PPXV50GC7U [MOTOROLA]

GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-7.25Psi, 0.25%, 20-80mV, RECTANGULAR, THROUGH HOLE MOUNT, SOP-8;
PPXV50GC7U
型号: PPXV50GC7U
厂家: MOTOROLA    MOTOROLA
描述:

GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-7.25Psi, 0.25%, 20-80mV, RECTANGULAR, THROUGH HOLE MOUNT, SOP-8

传感器 换能器
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中文:  中文翻译
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SEMICONDUCTOR TECHNICAL DATA  
The MPX50 silicon piezoresistive pressure sensor provides a very accurate and linear  
voltage output — directly proportional to the applied pressure. This standard, low cost,  
uncompensated sensor permits manufacturers to design and add their own external  
temperature compensating and signal conditioning networks. Compensation techniques  
are simplified because of the predictability of Motorola’s single element strain gauge  
design.  
0 to 50 kPa (07.25 psi)  
60 mV FULL SCALE SPAN  
(TYPICAL)  
SMALL OUTLINE  
Features  
PACKAGE  
Low Cost  
Patented Silicon Shear Stress Strain Gauge Design  
Ratiometric to Supply Voltage  
Easy to Use Chip Carrier Package Options  
60 mV Span (Typ)  
BASIC CHIP  
CARRIER ELEMENT  
CASE 344–15, STYLE 1  
Differential and Gauge Options  
±0.25% (Max) Linearity  
PPXV50GC6U  
CASE 482A–01  
Application Examples  
Air Movement Control  
Environmental Control Systems  
Level Indicators  
Leak Detection  
Medical Instrumentation  
Industrial Controls  
PPXV50GC7U  
CASE 482C–03  
DIFFERENTIAL  
PORT OPTION  
CASE 344C–01, STYLE 1  
Pneumatic Control Systems  
Robotics  
PIN NUMBER  
Figure 1 shows a schematic of the internal circuitry  
NOTE: Pin 1 is the notched pin.  
1
2
3
4
Gnd  
+V  
5
6
7
8
N/C  
N/C  
N/C  
N/C  
on the stand–alone pressure sensor chip.  
PIN NUMBER  
+ V  
S
out  
1
2
Gnd  
+V  
3
4
V
V
S
S
–V  
out  
+ V  
out  
–V  
out  
out  
Xducer  
– V  
out  
GND  
Figure 1. Uncompensated Pressure Sensor Schematic  
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE  
The differential voltage output of the X–ducer is directly proportional to the differential  
pressure applied.  
The output voltage of the differential or gauge sensor increases with increasing  
pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly,  
output voltage increases as increasing vacuum is applied to the vacuum side (P2)  
relative to the pressure side (P1).  
REV 7  
Motorola Sensor Device Data  
3–25  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
200  
Unit  
kPa  
kPa  
°C  
(8)  
Overpressure (P1 > P2)  
P
max  
(8)  
Burst Pressure (P1 > P2)  
P
burst  
500  
Storage Temperature  
Operating Temperature  
T
stg  
40 to +125  
40 to +125  
T
A
°C  
OPERATING CHARACTERISTICS (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2)  
S
A
Characteristic  
Symbol  
Min  
0
Typ  
Max  
50  
Unit  
kPa  
Vdc  
mAdc  
mV  
(1)  
Pressure Range  
P
OP  
(2)  
Supply Voltage  
Supply Current  
Full Scale Span  
V
S
3.0  
6.0  
60  
6.0  
I
o
(3)  
V
FSS  
45  
90  
(4)  
Offset  
V
off  
0
20  
35  
mV  
Sensitivity  
(5)  
V/P  
1.2  
mV/kPa  
Linearity  
Pressure Hysteresis (0 to 50 kPa)  
(5)  
0.25  
0.25  
%V  
%V  
%V  
FSS  
FSS  
FSS  
(5)  
± 0.1  
± 0.5  
Temperature Hysteresis (– 40°C to +125°C)  
(5)  
Temperature Coefficient of Full Scale Span  
(5)  
TCV  
FSS  
0.22  
0.16  
%V  
/°C  
µV/°C  
FSS  
Temperature Coefficient of Offset  
TCV  
off  
± 15  
(5)  
Temperature Coefficient of Resistance  
Input Impedance  
TCR  
0.28  
400  
750  
0.34  
550  
1800  
%Z /°C  
in  
Z
in  
Output Impedance  
Z
out  
(6)  
Response Time (10% to 90%)  
t
R
1.0  
20  
ms  
ms  
Warm–Up  
(9)  
Offset Stability  
± 0.5  
%V  
FSS  
MECHANICAL CHARACTERISTICS  
Characteristic  
Symbol  
Min  
Typ  
2.0  
Max  
Unit  
Weight (Basic Element Case 344–15)  
Grams  
kPa  
(7)  
Common Mode Line Pressure  
690  
NOTES:  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional  
error due to device self–heating.  
3. Full Scale Span (V  
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
FSS  
4. Offset (V ) is defined as the output voltage at the minimum rated pressure.  
off  
5. Accuracy (error budget) consists of the following:  
Linearity:  
Output deviation from a straight line relationship with pressure, using end point method, over the specified  
pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is  
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure  
applied.  
Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the  
minimum or maximum rated pressure, at 25°C.  
TcSpan:  
TcOffset:  
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.  
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative  
to 25°C.  
TCR:  
Z
deviation with minimum rated pressure applied, over the temperature range of 40°C to +125°C,  
in  
relative to 25°C.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to  
a specified step change in pressure.  
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.  
8. Exposure beyond these limits may cause permanent damage or degradation to the device.  
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
3–26  
Motorola Sensor Device Data  
TEMPERATURE COMPENSATION  
Figure 2 shows the typical output characteristics of the  
