APT30M40B2VR [ADPOW]

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.; 功率MOS V是新一代高压N沟道增强型功率MOSFET 。
APT30M40B2VR
型号: APT30M40B2VR
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
功率MOS V是新一代高压N沟道增强型功率MOSFET 。

晶体 晶体管 功率场效应晶体管 开关 脉冲 高压
文件: 总4页 (文件大小:119K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APT30M40B2VR  
APT30M40LVR  
300V 76A 0.040W  
POWER MOS V®  
B2VR  
Power MOS V® is a new generation of high voltage N-Channel enhancement  
mode power MOSFETs. This new technology minimizes the JFET effect,  
increases packing density and reduces the on-resistance. Power MOS V®  
also achieves faster switching speeds through optimized gate layout..  
T-MAX™  
TO-264  
LVR  
• Faster Switching  
• Lower Leakage  
• 100% Avalanche Tested  
D
S
• Popular T-MAX™ or TO-264  
Package  
G
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT30M40  
300  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
Volts  
Continuous Drain Current @ TC = 25°C  
76  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
304  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
±30  
±40  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
Watts  
W/°C  
520  
PD  
4.16  
-55 to 150  
300  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
76  
1
EAR  
EAS  
50  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
4
2500  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
300  
76  
TYP  
MAX  
UNIT  
BVDSS  
ID(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
Volts  
2
On State Drain Current  
(VDS > ID(on) x RDS(on) Max, VGS = 10V)  
Amps  
2
RDS(on)  
Drain-Source On-State Resistance  
(VGS = 10V, 0.5 ID[Cont.])  
Ohms  
µA  
0.040  
25  
Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V)  
IDSS  
Zero Gate Voltage Drain Current (VDS = 0.8 VDSS, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)  
250  
±100  
4
IGSS  
nA  
VGS(th)  
Volts  
2
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
USA  
405 S.W. Columbia Street  
Chemin de Magret  
Bend, Oregon 97702-1035  
F-33700 Merignac - France  
Phone: (541) 382-8028  
Phone: (33) 5 57 92 15 15  
FAX: (541) 388-0364  
FAX: (33) 5 56 47 97 61  
EUROPE  
DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT30M40 B2VR - LVR  
Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
8500 10200  
VGS = 0V  
VDS = 25V  
f = 1 MHz  
Output Capacitance  
1500  
390  
285  
56  
2100  
585  
425  
85  
pF  
Reverse Transfer Capacitance  
3
VGS = 10V  
Total Gate Charge  
Qgs  
Qgd  
VDD = 0.5 VDSS  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
ID = ID[Cont.] @ 25°C  
120  
16  
180  
32  
td(on)  
tr  
td(off)  
tf  
VGS = 15V  
VDD = 0.5 VDSS  
ID = ID[Cont.] @ 25°C  
RG = 0.6W  
20  
40  
Turn-off Delay Time  
Fall Time  
48  
72  
4
8
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
76  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
1
ISM  
VSD  
t rr  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
304  
1.3  
2
(VGS = 0V, IS = -ID[Cont.]  
)
Volts  
ns  
Reverse Recovery Time (IS = -ID[Cont.], dlS/dt = 100A/µs)  
Reverse Recovery Charge (IS = -ID[Cont.], dlS/dt = 100A/µs)  
530  
Q rr  
11.5  
µC  
THERMAL CHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.24  
40  
UNIT  
RqJC  
RqJA  
Junction to Case  
°C/W  
Junction to Ambient  
1
2
3
4
Repetitive Rating: Pulse width limited by maximum junction  
temperature.  
See MIL-STD-750 Method 3471  
Starting T = +25°C, L = 870µH, R = 25W, Peak I = 76A  
j
G
L
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%  
APT Reserves the right to change, without notice, the specifications and information contained herein.  
0.3  
D=0.5  
0.1  
0.2  
0.05  
0.1  
0.05  
Note:  
0.01  
0.02  
t
1
0.005  
0.01  
t
2
SINGLE PULSE  
t
1
Duty Factor D =  
Peak T = P x Z  
/
t
2
+ T  
J
DM  
θJC  
C
0.001  
10-5  
10-4  
10-3  
10-2  
10-1  
1.0  
10  
RECTANGULAR PULSE DURATION (SECONDS)  
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION  
APT30M40 B2VR - LVR  
150  
120  
90  
60  
30  
0
150  
120  
90  
60  
30  
0
V
=6.5V, 7V, 10V & 15V  
V
=15V  
GS  
GS  
=10V  
V
GS  
=6.5V & 7V  
6V  
V
6V  
GS  
5.5V  
5V  
5.5V  
5V  
4.5V  
4V  
4.5V  
4V  
5
0
V
30  
60  
90  
120  
150  
0
V
1
2
3
4
6
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS  
FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS  
150  
120  
90  
60  
30  
0
1.3  
T
J
= -55°C  
J
NORMALIZED TO  
V
= 10V  
@
0.5 I [Cont.]  
D
GS  
T
= +25°C  
1.2  
1.1  
1.0  
0.9  
0.8  
T
= +125°C  
J
V
> I (ON) x  
R
(ON)MAX.  
DS  
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
DS  
D
V
=10V  
GS  
V
=20V  
GS  
T
= +125°C  
= +25°C  
J
T
T = -55°C  
J
J
0
V
2
4
6
8
0
40  
80  
120  
160  
200  
, GATE-TO-SOURCE VOLTAGE (VOLTS)  
I , DRAIN CURRENT (AMPERES)  
GS  
D
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS  
FIGURE 5, R (ON) vs DRAIN CURRENT  
DS  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25 50 75 100 125 150  
T , CASE TEMPERATURE (°C)  
T , JUNCTION TEMPERATURE (°C)  
C
J
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE  
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE  
1.2  
2.5  
I
= 0.5 I [Cont.]  
D
D
V
= 10V  
GS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25 50 75 100 125 150  
T , JUNCTION TEMPERATURE (°C)  
T , CASE TEMPERATURE (°C)  
J
C
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE  
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE  
APT30M40 B2VR - LVR  
400  
30,000  
10µS  
OPERATION HERE  
LIMITED BY R (ON)  
DS  
100µS  
100  
50  
C
iss  
10,000  
5,000  
1mS  
C
oss  
10  
5
10mS  
C
rss  
100mS  
DC  
1,000  
500  
1
T
T
=+25°C  
=+150°C  
C
J
.5  
SINGLE PULSE  
.1  
100  
1
V
5
10  
50 100  
300  
.01  
V
.1  
1
10  
50  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 10, MAXIMUM SAFE OPERATING AREA  
FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE  
20  
16  
12  
8
400  
I
= I [Cont.]  
D
D
V
=60V  
DS  
=150V  
T
=+150°C  
T =+25°C  
J
J
100  
50  
V
DS  
V
=240V  
DS  
10  
5
4
0
1
0
100  
g
200  
300  
400  
500  
0
V
0.4  
0.8  
1.2  
1.6  
2.0  
Q , TOTAL GATE CHARGE (nC)  
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)  
SD  
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE  
FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE  
T-MAXTM (B2) Package Outline  
TO-264 (L) Package Outline  
4.69 (.185)  
4.60 (.181)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
5.21 (.205)  
19.51 (.768)  
20.50 (.807)  
1.49 (.059)  
2.49 (.098)  
1.80 (.071)  
2.01 (.079)  
3.10 (.122)  
3.48 (.137)  
5.38 (.212)  
6.20 (.244)  
5.79 (.228)  
6.20 (.244)  
20.80 (.819)  
21.46 (.845)  
25.48 (1.003)  
26.49 (1.043)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
2.29 (.090)  
2.69 (.106)  
2.29 (.090)  
2.69 (.106)  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
19.81 (.780)  
21.39 (.842)  
Gate  
Gate  
1.01 (.040)  
1.40 (.055)  
Drain  
Source  
Drain  
Source  
0.48 (.019)  
0.84 (.033)  
2.59 (.102)  
3.00 (.118)  
0.76 (.030)  
1.30 (.051)  
2.79 (.110)  
3.18 (.125)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
5.45 (.215) BSC  
2-Plcs.  
These dimensions are equal to the TO-247 without the mounting hole.  
Dimensions in Millimeters and (Inches)  
Dimensions in Millimeters and (Inches)  
APT's devices are covered by one or more of the following U.S.patents: 4,895,810  
5,256,583  
5,045,903  
4,748,103  
5,089,434  
5,283,202  
5,182,234  
5,231,474  
5,019,522  
5,434,095  
5,262,336  
5,528,058  

相关型号:

APT30M40JVFR

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
ADPOW

APT30M40JVR

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
ADPOW

APT30M40LVFR

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
ADPOW

APT30M40LVFR

Power Field-Effect Transistor, 76A I(D), 300V, 0.04ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
MICROSEMI

APT30M40LVFRG

Power Field-Effect Transistor, 76A I(D), 300V, 0.04ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
MICROSEMI

APT30M40LVR

Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs.
ADPOW

APT30M40LVRG

Power Field-Effect Transistor, 76A I(D), 300V, 0.04ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
MICROSEMI

APT30M45JNR

70A, 300V, 0.045ohm, N-CHANNEL, Si, POWER, MOSFET
MICROSEMI

APT30M45JNR

Power Field-Effect Transistor, 70A I(D), 300V, 0.045ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET
ADPOW

APT30M50JNR

65A, 300V, 0.05ohm, N-CHANNEL, Si, POWER, MOSFET
MICROSEMI

APT30M60J

N-Channel MOSFET
MICROSEMI

APT30M60J_09

N-Channel MOSFET
MICROSEMI