54HC4016J [MOTOROLA]
Quad Analog Switch/Multiplexer/Demultiplexer; 四路模拟开关/多路复用器/多路解复用器型号: | 54HC4016J |
厂家: | MOTOROLA |
描述: | Quad Analog Switch/Multiplexer/Demultiplexer |
文件: | 总11页 (文件大小:352K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
14
The MC54/74HC4016 utilizes silicon–gate CMOS technology to achieve
fast propagation delays, low ON resistances, and low OFF–channel leakage
current. This bilateral switch/multiplexer/demultiplexer controls analog and
1
digital voltages that may vary across the full power–supply range (from V
to GND).
The HC4016 is identical in pinout to the metal–gate CMOS MC14016 and
MC14066. Each device has four independent switches. The device has
CC
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
been designed so that the ON resistances (R
input voltage than R
ON
) are much more linear over
of metal–gate CMOS analog switches.
1
ON
This device is identical in both function and pinout to the HC4066. The
ON/OFF Control inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs. For analog
switches with voltage–level translators, see the HC4316. For analog
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
switches with lower R
characteristics, use the HC4066.
ON
ORDERING INFORMATION
•
•
•
•
•
•
•
Fast Switching and Propagation Speeds
MC54HCXXXXJ
MC74HCXXXXN
MC74HCXXXXD
Ceramic
Plastic
SOIC
High ON/OFF Output Voltage Ratio
Low Crosstalk Between Switches
Diode Protection on All Inputs/Outputs
Wide Power–Supply Voltage Range (V
Analog Input Voltage Range (V
CC
Improved Linearity and Lower ON Resistance over Input Voltage than
– GND) = 2.0 to 12.0 Volts
CC
– GND) = 2.0 to 12.0 Volts
PIN ASSIGNMENT
the MC14016 or MC14066
Low Noise
Chip Complexity: 32 FETs or 8 Equivalent Gates
X
1
2
3
4
14
13
12
11
V
A
CC
•
•
A ON/OFF
CONTROL
D ON/OFF
CONTROL
Y
A
Y
B
B
X
X
D
LOGIC DIAGRAM
B ON/OFF
CONTROL
C ON/OFF
CONTROL
5
6
10
9
Y
Y
D
C
1
2
X
Y
A
A
GND
7
8
X
C
13
4
A ON/OFF CONTROL
3
X
Y
Y
Y
B
B
C
D
FUNCTION TABLE
5
8
ANALOG
On/Off Control
State of
B ON/OFF CONTROL
OUTPUTS/INPUTS
Input
Analog Switch
9
L
H
Off
On
X
C
6
C ON/OFF CONTROL
11
12
10
X
D
D ON/OFF CONTROL
ANALOG INPUTS/OUTPUTS = X , X , X , X
D
A
B
C
PIN 14 = V
PIN 7 = GND
CC
10/95
REV 6
Motorola, Inc. 1995
MC54/74HC4016
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
V
Positive DC Supply Voltage (Referenced to GND)
Analog Input Voltage (Referenced to GND)
Digital Input Voltage (Referenced to GND)
DC Current Into or Out of Any Pin
– 0.5 to + 14.0
CC
V
– 0.5 to V
– 1.5 to V
+ 0.5
V
IS
CC
V
+ 1.5
V
in
CC
I
± 25
mA
mW
cuit. For proper operation, V and
in
P
D
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
V
should be constrained to the
out
range GND (V or V
)
V
CC
.
in out
Unused inputs must always be
tied to an appropriate logic voltage
T
Storage Temperature
– 65 to + 150
C
C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
L
level (e.g., either GND or V ).
CC
260
300
Unused outputs must be left open.
I/O pins must be connected to a
properly terminated line or bus.
