APT30M36LFLLG [MICROSEMI]

Power Field-Effect Transistor, 84A I(D), 300V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN;
APT30M36LFLLG
型号: APT30M36LFLLG
厂家: Microsemi    Microsemi
描述:

Power Field-Effect Transistor, 84A I(D), 300V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN

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APT30M36B2FLL  
APT30M36LFLL  
300V 84A 0.036Ω  
R
FET  
POWER MOS 7 FREDFET  
B2FLL  
Power MOS 7® is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS. Both conduction and switching  
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)  
and Qg. Power MOS 7® combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT's  
patented metal gate structure.  
T-MAX™  
TO-264  
LFLL  
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• Increased Power Dissipation  
• Easier To Drive  
D
S
• Popular T-MAX™ or TO-264 Package  
G
FAST RECOVERY BODY DIODE  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT30M36B2FLL_LFLL  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
300  
84  
Volts  
Continuous Drain Current @ TC = 25°C  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
336  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
±30  
±40  
Watts  
W/°C  
568  
PD  
4.55  
-55 to 150  
300  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
84  
1
EAR  
EAS  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
50  
4
2500  
STATICELECTRICALCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Volts  
Ohms  
BVDSS  
RDS(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
300  
2
Drain-Source On-State Resistance  
(VGS = 10V, ID = 42A)  
0.036  
250  
Zero Gate Voltage Drain Current (VDS = 300V, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 240V, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)  
IDSS  
µA  
1000  
±100  
5
IGSS  
nA  
VGS(th)  
Volts  
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
APT30M36B2FLL_LFLL  
DYNAMIC CHARACTERISTICS  
Symbol  
Ciss  
Coss  
Crss  
Qg  
MIN  
TYP  
MAX  
Characteristic  
UNIT  
TestConditions  
V
= 0V  
Input Capacitance  
6480  
1540  
GS  
V
= 25V  
pF  
Output Capacitance  
DS  
f = 1 MHz  
Reverse Transfer Capacitance  
75  
115  
35  
3
V
= 10V  
Total Gate Charge  
GS  
V
= 150V  
Qgs  
nC  
ns  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
DD  
I
= 84A @ 25°C  
D
Qgd  
45  
RESISTIVESWITCHING  
td(on)  
tr  
15  
31  
V
= 15V  
GS  
V
= 150V  
DD  
td(off)  
29  
Turn-off Delay Time  
Fall Time  
I
= 84A @ 25°C  
D
tf  
R
= 0.6Ω  
4
G
INDUCTIVESWITCHING@25°C  
6
Eon  
Eoff  
730  
765  
855  
845  
Turn-on Switching Energy  
V
= 200V, V = 15V  
GS  
DD  
I
Turn-off Switching Energy  
= 84A, R = 5Ω  
D
G
µJ  
INDUCTIVESWITCHING@125°C  
6
Eon  
Eoff  
Turn-on Switching Energy  
V
= 200V, V = 15V  
GS  
DD  
Turn-off Switching Energy  
I
= 84A, R = 5Ω  
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
84  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
1
ISM  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
336  
1.3  
8
2
VSD  
Volts  
V/ns  
(VGS = 0V, IS = -84A)  
dv  
/
dv  
5
Peak Diode Recovery  
/
dt  
dt  
Reverse Recovery Time  
(IS = -84A, di/dt = 100A/µs)  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
240  
500  
trr  
ns  
µC  
Reverse Recovery Charge  
(IS = -84A, di/dt = 100A/µs)  
1.1  
5.2  
12  
Qrr  
Peak Recovery Current  
(IS = -84A, di/dt = 100A/µs)  
IRRM  
Amps  
22  
THERMALCHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.22  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive Rating: Pulse width limited by maximum junction  
temperature  
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See MIL-STD-750 Method 3471  
4 Starting T = +25°C, L = 0.71mH, R = 25, Peak I = 84A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
device itself.  
I
-I 84A  
/
700A/µs  
V
R 300 T 150°C  
dt  
S
D
J
6 Eon includes diode reverse recovery. See figures 18, 20.  
APTReservestherighttochange,withoutnotice,thespecificationsandinforationcontainedherein.  
0.25  
0.9  
0.20  
0.7  
0.15  
0.5  
Note:  
0.10  
t
1
0.3  
t
2
t
0.05  
1
Duty Factor D =  
/
t
2
0.1  
Peak T = P  
x Z + T  
SINGLEPULSE  
0.05  
J
DM  
θJC C  
0
10-5  
10-4  
10-3  
10-2  
10-1  
1
RECTANGULARPULSEDURATION(SECONDS)  
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION  
Typical Performance Curves  
APT30M36B2FLL_LFLL  
200  
160  
120  
80  
V
=15V  
GS  
RC MODEL  
10V  
Junction  
temp. (°C)  
9V  
0.0145  
0.0871  
0.120  
0.00193F  
0.0167F  
0.197F  
8V  
Power  
(watts)  
7.5V  
7V  
