FU-48SDF-L31M40F [MITSUBISHI]

1.3 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL; 1.3 UM与单模光纤尾纤的DFB -LD模块


型号：	FU-48SDF-L31M40F
厂家：	Mitsubishi Group
描述：	1.3 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.3 UM与单模光纤尾纤的DFB -LD模块光纤
文件：	总6页 (文件大小：173K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

JAN06 (1/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

DESCRIPTION

Module type FU-48SDF-x31M4yF is a cooled butterfly

packaged 1.3μm DFB-LD module with single-mode

optical fiber.

This module is suitable for a light source of analog

applications such CATV systems.

FEATURES

•

High liniality multi quantum wells (MQW) DFB-LD

Emission wavelength is in 1.3μm band

Built-in optical isolator

Thermo electric cooler for laser temperature control

With photodiode for optical output monitor

RoHS (2002/95/EC) compliant

APPLICATION

CATV.

Analog transmission systems

ABSOLUTE MAXIMUM RATINGS (Tld=25°C)

Parameter

Optical output power from fiber end

Forward current

Symbol

Vrl

Vrd

Ifd

Vpem

Ipem

Conditions

Rating

150

2.4

1.2

Unit

Laser diode

Photodiode

Reverse voltage

Forward current

Cooler

(Note)

Voltage

Current

Operating case temperature

Storage temperature

-20 to 65

-40 to 70

°C

Tstg

Note. Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or

operation without heat sink may easily damage the module by exceeding the storage temperature range. Thermistor

resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic damage.

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (2/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

ELECTRICAL/OPTICAL CHARACTERISTICS (Tld=25°C, Tc=25°C, unless otherwise noted)

Parameter

Symbol

Condition

Limits

Typ.

Units

Min.

Max.

Threshold Current

Operating Current

Modulation Current

Ith

Iop

Imod

Imod = Iop-Ith

Please see

'Type vs. CATV performance'

Operating Voltage

Output Power from

Fiber End

Vop

CW, If = Iop (Note1)

CW, If = Iop

1.3

Please see

1.8

'Type vs. CATV performance'

Input impedance

Zin

If=Iop

1310

-17

Central Wavelength

RF driver power

CW, If = Iop

1300

-20

1320

-12

λc

RFin

terminate with 50ohm

by adding 25ohm serial resistor

CW, If = Iop

dBm

Side Mode

Suppression Ratio

Cut-off Frequency

Frequency response

Ripple

fc(-1.5dB) If = Iop

-0.5

3.5

GHz

If = Iop

0.5

ΔS21

f = 47~870MHz

112channel loading

55.25MHz~745.25MHz

(6MHz spacing)

If = Iop (Note2)

Composite Second Order

CSO

CTB

-60

-70

-57

-65

dBc

Composite Triple

Order

Carrier to Noise Ratio

CNR

Please see

'Type vs. CATV performance'

Optical Modulation Depth

RIN (Note 3)

Tracking Error(Note 4)

Differential Efficiency

2.9

3.0

-160

0.3

3.3

-155

0.5

dB/Hz

CW, If = Iop, f =40~870MHz

Tc = -20~65°C, APC, ATC

If(average) = Iop

Please see

mW/mA

'Type vs. CATV performance'

Monitor Current

Dark current( PD )

Capacitance ( PD )

Isolation

Imon

CW, If = Iop, Vrd = 5V

Vrd = 5V

0.1

2.5

μA

0.1

Iso

Vrd = 5V, f = 1MHz

Tc = 0 to 65°C

Note1. If : LD forwad current

Note2. Detailed test condition:

Total loss includes the fiber loss. (Please see 'Type vs. performance'.)

Receiver responsively = 0.9A/W

Input equivalent noise current = 7pA(Hz)^1/2

Optical return loss of the connector should be greater than 40dB in order to get the specification performance.

Note3. Relative intensity noise does not include shot noise of receiver.

Note4. Er = MAX | 10*log(Pf/Pf(25°C))|

TYPE VS. CATV PERFORMANCE (Tld=25°C, Tc=25°C Unless otherwise noted)

Type

Total loss[dB]

Fiber length

Pf[mW]

Imod[mA]

CNR[dB]

η[mW/mA]

Typ.

Min. Typ. Max Typ.

Max

Min.

0.05

0.07

0.11

0.15

0.20

0.22

Max

0.13

0.16

0.30

0.40

Min.

Typ.

-x31M40F

-x31M41F

-x31M42F

-x31M43F

-x31M44F

-x31M45F

1.5

2.5

6.5

8.5

10.5

2.5

0.08

0.12

0.20

0.23

0.27

0.30

5km

49.5

50.5

51.5

8.5

15km

26.5km

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (3/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

THERMAL CHARACTERISTICS (Tld=25°C,Tc=-20~+65°C)

Parameter

Symbol

Conditions

Limits

Typ.

