1N5811CBUS [MICROSEMI]

SURFACE MOUNT VOIDLESSHERMETICALLY-SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS; 表面贴装VOIDLESSHERMETICALLY密封超快速恢复整流二极管玻璃
1N5811CBUS
型号: 1N5811CBUS
厂家: Microsemi    Microsemi
描述:

SURFACE MOUNT VOIDLESSHERMETICALLY-SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS
表面贴装VOIDLESSHERMETICALLY密封超快速恢复整流二极管玻璃

整流二极管 超快恢复二极管 快速恢复二极管
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中文:  中文翻译
下载:  下载PDF数据表文档文件
1N5807CBUS thru 1N5811CBUS  
SURFACE MOUNT VOIDLESS-  
HERMETICALLY-SEALED ULTRA FAST  
RECOVERY GLASS RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This “Ultrafast Recovery” surface mount rectifier diode series is military qualified to MIL-  
PRF-19500/742 and is ideal for high-reliability applications where a failure cannot be  
tolerated. These industry-recognized 6.0 Amp rated rectifiers for working peak reverse  
voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction using  
an internal “Category III” metallurgical bond. These devices are also available in axial-  
leaded package configurations (see separate data sheet for 1N5807CB thru 1N5811CB).  
Microsemi also offers numerous other rectifier products to meet higher and lower current  
ratings with various recovery time speed requirements including standard, fast, and  
ultrafast device types in both through-hole and surface mount packages.  
Package “E”  
or D-5B  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount package series equivalent to the JEDEC  
Ultrafast recovery 6 Amp rectifier series 50 to 150V  
registered 1N5807 to 1N5811 series  
Military and other high-reliability applications  
Switching power supplies or other applications  
requiring extremely fast switching & low forward  
loss  
High forward surge current capability  
Low thermal resistance  
Voidless-hermetically-sealed glass package  
Extremely robust construction  
Triple-layer passivation  
Internal “Category III” Metallurgical bonds  
JAN, JANTX, & JANTXV available per MIL-PRF-19500/742  
Controlled avalanche with peak reverse power  
capability  
Further screening options are available for JANS in  
accordance with MIL-PRF-19500/742 by using a “SP” prefix  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
Axial-leaded equivalents also available (see separate data  
sheet for 1N5807CB thru 1N5811CB)  
MAXIMUM RATINGS  
Operating Temperature: -65oC to +175oC.  
Storage Temperature: -65oC to +175oC.  
MECHANICAL AND PACKAGING  
CASE: Hermetically sealed voidless hard glass  
with Tungsten slugs  
TERMINALS: End caps are Copper with Tin/Lead  
(Sn/Pb) finish.  
Average Rectified Forward Current (IO): 6 Amps @ TEC  
= 75ºC End Cap temperature (see note 1)  
MARKING & POLARITY: Cathode band only  
Tape & Reel option: Standard per EIA-481-B  
Weight: 539 mg  
Thermal Resistance: 6.5 ºC/W junction to end cap  
Thermal Impedance: 1.5 ºC/W @ 10 ms heating time  
Forward Surge Current (8.3 ms half sine) 125 Amps  
Capacitance: 60 pF at 10 volts, f = 1 MHz  
See package dimensions and recommended pad  
layout on last page  
Solder temperature: 260ºC for 10 s (maximum)  
ELECTRICAL CHARACTERISTICS  
WORKING BREAKDOWN  
AVERAGE  
AVERAGE  
MAXIMUM  
FORWARD  
VOLTAGE  
@ 4 A  
(8.3 ms pulse)  
VF  
REVERSE  
CURRENT  
(MAX)  
SURGE  
CURRENT  
(MAX)  
REVERSE  
RECOVERY  
TIME (MAX)  
(NOTE 4)  
PEAK  
REVERSE  
VOLTAGE  
VOLTAGE  
(MIN.)  
@ 100μA  
RECTIFIED RECTIFIED  
CURRENT  
CURRENT  
TYPE  
I
I
@ V  
I
FSM  
O1  
O2  
RWM  
V
t
rr  
IR  
(NOTE 3)  
AMPS  
V
@TA=55ºC  
(Note 2)  
AMPS  
RWM  
BR  
@T =75ºC  
EC  
(Note 1)  
AMPS  
VOLTS  
VOLTS  
VOLTS  
ns  
μA  
25oC  
100oC 25oC 125oC  
1N5807CBUS  
1N5809CBUS  
1N5811CBUS  
50  
60  
6.0  
6.0  
6.0  
3.0  
3.0  
3.0  
0.875  
0.800  
0.800  
0.800  
5
5
5
525  
525  
525  
125  
125  
125  
30  
30  
30  
100  
110  
0.875  
0.875  
150  
160  
NOTE 1: Rated at TEC = 75ºC. Derate at 60 mA/ºC for TEC above 75ºC  
NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance from mounting point to  
ambient is sufficiently controlled where TJ(max) does not exceed 175ºC  
NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals  
NOTE 4: I = 1.0 A, I  
= 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min  
RM  
F
Copyright © 2007  
7-26-2007  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1N5807CBUS thru 1N5811CBUS  
SURFACE MOUNT VOIDLESS-  
HERMETICALLY-SEALED ULTRA FAST  
RECOVERY GLASS RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
SYMBOLS & DEFINITIONS  
Definition  
Symbol  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.  
VBR  
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating  
temperature range.  
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.  
VRWM  
VF  
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and  
temperature.  
IR  
C
Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage  
Reverse Recovery Time: The time interval between the instant the current passes through zero when  
changing from the forward direction to the reverse direction and a specified recovery decay point after a peak  
reverse current is reached.  
trr  
GRAPHS  
FIGURE 1  
FIGURE 2  
TYPICAL FORWARD CURRENT  
vs. FORWARD VOLTAGE  
TYPICAL REVERSE CURRENT vs. VOLTAGE  
FIGURE 3  
FORWARD PULSE CURRENT vs. DURATION  
Copyright © 2007  
7-26-2007  
Microsemi  
Scottsdale Division  
Page 2  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1N5807CBUS thru 1N5811CBUS  
SURFACE MOUNT VOIDLESS-  
HERMETICALLY-SEALED ULTRA FAST  
RECOVERY GLASS RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
FIGURE 4  
MULTIPLE SURGE CURRENT vs. DURATION  
PACKAGE DIMENSIONS AND PAD LAYOUT  
NOTE: This Package Outline has also previously  
PAD LAYOUT  
been identified as “D-5B”  
INCHES  
0.288  
mm  
7.32  
1.78  
3.94  
INCHES  
mm  
A
B
C
MIN  
.205  
.137  
MAX  
.225  
.142  
MIN  
5.21  
3.48  
MAX  
5.72  
3.61  
0.070  
BL  
BD  
ECT  
S
0.155  
Note: If mounting requires adhesive  
separate from the solder, an additional  
0.080 inch diameter contact may be  
placed in the center between the pads  
as an optional spot for cement.  
.019  
.003  
.028  
---  
0.48  
0.08  
0.711  
---  
Copyright © 2007  
7-26-2007  
Microsemi  
Page 3  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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