MGFC36V7177A_11 [MITSUBISHI]

C band internally matched power GaAs FET; C波段内部匹配功率GaAs FET
MGFC36V7177A_11
型号: MGFC36V7177A_11
厂家: Mitsubishi Group    Mitsubishi Group
描述:

C band internally matched power GaAs FET
C波段内部匹配功率GaAs FET

文件: 总3页 (文件大小:120K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
< C band internally matched power GaAs FET >  
MGFC36V7177A  
7.1 – 7.7 GHz BAND / 4W  
DESCRIPTION  
OUTLINE DRAWING Unit : millimeters  
The MGFC36V7177A is an internally impedance-matched  
GaAs power FET especially designed for use in 7.1 – 7.7  
GHz band amplifiers. The hermetically sealed metal-ceramic  
package guarantees high reliability.  
0.6 +/-0.15  
FEATURES  
Class A operation  
Internally matched to 50(ohm) system  
(2)  
(2)  
High output power  
R-1.6  
P1dB=4W (TYP.) @f=7.1 – 7.7GHz  
High power gain  
GLP=9.0dB (TYP.) @f=7.1 – 7.7GHz  
High power added efficiency  
P.A.E.=30% (TYP.) @f=7.1 – 7.7GHz  
Low distortion [ item -51]  
IM3=-45dBc (TYP.) @Po=25dBm S.C.L.  
(3)  
APPLICATION  
item 01 : 7.1 – 7.7 GHz band power amplifier  
item 51 : 7.1 – 7.7 GHz band digital radio communication  
QUALITY  
IG  
RECOMMENDED BIAS CONDITIONS  
VDS=10V ID=1.2A Refer to Bias Procedure RG=100ohm  
(1) GATE  
(2) SOURCE (FLANGE)  
(3) DRAIN  
GF-8  
Absolute maximum ratings (Ta=25C)  
Keep Safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum  
effort into making semiconductor products better  
and more reliable , but there is always the  
possibility that trouble may occur with them.  
Trouble with semiconductors may lead to personal  
injury , fire or property damage. Remember to give  
due consideration to safety when making your  
circuit designs , with appropriate measure such  
as (I) placement of substitutive , auxiliary circuits ,  
(ii) use of non-flammable material or (iii) prevention  
against any malfunction or mishap.  
Symbol  
Parameter  
Ratings  
Unit  
V
Gate to drain  
VGDO  
breakdown voltage  
-15  
VGSO Gate to source breakdown voltage  
-15  
V
ID  
Drain current  
3.75  
-10  
A
IGR  
IGF  
PT *1  
Tch  
Reverse gate current  
Forward gate current  
Total power dissipation  
Cannel temperature  
Storage temperature  
mA  
mA  
W
21  
25  
175  
C  
C  
Tstg  
-65 to +175  
*1 : Tc=25C  
Electrical characteristics  
(Ta=25C)  
Symbol  
Parameter  
Test conditions  
Limits  
Unit  
Min.  
Typ.  
Max.  
Saturated drain current  
Transconductance  
VDS=3V,VGS=0V  
-
-
-
1
3.75  
A
S
IDSS  
VDS=3V,ID=1.1A  
VDS=3V,ID=10mA  
-
gm  
Gate to source cut-off voltage  
-
-
-4.5  
V
VGS(off)  
P1dB  
GLP  
Output power at 1dB gain compression VDS=10V,ID(RF off)=1.2A  
35  
8
36.5  
9
-
-
dBm  
dB  
A
f=7.1 – 7.7GHz  
Linear Power Gain  
Drain current  
ID  
-
-
1.8  
-
P.A.E.  
IM3 *2  
Rth(ch-c) *3  
Power added efficiency  
3rd order IM distortion  
Thermal resistance  
-
30  
-45  
5
%
-42  
-
-
dBc  
C/W  
6
*2 :Item -51,2 tone test, Po=25dBm Single Carrier Level, f=7.7GHz, Delta f=10MHz  
*3 :Channel-case  
Publication Date : Apr., 2011  
1
< C band internally matched power GaAs FET >  
MGFC36V7177A  
7.1 – 7.7 GHz BAND / 4W  
MGFC36V7177A TYPICAL CHARACTERISTICS( Ta=25deg.C )  
P1dB,GLP vs. f  
Po,PAE vs. Pin  
Po,IM3 vs. Pin  
MGFC36V7177A S-parameters( Ta=25deg.C , VDS=10(V),IDS=1.2(A) )  
S Parameters(Typ.)  
f
S11  
S21  
S12  
S22  
(GHz)  
Magn.  
0.41  
0.35  
0.29  
0.22  
0.14  
0.10  
0.18  
Angle(deg.)  
172  
Magn.  
2.85  
2.92  
2.97  
2.98  
2.93  
2.88  
2.79  
Angle(deg.)  
-109  
Magn.  
0.077  
0.082  
0.087  
0.091  
0.096  
0.098  
0.099  
Angle(deg.)  
-157  
-171  
174  
Magn.  
0.25  
0.24  
0.23  
0.21  
0.20  
0.19  
0.21  
Angle(deg.)  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
15  
0
160  
-124  
148  
-139  
-18  
-39  
-65  
-93  
-121  
134  
-154  
160  
123  
-169  
144  
132  
174  
129  
130  
158  
113  
Publication Date : Apr., 2011  
2
< C band internally matched power GaAs FET >  
MGFC36V7177A  
7.1 – 7.7 GHz BAND / 4W  
Keep safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more  
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors  
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when  
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi  
semiconductor product best suited to the customer’s application; they do not convey any license under any  
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.  
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any  
third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
•All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are subject  
to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It  
is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized  
Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product  
listed herein.  
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi  
Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these  
inaccuracies or errors.  
Please also pay attention to information published by Mitsubishi Electric Corporation by various means,  
including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).  
•When using any or all of the information contained in these materials, including product data, diagrams,  
charts, programs, and algorithms, please be sure to evaluate all information as a total system before making  
a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or  
system that is used under circumstances in which human life is potentially at stake. Please contact  
Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when  
considering the use of a product contained herein for any specific purposes, such as apparatus or systems  
for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.  
•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or  
in part these materials.  
•If these products or technologies are subject to the Japanese export control restrictions, they must be  
exported under a license from the Japanese government and cannot be imported into a country other than  
the approved destination.  
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of  
destination is prohibited.  
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor  
for further details on these materials or the products contained therein.  
© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.  
Publication Date : Apr., 2011  
3

