BCP69T3 [MOTOROLA]

1A, 25V, PNP, Si, POWER TRANSISTOR, TO-261AA;


型号：	BCP69T3
厂家：	MOTOROLA
描述：	1A, 25V, PNP, Si, POWER TRANSISTOR, TO-261AA 光电二极管晶体管
文件：	总4页 (文件大小：71K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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by BCP69T1/D

SEMICONDUCTOR TECHNICAL DATA

Motorola Preferred Device

This PNP Silicon Epitaxial Transistor is designed for use in low voltage, high current

applications. The device is housed in the SOT-223 package, which is designed for

medium power surface mount applications.

MEDIUM POWER

PNP SILICON

HIGH CURRENT

TRANSISTOR

•

High Current: I = –1.0 Amp

The SOT-223 Package can be soldered using wave or reflow.

SURFACE MOUNT

SOT-223 package ensures level mounting, resulting in improved thermal

conduction, and allows visual inspection of soldered joints. The formed leads

absorb thermal stress during soldering, eliminating the possibility of damage to

the die.

•

Available in 12 mm Tape and Reel

COLLECTOR 2,4

Use BCP69T1 to order the 7 inch/1000 unit reel.

Use BCP69T3 to order the 13 inch/4000 unit reel.

BASE

NPN Complement is BCP68

CASE 318E-04, STYLE 1

TO-261AA

EMITTER 3

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Rating

Collector-Emitter Voltage

Collector-Base Voltage

Emitter-Base Voltage

Symbol

Value

Unit

Vdc

Adc

CEO

CBO

EBO

–25

–20

–5.0

–1.0

Collector Current

(1)

Total Power Dissipation @ T = 25°C

Derate above 25°C

1.5

Watts

mW/°C

Operating and Storage Temperature Range

DEVICE MARKING

T , T

–65 to 150

°C

stg

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance — Junction-to-Ambient (surface mounted)

83.3

°C/W

θJA

Lead Temperature for Soldering, 0.0625″ from case

Time in Solder Bath

260

°C

Sec

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola, Inc. 1996

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Characteristics

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Collector-Emitter Breakdown Voltage (I = –100 µAdc, I = 0)

–25

–20

–5.0

—

Vdc

(BR)CES

(BR)CEO

(BR)EBO

Collector-Emitter Breakdown Voltage (I = –1.0 mAdc, I = 0)

Emitter-Base Breakdown Voltage (I = –10 µAdc, I = 0)

—

Vdc

Collector-Base Cutoff Current (V

= –25 Vdc, I = 0)

CBO

–10

µAdc

Emitter-Base Cutoff Current (V

ON CHARACTERISTICS

DC Current Gain

= –5.0 Vdc, I = 0)

EBO

—

(I = –5.0 mAdc, V

= –10 Vdc)

= –1.0 Vdc)

—

375

—

(I = –500 mAdc, V

(I = –1.0 Adc, V

= –1.0 Vdc)

Collector-Emitter Saturation Voltage (I = –1.0 Adc, I = –100 mAdc)

CE(sat)

—

–0.5

–1.0

Vdc

Base-Emitter On Voltage (I = –1.0 Adc, V

= –1.0 Vdc)

BE(on)

DYNAMIC CHARACTERISTICS

Current-Gain — Bandwidth Product

—

MHz

(I = –10 mAdc, V

= –5.0 Vdc)

TYPICAL ELECTRICAL CHARACTERISTICS

300

200

100

f = 30 MHz

= –10 V

= 25°C

= –1.0 V

= 25°C

–10

–100

, COLLECTOR CURRENT (mA)

–1000

–10

–100

–1000

I , COLLECTOR CURRENT (mA)

Figure 1. DC Current Gain

Figure 2. Current Gain Bandwidth Product

160

120

–1.0

–0.8

= 25

°C

= 25°C

@ I /I = 10

C B

(BE)sat

–0.6

–0.4

@ V

= –1.0 V

(BE)on

–0.2

@ I /I = 10

C B

(CE)sat

Cob

–1.0

–10

–100

–1000

–5.0

–1.0

–2.0

–1.5

–3.0

–2.0

–4.0

–2.5

–5.0

, COLLECTOR CURRENT (mA)

, REVERSE VOLTAGE (VOLTS)

Figure 3. Saturation and “ON” Voltages

Figure 4. Capacitances

Motorola Small–Signal Transistors, FETs and Diodes Device Data

INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE

POWER DISSIPATION

The power dissipation of the SOT-223 is a function of the

input pad size. These can vary from the minimum pad size

for soldering to the pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

the equation for an ambient temperature T of 25°C, one can

calculate the power dissipation of the device which in this

case is 1.5 watts.

150°C – 25°C

determinedby T

ture of the die, R

θJA

junction to ambient; and the operating temperature, T .

Using the values provided on the data sheet for the SOT-223

, themaximumratedjunctiontempera-

, the thermal resistance from the device

J(max)

= 1.5 watts

83.3°C/W

The 83.3°C/W for the SOT-223 package assumes the

recommended collector pad area of 965 sq. mils on a glass

epoxy printed circuit board to achieve a power dissipation of

1.5 watts. If space is at a premium, a more realistic

package, P can be calculated as follows.

– T

J(max)

approach is to use the device at a P of 833 mW using the

θJA

footprint shown. Using a board material such as Thermal

Clad, a power dissipation of 1.6 watts can be achieved using

the same footprint.

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

MOUNTING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•

The soldering temperature and time should not exceed

260°C for more than 10 seconds.

When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•

Always preheat the device.

The delta temperature between the preheat and

soldering should be 100°C or less.*

•

Mechanical stress or shock should not be applied during

cooling

•

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.15

3.8

0.079

2.0

0.248

6.3

0.091

2.3

0.091

2.3

0.079

2.0

inches

0.059

1.5

0.059

1.5

0.059

1.5

SOT-223

Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

INCHES

MILLIMETERS

DIM

MIN

MAX

0.263

0.145

0.068

0.035

0.126

0.094

MIN

6.30

3.30

1.50

0.60

2.90

2.20

0.020

0.24

1.50

0.85

MAX

6.70

3.70

1.75

0.89

3.20

2.40

0.100

0.35

2.00

1.05

0.249

0.130

0.060

0.024

0.115

0.087

0.0008 0.0040

0.009

0.060

0.033

0.014

0.078

0.041

0.08 (0003)

0.264

0.287

6.70

7.30

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

CASE 318E–04

ISSUE H

TO-261AA

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and

Opportunity/Affirmative Action Employer.

are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;

P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454

JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315

MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609

INTERNET: http://Design–NET.com

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

BCP69T1/D

◊

Motorola Small–Signal Transistors, FETs and Diodes Device Data

BCP69T3 [MOTOROLA]

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