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C
Ceramic DIP: – 10 mW/ C from 100 to 125 C
SOIC Package: – 7 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
Max
Unit
V
V
CC
Positive DC Supply Voltage (Referenced to GND)
Analog Input Voltage (Referenced to GND)
Digital Input Voltage (Referenced to GND)
Static or Dynamic Voltage Across Switch
Operating Temperature, All Package Types
12.0
V
IS
GND
GND
—
V
V
V
CC
V
in
V
CC
V
IO
*
1.2
V
T
A
– 55 + 125
C
t , t
r f
Input Rise and Fall Time, ON/OFF
Control Inputs (Figure 10)
V
V
V
= 2.0 V
= 4.5 V
= 9.0 V
0
0
0
0
1000
500
400
250
ns
CC
CC
CC
V
CC
= 12.0 V
* For voltage drops across the switch greater than 1.2 V (switch on), excessive V
current may
CC
and switch input components.
be drawn; i.e., the current out of the switch may contain both V
CC
The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC ELECTRICAL CHARACTERISTICS Digital Section (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
= per spec
Unit
85 C
125 C
V
IH
Minimum High–Level Voltage
ON/OFF Control Inputs
R
R
2.0
4.5
9.0
1.5
3.15
6.3
1.5
3.15
6.3
1.5
3.15
6.3
V
on
on
12.0
8.4
8.4
8.4
V
IL
Maximum Low–Level Voltage
ON/OFF Control Inputs
= per spec
2.0
4.5
9.0
0.3
0.9
1.8
2.4
0.3
0.9
1.8
2.4
0.3
0.9
1.8
2.4
V
12.0
I
Maximum Input Leakage Current,
ON/OFF Control Inputs
V
= V
or GND
12.0
±0.1
±1.0
±1.0
µA
µA
in
in
CC
I
Maximum Quiescent Supply
Current (per Package)
V
V
= V
or GND
6.0
12.0
2
8
20
80
40
160
CC
in
IO
CC
= 0 V
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
MC54/74HC4016
DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
Unit
85 C
125 C
R
Maximum “ON” Resistance
V
V
= V
= V
2.0†
4.5
9.0
—
—
—
Ω
on
in
IS
IH
CC
to GND
320
170
170
400
215
215
480
255
255
I
S
2.0 mA (Figures 1, 2)
12.0
V
V
= V
2.0
4.5
9.0
—
—
—
in
IS
IH
CC
= V or GND (Endpoints)
2.0 mA (Figures 1, 2)
180
135
135
225
170
170
270
205
205
I
S
12.0
∆R
Maximum Difference in “ON”
Resistance Between Any Two
Channels in the Same Package
V
V
in IH
2.0
4.5
9.0
—
30
20
20
—
35
25
25
—
40
30
30
Ω
on
V
I
= 1/2 (V
– GND)
IS
CC
2.0 mA
S
12.0
I
I
Maximum Off–Channel Leakage
Current, Any One Channel
V
V
= V
IL
12.0
12.0
0.1
0.5
1.0
µA
µA
off
in
= V
or GND
IO
CC
Switch Off (Figure 3)
Maximum On–Channel Leakage
Current, Any One Channel
V
V
= V
IH
0.1
0.5
1.0
on
in
IS
= V
or GND
CC
(Figure 4)
†At supply voltage (V
– GND) approaching 2 V the analog switch–on resistance becomes extremely non–linear. Therefore, for low–voltage
CC
operation, it is recommended that these devices only be used to control digital signals.
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, ON/OFF Control Inputs: t = t = 6 ns)
L
r
f
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Unit
85 C
125 C
t
t
,
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 8 and 9)
2.0
4.5
9.0
50
10
10
10
65
13
13
13
75
15
15
15
ns
PLH
PHL
12.0
t
t
,
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
2.0
4.5
9.0
150
30
30
190
38
38
225
45
45
ns
ns
pF
PLZ
PHZ
12.0
30
38
45
t
t
,
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
2.0
4.5
9.0
125
25
25
160
32
32
185
37
37
PZL
PZH
12.0
25
32
37
C
Maximum Capacitance
ON/OFF Control Input
—
10
10
10
Control Input = GND
Analog I/O
—
—
35
1.0
35
1.0
35
1.0
Feedthrough
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, V
= 5.0 V
CC
C
Power Dissipation Capacitance (Per Switch)* (Figure 13)
pF
15
PD
2
* Used to determine the no–load dynamic power consumption: P = C
D
Motorola High–Speed CMOS Data Book (DL129/D).
