MGFC36V3742A_11 [MITSUBISHI]

C band internally matched power GaAs FET; C波段内部匹配功率GaAs FET
MGFC36V3742A_11
型号: MGFC36V3742A_11
厂家: Mitsubishi Group    Mitsubishi Group
描述:

C band internally matched power GaAs FET
C波段内部匹配功率GaAs FET

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< C band internally matched power GaAs FET >  
MGFC36V3742A  
3.7 – 4.2 GHz BAND / 4W  
DESCRIPTION  
OUTLINE DRAWING Unit : millimeters  
The MGFC36V3742A is an internally impedance-matched  
GaAs power FET especially designed for use in 3.7 – 4.2  
GHz band amplifiers. The hermetically sealed metal-ceramic  
package guarantees high reliability.  
0.6 +/-0.15  
FEATURES  
Class A operation  
Internally matched to 50(ohm) system  
(2)  
(2)  
High output power  
R-1.6  
P1dB=4W (TYP.) @f=3.7 – 4.2GHz  
High power gain  
GLP=12.5dB (TYP.) @f=3.7 – 4.2GHz  
High power added efficiency  
P.A.E.=33% (TYP.) @f=3.7 – 4.2GHz  
Low distortion [ item -51]  
IM3=-45dBc (TYP.) @Po=25dBm S.C.L.  
(3)  
APPLICATION  
item 01 : 3.7 – 4.2 GHz band power amplifier  
item 51 : 3.7 – 4.2 GHz band digital radio communication  
QUALITY  
IG  
RECOMMENDED BIAS CONDITIONS  
(1) GATE  
(2) SOURCE (FLANGE)  
(3) DRAIN  
VDS=10V ID=1.2A RG=100ohm  
Refer to Bias Procedure  
GF-8  
Absolute maximum ratings (Ta=25C)  
Keep Safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum  
effort into making semiconductor products better  
and more reliable , but there is always the  
possibility that trouble may occur with them.  
Trouble with semiconductors may lead to personal  
injury , fire or property damage. Remember to give  
due consideration to safety when making your  
circuit designs , with appropriate measure such  
as (I) placement of substitutive , auxiliary circuits ,  
(ii) use of non-flammable material or (iii) prevention  
against any malfunction or mishap.  
Symbol  
Parameter  
Ratings  
Unit  
V
Gate to drain  
VGDO  
breakdown voltage  
-15  
VGSO Gate to source breakdown voltage  
-15  
V
ID  
Drain current  
3.75  
-10  
A
IGR  
IGF  
PT *1  
Tch  
Reverse gate current  
Forward gate current  
Total power dissipation  
Cannel temperature  
Storage temperature  
mA  
mA  
W
21  
25  
175  
C  
C  
Tstg  
-65 to +175  
*1 : Tc=25C  
Electrical characteristics  
(Ta=25C)  
Symbol  
Parameter  
Test conditions  
Limits  
Unit  
Min.  
Typ.  
Max.  
Saturated drain current  
Transconductance  
VDS=3V,VGS=0V  
-
-
-
1
3.75  
A
S
IDSS  
VDS=3V,ID=1.1A  
VDS=3V,ID=10mA  
-
gm  
Gate to source cut-off voltage  
-
-
-4.5  
V
VGS(off)  
P1dB  
GLP  
Output power at 1dB gain compression VDS=10V,ID(RF off)=1.2A  
35  
10  
-
37  
12.5  
-
-
-
dBm  
dB  
A
f=3.7 – 4.2GHz  
Linear Power Gain  
Drain current  
ID  
1.8  
-
P.A.E.  
IM3 *2  
Rth(ch-c) *3  
Power added efficiency  
3rd order IM distortion  
Thermal resistance  
-
33  
-45  
5
%
-42  
-
-
dBc  
C/W  
6
*2 :Item -51,2 tone test, Po=25dBm Single Carrier Level, f=4.2GHz, Delta f=10MHz  
*3 :Channel-case  
Publication Date : Apr., 2011  
1
< C band internally matched power GaAs FET >  
MGFC36V3742A  
3.7 – 4.2 GHz BAND / 4W  
MGFC36V3742A TYPICAL CHARACTERISTICS( Ta=25deg.C )  
P1dB,GLP vs. f  
Po,PAE vs. Pin  
Po,IM3 vs. Pin  
MGFC36V3742A S-parameters( Ta=25deg.C , VDS=10(V),IDS=1.2(A) )  
S Parameters(Typ.)  
f
S11  
S21  
S12  
S22  
(GHz)  
Magn.  
0.43  
0.42  
0.40  
0.35  
0.30  
0.32  
Angle(deg.)  
-140  
Magn.  
4.63  
4.69  
4.69  
4.60  
4.44  
4.23  
Angle(deg.)  
Magn.  
0.068  
0.067  
0.071  
0.071  
0.071  
0.070  
Angle(deg.)  
-14  
Magn.  
0.16  
0.12  
0.10  
0.09  
0.08  
0.07  
Angle(deg.)  
-116  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
46  
25  
5
-172  
-32  
-147  
170  
162  
-50  
142  
-12  
-28  
-45  
-70  
134  
126  
-87  
111  
111  
-104  
95  
Publication Date : Apr., 2011  
2
< C band internally matched power GaAs FET >  
MGFC36V3742A  
3.7 – 4.2 GHz BAND / 4W  
Keep safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more  
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors  
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when  
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi  
semiconductor product best suited to the customer’s application; they do not convey any license under any  
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.  
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any  
third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
•All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are subject  
to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It  
is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized  
Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product  
listed herein.  
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi  
Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these  
inaccuracies or errors.  
Please also pay attention to information published by Mitsubishi Electric Corporation by various means,  
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•When using any or all of the information contained in these materials, including product data, diagrams,  
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Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of  
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•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor  
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© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.  
Publication Date : Apr., 2011  
3

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