APTGF15X120T3G [MICROSEMI]

3 Phase bridge NPT IGBT Power Module; 3相桥NPT IGBT功率模块
APTGF15X120T3G
型号: APTGF15X120T3G
厂家: Microsemi    Microsemi
描述:

3 Phase bridge NPT IGBT Power Module
3相桥NPT IGBT功率模块

双极性晶体管
文件: 总6页 (文件大小:310K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APTGF15X120T3G  
VCES = 1200V  
3 Phase bridge  
IC = 15A @ Tc = 80°C  
NPT IGBT Power Module  
15  
16  
19  
31  
Application  
Motor control  
23  
25  
29  
30  
14  
Features  
20  
11  
Non Punch Through (NPT) Fast IGBT  
18  
22  
28  
R1  
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
8
7
4
3
Switching frequency up to 50 kHz  
Soft recovery parallel diodes  
Low diode VF  
13  
10  
12  
Low leakage current  
2
RBSOA and SCSOA rated  
It is recommended to connect a decoupling capacitor  
Kelvin emitter for easy drive  
Very low stray inductance  
between pins 31 & 2 to reduce switching overvoltages, if DC  
Power is connected between pins 15, 16 & 12.  
Pins 15 & 16 must be shorted together.  
High level of integration  
Internal thermistor for temperature monitoring  
Benefits  
28 27 26 25  
23 22  
20 19 18  
Outstanding performance at high frequency  
operation  
29  
30  
16  
15  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal  
for easy PCB mounting  
31  
32  
14  
13  
Low profile  
RoHS compliant  
2
3
4
7
8
10 11  
12  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
1200  
25  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
15  
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
60  
±20  
140  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
30A@1150V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 6  
www.microsemi.com  
APTGF15X120T3G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
500  
3.7  
V
GE = 0V  
ICES  
Zero Gate Voltage Collector Current  
µA  
VCE = 1200V  
2.5  
4
3.2  
4.0  
VGE =15V  
VCE(sat) Collector Emitter Saturation Voltage  
VGE(th) Gate Threshold Voltage  
IGES  
V
IC = 15A  
VGE = VCE, IC = 1mA  
6
400  
V
nA  
Gate – Emitter Leakage Current  
VGE = 20V, VCE = 0V  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Qg  
Qge  
Qgc  
Td(on)  
Tr  
Input Capacitance  
1000  
VGE = 0V  
VCE = 25V  
f = 1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Total gate Charge  
150  
70  
99  
VGE = 15V  
V
Bus = 600V  
nC  
Gate – Emitter Charge  
Gate – Collector Charge  
Turn-on Delay Time  
Rise Time  
10  
IC =15A  
70  
60  
Inductive Switching (25°C)  
V
GE = 15V  
50  
315  
ns  
VBus = 600V  
IC = 15A  
Td(off) Turn-off Delay Time  
Tf  
Fall Time  
30  
RG = 33  
Inductive Switching (125°C)  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
60  
50  
356  
VGE = 15V  
ns  
VBus = 600V  
IC = 15A  
Td(off) Turn-off Delay Time  
Tf  
Fall Time  
40  
RG = 33Ω  
V
GE = 15V  
Eon  
Turn-on Switching Energy  
Tj = 125°C  
Tj = 125°C  
2
1
VBus = 600V  
IC = 15A  
mJ  
Eoff  
Turn-off Switching Energy  
RG = 33Ω  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRM  
IF  
1200  
V
µA  
A
Tj = 25°C  
Tj = 125°C  
Tc = 80°C  
100  
500  
VR=1200V  
15  
IF = 15A  
IF = 30A  
IF = 15A  
2.8  
3.4  
2.4  
3.3  
VF  
Diode Forward Voltage  
V
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
240  
290  
260  
960  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
IF = 15A  
VR = 800V  
di/dt =200A/µs  
Qrr  
nC  
2 - 6  
www.microsemi.com  
APTGF15X120T3G  
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).  
Symbol Characteristic  
Min Typ Max Unit  
R25  
Resistance @ 25°C  
50  
kΩ  
K
B 25/85 T25 = 298.15 K  
3952  
R25  
T: Thermistor temperature  
RT: Thermistor value at T  
RT  
=
1
1
T
25/ 85   
exp B  
T25  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.9  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
2
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
2500  
-40  
-40  
-40  
2.5  
V
150  
125  
100  
4.7  
°C  
TSTG  
