RM805 [ETC]
POWER AMPLIFIER MODULE FOR BROADBAND; 功率放大器模块宽带型号: | RM805 |
厂家: | ETC |
描述: | POWER AMPLIFIER MODULE FOR BROADBAND |
文件: | 总10页 (文件大小:222K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RM805
Power Amplifier Module for Broadband
The RM805 Power Amplifier (PA) is a fully matched 28-pin surface mount module
designed for Private Mobile Radio (PMR), Wireless Local Loop (WLL), and Time
Division Multiple Access/Advanced Mobile Phone Service (TDMA/AMPS) mobile units
operating in the 806-849 MHz cellular bandwidth. Microwave Monolithic Integrated
Circuits (MMICs), comprised of Gallium Arsenide (GaAs) and CMOS, contain all active
circuitry in the module, which includes on-board bias circuitry as well as input and
interstage matching circuits. The output match is realized off-chip within the module
package to optimize efficiency and high power performance (P3db_sat ≅ 35.8 dBm)
into a 50 Ω load.
Distinguishing Features
•
•
•
•
•
•
Low voltage positive bias supply
Good linearity
High efficiency
Dual mode operation
Large dynamic range
28-pin LCC package
(10 x 13.97 x 1.7 mm)
•
Power down control
This device, manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor
(HBT) and silicon CMOS processes, provides for all positive voltage DC supply
operation while maintaining high efficiency and good linearity. Primary bias to the
RM805 can be supplied directly from a single cell lithium-ion or other suitable battery
with a nominal output 3.5 Volts.
Applications
•
•
•
•
•
PMR (806–825 MHz)
TETRA (806–825 MHz)
TDMA (824–849 MHz)
AMPS (824-849 MHz)
Wireless Local Loop
No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.
Functional Block Diagram
VD4
(28)
VD2
(22)
VD3
(8)
VREG
(1)
CMOS
CONTROLLER
CIRCUIT
RF IN
(5)
INTER
STAGE
MATCH 1
INTER
STAGE
MATCH 2
RF OUT
INPUT
MATCH
OUTPUT
(15)
PA 1
PA 2
MATCH
OUTPUT
STAGE
GaAs HBT IC
MODULE
Data Sheet
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
© 2000–2002 Skyworks Solutions, Inc., All Rights Reserved.
Electrical Specifications
RM805
Power Amplifier Module for Broadband
Electrical Specifications
The following tables list the electrical characteristics of the RM805 Power Amplifier. Table 1 lists
the absolute maximum rating for continuous operation. Table 2 lists the recommended operating
conditions for achieving the electrical performance listed in Table 3, which depicts the electrical
performance of the RM805 Power Amplifier over the recommended operating conditions.
Table 1. Absolute Maximum Ratings(1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
(2)
RF Input Power
Pin
Vcc
Vreg
Tc
—
—
–8.0
3.5
11.0
dBm
Volts
Volts
°C
(3)
Supply Voltage
6.9
(4)
Regulation Voltage
0.0
–30
–55
2.75
+25
—
Vcc
Case Operating Temperature
Storage Temperature
+110
+125
Tstg
°C
NOTE(S):
(1)
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below
nominal value.
Pulsed operation at 25% duty cycle.
When amplifier is biased off (Vreg = 0 V)
Voltage on Vreg pin may not exceed the applied Vcc voltage.
