54HC367A [MOTOROLA]
Hex 3-State Noninverting Buffer with Separate 2-Bit and 4-Bit Sections; 六角三态同相缓冲带独立2位和4位第
| 型号： | 54HC367A |
| 厂家： | 
MOTOROLA |
| 描述： | Hex 3-State Noninverting Buffer with Separate 2-Bit and 4-Bit Sections |
| 文件： | 总6页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
N SUFFIX
PLASTIC PACKAGE
16–LEAD
CASE 648–08
High–Performance Silicon–Gate CMOS
D SUFFIX
SOIC PACKAGE
16–LEAD
The MC74HC367A is identical in pinout to the LS367. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
CASE 751B–05
DT SUFFIX
TSSOP PACKAGE
16–LEAD
This device is arranged into 2–bit and 4–bit sections, each having its own
active–low Output Enable. When either of the enables is high, the affected
buffer outputs are placed into high–impedance states. The HC367A has
noninverting outputs.
CASE 948F–01
•
•
•
•
•
•
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
ORDERING INFORMATION
MC74HCXXXAN
MC74HCXXXAD
MC74HCXXXADT
Plastic
SOIC
TSSOP
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
•
Chip Complexity: 92 FETs or 23 Equivalent Gates
PIN ASSIGNMENT
OUTPUT
1
2
16
15
V
CC
OUTPUT
ENABLE 2
ENABLE 1
A0
LOGIC DIAGRAM
Y0
A1
3
4
5
6
7
8
14
13
12
11
10
9
A5
Y5
A4
Y4
A3
Y3
2
4
3
5
A0
A1
Y0
Y1
Y1
A2
Y2
6
7
9
A2
A3
Y2
Y3
GND
10
12
FUNCTION TABLE
11
A4
A5
Y4
Y5
Inputs
Enable 1,
Enable 2
Output
14
13
A
Y
L
L
H
L
H
X
L
H
Z
1
OUTPUT ENABLE 1
OUTPUT ENABLE 2
PIN 16 = V
CC
PIN 8 = GND
15
X = don’t care
Z = high impedance
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
3/97
REV 0.1
Motorola, Inc. 1997
MC74HC367A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
CC
V
– 0.5 to V
+ 0.5
V
in
CC
V
out
– 0.5 to V
+ 0.5
V
CC
I
± 20
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
I
DC Output Current, per Pin
± 25
± 50
out
V
should be constrained to the
out
range GND (V or V
)
V
.
DC Supply Current, V
and GND Pins
CC
in out
CC
CC
Unused inputs must always be
tied to an appropriate logic voltage
P
D
Power Dissipation in Still Air,
Plastic DIP†
SOIC Package†
TSSOP Package†
750
500
450
level (e.g., either GND or V ).
CC
Unused outputs must be left open.
T
Storage Temperature
– 65 to + 150
C
C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
L
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C
SOIC Package: – 7 mW/ C from 65 to 125 C
TSSOP Package: – 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
6.0
V , V
in out
V
CC
V
T
A
– 55 + 125
C
t , t
r f
Input Rise and Fall Time
(Figure 1)
V
CC
V
CC
V
CC
= 2.0 V
= 4.5 V
= 6.0 V
0
0
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
= V – 0.1 V
Unit
85 C
125 C
V
IH
Minimum High–Level Input
Voltage
V
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
out
CC
20 µA
|I
|
out
V
Maximum Low–Level Input
Voltage
V
= 0.1 V
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
V
IL
out
|I
|
20 µA
out
V
OH
Minimum High–Level Output
Voltage
V
= V
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
in
IH
20 µA
|I
|
out
V
in
= V
|I
out
|I
out
|I
out
|
|
|
3.6 mA
6.0 mA
7.8 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
IH
MOTOROLA
2
MC74HC367A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
85 C
125 C
Unit
V
OL
Maximum Low–Level Output
Voltage
V
= V
|
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
in
IL
20 µA
|I
out
V
V
= V
|I
|I
|I
|
|
|
3.6 mA
6.0 mA
7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
in
in
IL
out
out
out
I
Maximum Input Leakage Current
= V
or GND
CC
6.0
6.0
± 0.1
± 0.5
± 1.0
± 5.0
± 1.0
± 10
µA
µA
in
I
Maximum Three–State
Leakage Current
Output in High–Impedance State
OZ
V
= V or V
IL
= V
in
IH
or GND
V
out
CC
or GND
I
Maximum Quiescent Supply
Current (per Package)
V
= V
CC
= 0 µA
6.0
4
40
160
µA
CC
in
I
out
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)
L
r
f
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Unit
85 C
125 C
t
t
,
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
2.0
3.0
4.5
6.0
120
60
24
150
75
30
180
90
36
ns
PLH
PHL
20
26
31
t
t
,
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
175
90
35
220
110
44
265
135
53
ns
ns
ns
PLZ
PHZ
30
37
45
t
t
,
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
190
95
38
240
120
48
285
150
57
PZL
PZH
32
21
48
t
t
,
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
22
12
10
75
28
15
13
90
34
18
15
TLH
THL
C
Maximum Input Capacitance
—
—
10
15
10
15
10
15
pF
pF
in
C
Maximum Three–State Output Capacitance
(Output in High–Impedance State)
out
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, V
= 5.0 V
CC
C
Power Dissipation Capacitance (Per Buffer)*
pF
35
PD
2
* Used to determine the no–load dynamic power consumption: P = C
D
Motorola High–Speed CMOS Data Book (DL129/D).
