MMA6280Q [FREESCALE]
【1.5g - 6g Dual Axis Low-g Micromachined Accelerometer; 【 1.5克 - 6克双轴低g加速度计微机械
| 型号： | MMA6280Q |
| 厂家： | 
Freescale |
| 描述： | 【1.5g - 6g Dual Axis Low-g Micromachined Accelerometer |
| 文件： | 总8页 (文件大小：128K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMA6280Q
Rev 1.0, 2/2006
Freescale Semiconductor
Technical Data
±1.5 g - 6 g Dual Axis Low-g
Micromachined Accelerometer
MMA6280Q
The MMA6280Q low cost capacitive micromachined accelerometer
features signal conditioning, a 1-pole low pass filter, temperature
compensation and g-Select which allows for the selection among 4
sensitivities. Zero-g offset full scale span and filter cut-off are factory set and
require no external devices. Includes a Sleep Mode that makes it ideal for
handheld battery powered electronics.
MMA6280Q: XZ AXIS
ACCELEROMETER
±1.5 g / 2 g / 4 g / 6 g
Features
•
•
•
•
•
•
•
•
•
•
•
•
Selectable Sensitivity (1.5 g / 2 g / 4 g / 6 g)
Low Current Consumption: 500 µA
Sleep Mode: 3 µA
Low Voltage Operation: 2.2 V – 3.6 V
6 mm x 6 mm x 1.45 mm QFN
High Sensitivity (800 mV/g @1.5 g)
Fast Turn On Time
Bottom View
Integral Signal Conditioning with Low Pass Filter
Robust Design, High Shocks Survivability
Pb-Free Terminations
Environmentally Preferred Package
Low Cost
16 LEAD
QFN
98ASA10651D
Typical Applications
•
•
•
•
•
•
•
Portable Applications: Tilt Monitoring, Anti-Theft
Pedometer: Motion Sensing
PDA: Text Scroll
Gaming: Tilt and Motion Sensing, Event Recorder
Robotics: Motion Sensing
Top View
Impact Monitoring (shipping/handling, black box event recorder)
Vibration Monitoring and Recording (appliance balance, seismic, smart
motors, etc.).
16 15
14 13
ORDERING INFORMATION
Package
Sleep
Mode
g-Select1
g-Select2
VDD
1
2
3
4
12
Device Name
Temperture Range
Package
11 N/C
10 N/C
Drawing
MMA6280Q
– 20 to +85°C
– 20 to +85°C
98ASA10651D
98ASA10651D
QFN-16, Tube
VSS
9
N/C
MMA6280QR2
QFN-16,Tape & Reel
5
6
7
8
Figure 1. Pin Connections
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VDD
g-Select1
g-Select2
Clock
Generator
X-Temp
Comp
XOUT
Oscillator
Gain
+
Filter
G-Cell
Sensor
C to V
Converter
Sleep Mode
Control Logic
EEPROM Trim Circuits
Z-Temp
Comp
ZOUT
VSS
Figure 2. Simplified Accelerometer Functional Block Diagram
Table 1. Maximum Ratings
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Maximum Acceleration (all axis)
Symbol
gmax
Value
±2000
Unit
g
Supply Voltage
VDD
–0.3 to +3.6
1.8
V
Drop Test(1)
Ddrop
m
Storage Temperature Range
1. Dropped onto concrete surface from any axis.
Tstg
–40 to +125
°C
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Freescale accelerometer contains internal
2000 V ESD protection circuitry, extra precaution must be
taken by the user to protect the chip from ESD. A charge of
over 2000 volts can accumulate on the human body or
associated test equipment. A charge of this magnitude can
alter the performance or cause failure of the chip. When
handling the accelerometer, proper ESD precautions should
be followed to avoid exposing the device to discharges which
may be detrimental to its performance.
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
2
Table 2. Operating Characteristics
Unless otherwise noted: –20°C < TA < 85°C, 2.2 V < VDD < 3.6 V, Acceleration = 0 g, Loaded output(1)
Characteristic
Symbol
Min
Typ
Max
Unit
Operating Range(2)
Supply Voltage(3)
Supply Current
Supply Current at Sleep Mode(4)
Operating Temperature Range
Acceleration Range, X-Axis, Z-Axis
g-Select1 & 2: 00
VDD
IDD
IDD
TA
2.2
—
3.3
500
3
3.6
800
10
V
µA
µA
°C
—
–20
—
+85
gFS
gFS
gFS
gFS
—
—
—
—
±1.5
±2.0
±4.0
±6.0
—
—
—
—
g
g
g
g
g-Select1 & 2: 10
g-Select1 & 2: 01
g-Select1 & 2: 11
Output Signal
Zero g (TA = 25°C, VDD = 3.3 V)(5)
Zero g
VOFF
VOFF, TA
1.485
—
1.65
±2
1.815
—
V
mg/°C
Sensitivity (TA = 25°C, VDD = 3.3 V)
1.5 g
S1.5g
S2g
S4g
S6g
S,TA
740
555
277.5
185
—
800
600
860
645
322.5
215
—
mV/g
mV/g
mV/g
mV/g
%/°C
2 g
4 g
300
6 g
200
Sensitivity
±0.03
Bandwidth Response
X
Z
f-3dB
f-3dB
—
—
350
150
—
—
Hz
Hz
Noise
RMS (0.1 Hz – 1 kHz)(4)
Power Spectral Density RMS (0.1 Hz – 1 kHz)(4)
nRMS
nPSD
—
—
4.7
—
—
mVrms
350
µg/
Hz
Control Timing
Power-Up Response Time(6)
Enable Response Time(7)
tRESPONSE
tENABLE
—
—
1.0
0.5
2.0
2.0
ms
ms
Sensing Element Resonant Frequency
X
fGCELL
fGCELL
fCLK
—
—
—
6.0
3.4
11
—
—
—
kHz
kHz
kHz
Z
Internal Sampling Frequency
Output Stage Performance
Full-Scale Output Range (IOUT = 30 µA)
VFSO
VSS+0.25
–1.0
—
—
VDD–0.25
+1.0
V
Nonlinearity, XOUT, ZOUT
Cross-Axis Sensitivity(8)
NLOUT
%FSO
VXY, XZ, YZ
—
—
5.0
%
1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor on VDD-GND.
