MMA6263QR2 [MOTOROLA]
【1.5g Dual Axis Micromachined Accelerometer; 【 1.5克双轴微机械加速度计
| 型号： | MMA6263QR2 |
| 厂家： | 
MOTOROLA |
| 描述： | 【1.5g Dual Axis Micromachined Accelerometer |
| 文件： | 总8页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMA6260Q
Rev. 2, 10/2004
Freescale Semiconductor
Technical Data
±1.5g Dual Axis
Micromachined Accelerometer
MMA6260Q
The MMA6200 series of low cost capacitive micromachined accelerometers
feature signal conditioning, a 1-pole low pass filter and temperature compen-
sation. Zero-g offset full scale span and filter cut-off are factory set and require
no external devices. A full system self-test capability verifies system function-
ality.
MMA6261Q
MMA6262Q
MMA6263Q
Features
•
•
•
•
•
•
•
•
•
•
High Sensitivity
Low Noise
Low Power
MMA6260Q Series: X-Y AXIS SENSITIVITY
MICROMACHINED ACCELEROMETER
±1.5 g
2.7 V to 3.6 V Operation
6mm x 6mm x 1.98 mm QFN
Integral Signal Conditioning with Low Pass Filter
Linear Output
Ratiometric Performance
Self-Test
Bottom View
Robust Design, High Shocks Survivability
Typical Applications
•
•
•
•
•
•
•
Tilt Monitoring
Position & Motion Sensing
Freefall Detection
Impact Monitoring
Appliance Control
16 LEAD QFN
CASE 1477-01
Vibration Monitoring and Recording
Smart Portable Electronics
ORDERING INFORMATION
Pin Assignment
Top View
Bandwidth
Device Name
IDD
Case No.
Package
Response
MMA6260Q
MMA6260QR2
MMA6261Q
50 Hz
50 Hz
1.2 mA
1.2 mA
1.2 mA
1.2 mA
2.2 mA
2.2 mA
2.2 mA
2.2 mA
1477-01
1477-01
1477-01
1477-01
1477-01
1477-01
1477-01
1477-01
QFN-16, Tube
QFN-16,Tape & Reel
QFN-16, Tube
16 15 14 13
1
12 ST
11 N/C
10 N/C
N/C
N/C
300 Hz
300 Hz
150 Hz
150 Hz
900 Hz
900 Hz
2
MMA6261QR2
MMA6262Q
QFN-16,Tape & Reel
QFN-16,Tube
VDD
3
4
MMA6262QR2
MMA6263Q
QFN-16,Tape & Reel
QFN-16, Tube
9
N/C
VSS
5
6
7
8
MMA6263QR2
QFN-16,Tape & Reel
© Freescale Semiconductor, Inc., 2004. All rights reserved.
VDD
G-CELL
SENSOR
X-TEMP
COMP
X
OUT
X-FILTER
OSCILLATOR
Y-FILTER
X-INTEGRATOR
X-GAIN
CONTROL LOGIC &
EEPROM TRIM CIRCUITS
ST
SELF-TEST
CLOCK GEN
Y-TEMP
COMP
Y-INTEGRATOR
Y-GAIN
YOUT
VSS
Figure 1. Simplified Accelerometer Functional Block Diagram
MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Symbol
Value
Unit
Maximum Acceleration (all axis)
gmax
g
±2000
-0.3 to +3.6
1.2
Supply Voltage
VDD
Ddrop
Tstg
V
m
Drop Test1
Storage Temperature Range
-40 to +125
°C
Note:
1. Dropped onto concrete surface from any axis.
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Freescale Semiconductor accelerome-
ters contain internal 2000 V ESD protection circuitry, ex-
tra precaution must be taken by the user to protect the
chip from ESD. A charge of over 2000 volts can accumu-
late on the human body or associated test equipment. A
charge of this magnitude
can alter the performance or cause failure of the chip.
