MC10123LD [MOTOROLA]
Bus Driver, ECL10K, CDIP16;
| 型号： | MC10123LD |
| 厂家： | 
MOTOROLA |
| 描述： | Bus Driver, ECL10K, CDIP16 总线驱动器 总线收发器 逻辑集成电路 输入元件 |
| 文件： | 总4页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10123 consists of three NOR gates designed for bus driving
applications on card or between cards. Output low logic levels are specified with
V
= –2.1 Vdc so that the bus may be terminated to –2.0 Vdc. The gate output,
OL
when low, appears as a high impedance to the bus, because the output emitter–
followers of the MC10123 are “turned–off.” This eliminates discontinuities in the
characteristic impedance of the bus.
The V
level is specified when driving a 25–ohm load terminated to –2.0
OH
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
Vdc, the equivalent of a 50–ohm bus terminated at both ends. Although 25
ohms is the lowest characteristic impedance that can be driven by the
MC10123, higher impedance values may be used with this part. A typical
50–ohm bus is shown in Figure 1.
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
P
= 310 mW typ/pkg (No Load)
= 3.0 ns typ
D
t
pd
FN SUFFIX
PLCC
CASE 775–02
t , t = 2.5 ns typ (20%–80%)
r f
LOGIC DIAGRAM
DIP
4
5
PIN ASSIGNMENT
3
6
7
V
B
V
CC2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CC1
9
10
11
C
C
C
C
OUT
IN
OUT
OUT
2
A
12
13
14
A
IN
IN
15
A
IN
IN
V
V
V
= PIN 1
= PIN 16
= PIN 8
B
A
CC1
CC2
EE
IN
IN
IN
IN
B
B
A
IN
V
EE
FIGURE 1 — 50–OHM BUS DRIVER (TYPICAL APPLICATION)
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
1/3 MC10123
1/3 MC10123
1/3 MC10123
Z
= 50
Ω
O
50
Ω
50 Ω
RECEIVERS (MECL GATES)
–2.0
VDC
–2.0
VDC
3/93
Motorola, Inc. 1996
REV 5
MC10123
ELECTRICAL CHARACTERISTICS
Test Limits
+25°C
Typ
Pin
Under
Test
–30°C
+85°C
Characteristic
Power Supply Drain Current
Input Current
Symbol
Unit
mAdc
µAdc
µAdc
Min
Max
82
Min
Max
75
Min
Max
82
I
E
8
4
4
3
3
3
3
71
I
350
220
220
inH
I
0.5
inL
Output Voltage
Logic 1
V
OH
–1.060
–2.100
–1.080
–0.890
–2.030
–0.960
–2.100
–0.980
–0.810
–2.030
–0.890
–2.100
–0.910
–0.700
–2.030
Vdc
Vdc
Vdc
Vdc
ns
Output Voltage
Logic 0
Logic 1
Logic 0
V
OL
Threshold Voltage
Threshold Voltage
V
OHA
V
OLA
–2.100
–2.100
–2.100
Switching Times (50Ω Load)
Propagation Delay
t
t
3
3
1.2
1.2
4.6
4.6
1.2
1.2
3.0
3.0
4.4
4.4
1.2
1.2
4.8
4.8
4+3–
4–3+
Rise Time
Fall Time
(20 to 80%)
(20 to 80%)
t
3
3
1.0
1.0
3.7
3.7
1.0
1.0
2.5
2.5
3.5
3.5
1.0
1.0
3.9
3.9
3+
t
3–
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature
–30°C
V
V
V
V
V
EE
IHmax
ILmin
IHAmin
ILAmax
–0.890
–0.810
–0.700
–1.890
–1.850
–1.825
–1.205
–1.105
–1.035
–1.500
–1.475
–1.440
–5.2
–5.2
–5.2
+25°C
+85°C
Pin
Under
Test
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
(V )
CC
Characteristic
Symbol
Gnd
V
V
ILmin
V
V
V
EE
IHmax
IHAmin
ILAmax
Power Supply Drain Current
I
E
8
4,5,6,7,9
10,11,12
13,14
8
1, 16
Input Current
I
4
4
3
3
4
8
8
8
8
1, 16
1, 16
1, 16
1, 16
inH
I
4
inL
Output Voltage
Output Voltage
Logic 1
Logic 0
V
OH
V
4,5,6,7
9,12
OL
Threshold Voltage
Threshold Voltage
Switching Times
Propagation Delay
Logic 1
Logic 0
V
3
3
4,5,6,7
8
8
1, 16
1, 16
OHA
V
9,12
4,5,6,7
OLA
(50Ω Load)
Pulse In
Pulse Out
–3.2 V
+2.0 V
t
t
3
3
4
4
3
3
8
8
1, 16
1, 16
4+3–
4–3+
Rise Time
Fall Time
(20 to 80%)
(20 to 80%)
t
3
3
4
4
3
3
8
8
1, 16
1, 16
3+
t
3–
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
3–79
MOTOROLA
MC10123
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
MOTOROLA
3–80
MC10123
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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MC10123/D
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