RM800DG-90F [MITSUBISHI]

HIGH VOLTAGE DIODE MODULES; 高压二极管模块
RM800DG-90F
型号: RM800DG-90F
厂家: Mitsubishi Group    Mitsubishi Group
描述:

HIGH VOLTAGE DIODE MODULES
高压二极管模块

二极管 高压
文件: 总5页 (文件大小:563K)
中文:  中文翻译
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< HIGH VOLTAGE DIODE MODULES >  
RM800DG-90F  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
High Voltage Diode Modules  
RM800DG-90F  
IF····································································800A  
VRRM·························································· 4500V  
2-element in a Pack  
High insulated Type  
Soft Recovery Diode  
AlSiC Baseplate  
APPLICATION  
Traction drives, High Reliability Converters / Inverters, DC choppers  
OUTLINE DRAWING & CIRCUIT DIAGRAM  
Dimensions in mm  
December 2012  
HVM-2026-B.doc  
1
< HIGH VOLTAGE DIODE MODULES >  
RM800DG-90F  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
High Voltage Diode Modules  
MAXIMUM RATINGS  
Symbol  
VRRM  
Item  
Conditions  
Ratings  
Unit  
V
Tj = 40…+125°C  
Tj = 50°C  
4500  
4400  
Repetitive peak reverse voltage  
IF  
Forward current  
DC, Tc = 65°C  
800  
A
kA  
kA2s  
W
IFSM  
Surge forward current  
6.5  
Tj_start = 125°C, tp = 10 ms, Half-sine wave, VR = 0 V  
I2  
Surge current load integral  
Maximum power dissipation  
Isolation voltage  
211  
t
Ptot  
Viso  
Ve  
Tc = 25°C  
4160  
RMS, sinusoidal, f = 60 Hz, t = 1 min.  
RMS, sinusoidal, f = 60 Hz, QPD 10 pC  
10200  
V
Partial discharge extinction voltage  
Junction temperature  
3500  
V
Tj  
50 ~ +150  
50 ~ +125  
55 ~ +125  
°C  
°C  
°C  
Tjop  
Tstg  
Operating junction temperature  
Storage temperature  
ELECTRICAL CHARACTERISTICS  
Limits  
Symbol  
IRRM  
VFM  
trr  
Item  
Conditions  
Unit  
mA  
V
Min  
Typ  
Max  
Tj = 25°C  
1.0  
Repetitive reverse current  
Forward voltage  
VRM = VRRM  
IF = 800 A  
Tj = 125°C  
3.0  
Tj = 25°C  
2.55  
2.85  
0.70  
0.90  
700  
760  
660  
1040  
0.96  
1.50  
1.10  
1.70  
Tj = 125°C  
3.45  
Tj = 25°C  
Reverse recovery time  
Reverse recovery current  
Revers0He recovery charge  
Reverse recovery energy (Note 1)  
Reverse recovery energy  
µs  
A
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
VCC = 2800 V  
IF = 800 A  
Irr  
di/dt = 2600 A/µs @ Tj = 25°C  
di/dt = 2400 A/µs @ Tj = 125°C  
Qrr  
µC  
J
Erec(10%)  
Erec  
Ls = 150 nH  
Inductive load  
J
THERMAL CHARACTERISTICS  
Limits  
Typ  
Symbol  
Rth(j-c)  
Rth(c-s)  
Item  
Conditions  
Unit  
Min  
Max  
30.0  
Thermal resistance  
Junction to Case (per 1/2 module)  
K/kW  
Case to heat sink, grease = 1 W/m·k  
(c-s) = 100 µm (per 1/2 module)  
Contact thermal resistance  
24.0  
K/kW  
D
MECHANICAL CHARACTERISTICS  
Symbol Item  
Limits  
Typ  
Conditions  
Unit  
Min  
7.0  
3.0  
Max  
22.0  
6.0  
Mt  
M8 : Main terminals screw  
M6 : Mounting screw  
N·m  
N·m  
kg  
Mounting torque  
Ms  
m
Mass  
1.0  
CTI  
da  
Comparative tracking index  
Clearance  
600  
26.0  
56.0  
mm  
mm  
nH  
ds  
Creepage distance  
Parasitic stray inductance  
Internal lead resistance  
LP AK  
RAA’+KK’  
22.0  
0.14  
Tc = 25°C  
mΩ  
Note 1.  
Note 2.  
Erec(10%) are the integral of 0.1VR x 0.1IF x dt.  
Definition of all items is according to IEC 60747, unless otherwise specified.  
December 2012  
HVM-2026-B.doc  
2
< HIGH VOLTAGE DIODE MODULES >  
RM800DG-90F  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
High Voltage Diode Modules  
PERFORMANCE CURVES  
FORWARD CHARACTERISTICS  
(TYPICAL)  
REVERSE RECOVERY ENERGY  
CHARACTERISTICS (TYPICAL)  
1600  
1200  
4
3
2
1
0
VCC = 2800V  
-di/dt = 2400 A/µs @125°C  
LS = 150nH, T = 125°C  
j
Inductive load  
T = 25°C  
j
Tj = 125°C  
Erec  
800  
400  
0
0
1
2
3
4
5
0
400  
800  
1200  
1600  
Forward Voltage [V]  
Forward Current [A]  
REVERSE RECOVERY  
REVERSE RECOVERY  
CHARACTERISTICS (TYPICAL)  
SAFE OPERATING AREA (RRSOA)  
100  
10  
1
10000  
1000  
100  
3200  
VCC = 2800V  
VCC 3200V, -di/dt < 4kA/µs  
-di/dt = 2400 A/µs @125°C  
Tj = 125°C  
LS = 150nH, Tj = 125°C  
Inductive load  
2400  
1600  
800  
0
Irr  
trr  
0.1  
10  
100  
1000  
10000  
0
1000  
2000  
3000  
4000  
5000  
Forward Current [A]  
Reverse Voltage [V]  
December 2012  
HVM-2026-B.doc  
3
< HIGH VOLTAGE DIODE MODULES >  
RM800DG-90F  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
High Voltage Diode Modules  
PERFORMANCE CURVES  
TRANSIENT THERMAL IMPEDANCE  
CHARACTERISTICS  
1.2  
t
  
Rt h(j-c) = 30.0K/kW  
n
  
(t )   
i   
1exp  
Zth( jc )  
R
i  
1
0.8  
0.6  
0.4  
0.2  
0
i1  
1
2
3
4
Ri [K/kW]  
ti [sec]  
0.0055  
0.0001  
0.2360  
0.0131  
0.4680  
0.0878  
0.2905  
0.6247  
0.001  
0.01  
0.1  
1
10  
Time [s]  
December 2012  
HVM-2026-B.doc  
4
< HIGH VOLTAGE DIODE MODULES >  
RM800DG-90F  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
High Voltage Diode Modules  
Keep safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more  
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead  
to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit  
designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of  
non-flammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi  
semiconductor product best suited to the customer’s application; they do not convey any license under any  
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.  
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s  
rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application  
examples contained in these materials.  
All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are subject to  
change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi  
Semiconductor product distributor for the latest product information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi  
Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these  
inaccuracies or errors.  
Please also pay attention to information published by Mitsubishi Electric Corporation by various means,  
including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).  
When using any or all of the information contained in these materials, including product data, diagrams,  
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no responsibility for any damage, liability or other loss resulting from the information contained herein.  
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or  
system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi  
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© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.  
December 2012  
HVM-2026-B.doc  
5

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