When handling the accelerometer, proper ESD precau-
tions should be followed to avoid exposing the device to
discharges which may be detrimental to its performance.
MMA6200 SERIES
Sensor Device Data
2
Freescale Semiconductor
Operating Characteristics
Unless otherwise noted: -20°C < TA < 85°C, 3.0 V < VDD < 3.6 V, Acceleration = 0g, Loaded output1
Characteristic
Symbol
Min
Typ
Max
Unit
Operating Range2
Supply Voltage3
VDD
2.7
3.3
3.6
V
Supply Current
IDD
IDD
TA
MMA6260Q, MMA6261Q
—
—
1.2
2.2
—
1.5
3.0
+85
—
mA
mA
°C
g
MMA6262Q, MMA6263Q
Operating Temperature Range
Acceleration Range
-20
—
gFS
1.5
Output Signal
Zero g (TA = 25°C, VDD = 3.3 V)4
VOFF
1.485
—
1.65
2.0
1.815
—
V
V
OFF, TA
Zero g
mg/°C
mV/g
%/°C
Sensitivity (TA = 25°C, VDD = 3.3 V)
S
S, TA
740
—
800
860
—
Sensitivity
0.015
Bandwidth Response
MMA6260Q
f_3dB
f_3dB
—
—
50
300
150
900
—
—
—
Hz
Hz
MMA6261Q
f_3dB
MMA6262Q
—
—
Hz
f_3dB
MMA6263Q
—
—
Hz
NLOUT
Nonlinearity
-1.0
+1.0
% FSO
Noise
nRMS
nRMS
nRMS
nRMS
MMA6260Q RMS (0.1 Hz – 1 kHz)
MMA6261Q RMS (0.1 Hz – 1 kHz)
MMA6262Q RMS (0.1 Hz – 1 kHz)
MMA6263Q RMS (0.1 Hz – 1 kHz)
Power Spectral Density RMS (0.1 Hz – 1 kHz)
MMA6260Q, MMA6261Q
MMA6262Q, MMA6263Q
Self-Test
—
—
—
—
1.8
3.5
1.3
2.5
—
—
—
—
mVrms
nPSD
nPSD
—
—
300
200
—
—
ug/√Hz
VST
VIL
0.9 VDD
VDD
0.3 VDD
VDD
Output Response
—
—
V
V
Input Low
—
0.7 VDD
VIH
RPO
tST
Input High
Pull-Down Resistance5
Response Time6
—
V
43
—
57
2.0
71
kΩ
ms
—
Output Stage Performance
Full-Scale Output Range (IOUT = 200 µA)
Capacitive Load Drive7
Output Impedance
Power-Up Response Time
MMA6260Q
VFSO
CL
VSS +0.25
VDD -0.25
100
—
—
50
V
pF
Ω
—
—
ZO
300
tRESPONSE
tRESPONSE
tRESPONSE
tRESPONSE
—
—
—
—
14
2.0
4.0
0.7
—
—
—
—
ms
ms
ms
ms
MMA6261Q
MMA6262Q
MMA6263Q
Mechanical Characteristics
Transverse Sensitivity8
VZX
,
,
-5.0
—
+5.0
% FSO
YX ZY
Notes:
1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor to ground.
2. These limits define the range of operation for which the part will meet specification.
3. Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
4. The device can measure both + and - acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
5. The digital input pin has an internal pull-down resistance to prevent inadvertent self-test initiation due to external board level leakages.
6. Time for the output to reach 90% of its final value after a self-test is initiate.
7. Preserves phase margin (60°) to guarantee output amplifier stability.
8. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
MMA6200 SERIES
Sensor Device Data
Freescale Semiconductor
3
PRINCIPLE OF OPERATION
SPECIAL FEATURES
The Freescale Semiconductor accelerometer is a surface-
micromachined integrated-circuit accelerometer.