2. These limits define the range of operation for which the part will meet specification.
3. Within the supply range of 2.2 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
4. This value is measured with g-Select in 1.5 g mode.
5. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
6. The response time between 10% of full scale Vdd input voltage and 90% of the final operating output voltage.
7. The response time between 10% of full scale Sleep Mode input voltage and 90% of the final operating output voltage.
8. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PRINCIPLE OF OPERATION
The Freescale accelerometer is a surface-micromachined
SPECIAL FEATURES
integrated-circuit accelerometer.
The device consists of two surface micromachined
capacitive sensing cells (g-cell) and a signal conditioning
ASIC contained in a single integrated circuit package. The
sensing elements are sealed hermetically at the wafer level
using a bulk micromachined cap wafer.
The g-cell is a mechanical structure formed from
semiconductor materials (polysilicon) using semiconductor
processes (masking and etching). It can be modeled as a set
of beams attached to a movable central mass that move
between fixed beams. The movable beams can be deflected
from their rest position by subjecting the system to an
acceleration (Figure 3).
As the beams attached to the central mass move, the
distance from them to the fixed beams on one side will
increase by the same amount that the distance to the fixed
beams on the other side decreases. The change in distance
is a measure of acceleration.
The g-cell beams form two back-to-back capacitors
(Figure 3). As the center beam moves with acceleration, the
distance between the beams changes and each capacitor's
value will change, (C = Aε/D). Where A is the area of the
beam, ε is the dielectric constant, and D is the distance
between the beams.
g-Select
The g-Select feature allows for the selection among 4
sensitivities present in the device. Depending on the logic
input placed on pins 1 and 2, the device internal gain will be
changed allowing it to function with a 1.5 g, 2 g, 4 g, or 6 g
sensitivity (Table 3). This feature is ideal when a product has
applications requiring different sensitivities for optimum
performance. The sensitivity can be changed at anytime
during the operation of the product. The g-Select1 and g-
Select2 pins can be left unconnected for applications
requiring only a 1.5 g sensitivity as the device has an internal
pulldown to keep it at that sensitivity (800 mV/g).
Table 3. g-Select Pin Descriptions
g-Select2
g-Select1
g-Range
1.5 g
2 g
Sensitivity
800 mV/g
600 mV/g
300 mV/g
200 mV/g
0
0
1
1
0
1
0
1
4 g
6 g
The ASIC uses switched capacitor techniques to measure
the g-cell capacitors and extract the acceleration data from
the difference between the two capacitors. The ASIC also
signal conditions and filters (switched capacitor) the signal,
providing a high level output voltage that is ratiometric and
proportional to acceleration.
Sleep Mode
The dual axis accelerometer provides a Sleep Mode that
is ideal for battery operated products. When Sleep Mode is
active, the device outputs are turned off, providing significant
reduction of operating current. A low input signal on pin 12
(Sleep Mode) will place the device in this mode and reduce
the current to 3uA typ. For lower power consumption, it is
recommended to set g-Select1 and g-Select2 to 1.5g mode.
By placing a high input signal on pin 12, the device will
resume to normal mode of operation.
Acceleration
Filtering
The dual axis accelerometer contains onboard single-pole
switched capacitor filters. Because the filter is realized using
switched capacitor techniques, there is no requirement for
external passive components (resistors and capacitors) to set
the cut-off frequency.
Figure 3. Simplified Transducer Physical Model
Ratiometricity
Ratiometricity simply means the output offset voltage and
sensitivity will scale linearly with applied supply voltage. That
is, as supply voltage is increased, the sensitivity and offset
increase linearly; as supply voltage decreases, offset and
sensitivity decrease linearly. This is a key feature when
interfacing to a microcontroller or an A/D converter because
it provides system level cancellation of supply induced errors
in the analog to digital conversion process.