40  
6.5V  
6V  
Case temperature. (°C)  
0
0
V
5
10  
15  
20  
25  
30  
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGURE3,LOW VOLTAGE OUTPUTCHARACTERISTICS  
250  
1.4  
NORMALIZED TO  
V
> I (ON) x  
DS  
R
(ON)MAX.  
DS  
D
V
= 10V  
@
I
= 42A  
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
GS  
D
1.3  
1.2  
1.1  
1.0  
200  
150  
100  
50  
V
=10V  
GS  
T
= +25°C  
V
=20V  
J
0.9  
0.8  
GS  
T
= +125°C  
J
T
= -55°C  
J
0
0
V
2
4
6
8
10  
0
20  
40  
60  
80 100 120 140 160  
,GATE-TO-SOURCEVOLTAGE(VOLTS)  
I ,DRAINCURRENT(AMPERES)  
GS  
D
FIGURE4, TRANSFERCHARACTERISTICS  
FIGURE5,R (ON)vsDRAINCURRENT  
DS  
90  
80  
70  
60  
50  
40  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
30  
20  
10  
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100 125 150  
T ,CASETEMPERATURE(°C)  
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE  
T ,JUNCTIONTEMPERATURE(°C)  
C
J
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE  
2.5  
1.2  
I
= 42A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T ,JUNCTIONTEMPERATURE(°C)  
T ,CASETEMPERATURE(°C)  
J
C
FIGURE8,ON-RESISTANCEvs.TEMPERATURE  
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE  
APT30M36B2FLL_LFLL  
336  
20,000  
10,000  
5,000  
OPERATIONHERE  
LIMITEDBYR (ON)  
DS  
C
iss  
100  
50  
C
oss  
1,000  
500  
100µS  
10  
5
1mS  
100  
10  
C
rss  
10mS  
T
=+25°C  
C
T =+150°C  
J
SINGLEPULSE  
5
1
1
10  
50 100  
300  
0
10  
20  
30  
40  
50  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
DS  
FIGURE10,MAXIMUMSAFEOPERATINGAREA  
FIGURE11,CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE  
16  
14  
12  
10  
8
200  
I
= 84A  
D
100  
V
=60V  
DS  
T =+150°C  
50  
J
V
=150V  
T =+25°C  
DS  
J
V
=240V  
DS  
10  
5
6
4
2
0
1
0
20 40 60 80 100 120 140 160 180  
Q ,TOTALGATECHARGE(nC)  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
,SOURCE-TO-DRAINVOLTAGE(VOLTS)  
g
SD  
FIGURE12,GATECHARGESvsGATE-TO-SOURCEVOLTAGE  
FIGURE13,SOURCE-DRAINDIODEFORWARDVOLTAGE  
80  
140  
V
= 200V  
DD  
= 5Ω  
t
d(off)  
R
T
G
70  
60  
120  
100  
80  
60  
40  
20  
0
= 125°C  
t
J
f
L = 100µH  
V
= 200V  
DD  
= 5Ω  
50  
40  
30  
20  
10  
0
R
T
G
= 125°C  
J
t
L = 100µH  
r
t
d(on)  
40  
60  
80  
100  
(A)  
120  
140  
40  
60  
80  
100  
120  
140  
I
I (A)  
D
D
FIGURE 14, DELAY TIMES vs CURRENT  
FIGURE 15, RISE AND FALL TIMES vs CURRENT  
3000  
2000  
1500  
1000  
500  
0
V
= 200V  
DD  
= 5Ω  
R
T
G
E
2500  
2000  
1500  
1000  
off  
= 125°C  
J
L = 100µH  
E
off  
EON includes  
diode reverse recovery.  
E
on  
V
I
= 200V  
DD  
= 84A  
E
on  
D
T
= 125°C  
J
500  
0
L = 100µH  
EON includes  
diode reverse recovery.  
40  
60  
80  
100  
120  
140  
0
5
10 15 20 25 30 35 40 45 50  
I
D
(A)  
R ,GATERESISTANCE(Ohms)  
G
FIGURE16, SWITCHING ENERGYvs CURRENT  
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE  
APT30M36B2FLL_LFLL  
90%  
10%  
GateVoltage  
DrainCurrent  
GateVoltage  
T 125°C  
J
T 125°C  
J
td(off)  
td(on)  
tr  
90%  
DrainVoltage  
90%  
tf  
10%  
0
5%  
5%  
10%  
DrainCurrent  
DrainVoltage  
SwitchingEnergy  
SwitchingEnergy  
Figure18,Turn-onSwitchingWaveformsandDefinitions  
Figure19,Turn-offSwitchingWaveformsandDefinitions  
APT60DS30  
VDS  
ID  
VDD  
G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
T-MAXTM (B2)PackageOutline  
TO-264(L)PackageOutline  
4.69 (.185)  
4.60 (.181)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
5.21 (.205)  
19.51 (.768)  
20.50 (.807)  
1.49 (.059)  
2.49 (.098)  
1.80 (.071)  
2.01 (.079)  
3.10 (.122)  
3.48 (.137)  
5.38 (.212)  
6.20 (.244)  
5.79 (.228)  
6.20 (.244)  
20.80 (.819)  
21.46 (.845)  
25.48 (1.003)  
26.49 (1.043)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
2.29 (.090)  
2.69 (.106)  
2.29 (.090)  
2.69 (.106)  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
19.81 (.780)  
21.39 (.842)  
Gate  
Drain  
Source  
Gate  
Drain  
Source  
1.01 (.040)  
1.40 (.055)  
0.48 (.019)  
0.84 (.033)  
2.59 (.102)  
3.00 (.118)  
0.76 (.030)  
1.30 (.051)  
2.21 (.087)  
2.59 (.102)  
2.79 (.110)  
5.45 (.215) BSC  
2-Plcs.  
3.18 (.125)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
These dimensions are equal to the TO-247 without the mounting hole.  
Dimensions in Millimeters and (Inches)  
APT’sproductsarecoveredbyoneormoreofU.S.patents4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058andforeignpatents. USandForeignpatentspending. AllRightsReserved.  

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