TC  
Operating Case Temperature  
Torque Mounting torque  
To heatsink  
M4  
N.m  
g
Wt  
Package Weight  
110  
SP3 Package outline (dimensions in mm)  
2 8  
1 7  
1
12  
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com  
3 - 6  
www.microsemi.com  
APTGF15X120T3G  
Typical Performance Curve  
Output Characteristics (VGE=10V)  
Output characteristics (VGE=15V)  
70  
60  
50  
40  
30  
20  
10  
0
16  
14  
12  
10  
8
250µs Pulse Test  
< 0.5% Duty cycle  
250µs Pulse Test  
< 0.5% Duty cycle  
TJ=25°C  
TJ=25°C  
6
TJ=125°C  
4
TJ=125°C  
2
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
0
1
2
3
4
5
6
7
8
VCE, Collector to Emitter Voltage (V)  
VCE, Collector to Emitter Voltage (V)  
Gate Charge  
Transfer Characteristics  
70  
60  
50  
40  
30  
20  
10  
0
18  
IC = 15A  
J = 25°C  
VCE=240V  
250µs Pulse Test  
< 0.5% Duty cycle  
16  
14  
12  
10  
8
T
VCE=600V  
VCE=960V  
6
TJ=125°C  
TJ=25°C  
4
2
0
0
20  
40  
60  
80  
100  
120  
0
2.5  
5
7.5  
10  
12.5  
15  
VGE, Gate to Emitter Voltage (V)  
Gate Charge (nC)  
On state Voltage vs Junction Temperature  
On state Voltage vs Gate to Emitter Volt.  
9
6
5
4
3
2
1
0
TJ = 125°C  
250µs Pulse Test  
250µs Pulse Test  
Ic=30A  
8
7
6
5
4
3
2
1
0
< 0.5% Duty cycle  
< 0.5% Duty cycle  
VGE = 15V  
Ic=30A  
Ic=15A  
Ic=15A  
Ic=7.5A  
Ic=7.5A  
9
10  
11  
12  
13  
14  
15  
16  
-50  
-25  
0
25  
50  
75  
100 125  
V
GE, Gate to Emitter Voltage (V)  
TJ, Junction Temperature (°C)  
DC Collector Current vs Case Temperature  
Breakdown Voltage vs Junction Temp.  
40  
35  
30  
25  
20  
15  
10  
5
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0
-50 -25  
0
25  
50  
75 100 125  
-50 -25  
0
25  
50  
75 100 125 150  
TC, Case Temperature (°C)  
TJ, Junction Temperature (°C)  
4 - 6  
www.microsemi.com  
APTGF15X120T3G  
Turn-On Delay Time vs Collector Current  
Turn-Off Delay Time vs Collector Current  
75  
70  
65  
60  
55  
50  
400  
350  
300  
250  
200  
VCE = 600V  
VGE=15V,  
TJ=125°C  
RG = 33  
VGE = 15V  
VGE=15V,  
TJ=25°C  
VCE = 600V  
RG = 33Ω  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
I
CE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Current Rise Time vs Collector Current  
Current Fall Time vs Collector Current  
160  
120  
80  
40  
0
50  
45  
40  
35  
30  
25  
20  
VCE = 600V  
R
G = 33Ω  
TJ = 125°C  
TJ = 25°C  
VGE=15V  
VCE = 600V, VGE = 15V, RG = 33Ω  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
I
CE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Turn-Off Energy Loss vs Collector Current  
2.5  
Turn-On Energy Loss vs Collector Current  
8
7
6
5
4
3
2
1
0
VCE = 600V  
TJ=125°C,  
VCE = 600V  
GE = 15V  
G = 33Ω  
TJ = 125°C  
R
G = 33Ω  
V
R
2
V
GE=15V  
1.5  
1
TJ = 25°C  
TJ=25°C,  
VGE=15V  
0.5  
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
ICE, Collector to Emitter Current (A)  
I
CE, Collector to Emitter Current (A)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
8
7
6
5
4
3
2
1
0
35  
30  
25  
20  
15  
10  
5
VCE = 600V  
V
GE = 15V  
TJ= 125°C  
Eon, 15A  
Eoff, 15A  
0
0
20  
40  
60  
80  
100  
120  
0
400  
800  
1200  
VCE, Collector to Emitter Voltage (V)  
Gate Resistance (Ohms)  
5 - 6  
www.microsemi.com  
APTGF15X120T3G  
Capacitance vs Collector to Emitter Voltage  
Operating Frequency vs Collector Current  
10000  
1000  
100  
120  
100  
80  
60  
40  
20  
0
VCE = 600V  
D = 50%  
Cies  
R
G = 33  
TJ = 125°C  
TC= 75°C  
Coes  
Cres  
Hard  
switching  
10  
0
10  
20  
30  
40  
50  
0
5
10  
15  
20  
25  
VCE, Collector to Emitter Voltage (V)  
IC, Collector Current (A)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
1
0.8  
0.6  
0.4  
0.2  
0
0.9  
0.7  
0.5  
0.3  
Single Pulse  
0.1  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
6 - 6  
www.microsemi.com  

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