FU-48SDF-L37M92F [MITSUBISHI]

1.3 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL; 1.3 UM与单模光纤尾纤的DFB -LD模块
FU-48SDF-L37M92F
型号: FU-48SDF-L37M92F
厂家: Mitsubishi Group    Mitsubishi Group
描述:

1.3 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
1.3 UM与单模光纤尾纤的DFB -LD模块

光纤
文件: 总5页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
JAN06 (1/5)  
MITSUBISHI (OPTICAL DEVICES)  
FU-48SDF-x37M9yF  
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
DESCRIPTION  
Module type FU-48SDF-x37M9yF is a cooled butterfly  
packaged 1.3μm DFB-LD module with single-mode  
optical fiber.  
This module is suitable for a light source of analog  
applications such repeater systems.  
FEATURES  
High liniality multi quantum wells (MQW) DFB-LD  
Emission wavelength is in 1.3μm band  
Built-in optical isolator  
Thermo electric cooler for laser temperature control  
With photodiode for optical output monitor  
RoHS (2002/95/EC) compliant  
APPLICATION  
Repeater systems  
Radio on fiber  
Analog transmission systems  
ABSOLUTE MAXIMUM RATINGS (Tld=25°C)  
Parameter  
Optical output power from fiber end  
Symbol  
Pf  
Conditions  
CW -37M92  
Rating  
10  
Unit  
mW  
Laser diode  
-37M96  
-37M98  
20  
Forward current  
Reverse voltage  
Reverse voltage  
Forward current  
If  
Vrl  
Vrd  
Ifd  
Vpem  
Ipem  
Tc  
CW  
150  
2
20  
2
2.4  
mA  
V
V
mA  
V
A
-
-
-
-
-
-
-
Photodiode  
Cooler  
(Note)  
Voltage  
Current  
Operating case temperature  
Storage temperature  
1.2  
-20 to 65  
-40 to 70  
°C  
°C  
Tstg  
Note. Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or  
operation without heat sink may easily damage the module by exceeding the storage temperature range. Thermistor  
resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic  
damage.  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
MITSUBISHI CONFIDENTIAL  
JAN06 (2/5)  
MITSUBISHI (OPTICAL DEVICES)  
FU-48SDF-x37M9yF  
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
ELECTRICAL/OPTICAL CHARACTERISTICS (Tld=25°C,Tc=25°C, unless otherwise noted)  
Parameter  
Symbol  
Condition  
Limits  
Typ.  
10  
Units  
mA  
Min.  
-
Max.  
20  
Threshold Current  
Ith  
CW  
-37M92  
-37M96  
-37M98  
-37M92  
-37M96  
-37M98  
-37M92  
-37M96  
-37M98  
-
-
-
-
-
-
-
-
15  
40  
43  
54  
30  
33  
39  
1.3  
4
25  
55  
70  
85  
40  
50  
60  
1.8  
-
Operating Current  
Modulation Current  
Iop  
CW  
mA  
mA  
Imod  
Imod = Iop-Ith  
Operating Voltage  
Output Power from Fiber  
End  
Vop  
Pf  
CW, If = Iop (Note1)  
CW, If = Iop  
V
mW  
-37M92  
-37M96  
-37M98  
-
-
-
8
-
-
12  
1310  
35  
Central Wavelength  
CW, If = Iop  
CW, If = Iop  
1290  
30  
1330  
-
nm  
dB  
λc  
Sr  
Side Mode Suppression  
Ratio  
Cut-off Frequency  
fc(-1.5dB) If = Iop  
2
3
-0.5  
-
3
4
-
-
-
GHz  
fc(-3dB)  
ΔS21  
D3  
If = Iop  
If = Iop, f = 1900~2100MHz  
Frequency response ripple  
3rd order distortion  
0.5  
-65  
dB  
2-tone test  
2000±3MHz,  
(Note 2) , f1,f2 =  
21%/carrier,  
-75  
dBc  
m
=
If(average) = Iop  
RIN (Note 3)  
Tracking Error(Note 4)  
Differential Efficiency  
Nr  
Er  
η
CW, If = Iop, f = 2000MHz (Note 2)  
Tc = -20~65°C, APC, ATC  
-
-
-160  
0.3  
0.13  
0.24  
0.31  
-
0.1  
10  
37  
-155  
0.5  
0.4  
0.4  
0.45  
3
1
20  
-
dB/Hz  
dB  
mW/m  
A
If(average) = Iop  
-37M92  
-37M96  
-37M98  
0.1  
0.16  
0.2  
0.1  
-
Monitor Current  
Dark current( PD )  
Capacitance ( PD )  
Isolation  
Imon  
Id  
Ct  
CW, If = Iop, Vrd = 5V  
Vrd = 5V  
Vrd = 5V, f = 1MHz  
Tc = 0 to 65°C  
mA  
mA  
pF  
-
25  
Iso  
dB  
Note 1. If : LD forward current  
Note 2. Optical return loss of the connectors should be greater than 40dB in order to get the specified performance.  
Note 3. Relative intensity noise does not include shot noise of receiver.  
Note 4. Er = MAX |10* log (Pf/Pf(25°C))|  
THERMAL CHARACTERISTICS (Tld=25°C,Tc=-20~+65°C)  
Parameter  
Symbol  
Conditions  
Limits  
Typ.  
10  
Units  
Min.  
9.5  
-
Max.  
10.5  
-
Thermistor resistance  
Rth  
B
Tld=25°C  
-
KΩ  
K
B constant of thermistor  
resistance  
3950  
Cooling capacity  
Tc=65°C  
ΔT=40K  
ΔT=40K  
40  
-
-
-
K
A
V
ΔT  
Ipe  
Cooler current  
Cooler voltage  
0.6  
1.2  
1
2
Vpe  
-
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
MITSUBISHI CONFIDENTIAL  
JAN06 (3/5)  
MITSUBISHI (OPTICAL DEVICES)  
FU-48SDF-x37M9yF  
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
OPTICAL FIBER SPECIFICATION  
Parameter  
Limits  
SM  
Unit  
-
Type  
Mode filed diameter  
Cladding diameter  
Jacket diameter  
Connector type  
9.5±1  
125±2  
900±100  
μm  
μm  
μm  
-
Pigtail without connector(or with SC/PC for test)  
(FU-48SDF-37M92/96/98)  
SC/PC  
FC/PC  
(FU-48SDF-W37M92/96/98)  
(FU-48SDF-V37M92/96/98)  
Lfiber = 1100±100  
Fiber pintail length  
mm  
dB  