MPX50 series over temperature.  
or by designing your system using the MPX2050 series  
sensors.  
Several approaches to external temperature compensa-  
tion over both 40 to +125°C and 0 to +80°C ranges are  
presented in Motorola Applications Note AN840.  
The X–ducer piezoresistive pressure sensor element is a  
semiconductor device which gives an electrical output signal  
proportional to the pressure applied to the device. This de-  
vice uses a unique transverse voltage diffused semiconduc-  
tor strain gauge which is sensitive to stresses produced in a  
thin silicon diaphragm by the applied pressure.  
Because this strain gauge is an integral part of the silicon  
diaphragm, there are no temperature effects due to differ-  
ences in the thermal expansion of the strain gauge and the  
diaphragm, as are often encountered in bonded strain gauge  
pressure sensors. However, the properties of the strain  
gauge itself are temperature dependent, requiring that the  
device be temperature compensated if it is to be used over  
an extensive temperature range.  
LINEARITY  
Linearity refers to how well a transducer’s output follows  
the equation: V  
= V + sensitivity x P over the operating  
out  
off  
pressure range (see Figure 3). There are two basic methods  
for calculating nonlinearity: (1) end point straight line fit or (2)  
a least squares best line fit. While a least squares fit gives  
the “best case” linearity error (lower numerical value), the  
calculations required are burdensome.  
Conversely, an end point fit will give the “worst case” error  
(often more desirable in error budget calculations) and the  
calculations are more straightforward for the user. Motorola’s  
specified pressure sensor linearities are based on the end  
point straight line method measured at the midrange  
pressure.  
Temperature compensation and offset calibration can be  
achieved rather simply with additional resistive components,  
70  
100  
LINEARITY  
60  
90  
40°C  
MPX50  
80  
70  
60  
50  
40  
+25°C  
50  
V = 3 Vdc  
S
ACTUAL  
P1 > P2  
40  
SPAN  
RANGE  
(TYP)  
+125°C  
SPAN  
(V  
FSS  
)
30  
20  
THEORETICAL  
30  
20  
10  
0
PSI  
kPa  
OFFSET  
(TYP)  
10  
0
OFFSET  
(V  
)
OFF  
0
0
1
2
3
20  
4
5
6
7
8
0
MAX  
P
OP  
10  
30  
40  
50  
PRESSURE DIFFERENTIAL  
PRESSURE (kPA)  
Figure 2. Output versus Pressure Differential  
Figure 3. Linearity Specification Comparison  
SILICONE  
DIE COAT  
STAINLESS STEEL  
METAL COVER  
EPOXY  
DIE  
P1  
P2  
WIRE BOND  
LEAD FRAME  
CASE  
RTV DIE  
BOND  
Figure 4. Cross–Sectional Diagram (not to scale)  
Figure 4 illustrates the differential or gauge configuration  
in the basic chip carrier (Case 344–15). A silicone gel iso-  
lates the die surface and wire bonds from the environment,  
while allowing the pressure signal to be transmitted to the sil-  
icon diaphragm.  
tics and internal reliability and qualification tests are based  
on use of dry air as the pressure media. Media other than dry  
air may have adverse effects on sensor performance and  
long term reliability. Contact the factory for information re-  
garding media compatibility in your application.  
The MPX50 series pressure sensor operating characteris-  
Motorola Sensor Device Data  
3–27  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Motorola designates the two sides of the pressure sensor  
pressure sensor is designed to operate with positive differen-  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing silicone gel which  
isolates the die from the environment. The Motorola MPX  
tial pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Part Number  
Case Type  
344–15  
Pressure (P1) Side Identifier  
Stainless Steel Cap  
MPX50D  
MPX50DP  
MPX50GP  
344C–01  
344B–01  
344D–01  
344E–01  
344A–01  
344F–01  
344G–01  
Side with Part Marking  
Side with Port Attached  
Stainless Steel Cap  
MPX50GVP  
MPX50GS  
Side with Port Attached  
Stainless Steel Cap  
MPX50GVS  
MPX50GSX  
MPX50GVSX  
Side with Port Attached  
Stainless Steel Cap  
ORDERING INFORMATION  
MPX50 series pressure sensors are available in differential and gauge configurations. Devices are available with basic  
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure  
connections.  
MPX Series  
Device Type  
Basic Element  
Ported Elements  
Options  
Case Type  
Case 344–15  
Order Number  
MPX50D  
Device Marking  
MPX50D  
Differential  
Differential  
Gauge  
Case 344C–01  
Case 344B–01  
Case 344D–01  
Case 344E–01  
Case 344A–01  
Case 344F–01  
Case 344G–01  
MPX50DP  
MPX50DP  
MPX50GP  
MPX50GVP  
MPX50D  
MPX50D  
MPX50D  
MPX50D  
MPX50GP  
MPX50GVP  
MPX50GS  
MPX50GVS  
MPX50GSX  
MPX50GVSX  
Gauge Vacuum  
Gauge Stovepipe  
Gauge Vacuum Stovepipe  
Gauge Axial  
Gauge Vacuum Axial  
ORDERING INFORMATION — SMALL OUTLINE PACKAGE  
Small outline package is currently available as a prototype status device. Please contact factory for more information or  
mechanical samples.  
Device  
PPXV50GC6U  
PPXV50GC7U  
Case No.  
482A–01  
482C–03  
Packing Options  
Rails  
Marking  
PPXV50G  
Rails  
PPXV50G  
3–28  
Motorola Sensor Device Data  

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