TC962COEG [MICROCHIP]
SWITCHED CAPACITOR CONVERTER, 24 kHz SWITCHING FREQ-MAX, PDSO16, SOIC-16;
| 型号： | TC962COEG |
| 厂家： | 
MICROCHIP |
| 描述： | SWITCHED CAPACITOR CONVERTER, 24 kHz SWITCHING FREQ-MAX, PDSO16, SOIC-16 开关 光电二极管 |
| 文件： | 总14页 (文件大小：385K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC962
High Current Charge Pump DC-to-DC Converter
Features:
General Description:
• Pin Compatible With TC7662/ICL7662/SI7661
• High Output Current 80 mA
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC962 can source as much as 80 mA
versus the 7662’s 20 mA capability.
• No External Diodes Required
• Wide Operating Range 3V to 18V
• Low Output Impedance 28 Typ.
• No Low Voltage Terminal Required
• Application Zener On-Chip
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28 (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
• OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications:
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from 12
kHz to 24 kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
• Laptop Computers
• Disk Drives
• Process Instrumentation
• P-Based Controllers
Device Selection Table
Operating
Temp.
Range
Part
Number
Package
Pin 1, which is used as a test pin on the 7662, is a
voltage reference Zener on the TC962. This Zener (6.4V
at 5 mA) has a dynamic impedance of 12 and is
intended for use where the TC962 is supplying current to
external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
Information” Applications Information).
TC962COE 16-Pin SOIC Wide
0°C to +70°C
0°C to +70°C
TC962CPA
TC962EPA
TC962IJA
TC962MJA
8-Pin Plastic DIP
8-Pin Plastic DIP
8-Pin CERDIP
8-Pin CERDIP
-40°C to +85°C
-25°C to +85°C
-55°C to +125°C
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
16-Pin SOIC Wide
Zener
1
2
3
4
5
6
7
8
16
15
V
DD
Cathode
8-Pin DIP
8-Pin CERDIP
NC
NC
+
Zener
14 C
C
OSC
V
1
2
3
4
8
7
6
5
DD
•
Cathode
NC
GND
NC
13
12
11
NC
+
TC962CPA
TC962EPA
TC962IJA
TC962MJA
C
C
OSC
TC962COE
FREQ x 2
NC
GND
FREQ x 2
–
C
V
OUT
–
C
10 V
9
OUT
NC
NC
2001-2012 Microchip Technology Inc.
DS21484D-page 1
TC962
Functional Block Diagram
8
V
DD
6
I
I
FREQ x 2
TC962
–
7
OSC/C
Timing
Level
Shift
P SW1
N SW4
Q
2
+
+
–
F/F
CAP
C
Q
Level
Shift
+
C
P
Comparator
with Hysteresis
External
GND
3
1
Zener
V
Cathode
REF
6.4V
+
OUT
–
C
R
EXT
Level
Shift
N SW2
N SW3
4
CAP
R
L
Level
Shift
5
V
OUT
DS21484D-page 2
2001-2012 Microchip Technology Inc.
TC962
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (VDD to GND) ..............................+18V
Input Voltage Any Pin
......................... (VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin...........................................10 mA
ESD Protection ................................................±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (TA 70°C)
SOIC .......................................................760 mW
PDIP........................................................730 mW
CERDIP ..................................................800 mW
Package Thermal Resistance
CERDIP, RJ-A .........................................90°C/W
PDIP, RJ-A ............................................140°C/W
Operating Temperature Range
CPA, COE ....................................... 0°C to +70°C
IJA................................................-25°C to +85°C
EPA ..............................................-40°C to +85°C
MJA............................................-55°C to +125°C
Storage Temperature Range .............-65°C to +150°C
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V = 15V, T = 25°C (See Figure ) unless otherwise noted.