(Lfiber is defined in the outline drawing.)  
>45  
Optical return loss of the  
connector  
FC/APC CONNECTOR SPECIFICATION  
(1) FC/APC CONNECTOR PARTS  
Part  
Maker  
Part No.  
PF11A  
FF3A  
FC connector  
Ferrule  
SEIKOH  
GIKEN  
(2) FERRULE ENDFACE GEOMETRY  
Reference  
Dimensions  
8°  
EB  
EO  
rEP  
EQ  
50μmMAX  
5~12mm  
±0.1μm  
ORDERING INFORMATION  
FU - 48SDF – _ 37M9 _ F  
Output Power Range  
2
6
8
4mW  
8mW  
12mW  
Connector  
SC/PC  
SC/APC  
FC/APC  
W
L
Y
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
MITSUBISHI CONFIDENTIAL  
JAN06 (4/5)  
MITSUBISHI (OPTICAL DEVICES)  
FU-48SDF-x37M9yF  
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
OUTLINE DIAGRAM  
Unless otherwise noted +/-0.5mm  
(Unit : mm)  
FU-48SDF-x37M9yF  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
MITSUBISHI CONFIDENTIAL  
JAN06 (5/5)  
MITSUBISHI (OPTICAL DEVICES)  
FU-48SDF-x37M9yF  
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
Safety Cautions for Use of Optoelectronic Devices  
General:  
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with  
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that  
results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended  
to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly  
observed.  
Warning!  
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human  
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-  
viewer, or other appropriate instruments.  
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if  
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in  
one's mouth or swallow it.  
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general  
industrial waste and general garbage.  
Handling Cautions for Optoelectronic Devices  
1. General:  
(1) The products described in this specification are designed and manufactured for use in general communication systems or  
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for  
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.  
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,  
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi  
Electric or an authorized distributor.  
2. Shipping Conditions:  
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes  
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical  
fiber, or other problems.  
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.  
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.  
3. Storage Conditions:  
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not  
taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The  
main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over  
the following general cautions):  
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent  
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in  
case of long-term storage for six months or more.  
(2) The atmosphere should be particularly free from toxic gases and dust.  
(3) Do not apply any load on the product.  
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead  
causing soldering problems in the customer’s assembling process.  
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for  
storing. Temperature in storage locations should be stable.  
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the  
atmosphere.  
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products  
require stricter controls than package sealed products.  
4. Design Conditions and Environment under Use:  
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the  
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly  
lower the reliability, but also may lead to serious accidents.  
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested  
to design not to exceed those ratings even for a short time.  
5. ESD Safety Cautions:  
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When  
handling this product, please observe the following countermeasures:  
<Countermeasures against Static Electricity and Surge>  
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:  
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot  
plates, solder irons and other items for which the commercial power supplies are prone to leakage.  
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at  
work is highly recommended.  
(3) Use conductive materials for this product’s container, etc.  
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work  
area, etc.  
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),  
pay close attention to the static electricity in those parts. ESD may damage the product.  
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.  
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this  
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
MITSUBISHI CONFIDENTIAL  

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