V
f + I
V
. For load considerations, see Chapter 2 of the
PD CC
CC CC
3
MOTOROLA
MC54/74HC4016
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND unless noted)
Limit*
25 C
54/74HC
V
CC
V
Symbol
Parameter
Test Conditions
= 1 MHz Sine Wave
Unit
BW
Maximum On–Channel Bandwidth or
Minimum Frequency Response
(Figure 5)
f
in
4.5
9.0
12.0
150
160
160
MHz
Adjust f Voltage to Obtain 0 dBm at V
in
OS
Increase f Frequency Until dB Meter Reads – 3 dB
in
R
= 50 Ω, C = 10 pF
L
L
—
—
Off–Channel Feedthrough Isolation
(Figure 6)
4.5
9.0
12.0
– 50
– 50
– 50
dB
f
Sine Wave
in
Adjust f Voltage to Obtain 0 dBm at V
in IS
f
in
= 10 kHz, R = 600 Ω, C = 50 pF
L
L
f
in
= 1.0 MHz, R = 50 Ω, C = 10 pF
4.5
9.0
12.0
– 40
– 40
– 40
L
L
Feedthrough Noise, Control to Switch
(Figure 7)
V
1 MHz Square Wave (t = t = 6 ns)
4.5
9.0
12.0
60
130
200
mV
PP
in
r
f
Adjust R at Setup so that I = 0 A
L
S
R
= 600 Ω, C = 50 pF
L
L
R
= 10 kΩ, C = 10 pF
4.5
9.0
30
65
L
L
12.0
100
—
Crosstalk Between Any Two Switches
(Figure 12)
4.5
9.0
12.0
– 70
– 70
– 70
dB
f
Sine Wave
in
Adjust f Voltage to Obtain 0 dBm at V
in IS
f
in
= 10 kHz, R = 600 Ω, C = 50 pF
L
L
f
in
= 1.0 MHz, R = 50 Ω, C = 10 pF
4.5
9.0
12.0
– 80
– 80
– 80
L
L
THD
Total Harmonic Distortion
(Figure 14)
f
= 1 kHz, R = 10 kΩ, C = 50 pF
%
in
THD = THD
L
L
– THD
Measured
Source
V
IS
V
IS
= 4.0 V
sine wave
sine wave
sine wave
4.5
9.0
12.0
0.10
0.06
0.04
PP
PP
PP
= 8.0 V
= 11.0 V
V
IS
* Guaranteed limits not tested. Determined by design and verified by qualification.
MOTOROLA
4
MC54/74HC4016
3000
2500
2000
1500
1000
500
300
250
200
125°C
125°C
150
100
50
25°C
25°C
–55°C
–55°C
0
0
0
.25
.50
.75
1.00 1.25
1.5
1.75 2.00
0
.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
V
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
V
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
in
in
Figure 1a. Typical On Resistance, V
CC
= 2.0 V
Figure 1b. Typical On Resistance, V = 4.5 V
CC
160
120
100
80
60
40
20
0
140
120
100
80
125°C
25
°
C
C
125°C
25°C
–55
°
60
–55°C
40
20
0
0
.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
V
V
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
in
in
Figure 1c. Typical On Resistance, V
CC
= 6.0 V
Figure 1d. Typical On Resistance, V
= 9.0 V
CC
80
70
60
50
PLOTTER
125
°
C
PROGRAMMABLE
POWER
25°
C
MINI COMPUTER
DC ANALYZER
SUPPLY
40
30
20
10
–
+
V
CC
–55°C
DEVICE
UNDER TEST
ANALOG IN
COMMON OUT
0
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
GND
V
in
Figure 1e. Typical On Resistance, V
CC
= 12.0 V
Figure 2. On Resistance Test Set–Up
5
MOTOROLA
MC54/74HC4016
V
CC
V
V
V
CC
CC
V
14
14
GND
CC
N/C
A
ON
A
OFF
GND
V
CC
SELECTED
CONTROL
INPUT
SELECTED
CONTROL
INPUT
V
IL
IH
7
7
Figure 3. Maximum Off Channel Leakage Current,
Any One Channel, Test Set–Up
Figure 4. Maximum On Channel Leakage Current,
Channel to Channel, Test Set–Up
V
V
V
OS
V
IS
V
OS
CC
14
CC
14
f
in
f
ON
OFF
in
dB
METER
dB
METER
0.1µF
0.1µF
C *
C *
L
R
L
L
SELECTED
CONTROL
INPUT
SELECTED
CONTROL
INPUT
V
CC
7
7
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 5. Maximum On–Channel Bandwidth
Test Set–Up
Figure 6. Off–Channel Feedthrough Isolation,
Test Set–Up
V
V
CC
V
CC/2
CC/2
14
R
S
R
L
L
V
OS
I
OFF/ON
V
CC
C *
L
50%
ANALOG IN
SELECTED
CONTROL
INPUT
GND
7
V
≤
1 MHz
t
t
PHL
in
PLH
t = t = 6 ns
r
f
V
CC
GND
CONTROL
50%
ANALOG OUT
*Includes all probe and jig capacitance.