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
4
BASIC CONNECTIONS
PCB Layout
Pin Descriptions
Connection Diagram
Top View
POWER SUPPLY
16 15 14 13
g-Select1
g-Select2
VDD
1
2
12
Sleep Mode
VDD
11 NC
VRH
VDD
VSS
C
C
VSS
Sleep Mode
g-Select1
C
NC
NC
3
4
10
9
P0
P1
P2
VSS
5
6
7
8
g-Select2
Figure 4. Pinout Description
Table 4. Pin Descriptions
R
R
XOUT
A/DIN
A/DIN
C
C
Pin No.
Pin Name
g-Select1
g-Select2
VDD
Description
Logic input pin to select g level.
Logic input pin to select g level.
Power Supply Input
ZOUT
1
2
Figure 6. Recommended PCB Layout for Interfacing
Accelerometer to Microcontroller
3
4
VSS
Power Supply Ground
NOTES:
5 - 7
N/C
No internal connection.
Leave unconnected.
1. Use 0.1 µF capacitor on VDD to decouple the power
source. Do not exceed capacitor values of 2.2 or
3.3 µF.
8 - 11
12
N/C
Unused for factory trim.
Leave unconnected.
2. Physical coupling distance of the accelerometer to
the microcontroller should be minimal.
Sleep Mode Logic input pin to enable product or
Sleep Mode.
3. Flag underneath package is connected to ground.
13
14
ZOUT
N/C
Z direction output voltage.
4. Place a ground plane beneath the accelerometer to
reduce noise, the ground plane should be attached to
all of the open ended terminals shown in Figure 6.
No internal connection.
Leave unconnected.
15
16
XOUT
N/C
X direction output voltage.
5. Use an RC filter with 1.0 kΩ and 0.1 µF on the
outputs of the accelerometer to minimize clock noise
(from the switched capacitor filter circuit).
No internal connection.
Leave unconnected.
6. PCB layout of power and ground should not couple
power supply noise.
Logic
Inputs
1 kΩ
1
2
7. Accelerometer and microcontroller should not be a
high current path.
13
ZOUT
g-Select1
g-Select2
0.1 µF
8. A/D sampling rate and any external power supply
switching frequency should be selected such that
they do not interfere with the internal accelerometer
sampling frequency (11 kHz for the sampling
frequency). This will prevent aliasing errors.
VDD
MMA6280Q
3
VDD
0.1 µF
4
VSS
1 kΩ
15
XOUT
12
Sleep Mode
0.1 µF
Logic
Input
Figure 5. . Accelerometer with Recommended
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
DYNAMIC ACCELERATION
Top View
Y direction
(For reference only)
Side View
16 15 14 13
1
2
12
11
+X
-X
-Z
+Z
3
4
10
9
5
6
7
8
: Arrow indicates direction of mass movement.
16-Pin QFN Package
STATIC ACCELERATION
Direction of Earth’s gravity field.*
Top View
Side View
XOUT
ZOUT
@
@
0g = 1.
0g = 1.6
65 V
5 V
XOUT @ 0g = 1.65 V
Z
OUT @ +1g = 2.45 V
XOUT @ +1g = 2.45 V
XOUT @ -1g = 0.85 V
Z
OUT @ 0g = 1.65 V
XOUT @ 0g = 1.65 V
OUT @ -1g = 0.85 V
Z
OUT @ 0g = 1.65 V
Z
XOUT @ 0g = 1.65 V
OUT @ 0g = 1.65 V
Z
* When positioned as shown, the Earth’s gravity will result in a positive 1g output.
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
6
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
6.0
0.55
4.25
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
12
9
1.00
1
4
Solder areas
Pin 1 ID (non metallic)
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
DETAIL G
6
A
M
PIN 1
INDEX AREA
0.1
C
2X
0.10 C
0.08 C
1.45 0.1
(0.203)
5
6
(0.5)
(0.102)
SEATING PLANE
C
(1)
DETAIL G
VIEW ROTATED 90˚ CLOCKWISE
2X
M
0.10 C
B
4
0.1 C A B
16X
(45˚)
0.1
4.24
4.04
DETAIL M
PIN 1 INDEX
EXPOSED DIE
ATTACH PAD
13
16
DETAIL M
12
9
1
4
0.5
4.24
4.04
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. THIS DIMENSION APPLIES TO METALLIZED
TERMINAL AND IS MEASURED BETWEEN 0.25MM
AND 0.30MM FROM TERMINAL TIP.
4. THIS DIMENSION REPRESENTS TERMINAL FULL
BACK FROM PACKAGE EDGE UP TO 0.1MM IS
ACCEPTABLE.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT
SLUG AS WELL AS THE TERMINAL.
0.1 C A B
12X
1
3
8
5
0.63
16X
0.60
0.40
16X
0.43
M
0.1
C A B
C
VIEW M-M
M
0.05
6. RADIUS ON TERMINAL IS OPTIONAL.
7. MINIMUM METAL GAP 0.2MM.
CASE 1622-01
ISSUE O
16-LEAD QFN
MMA6280Q
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
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MMA6280Q
Rev 1.0, 2/2006
2/2006
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