DD
A
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
I
Supply Voltage
Supply Current
3
—
18
V
DD
—
—
—
—
—
—
—
—
—
700
—
—
—
A
R =
L
S
V
= 15V
510
560
650
190
210
210
T = +25°C
DD
A
0 T 70°C
A
-55°C T 125°C
A
V
= 5V
T = +25°C
DD
A
—
—
0 T 70°C
A
-55°C T 125°C
A
R
Output Source
Resistance
—
—
—
32
35
—
37
40
50
I = 20 mA, V = 15V
O
L
DD
I = 80 mA, V = 15V
L
DD
I = 3 mA, V = 5V
L
DD
F
Oscillator Frequency
Power Efficiency
—
—
12
24
—
—
kHz
%
Pin 6 Open
Pin 6 GND
OSC
P
93
—
97
—
—
—
R = 2 k
EFF
DEF
L
V
Voltage Efficiency
99
—
96
99.9
—
—
—
—
—
%
R =
L
Over temperature range
V
Z
Zener Voltage
6.0
6.2
6.4
V
I = 5 mA
Z
Z
Zener Impedance
—
12
—
I = 2.5 mA to 7.5 mA
ZT
L
Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.
2001-2012 Microchip Technology Inc.
DS21484D-page 3
TC962
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
Symbol
Description
(8-Pin CERDIP)
1
2
3
4
5
6
7
8
Zener Cathode Cathode of internal Zener diode.
+
C
Positive side of external CP capacitor (pump cap).
Ground terminal.
GND
-
C
Negative side of external CP capacitor (pump cap).
Output voltage.
V
OUT
FREQ x 2
If grounded, frequency doubles.
Capacitor to GND will decrease frequency.
Input voltage.
C
OSC
V
DD
Pin No.
(16-Pin SOIC)
Symbol
Zener Cathode Cathode of internal Zener diode.
Description
1
2
NC
No connect.
+
3
C
Positive side of external CP capacitor (pump cap).
4
NC
GND
NC
No connect.
5
Ground terminal.
6
No connect.
-
7
C
Negative side of external CP capacitor (pump cap).
No connect.
8
NC
NC
9
No connect.
10
11
12
13
14
15
16
V
Output voltage.
OUT
NC
FREQ x 2
NC
No connect.
If grounded, frequency doubles.
No connect.
C
Capacitor to GND will decrease frequency.
No connect.
OSC
NC
V
Input voltage.
DD
DS21484D-page 4
2001-2012 Microchip Technology Inc.
TC962
current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.
3.0
3.1
APPLICATIONS INFORMATION
Theory of Operation
A Zener diode has been added to the TC962 for use as
a reference in building external regulators. This Zener
runs from pin 1 to ground.
The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
3.2
Latch-Up
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultane-
ously, charging CP to the supply voltage, VIN. This
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on time provided
by the oscillator frequency as shown:
All CMOS structures contain a parasitic SCR. Care
must be taken to prevent any input from going above or
below the supply rail, or latch-up will occur. The result
of latch-up is an effective short between VDD and VSS
.
Unless the power supply input has a current limit, this
latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
Drivers.)
3 (RDS(ON) CP) < CP/(0.5 fOSC
)
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turned on. The charge
in CP is then transferred to CR, but with the polarity
inverted. In this way, a negative voltage is now derived.
690
I
S
+
V
1
2
8
7
NC
(+5V)
I
L
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
+
10 μF
C
3
4
TC962
R
OSC
C
L
C
P
V
(–5V)
5
OUT
10 μF
R
The oscillator has two pins that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will lower the frequency of the
oscillator by adding capacitance to the timing capacitor
internal to the TC962. Grounding pin 6 will turn on a
+
FIGURE 3-1:
Test Circuit
Combined Negative Converter and Positive Multiplier
+
Split V In Half
+
+
V
V
1
2
8
7
1
2
8
7
V
D1
10 μF
V
+
D2
+
10 μF
V
=
TC962
OUT
+
C
3
4
6
3
4
6
5
C
TC962
P
P2
+
= –V
V
OUT
2V –2V
10 μF
D
5
+
C
R1
+
10 μF
V
2
+
V
=
OUT
C
P1
+
+
C
R
10 μF
Lowering Output Resistance by Paralleling Devices
Positive Voltage Multiplier
+
V
+
V
1
2
8
7
8
1
2
1
2
8
7
V
D1
7
6
5
V
D2
+
+
10 μF
10 μF
V
=
TC962
OUT
+
3
4
TC962
C
3
4
TC962
6
5
3
4
6
5
C
P2
P1
2V –2V
D
+
+
10 μF
C
C
P
P
10 μF
V
OUT
10 μF
C
R
+
FIGURE 3-2:
Typical Applications
2001-2012 Microchip Technology Inc.