Filtering
The device consists of a surface micromachined capacitive
sensing cell (g-cell) and a signal conditioning ASIC contained in
a single integrated circuit package. The sensing element is
sealed hermetically at the wafer level using a bulk microma-
chined cap wafer.
These Freescale Semiconductor accelerometers contain an
onboard single-pole switched capacitor filter. Because the filter
is realized using switched capacitor techniques, there is no re-
quirement for external passive components (resistors and ca-
pacitors) to set the cut-off frequency.
The g-cell is a mechanical structure formed from semicon-
ductor materials (polysilicon) using semiconductor processes
(masking and etching). It can be modeled as a set of beams at-
tached to a movable central mass that move between fixed
beams. The movable beams can be deflected from their rest
position by subjecting the system to an acceleration (Figure 2).
As the beams attached to the central mass move, the dis-
tance from them to the fixed beams on one side will increase by
the same amount that the distance to the fixed beams on the
other side decreases. The change in distance is a measure of
acceleration.
The g-cell plates form two back-to-back capacitors
(Figure 2). As the center plate moves with acceleration, the dis-
tance between the plates changes and each capacitor's value
will change, (C = Aε/D). Where A is the area of the plate,
ε is the dielectric constant, and D is the distance between
the plates.
Self-Test
The sensor provides a self-test feature allowing the verifica-
tion of the mechanical and electrical integrity of the accelerom-
eter at any time before or after installation. A fourth plate is used
in the g-cell as a self-test plate. When a logic high input to the
self-test pin is applied, a calibrated potential is applied across
the self-test plate and the moveable plate. The resulting electro-
static force (Fe = 1/2 AV2/d2) causes the center plate to deflect.
The resultant deflection is measured by the accelerometer's
ASIC and a proportional output voltage results. This procedure
assures both the mechanical (g-cell) and electronic sections of
the accelerometer are functioning.
Freescale Semiconductor accelerometers include fault de-
tection circuitry and a fault latch. Parity of the EEPROM bits be-
comes odd in number.
Self-test is disabled when EEPROM parity error occurs.
The ASIC uses switched capacitor techniques to measure
the g-cell capacitors and extract the acceleration data from the
difference between the two capacitors. The ASIC also signal
conditions and filters (switched capacitor) the signal, providing
a high level output voltage that is ratiometric and proportional to
acceleration.
Ratiometricity
Ratiometricity simply means the output offset voltage and
sensitivity will scale linearly with applied supply voltage. That is,
as supply voltage is increased, the sensitivity and offset in-
crease linearly; as supply voltage decreases, offset and sensi-
tivity decrease linearly. This is a key feature when interfacing to
a microcontroller or an A/D converter because it provides sys-
tem level cancellation of supply induced errors in the analog to
digital conversion process.
Acceleration
Figure 2. Simplified Transducer Physical Model
MMA6200 SERIES
Sensor Device Data
4
Freescale Semiconductor
BASIC CONNECTIONS
Top View
P0
ST
XOUT
R
A/D IN
C 0.1 µF
1 kΩ
VSS
YOUT
VSS
R
A/D IN
0.1 µF
C
1 kΩ
0.1 µF
C
16 15 14 13
VDD
C
0.1 µF
1
12 ST
N/C
N/C
VDD
VRH
0.1 µF
2
11 N/C
10
C
V
DD
3
4
N/C
9
N/C
VSS
5
6
7
8
POWER SUPPLY
Figure 5. Recommend PCB Layout for Interfacing
Accelerometer to Microcontroller
Figure 3. Pinout Description
Pin No.
Pin
Name
Description
Notes:
1. Use 0.1 µF capacitor on VDD to decouple the power
source.
1, 5 - 7, 13, 16
N/C
No internal connection.
Leave unconnected.
2. Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
14
15
YOUT
XOUT
Output voltage of the accelerometer. Y
Direction.
Output voltage of the accelerometer. X
Direction.