V
f + I
V
. For load considerations, see Chapter 2 of the
PD CC
CC CC
3
MOTOROLA
MC74HC367A
SWITCHING WAVEFORMS
V
CC
50%
t
t
f
r
OUTPUT ENABLE
GND
V
CC
90%
50%
10%
t
t
PLZ
PZL
INPUT A
HIGH
GND
IMPEDANCE
50%
t
t
PHL
PLH
OUTPUT Y
OUTPUT Y
10%
90%
V
V
OL
90%
50%
10%
t
t
PHZ
PZH
OUTPUT Y
OH
50%
HIGH
IMPEDANCE
t
t
THL
TLH
Figure 1.
Figure 2.
TEST CIRCUITS
TEST POINT
TEST POINT
1 k
OUTPUT
CONNECT TO V
WHEN
.
PZL
CC
AND t
Ω
OUTPUT
TESTING t
PLZ
CONNECT TO GND WHEN
TESTING t AND t
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
.
PZH
PHZ
C *
C *
L
L
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 3.
Figure 4.
LOGIC DETAIL
TO OTHER
BUFFERS
ONE OF 6
BUFFERS
V
CC
Y
A
OUTPUT ENABLE
MOTOROLA
4
MC74HC367A
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A
–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
1
9
8
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
MIN
MAX
0.770
0.270
0.175
0.021
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
F
C
L
0.740
0.250
0.145
0.015
0.040
S
0.070
1.77
SEATING
–T
–
PLANE
0.100 BSC
0.050 BSC
0.015
0.130
0.305
2.54 BSC
1.27 BSC
0.38
3.30
7.74
M
K
0.008
0.110
0.295
0.21
2.80
7.50
H
J
G
D 16 PL
0.25 (0.010)
M
S
0°
10°
0°
10°
M
M
T
A
0.020
0.040
0.51
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
1
9
–B
–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
MIN
9.80
3.80
1.35
0.35
0.40
MAX
10.00
4.00
1.75
0.49
MIN
MAX
0.393
0.157
0.068
0.019
0.049
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
F
K
R X 45°
C
1.25
1.27 BSC
–T
0.19
0.10
0.25
0.25
0.009
0.009
J
SEAT
–
ING
M
K
PLANE
D 16 PL
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.229
0.010
M
S
S
0.25 (0.010)
T
B
A
5
MOTOROLA
MC74HC367A
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X KREF
0.10 (0.004)
M
S
S
T
U
V
NOTES:
S
0.15 (0.006) T
U
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
K
K1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
16
9
2X L/2
J1
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
B
–U–
SECTION N–N
L
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
S
0.15 (0.006) T
U
A
M
MILLIMETERS
INCHES
–V–
DIM
A
B
C
D
MIN
4.90
4.30
–––
0.05
0.50
MAX
5.10
4.50
1.20
0.15
0.75
MIN
MAX
0.200
0.177
0.047
0.006
0.030
N
0.193
0.169
–––
0.002
0.020
F
F
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28
0.20
0.16
0.30
0.25
0.007
0.004
0.004
0.007
0.007
0.011
0.008
0.006
0.012
0.010
–W–
C
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
DETAIL E
H
SEATING
PLANE
–T–
D
G
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
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MC74HC367A/D
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