Figure 7. Feedthrough Noise, ON/OFF Control to
Analog Out, Test Set–Up
Figure 8. Propagation Delays, Analog In to
Analog Out
MOTOROLA
6
MC54/74HC4016
V
t
t
f
CC
r
14
V
CC
90%
50%
10%
CONTROL
ANALOG IN
ANALOG OUT
C *
TEST
POINT
ON
GND
L
t
t
t
PLZ
PZL
HIGH
IMPEDANCE
50%
50%
SELECTED
CONTROL
INPUT
V
CC
10%
90%
V
OL
ANALOG
OUT
7
t
PZH
PHZ
V
OH
HIGH
IMPEDANCE
*Includes all probe and jig capacitance.
Figure 9. Propagation Delay Test Set–Up
Figure 10. Propagation Delay, ON/OFF Control
to Analog Out
1
2
POSITION
POSITION
WHEN TESTING t
WHEN TESTING t
AND t
PHZ
AND t
PLZ
PZH
V
IS
V
CC
1
2
PZL
14
R
V
L
OS
V
CC
14
f
ON
in
V
CC
1 kΩ
0.1 µF
1
2
TEST
POINT
ON/OFF
OFF
V
OR GND
CC
C *
R
C *
R
C *
L
L
L
L
L
R
L
SELECTED
CONTROL
INPUT
SELECTED
CONTROL
INPUT
V
V
CC/2
CC/2
7
7
V
CC/2
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance
Figure 11. Propagation Delay Test Set–Up
Figure 12. Crosstalk Between Any Two Switches,
Test Set–Up
V
CC
A
V
IS
V
CC
V
OS
14
0.1 µF
TO
NC
NC
OFF/ON
f
ON
DISTORTION
METER
in
R
C *
L
L
V
SELECTED
CONTROL
INPUT
CC/2
7
SELECTED
CONTROL
INPUT
V
CC
7
ON/OFF CONTROL
*Includes all probe and jig capacitance.
Figure 13. Power Dissipation Capacitance
Test Set–Up
Figure 14. Total Harmonic Distortion, Test Set–Up
7
MOTOROLA
MC54/74HC4016
0
–10
–20
–30
–40
FUNDAMENTAL FREQUENCY
–50
–60
DEVICE
SOURCE
–70
–80
–90
–100
1.0
2.0
FREQUENCY (kHz)
3.0
Figure 15. Plot, Harmonic Distortion
below, the difference between V
CC
and GND is twelve volts.
APPLICATION INFORMATION
Therefore, using the configuration in Figure 16, a maximum
analog signal of twelve volts peak–to–peak can be con-
trolled.
The ON/OFF Control pins should be at V
or GND logic
CC
being recognized as logic high and GND being
levels, V
CC
recognized as a logic low. Unused analog inputs/outputs
may be left floating (not connected). However, it is advisable
When voltage transients above V
and/or below GND
CC
are anticipated on the analog channels, external diodes (Dx)
are recommended as shown in Figure 17. These diodes
should be small signal, fast turn–on types able to absorb the
maximum anticipated current surges during clipping. An al-
ternate method would be to replace the Dx diodes with
MO sorbs (Motorola high current surge protectors).