(2)
(3)
(4)
Table 2. Recommended Operating Conditions
Parameter Symbol
Supply Voltage
Minimum
Nominal
Maximum
Unit
Vcc
Vreg
Fo
3.0
2.65
806
3.5
2.75
—
4.4
2.85
849
31.0
+85
Volts
Volts
MHz
dBm
°C
Regulation Voltage
Operating Frequency
Continuous RMS Output Power
Operating Temperature
PoRMS
To
29.0
+25
–30
2
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
RM805
Electrical Specifications
Power Amplifier Module for Broadband
Table 3. Electrical Specifications for TDMA/AMPS Nominal Operating Conditions(1)
Characteristics
Quiescent current
Condition
Symbol
Minimum
Typical
Maximum
Unit
Vreg = 2.75
Iq
332
35.5
35.3
370
38.0
35.8
450
40.0
—
mA
dB
Gain
Po = 29 dBm
G
p
Saturated Output Power
Duty Cycle ≤ 25%
Gain Compression
≤ 3 dB
P3dB sat
dBm
Power Added Efficiency
Harmonic Levels
Po = 29 dBm
Po = P3dB sat
PAEa
PAEd
21.0
48.0
23.0
52.0
—
—
%
%
Second
Third
Fourth
Po ≤ P3db sat
Po ≤ P3db sat
Po ≤ P3db sat
AFo2
AFo3
AFo4
—
—
—
–10.0
–30.0
–30.0
—
—
—
dBm
dBm
dBm
Noise Power in RX Band
Fc + 30 MHz, BW = 18 kHz
Po ≤ 29 dBm
RxBN
—
—
–85.0
dBm/Hz
Noise Figure
—
—
NF
—
—
8.0
—
dB
Input Voltage Standing Wave
Ratio
VSWR
1.3:1
2.0:1
—
Stability (Spurious output)
S
10.0:1
15.0:1
—
—
–36.0
dBm
Ruggedness – No damage
Po ≤ 29 dBm
Ru
—
VSWR
NOTE(S):
(1)
Vcc = +3.5 V, Vreg = +2.75 V, Freq = 815 MHz, Tc = 25 °C, Vreg pulsed at 25% duty cycle, unless otherwise specified.
101505D
December 6, 2002
Skyworks Solutions, Inc., Proprietary
3
Evaluation Board Description
RM805
Power Amplifier Module for Broadband
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the
interface testing of the RM805, the evaluation board schematic and assembly diagram are included
for preliminary analysis and design. Figure 1 shows the basic schematic of the board for the
806 MHz to 849 MHz range and Figure 2 illustrates the board layout.
Figure 1. Evaluation Board Schematic
NC
RM805
NC
101505_009
Figure 2. Evaluation Board Assembly Diagram
GND VCTL VREG VD4 VD3 VD2 VD1 GND
C2
+
+
C1
C3
INPUT
RM805
C5 C6
+
+
C4
C7
IDEN TEST FIXTURE
101505-007
4
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
RM805
Package Dimensions and Pin Descriptions
Power Amplifier Module for Broadband
Package Dimensions and Pin Descriptions
The RM805 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface mount solder attachment to a printed circuit board.
Figure 3. RM805 Package Dimensions
Pin 1
6.99
28 X 0.13
Exposed Center
Ground Pad
0.05
TYPICAL
10.00
6.50
5.00
9.00
4 X R 0.99
13.97
BOTTOM VIEW
R0.38
0.89
1.70
0.76
PAD
FRONT VIEW
DETAIL
101505_006
101505D
December 6, 2002
Skyworks Solutions, Inc., Proprietary
5
Package Dimensions and Pin Descriptions
RM805
Power Amplifier Module for Broadband
Table 4. Pin Names and Descriptions
Pad
Pad
Description
Name
1
VREG1
VCNTL
GND1
GND2
RFIN
Regulated bias enable control voltage, 0.0=Off, 2.75V=On
Reserved for gain adjust control, currently a floating pad
Low Inductance Ground Connection
2
3
4
Low Inductance Ground Connection
5
806-849 MHz RF input signal (typically -8 dBm) 50 Ohm
Low Inductance Ground Connection
6
GND3
VREG2
VD3
7
Reserved for additional VREG signal, currently a floating pad
Supply voltage for driver collector bias (typically 3.5V)
Low Inductance Ground Connection
8
9
GND4
RSVD
GND5
GND6
GND7
VD1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Used to identify device, Skyworks pad must float
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Unused supply voltage, currently a floating pad
806-849 MHz RF output signal (typically +29 dBm) 50 Ohm
Low Inductance Ground Connection
RFOUT
GND8
GND9
GND10
GND11
GND12
GND13
VD2
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Supply voltage for output (final) stage collector bias (typically 3.5V)
Low Inductance Ground Connection
GND14
GND15
GND16
GND17
GND18
VD4
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Low Inductance Ground Connection
Supply voltage for base bias circuitry to all stages (typically 3.5V)
NOTE(S): Center attachment pad must have a low inductance and low thermal resistance connection to the
customer's printed circuit board ground plane.
