TC962EPAG [MICROCHIP]

SWITCHED CAPACITOR CONVERTER, 24 kHz SWITCHING FREQ-MAX, PDIP8, PLASTIC, DIP-8;
TC962EPAG
型号: TC962EPAG
厂家: MICROCHIP    MICROCHIP
描述:

SWITCHED CAPACITOR CONVERTER, 24 kHz SWITCHING FREQ-MAX, PDIP8, PLASTIC, DIP-8

转换器 泵
文件: 总12页 (文件大小:436K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TC962  
M
High Current Charge Pump DC-to-DC Converter  
Features  
General Description  
• Pin Compatible With TC7662/ICL7662/SI7661  
• High Output Current 80mA  
The TC962 is an advanced version of the industry  
standard TC7662 high voltage DC-to-DC converter.  
Using improved design techniques and CMOS  
construction, the TC962 can source as much as 80mA  
versus the 7662s 20mA capability.  
• No External Diodes Required  
• Wide Operating Range 3V to 18V  
• Low Output Impedance 28Typ.  
• No Low Voltage Terminal Required  
• Application Zener On-Chip  
As an inverter, the TC962 can put out voltages as high  
as 18V and as low as 3V without the need for external  
diodes. The output impedance of the device is a low  
28(with the proper capacitors), voltage conversion  
efficiency is 99.9%, and power conversion efficiency is  
97%.  
OSC Frequency Doubling Pin Option for Smaller  
Output Capacitors  
Applications  
The low voltage terminal (pin 6) required in some  
TC7662 applications has been eliminated. Grounding  
this terminal will double the oscillator frequency from  
12kHz to 24kHz. This will allow the use of smaller  
capacitors for the same output current and ripple, in  
most applications. Only two external capacitors are  
required for inverter applications. In the event an  
external clock is needed to drive the TC962 (such as  
paralleling), driving this pin directly will cause the  
internal oscillator to sync to the external clock.  
Laptop Computers  
Disk Drives  
Process Instrumentation  
µP-Based Controllers  
Device Selection Table  
Operating  
Part  
Package  
Temp.  
Range  
Number  
Pin 1, which is used as a test pin on the 7662, is a  
voltage reference zener on the TC962. This zener  
(6.4V at 5mA) has a dynamic impedance of 12and is  
intended for use where the TC962 is supplying current  
to external regulator circuitry and a reference is needed  
for the regulator circuit. (See Section 3.0 Applications  
Information).  
TC962COE 16-Pin SOIC Wide  
0°C to +70°C  
0°C to +70°C  
TC962CPA  
TC962EPA  
TC962IJA  
TC962MJA  
8-Pin Plastic DIP  
8-Pin Plastic DIP  
8-Pin CERDIP  
8-Pin CERDIP  
-40°C to +85°C  
-25°C to +85°C  
-55°C to +125°C  
The TC962 is compatible with the LTC1044, SI7661  
and ICL7662. It should be used in designs that require  
greater power and/or less input to output voltage drop.  
It offers superior performance over the ICL7660S.  
Package Type  
16-Pin SOIC Wide  
Zener  
Cathode  
1
2
3
4
5
6
7
8
16  
15  
V
DD  
8-Pin DIP  
8-Pin CERDIP  
NC  
NC  
+
Zener  
Cathode  
14 C  
C
OSC  
V
1
2
3
4
8
7
6
5
DD  
NC  
GND  
NC  
13  
12  
11  
NC  
+
TC962CPA  
TC962EPA  
TC962IJA  
TC962MJA  
C
C
OSC  
TC962COE  
FREQ x 2  
NC  
GND  
FREQ x 2  
C
V
OUT  
C
10 V  
9
OUT  
NC  
NC  
2002 Microchip Technology Inc.  
DS21484B-page 1  
TC962  
Functional Block Diagram  
8
V
DD  
6
I
I
FREQ x 2  
TC962  
7
OSC/C  
Timing  
Level  
Shift  
P SW1  
N SW4  
Q
2
+
+
F/F  
CAP  
C
Q
Level  
Shift  
+
C
P
Comparator  
with Hysteresis  
External  
3
GND  
1
Zener  
V
Cathode  
REF  
6.4V  
+
OUT  
C
R
Level  
Shift  
N SW2  
N SW3  
EXT  
4
CAP  
R
L
Level  
Shift  
5
V
OUT  
DS21484B-page 2  
2002 Microchip Technology Inc.  
TC962  
*Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device. These  