MO sorbs are fast turn–on devices ideally suited for precise
DC protection with no inherent wear–out mechanism.
to tie unused analog inputs and outputs to V
or GND
CC
through a low value resistor. This minimizes crosstalk and
feedthrough noise that may be picked up by the unused I/O
pins.
The maximum analog voltage swings are determined by
the supply voltages V
voltage should not exceed V . Similarly, the negative peak
analog voltage should not go below GND. In the example
and GND. The positive peak analog
CC
CC
V
= 12 V
CC
14
+ 12 V
0 V
+ 12 V
ANALOG I/O
ANALOG O/I
ON
0 V
SELECTED
CONTROL
INPUT
+ 12 V
OTHER CONTROL
INPUTS
7
(V
OR GND)
CC
Figure 16. 12 V Application
V
V
CC
CC
D
x
D
D
14
x
ON
D
x
x
SELECTED
CONTROL
INPUT
V
CC
OTHER CONTROL
INPUTS
7
(V
OR GND)
CC
Figure 17. Transient Suppressor Application
MOTOROLA
8
MC54/74HC4016
+5 V
+5 V
14
14
ANALOG
SIGNALS
ANALOG
SIGNALS
ANALOG
SIGNALS
ANALOG
SIGNALS
HCT
BUFFER
R* R* R* R*
HC4016
HC4016
LSTTL/
NMOS
LSTTL/
NMOS
5
6
5
6
CONTROL
INPUTS
CONTROL
INPUTS
14
15
14
15
7
7
R* = 2 TO 10 k
Ω
a. Using Pull-Up Resistors
b. Using HCT Buffer
Figure 18. LSTTL/NMOS to HCMOS Interface
V
= 5 V
V
= 5 TO 12 V
DD
CC
1
16
14
13
3
ANALOG
SIGNALS
ANALOG
SIGNALS
HC4016
5
7
2
5
6
MC14504
9
4
CONTROL
INPUTS
11
14
6
14
15
10
8
7
Figure 19. TTL/NMOS–to–CMOS Level Converter
Analog Signal Peak–to–Peak Greater than 5 V
(Also see HC4316)
1 OF 4
SWITCHES
CHANNEL 4
CHANNEL 3
CHANNEL 2
CHANNEL 1
1 OF 4
SWITCHES
COMMON I/O
1 OF 4
SWITCHES
–
+
1 OF 4
SWITCHES
OUTPUT
1 OF 4
INPUT
LF356 OR
EQUIVALENT
SWITCHES
0.01 µF
1
2
3
4
CONTROL INPUTS
9
MOTOROLA
MC54/74HC4016
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE Y
14
1
8
7
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
-B-
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.785
0.280
0.200
0.020
0.065
MIN
19.05
6.23
3.94
0.39
1.40
MAX
19.94
7.11
5.08
0.50
1.65
0.750
0.245
0.155
0.015
0.055
-T-
SEATING
PLANE
K
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
M
F
G
N
D 14 PL
0.25 (0.010)
J 14 PL
0.300 BSC
15
0.040
7.62 BSC
15
0.51 1.01
0°
°
0°
°
M
M
S
S
T
A
0.25 (0.010)
T
B
0.020
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
ISSUE L
14
1
8
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
7
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
C
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
0
10
0
10
0.015
0.039
0.39
1.01
H
G
D
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE F
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
14
1
8
P 7 PL
–B–
M
M
0.25 (0.010)
B
7
MILLIMETERS
INCHES
G
F
R X 45°
DIM
A
B
C
D
F
G
J
MIN
8.55
3.80
1.35
0.35
0.40
MAX
8.75
4.00
1.75
0.49
1.25
MIN
MAX
0.344
0.157
0.068
0.019
0.049
C
0.337
0.150
0.054
0.014
0.016
J
M
SEATING
PLANE
K
D 14 PL
1.27 BSC
0.050 BSC
0.19
0.10
0.25
0.25
0.008
0.004
0.009
0.009
M
S
S
0.25 (0.010)
T
B
A
K
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.228
0.010
MOTOROLA
10
MC54/74HC4016
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