DS21484D-page 5
TC962
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure , CP = CR = 10 F, CPESR CRESR 1.
Frequency vs. Temperature
Oscillator Frequency vs. COSC
Supply Current vs. Temperature
20
18
16
700
600
T
= +25°C
C
= FREQ x 2 = OPEN
A
OSC
10k
500
400
300
200
+
1k
14
12
10
V
= 15V
100
+
V
= 15V
8
6
100
0
10
1
10
100
1000
10,000
-60 -40 -20
0
20 40 60 80 100 120 140
-60 -40 -20
0
20 40 60 80 100 120 140
CAPACITANCE (pF)
TEMPERATURE (°C)
TEMPERATURE (°C)
Output Resistance vs. Temperature
Current vs. Zener Voltage
Power Conversion Efficiency vs. I
LOAD
80
70
T
= +25°C
T
= +25°C
A
150
50
100
90
A
135
120
EFFICIENCY
60
50
40
40
30
20
80
70
60
+
105
90
V
= 5V I = 3 mA
L
SUPPLY
CURRENT
50
75
40
30
20
10
0
60
45
30
15
0
+
30
20
10
V
= 15V I = 20 mA
L
10
0
4.5
4.0
ZENER VOLTAGE (V)
5.5
6.0
6.5
7.0
8
16 24 32 40 48 56 64 72 80
-60 -40 -20
0
20 40 60 80 100 120 140
TEMPERATURE (°C)
LOAD CURRENT (mA)
Output Resistance vs. Input Voltage
110
100
90
T
= +25°C
A
80
70
60
50
40
30
20
3 μA
20 μA
10
0
2
4
6
8
10 12 14 16 18 20
INPUT VOLTAGE (V)
DS21484D-page 6
2001-2012 Microchip Technology Inc.
TC962
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
16-Pin SOIC (W)
16 mm
12 mm
1000
13 in
5.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin CDIP (Narrow)
.110 (2.79)
.090 (2.29)
Pin 1
.300 (7.62)
.230 (5.84)
.020 (0.51) Min.
.055 (1.40) Max.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.040 (1.02)
.020 (0.51)
.200 (5.08)
.160 (4.06)
.015 (0.38)
.008 (0.20)
3° Min.
.150 (3.81)
Min.
.200 (5.08)
.125 (3.18)
.400 (10.16)
.320 (8.13)
.065 (1.65)
.045 (1.14)
.020 (0.51)
.016 (0.41)
Dimensions: inches (mm)
2001-2012 Microchip Technology Inc.
DS21484D-page 7
TC962
Package Dimensions (Continued)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
3° Min.
.150 (3.81)
.115 (2.92)
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
16-Pin SOIC (Wide)
Pin 1
.299 (7.59) .419 (10.65)
.291 (7.40) .398 (10.10)
.413 (10.49)
.398 (10.10)
.104 (2.64)
.097 (2.46)
8°
Max.
.013 (0.33)
.009 (0.23)
.012 (0.30)
.004 (0.10)
.019 (0.48)
.014 (0.36)
.050 (1.27) Typ.
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21484D-page 8
2001-2012 Microchip Technology Inc.
TC962
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc.
DS21484D-page 9
TC962
NOTES:
DS21484D-page 10
2001-2012 Microchip Technology Inc.
TC962
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2001-2012 Microchip Technology Inc.
DS21484D-page 11
TC962
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DS21484D-page 12
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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•
•
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The Microchip name and logo, the Microchip logo, dsPIC,
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32
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Company are registered trademarks of Microchip Technology
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Printed on recycled paper.
ISBN: 9781620768808
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DS21484D-page 13
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS21484D-page 14
2001-2012 Microchip Technology Inc.
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