APT6021BLLG [MICROSEMI]

Power Field-Effect Transistor, 29A I(D), 600V, 0.21ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AD, TO-247, 3 PIN;
APT6021BLLG
型号: APT6021BLLG
厂家: Microsemi    Microsemi
描述:

Power Field-Effect Transistor, 29A I(D), 600V, 0.21ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AD, TO-247, 3 PIN

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APT6021BLL  
APT6021SLL  
600V 29A 0.210Ω  
R
BLL  
POWER MOS 7 MOSFET  
D3PAK  
TO-247  
Power MOS 7® is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS. Both conduction and switching  
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)  
and Qg. Power MOS 7® combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT's  
patented metal gate structure.  
SLL  
D
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• IncreasedPowerDissipation  
• Easier To Drive  
• TO-247 or Surface Mount D3PAK Package  
G
S
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT6021BLL_SLL  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
600  
29  
Volts  
Continuous Drain Current @ TC = 25°C  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
116  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
±30  
±40  
Watts  
W/°C  
400  
PD  
3.20  
-55 to 150  
300  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
29  
1
EAR  
EAS  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
30  
4
1300  
STATICELECTRICALCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Volts  
Ohms  
BVDSS  
RDS(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
600  
2
Drain-Source On-State Resistance  
(VGS = 10V, ID = 14.5A)  
0.210  
100  
500  
±100  
5
Zero Gate Voltage Drain Current (VDS = 600V, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 480V, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 1mA)  
IDSS  
µA  
IGSS  
nA  
VGS(th)  
Volts  
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT6021BLL_SLL  
TestConditions  
UNIT  
MIN  
TYP  
MAX  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
3470  
635  
48  
V
= 0V  
GS  
Output Capacitance  
pF  
V
= 25V  
DS  
f = 1 MHz  
Reverse Transfer Capacitance  
3
Total Gate Charge  
V
= 10V  
80  
GS  
V
= 300V  
Qgs  
Qgd  
td(on)  
tr  
DD  
nC  
ns  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
20  
I
= 29A @ 25°C  
D
44  
RESISTIVESWITCHING  
10  
V
= 15V  
GS  
7
V
= 300V  
DD  
I
= 29A @ 25°C  
td(off)  
25  
Turn-off Delay Time  
Fall Time  
D
R
= 1.6Ω  
G
tf  
4
INDUCTIVESWITCHING@25°C  
6
Eon  
Eoff  
Eon  
Eoff  
Turn-on Switching Energy  
325  
205  
500  
250  
V
= 400V, V = 15V  
GS  
DD  
I
= 29A, R = 5Ω  
Turn-off Switching Energy  
D
G
µJ  
INDUCTIVESWITCHING@125°C  
6
Turn-on Switching Energy  
V
= 400V V = 15V  
GS  
DD  
I
= 29A, R = 5Ω  
Turn-off Switching Energy  
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS  
Symbol  
MIN  
TYP  
MAX  
29  
Characteristic / Test Conditions  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
ISM  
1
116  
1.3  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
2
VSD  
t rr  
(VGS = 0V, IS = -29A)  
Volts  
ns  
664  
Reverse Recovery Time (IS = -29A, dlS/dt = 100A/µs)  
Reverse Recovery Charge (IS = -29A, dlS/dt = 100A/µs)  
Q rr  
9.29  
µC  
dv  
/
dv  
5
V/ns  
8
Peak Diode Recovery  
/
dt  
dt  
THERMALCHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.31  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive Rating: Pulse width limited by maximum junction  
temperature  
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See MIL-STD-750 Method 3471  
4 Starting T = +25°C, L = 3.09mH, R = 25, Peak I = 29A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
device itself.  
I
-I 29A  
/
700A/µs  
VR V  
T 150°C  
J
dt  
S
D
DSS  
6
Eon includes diode reverse recovery. See figures 18, 20.  
APTReservestherighttochange,withoutnotice,thespecificationsandinformationcontainedherein.  
0.35  
0.30  
0.9  
0.25  
0.7  
0.20  
Note:  
0.5  
0.15  
t
1
0.3  
0.10  
t
2
t
1
Duty Factor D =  
/
t
2
0.05  
0
Peak T = P  
x Z + T  
0.1  
J
DM  
θJC C  
0.05  
SINGLEPULSE  
10-3  
10-5  
10-4  
10-2  
10-1  
1.0  
RECTANGULARPULSEDURATION(SECONDS)  
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION  
Typical Performance Curves  
APT6021BLL_SLL  
80  
60  
40  
V
=15 &10V  
GS  
