1N5811D3B [SEME-LAB]
ULTRA FAST RECOVERY POWER RECTIFIER; 超快速恢复电力整流器
| 型号： | 1N5811D3B |
| 厂家： | 
SEME LAB |
| 描述： | ULTRA FAST RECOVERY POWER RECTIFIER |
| 文件： | 总4页 (文件大小：293K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ULTRA FAST RECOVERY
POWER RECTIFIER
1N5811D3A / 1N5811D3B
•
DLCC3 - Light Weight Hermetic Ceramic Surface Mount
Package is designed as a drop In replacement for “D-5B” / “E-
MELF” package†
•
•
•
Ultra Fast Reverse Recovery
Switching Power Supply Applications
Space Level and High-Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise stated)
A
V
V
I
Breakdown Voltage
160V
BR
Working Peak Reverse Voltage
Maximum Rectified Current I 1 = T +55°C
150V
RWM
(1)
A
Derate above T 55°C
3.0A
O
o
25mA/°C
125A
A
(2)
I
Surge Current, t = 8.3ms
p
FSM
T
Junction Temperature Range
Storage Temperature Range
-65 to +175°C
-65 to +175°C
J
T
stg
THERMAL PROPERTIES
Symbols
Parameters
Max.
Units
°C/W
°C/W
°C/W
Thermal Resistance, Junction To Solder Pads T = 25°C
SP
R
17
50
θJSP(IN)
(3)
(4)
R
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
θJA(PCB)
R
117
θJA(PCB)
Notes
(1) I
is rated at 3.0A @ T = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
O1
A
T
does not exceed 175°C; This equates to R
θJA(PCB)
≤ 52°C/W.
J(Max)
(2) T = 25°C @ I =3.0A and V for ten 8.3mS surges at 1 minute intervals.
RWM
A
O
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
is rated at 1.5A @ T = 55°C for PC boards where R ≤ 120°C/W. Derate at 12.5mA/°C above T = 55°C in this case.
θJA(PCB) A
I
O1
A
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab plc
Telephone +44 (0) 1455 556565
Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 8613
Issue 2
Page 1 of 4
ULTRA FAST RECOVERY
POWER RECTIFIER
1N5811D3A / 1N5811D3B
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise stated)
A
Symbols
Parameters
Test Conditions
Min. Typ. Max. Units
I = 100µA
R
160
(5)
V
Breakdown Voltage
BR
T
= -65°C
150
A
I = 3.0A
F
0.865
I = 4.0A
F
V
0.875
0.800
1.075
0.925
5.0
(5)
V
F
T
T
= 125°C
= -65°C
Forward Voltage
Reverse Current
A
A
I = 6.0A
F
V = 150V
R
(5)
I
µA
R
T
I
= 125°C
= 0.1A
525
A
DYNAMIC CHARACTERISTICS
I = I
= 1.0A
F
RM
REC
t
Reverse Recovery Time
50
ns
rr
di/dt = 100A/µs (min)
V
t
I = 500mA
F
T = 8ns
r
Forward Recovery Voltage
Forward Recovery Time
Capacitance
2.2
15
85
V
fr
I = 500mA, T ≥ 20ns, T = 8ns
ns
pF
fr
F
p
r
C
V = 10V
R
f = 1.0MHz
J
Notes
(5) Pulse Width ≤ 300us, δ ≤ 2%
Semelab plc
Telephone +44 (0) 1455 556565
Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 8613
Issue 2
Page 2 of 4
ULTRA FAST RECOVERY
POWER RECTIFIER
1N5811D3A / 1N5811D3B
MECHANICAL DATA
A
DLCC3 Variant A (D3A)
D
PAD 1
PAD 2
ANODE
CATHODE
SML
D3A
DIMENSION
mm
Inches
A
B
C
D
7.00 0.10
3.75 0.10
1.60 0.10
1.76 0.10
0.275 0.004
0.143 0.004
0.063 0.004
0.069 0.004
C
1
C
2
A
D
DLCC3 Variant B (D3B)
PAD 1
PAD 2
PAD 3
ANODE
CATHODE
LID CONTACT TO CATHODE*
SML
D3B
DIMENSION
mm
Inches
C
1
C
A
B
C
D
7.00 0.10
3.75 0.10
1.60 0.10
1.76 0.10
0.275 0.004
0.143 0.004
0.063 0.004
0.069 0.004
2
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant
to be specified at order.