6
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
RM805
Package and Handling Information
Power Amplifier Module for Broadband
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM805 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Skyworks, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 4. Typical Case Markings
Manufacturing
Part Number-Revision Number
CONEXANT
RM805-NN
EXXXXX.XX
YYWW MEX
Mark Pin 1
Identifier
Lot Number
YY = Manufacture Year
WW = Week Package
Sealed
MEX = Country Code
101505_008
101505D
December 6, 2002
Skyworks Solutions, Inc., Proprietary
7
Electrostatic Discharge Sensitivity
RM805
Power Amplifier Module for Broadband
Electrostatic Discharge Sensitivity
The RM805 is a Class I device. Figure 5 lists the Electrostatic Discharge (ESD) immunity level for
each pin of the RM805 product. The numbers in Figure 5 specify the ESD threshold level for each
pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing
was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model.
Since 2000 volts represents the maximum measurement limit of the test equipment used, pins
marked > 2000 V pass 2000V ESD stress.
7
Figure 5. ESD Sensitivity Areas
> + 2000 V
< – 2000 V
28
27
26
25
24 23
22
VREG1
VCNTL
GND13
GND12
1
2
21
20
> + 2000 V
< – 2000 V
GND11
GND10
19
18
17
3
4
GND1
GND2
+ 700 V
– 1800 V
5
RFIN
GND9
GND3
6
7
16 GND8
RFOUT
> + 2000 V
> + 2000 V
VREG2
15
< – 2000 V
< – 2000 V
8
9
10
11
12
13
14
101505_005
Various failure criteria can be utilized when performing ESD testing. Many vendors employ
relaxed ESD failure standards which fail devices only after “the pin fails the electrical specification
limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria,
fails devices as soon as the pin begins to show any degradation on a curve tracer.
To avoid ESD damage, both latent and visible, it is very important that the product assembly and
test areas follow the Class-1 ESD handling precautions listed in Table 5.
Table 5. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V
Facility
Personnel Grounding
Relative Humidity Control and Air Ionizers
Wrist Straps
9
Dissipative Floors (less than 10 Ω to GND)
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Protective Packaging & Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Static Sensors
Protective Work Order Holders
8
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
Ordering Information
Manufacturing
Part Number
Model Number
Product Revision
Package
Operating Temperature
RM805
RM805–17
17
10.0 x 13.97 x 1.7mm
–30 °C to +85 °C
Revision History
Revision
Level
Date
Description
A
B
C
May 2001
Initial Release
August 2001
June 17, 2002
Revise: Product Description/Applications
Revise: ESD data;
Update: References Information
D
Decmber 6, 2002
Updated Produt Revision to 17
References
Application Note: Tape and Reel, Document Number 101568
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752
© 2000–2002, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are
provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no
responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product
descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility
whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as
may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING
TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT,
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OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS.
SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES,
INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE
MATERIALS.
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damages resulting from such improper use or sale.
The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and "Breakthrough Simplicity"™.
Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-
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Additional information, posted at www.skyworksinc.com, is incorporated by reference.
General Information:
Skyworks Solutions, Inc.
4311 Jamboree Rd.
Newport Beach, CA. 92660-3007
www.skyworksinc.com
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