RC MODEL  
Junction  
temp. (°C)  
8V  
0.131  
0.180  
0.00789F  
0.161F  
7.5V  
7V  
Power  
(watts)  
6.5V  
20  
0
Case temperature. (°C)  
6V  
5.5V  
0
5
10  
15  
20  
25  
30  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGURE3,LOW VOLTAGE OUTPUTCHARACTERISTICS  
1.2  
100  
NORMALIZED TO  
V
> I (ON) x  
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
R
(ON)MAX.  
DS  
DS  
D
V
= 10V  
@
14.5A  
90  
80  
70  
60  
50  
40  
30  
20  
GS  
1.15  
1.10  
1.05  
1.00  
V
=10V  
GS  
V
=20V  
GS  
T
T
= +125°C  
J
= +25°C  
J
0.95  
0.90  
10  
0
T = -55°C  
J
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
60  
V
,GATE-TO-SOURCEVOLTAGE(VOLTS)  
I ,DRAINCURRENT(AMPERES)  
GS  
D
FIGURE4, TRANSFERCHARACTERISTICS  
FIGURE5,R (ON)vsDRAINCURRENT  
DS  
1.15  
1.10  
1.05  
1.00  
30  
25  
20  
15  
10  
0.95  
0.90  
5
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100 125 150  
T ,CASETEMPERATURE(°C)  
T ,JUNCTIONTEMPERATURE(°C)  
C
J
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE  
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE  
2.5  
1.2  
I
= 14.5A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T ,JUNCTIONTEMPERATURE(°C)  
T ,CASETEMPERATURE(°C)  
J
C
FIGURE8,ON-RESISTANCEvs.TEMPERATURE  
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE  
APT6021BLL_SLL  
Typical Performance Curves  
116  
10,000  
1,000  
OPERATIONHERE  
C
iss  
LIMITEDBYR (ON)  
DS  
50  
100µS  
C
oss  
10  
100  
10  
C
rss  
1mS  
T
=+25°C  
C
T =+150°C  
J
SINGLEPULSE  
10mS  
1
16  
12  
8
1
10  
100  
600  
0
V
10  
20  
30  
40  
50  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
DS  
FIGURE10,MAXIMUMSAFEOPERATINGAREA  
FIGURE11, CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE  
200  
I
= 29A  
D
100  
V
=120V  
DS  
T =+150°C  
J
V
=300V  
T =+25°C  
J
DS  
V
=480V  
10  
DS  
4
0
1
0
20  
40  
60  
80  
100  
120  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
Q ,TOTALGATECHARGE(nC)  
,SOURCE-TO-DRAINVOLTAGE(VOLTS)  
g
SD  
FIGURE12,GATECHARGESvsGATE-TO-SOURCEVOLTAGE  
FIGURE13, SOURCE-DRAINDIODEFORWARDVOLTAGE  
70  
60  
V
= 400V  
DD  
= 5Ω  
R
T
G
60  
50  
40  
30  
20  
= 125°C  
J
t
L = 100µH  
d(off)  
50  
V
= 400V  
DD  
= 5Ω  
t
f
R
T
G
40  
30  
20  
= 125°C  
J
L = 100µH  
t
r
t
d(on)  
10  
0
10  
0
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
I
(A)  
I (A)  
D
D
FIGURE 14, DELAY TIMES vs CURRENT  
FIGURE 15, RISE AND FALL TIMES vs CURRENT  
1000  
800  
600  
400  
1400  
1200  
1000  
800  
V
= 400V  
DD  
= 5Ω  
V
I
= 400V  
DD  
= 29A  
R
T
G
D
= 125°C  
J
T = 125°C  
J
E
off  
L = 100µH  
L = 100µH  
EON includes  
E
on  
EON includes  
diode reverse recovery.  
diode reverse recovery.  
E
on  
600  
400  
E
off  
200  
0
200  
0
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
I
(A)  
R ,GATERESISTANCE(Ohms)  
D
G
FIGURE16, SWITCHING ENERGYvs CURRENT  
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE  
APT6021BLL_SLL  
Gate Voltage  
10 %  
90%  
Gate Voltage  
T
= 125 C  
T
= 125 C  
J
J
t
d(off)  
t
d(on)  
tr  
90%  
Drain Current  
Drain Voltage  
Drain Voltage  
Drain Current  
90%  
t
f
5 %  
5 %  
10%  
0
10 %  
Switching Energy  
Switching Energy  
Figure19,Turn-offSwitchingWaveformsandDefinitions  
Figure18,Turn-onSwitchingWaveformsandDefinitions  
APT15DF60  
VDS  
ID  
VDD  
G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
D3PAKPackageOutline  
TO-247 Package Outline  
4.98 (.196)  
5.08 (.200)  
1.47 (.058)  
1.57 (.062)  
4.69 (.185)  
15.95 (.628)  
16.05 (.632)  
13.41 (.528)  
13.51 (.532)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15 (.045)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99 (.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
2.67 (.105)  
2.84 (.112)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
Heat Sink (Drain)  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.}  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
Source  
Drain  
Gate  
Dimensions in Millimeters (Inches)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’sproductsarecoveredbyoneormoreofU.S.patents4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058andforeignpatents. USandForeignpatentspending. AllRightsReserved.  

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