相关型号:

MGFC36V7785A

7.7 - 8.5GHz BAND 4W INTERNALLY MATCHED GaAs FET
MITSUBISHI

MGFC36V7785A-01

RF Power Field-Effect Transistor, 1-Element, X Band, Gallium Arsenide, N-Channel, Junction FET
MITSUBISHI

MGFC36V7785A_04

7.7 ~ 8.5GHz BAND 4W INTERNALLY MATCHED GaAs FET
MITSUBISHI

MGFC36V7785A_11

C band internally matched power GaAs FET
MITSUBISHI

MGFC38V3642

RF Power Field-Effect Transistor, C Band, Gallium Arsenide, N-Channel, Junction FET, HERMETIC SEALED PACKAGE-2
MITSUBISHI

MGFC38V3642-01

RF Power Field-Effect Transistor, 1-Element, C Band, Gallium Arsenide, N-Channel, Junction FET, HERMETIC SEALED, METAL CERAMIC, GF-18, 2 PIN
MITSUBISHI

MGFC38V5867

5.8~6.75 GHZ BAND 6W INTERNALLY MATCHED GAASFET
MITSUBISHI

MGFC38V5867_11

C band internally matched power GaAs FET
MITSUBISHI

MGFC38V5964

5.9 - 6.4GHz BAND 6W INTERNALLY MATCHED GaAs FET
MITSUBISHI

MGFC38V5964-51

RF Power Field-Effect Transistor, 1-Element, C Band, Gallium Arsenide, N-Channel, Junction FET
MITSUBISHI

MGFC38V5964_11

C band internally matched power GaAs FET
MITSUBISHI

MGFC38V5964_97

5.9 - 6.4GHz BAND 6W INTERNALLY MATCHED GaAs FET
MITSUBISHI