† The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
mm
7.32
1.78
3.94
Inches
0.288
0.070
0.155
A
B
C
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “E-
MELF” outlines. The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
Soldering temperature should be 260°C for a
maximum of 10 seconds.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
Semelab plc
Telephone +44 (0) 1455 556565
Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 8613
Issue 2
Page 3 of 4
ULTRAFAST RECOVERY
POWER RECTIFIER DIODE
1N5811D3A / 1N5811D3B
SCREENING OPTIONS
ORDERING INFORMATION
Space Level (JQRS/ESA) and High Reliability options are
available in accordance with the High Reliability and
Screening Options Handbook available for download from
the from the TT electronics Semelab web site.
Part numbers are built up from Type, Package Variant, and
screening level. The part numbers are extended to include
the additional options as shown below.
Type – See Main Part Number
Package Variant – See Mechanical Data
Screening Level – See Screening Options (ESA / JQRS)
ESA Quality Level Products are based on the testing
procedures specified in the generic ESCC 5000 and in the
corresponding part detail specifications.
Additional Options:
Semelab’s QR216 and QR217 processing specifications
(JQRS), in conjunction with the companies ISO 9001:2000
approval present a viable alternative to the American MIL-
PRF-19500 space level processing.
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
.CVP
.CVB
.DA
Solderability Samples
.SS
QR217 (Space Level Quality Conformance) is based on the
quality conformance inspection requirements of MIL-PRF-
19500 groups A (table V), B (table VIa), C (table VII) and
also ESA / ESCC 5000 (chart F4) lot validation tests.
Scanning Electron Microscopy
Radiography (X-ray)
.SEM
.XRAY
.RAD
Total Dose Radiation Test
MIL-PRF-19500 (QR217)
Group B charge
.GRPB
QR216 (Space Level Screening) is based on the screening
requirements of MIL-PRF-19500 (table IV) and also ESA
/ESCC 5000 (chart F3).
Group B destructive mechanical samples
Group C charge
.GBDM (12 pieces)
.GRPC
Group C destructive electrical samples
Group C destructive mechanical samples
.GCDE (12 pieces)
.GCDM (6 pieces)
JQRS parts are processed to the device data sheet and
screened to QR216 with conformance testing to Q217
groups A and B in accordance with MIL-STD-750 methods
and procedures.
ESA/ESCC
Lot Validation Testing (subgroup 1) charge
LVT1 destructive samples (environmental)
LVT1 destructive samples (mechanical)
Lot Validation Testing (subgroup 2) charge
LVT2 endurance samples (electrical)
Lot Validation Testing (subgroup 3) charge
LVT3 destructive samples (mechanical)
Additional Option Notes:
.LVT1
.L1DE (15 pieces)
.L1DM (15 pieces)
.LVT2
Additional conformance options are available, for example
Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs.
These are chargeable and must be specified at the order
stage (See Ordering Information). Minimum order
quantities may apply.
.L2D (15 pieces)
.LVT3
.L3D (5 pieces)
Alternative or additional customer specific conformance or
screening requirements would be considered. Contact
Semelab sales with enquires.
1) All ‘Additional Options’ are chargeable and must be specified at order stage.
2) When Group B,C or LVT is required, additional electrical and mechanical destructive
samples must be ordered
3) All destructive samples are marked the same as other production parts unless
otherwise requested.
MARKING DETAILS
Example ordering information:
Parts can be laser marked with approximately 7 characters
on two lines and always includes cathode identification.
Typical marking would include part or specification number,
week of seal or serial number subject to available space and
legibility.
The following example is for the 1N5811D3 part with
package variant B, JQRS screening, additional Group C
conformance testing and a Data pack.
Part Numbers:
1N5811D3B-JQRS (Include quantity for flight parts)
1N5811D3B-JQRS.GRPC (chargeable conformance option)
1N5811D3B-JQRS.GCDE (charge for destructive parts)
1N5811D3B-JQRS.GCDM (charge for destructive parts)
1N5811D3B-JQRS.DA (charge for Data pack)
Customer specific marking requirements can be arranged at
the time of order.
Example Marking:
Customers with any specific requirements (e.g. marking or
screening) may be supplied with a similar alternative part
number (there is maximum 20 character limit to part
numbers). Contact Semelab sales with enquiries.
High Reliability and Screening Options Handbook link: http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf
Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com
Document Number 8613
Issue 2
Page 4 of 4
Website: http://www.semelab-tt.com
相关型号：
1N5811E3
Rectifier Diode, 1 Phase, 1 Element, 6A, Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, E, 2 PIN
MICROSEMI
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