3. Flag underneath package is connected to ground.
4. Place a ground plane beneath the accelerometer to
reduce noise, the ground plane should be attached to all
of the open ended terminals shown in Figure 5.
3
4
VDD
VSS
N/C
Power supply input.
The power supply ground.
5. Use an RC filter with 1.0 kΩ and 0.1 µF on the outputs of
the accelerometer to minimize clock noise (from the
switched capacitor filter circuit).
2, 8 - 11
Used for factory trim.
Leave unconnected.
12
ST
Logic input pin used to initiate
self-test.
6. PCB layout of power and ground should not couple power
supply noise.
7. Accelerometer and microcontroller should not be a high
current path.
8. A/D sampling rate and any external power supply
switching frequency should be selected such that they do
not interfere with the internal accelerometer sampling
frequency (16 kHz for Low IDD and 52 kHz for Standard
VDD
MMA6260Q
Series
1 kΩ
3
14
VDD
YOUT
IDD for the sampling frequency). This will prevent aliasing
errors.
0.1 µF
0.1 µF
4
VSS
ST
1 kΩ
15
XOUT
12
0.1 µF
Logic
Input
Figure 4. Accelerometer with Recommended Connection
Diagram
MMA6200 SERIES
Sensor Device Data
Freescale Semiconductor
5
DYNAMIC ACCELERATION
Top View
+Y
16 15 14 13
1
2
3
4
12
11
10
9
+X
-X
5
6
7
8
-Y
16-Pin QFN Package
STATIC ACCELERATION
Top View
Direction of Earth's gravity field.*
XOUT @ 0g = 1.65V
YOUT @ -1g = 0.85V
X
Y
OUT @ -1g = 0.85V
OUT @ 0g = 1.65V
X
Y
OUT @ +1g = 2.45V
OUT @ 0g = 1.65V
XOUT @ 0g = 1.65V
YOUT @ +1g = 2.45V
* When positioned as shown, the Earth's gravity will result in a positive 1g output
MMA6200 SERIES
Sensor Device Data
6
Freescale Semiconductor
6
A
M
PIN 1
INDEX AREA
0.1
C
2X
G
0.15 C
0.08 C
1.98+0.1
(0.203)
5
6
(0.5)
(0.102)
SEATING PLANE
C
(1)
DETAIL G
VIEW ROTATED 90˚ CLOCKWISE
2X
M
0.15 C
B
4
0.1 C A B
16X 0.1
(45˚)
4.24
4.04
DETAIL M
PIN 1 INDEX
EXPOSED DIE
ATTACH PAD
13
16
DETAIL M
12
9
1
4
0.5
4.24
4.04
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. THIS DIMENSION APPLIES TO METALLIZED
TERMINAL AND IS MEASURED BETWEEN 0.25MM
AND 0.30MM FROM TERMINAL TIP.
4. THIS DIMENSION REPRESENTS TERMINAL FULL
BACK FROM PACKAGE EDGE UP TO 0.1MM IS
ACCEPTABLE.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT
SLUG AS WELL AS THE TERMINAL.
6. RADIUS ON TERMINAL IS OPTIONAL.
0.1 C A B
12X
1
3
8
5
0.63
16X
0.60
0.40
0.1
16X
0.43
M
C A B
C
VIEW M-M
M
0.05
CASE 1477-01
ISSUE O
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
6.0
Surface mount board layout is a critical portion of the
total design. The footprint for the surface mount packag-
es must be the correct size to ensure proper solder con-
nection interface between the board and the package.
With the correct footprint, the packages will self-align
when subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer
to avoid bridging and shorting between solder pads.
0.55
4.25
12
9
1.00
1
4
Solder areas
Pin 1 ID (non metallic)
MMA6200 SERIES
Sensor Device Data
Freescale Semiconductor
7
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© Freescale Semiconductor, Inc. 2004. All rights reserved.
MMA6260Q
Rev. 2
10/2004
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