALL OUTLINE PACKAGE DIMENSIONS

2 ꢀꢀ PL A CE Sꢀꢀ 4 ꢀꢀ T IPS

0

.

0

08

ꢀ

(

0

.

2

0

)

C

A

B

E

A

G A G E

P LA N E

e

5

4

e/2

.014 (0.35)

θ

L

A1

D

F

DETAIL G

8

1

N

O

T

E

S

:

1. C O N TR O LL IN G D I MEN S I ON : I N CH .

2. I N TE R PR E T D I MEN S I ON S A ND TO LE R AN C ES PE R

A SME Y 14. 5M- 1994.

3. D I MEN S I ON S " D " A N D " E1" D O N O T IN C L U D E M O LD

F LAS H O R P RO T R U SI O N S. MO LD F LA SH O R

P R OT R U SI O N S S HA LL N O T E XC E ED 0 .0 06 (0 .1 52 )

P ER S ID E .

4. D I MEN S I ON " b" D O ES N O T I N CL U D E D AM BAR

P R OT R U SI O N . A LLO WA BLE D AM BA R PR O T RU S IO N

S H ALL B E 0. 008 ( 0.2 03) MA XI MU M .

8X b

M

0

.

0

4

ꢀ

(

0

.

1

)

C

A

B

E1

B

I N CH E S

D I M MI N MA X

0. 300

A 1 0. 002

MI LL I ME TE R S

MI N

7. 11

MA X

7. 62

0. 25

1. 07

12. 32

N

T

A

0. 330

0. 010

0. 042

0. 485

K

0. 05

0. 96

11. 81

b

D

E

0. 038

0. 465

0. 717 ꢀB SC

18. 21 ꢀB SC

E 1 0. 465

0. 485

11. 81

2. 54ꢀ B SC

12. 32

A

M

0

.

1

0

ꢀ

B

S

C

e

F

0. 245

0. 120

0. 061

0. 270

0. 080

0. 009

0. 115

0. 255

0. 130

0. 071

0. 290

0. 090

0. 011

0. 125

6. 22

3. 05

1. 55

6. 86

2. 03

0. 23

2. 92

6. 47

3. 30

1. 80

7. 36

2. 28

0. 28

3. 17

K

L

8X

0. 00 4ꢀ ( 0.1 )

M

N

P

T

P

DETAIL G

SEATIN G

PLA N E

C

°

0ꢀ ꢀ

°

7ꢀ ꢀ

°

0ꢀ ꢀ

°

7ꢀ ꢀ

θ

CASE 1369–01

ISSUE O

8

Motorola Sensor Device Data

P

X

V

5

0

2

5

G

SE R I ES

2 ꢀ ꢀPL AC ESꢀ ꢀ4ꢀ ꢀTI PS

0

.

0

6

ꢀ

(

0

.1

5

)

C

A

B

E

A

G A G E

P LA N E

e

5

4

e/2

.014 (0.35)

θ

L

A1

D

F

DETAIL G

8

1

N O TE S :

1. C O N TR O LL IN G D I MEN S I ON : I N CH .

2. I N TE R PR E T D I MEN S I ON S A ND TO L ER AN C ES PE R

A SME Y 14. 5M- 1994.

3. D I MEN S I ON S " D " A N D " E1" D O N O T IN C L U D E M O LD

F LAS H O R P RO T R U SI O N S. MO L D FL ASH O R

P R OT R U SI O N S S HA LL N O T E XC EE D 0 .0 06 (0 .1 52 )

P ER S ID E .

4. D I MEN S I ON " b" D O ES N O T I N C LU D E D AM BAR

P R OT R U SI O N . A LLO WA BLE D AM BAR PR O TR U S IO N

S H ALL B E 0. 008 ( 0.2 03) MA XI M U M.

8X b

S TY LE 1:

P IN 1. G N D

S TY LE 2:

P IN 1. N / C

2. V s

M

0

.

0

4

ꢀ

(

0

.

1

)

C A B

2. +Vout

3. V s

3. G N D

4. Vout

5. N / C

6. N / C

7. N / C

8. N / C

4. -Vout

5. N / C

6. N / C

7. N / C

8. N / C

E1

B

I N CH E S

D I M MI N MA X

0. 370

A 1 0. 002

MI LL I ME TER S

N

MI N

9. 39

M A X

9.9 1

T

A

0. 390

0. 010

0. 042

0. 485

0. 700

0. 485

0. 05

0. 96

0.2 5

1.0 7

b

D

E

0. 038

0. 465

0. 680

11. 81

17. 27

11. 81

12. 32

17. 78

12. 32

E 1 0. 465

M

A

e

F

0

.

1

0

ꢀ

B

S

C

2

.

5

4

ꢀ

B

S

C

0. 240

0. 115

0. 040

0. 270

0. 160

0. 009

0. 110

0. 260

0. 135

0. 060

0. 290

0. 180

0. 011

0. 130

6. 10

2. 92

1. 02

6. 86

4. 06

0. 23

2. 79

6.6 0

3.4 3

1.5 2

7.3 7

4.5 7

0 .2 8

3.3 0

K

L

8X

0

.

0

4

ꢀ

(

0

.

1

)

M

N

P

T

K

P

DETAIL G

SEATIN G

PLA N E

°

0ꢀ ꢀ

°

7ꢀ ꢀ

°

0ꢀ ꢀ

°

7 ꢀꢀ

θ

C

CASE 1351–01

ISSUE O

Motorola Sensor Device Data

9

P

PX

V

5

0

25

G

SE R IE S

NOTES

10

Motorola Sensor Device Data

P

X

V

5

0

2

5

G

SE R I ES

NOTES

Motorola Sensor Device Data

11

P

PX

V

5

0

25

G

SE R IE S

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

MOTOROLA and the

logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners.

E Motorola, Inc. 2001.

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447

JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334

Technical Information Center: 1–800–521–6274

HOME PAGE: http://www.motorola.com/semiconductors/

12

Motorola Sensor Device Data

◊

PPXV5025G/D


型号：	PPXV5025G6T1
厂家：	MOTOROLA
描述：	GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-3.62Psi, 2.5%, 0.20-4.70V, SQUARE, SURFACE MOUNT, PLASTIC, SO-8 传感器换能器
文件：	总12页 (文件大小：186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PPXV5025G6T1 [MOTOROLA]

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