Units

Min.

9.5

Max.

10.5

Thermistor resistance

Rth

Tld=25°C

KΩ

B constant of

thermistor resistance

Cooling capacity

3950

Tc=65°C

ΔT=40K

ΔT

Ipe

Cooler current

Cooler voltage

0.6

1.2

Vpe

OPTICAL FIBER SPECIFICATION

Parameter

Limits

Unit

Type

Mode filed diameter

Cladding diameter

Jacket diameter

Connector type

9.5±1

125±2

900 typ.

μm

Pigtail without fiber, SC/PC, SC/APC, FC/APC

Please see ' FC/APC connector specification'

Lfiber = 1000+200/-0

Fiber pintail length

(Lfiber is defined in the outline drawing.)

Optical return loss to connector

SC/PC

: 50dB min

SC/APC and FC/APC : 60dB min

FC/APC CONNECTOR SPECIFICATION

(1) FC/APC CONNECTOR PARTS

Part

Maker

Part No.

PF11A

FF3A

FC connector

Ferrule

SEIKOH

GIKEN

(2) FERRULE ENDFACE GEOMETRY

Reference

Dimensions

8°

rEP

50μmMAX

5~12mm

±0.1μm

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (4/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

DOCUMENTATION

Threshold current(Ith) at Tc=25°C

Operating current(Iop) at Tc=25°C

Optical output power form fiber end(Pf) at Tc=25°C

Central wavelength(λc) at Tc=25°C

Monitor current(Imon) at Tc=25°C

Differential efficiency(η) at Tc=25°C

Side mode suppression ratio(Sr) at Tc=25°C

Optical modulation(m) at Tc=25°C

RF input power(RFin) at Tc=25°C

Composite second order(CSOL2, CSOH41, CSOH78, CSOH123) at Tc=25°C

Composite triple order(CTB2, CTB41, CTB78, CTB123) at Tc=25°C

Carrier to noise ratio(CNR2, CNR41, CNR78, CNR123) at Tc=25°C

Relative intensity noise(Nr2, Nr123) at Tc=25°C

Pf - If graph at Tc=-20, 25, 65°C

If - Vf graph at Tc=25°C

dPf/dIf - If graph at Tc=25°C

If - Imon graph at Tc=25°C

ORDERING INFORMATION

FU - 48SDF – _ 31M4 _ F

Output Power Range

1.5~2.5mW

2.5~4mW

4~6mW

6~8mW

8~10mW

10~13mW

Connector

SC/PC

SC/APC

FC/APC

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (5/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

OUTLINE DIAGRAM

Unless otherwise noted +/-0.5mm

(Unit : mm)

FU-48SDF-x31M4yF

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (6/6)

MITSUBISHI (OPTICAL DEVICES)

FU-48SDF-x31M4yF

1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

Safety Cautions for Use of Optoelectronic Devices

General:

Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with

semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that

results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended

to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly

observed.

Warning!

1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human

eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-

viewer, or other appropriate instruments.

2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if

made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in

one's mouth or swallow it.

3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general

industrial waste and general garbage.

Handling Cautions for Optoelectronic Devices

1. General:

(1) The products described in this specification are designed and manufactured for use in general communication systems or

electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for

installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.

(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,

vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi

Electric or an authorized distributor.

2. Shipping Conditions:

(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes

upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical

fiber, or other problems.

(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.

(3) Take strict precautions to keep the devices dry when shipping under rain or snow.

3. Storage Conditions:

When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not

taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The

main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over

the following general cautions):

(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent

RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in

case of long-term storage for six months or more.

(2) The atmosphere should be particularly free from toxic gases and dust.

(3) Do not apply any load on the product.

(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead

causing soldering problems in the customer’s assembling process.

(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for

storing. Temperature in storage locations should be stable.

(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the

atmosphere.

(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products

require stricter controls than package sealed products.

4. Design Conditions and Environment under Use:

(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the

generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly

lower the reliability, but also may lead to serious accidents.

(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested

to design not to exceed those ratings even for a short time.

5. ESD Safety Cautions:

The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When

handling this product, please observe the following countermeasures:

To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:

(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot

plates, solder irons and other items for which the commercial power supplies are prone to leakage.

(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at

work is highly recommended.

(3) Use conductive materials for this product’s container, etc.

(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work

area, etc.

(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),

pay close attention to the static electricity in those parts. ESD may damage the product.

(6) Humidity in working environment should be controlled to be 40 percent RH or higher.

These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this

product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

FU-48SDF-L31M40F [MITSUBISHI]

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