are stress ratings only and functional operation of the device  
at these or any other conditions above those indicated in the  
operation sections of the specifications is not implied.  
Exposure to Absolute Maximum Rating conditions for  
extended periods may affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings*  
Supply Voltage (VDD to GND) ..............................+18V  
Input Voltage Any Pin  
......................... (VDD +0.3) to (VSS -0.3) (Note 1)  
Current Into Any Pin............................................10mA  
ESD Protection ................................................±2000V  
Output Short Circuit ........... Continuous (at 5.5V Input)  
Package Power Dissipation (TA 70°C)  
SOIC .......................................................760 mW  
PDIP........................................................730 mW  
CERDIP ..................................................800 mW  
Package Thermal Resistance  
CERDIP, RθJ-A .........................................90°C/W  
PDIP, RθJ-A ............................................140°C/W  
Operating Temperature Range  
CPA, COE ....................................... 0°C to +70°C  
IJA................................................-25°C to +85°C  
EPA ..............................................-40°C to +85°C  
MJA............................................-55°C to +125°C  
Storage Temperature Range .............-65°C to +150°C  
TC962 ELECTRICAL SPECIFICATIONS  
Electrical Characteristics: V = 15V, T = 25°C (See Figure 3-1) unless otherwise noted.  
DD  
A
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Test Conditions  
V
I
Supply Voltage  
Supply Current  
3
18  
V
DD  
700  
µA  
R = ∞  
L
S
V
= 15V  
510  
560  
650  
190  
210  
210  
T = +25°C  
DD  
A
0 T ≤ +70°C  
A
-55°C T ≤ +125°C  
A
V
= 5V  
T = +25°C  
DD  
A
0 T ≤ +70°C  
A
-55°C T ≤ +125°C  
A
R
Output Source  
Resistance  
32  
35  
37  
40  
50  
I = 20mA, V = 15V  
O
L
DD  
I = 80mA, V = 15V  
L
DD  
I = 3mA, V = 5V  
L
DD  
F
Oscillator Frequency  
Power Efficiency  
12  
24  
kHz  
%
Pin 6 Open  
Pin 6 GND  
OSC  
P
93  
97  
R = 2kΩ  
EFF  
DEF  
L
V
Voltage Efficiency  
99  
96  
99.9  
%
R = ∞  
L
Over temperature range  
V
Z
Zener Voltage  
6.0  
6.2  
6.4  
V
I = 5mA  
Z
Z
Zener Impedance  
12  
I = 2.5mA to 7.5mA  
ZT  
L
Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no  
inputs from sources operating from external supplies be applied prior to "power up" of the TC962.  
2002 Microchip Technology Inc.  
DS21484B-page 3  
TC962  
2.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 2-1.  
TABLE 2-1:  
PIN FUNCTION TABLE  
Pin No.  
(8-Pin DIP)  
Symbol  
Description  
(8-Pin CERDIP)  
1
2
3
4
5
6
7
8
Zener Cathode Cathode of internal zener diode.  
+
C
Positive side of external CP capacitor (pump cap).  
Ground terminal.  
GND  
-
C
Negative side of external CP capacitor (pump cap).  
Output voltage.  
V
OUT  
FREQ x 2  
If grounded, frequency doubles.  
Capacitor to GND will decrease frequency.  
Input voltage.  
C
OSC  
V
DD  
Pin No.  
(16-Pin SOIC)  
Symbol  
Zener Cathode Cathode of internal zener diode.  
Description  
1
2
NC  
No connect.  
+
3
C
Positive side of external CP capacitor (pump cap).  
4
NC  
GND  
NC  
No connect.  
5
Ground terminal.  
6
No connect.  
-
7
C
Negative side of external CP capacitor (pump cap).  
No connect.  
8
NC  
NC  
9
No connect.  
10  
11  
12  
13  
14  
15  
16  
V
Output voltage.  
OUT  
NC  
FREQ x 2  
NC  
No connect.  
If grounded, frequency doubles.  
No connect.  
C
Capacitor to GND will decrease frequency.  
No connect.  
OSC  
NC  
V
Input voltage.  
DD  
DS21484B-page 4  
2002 Microchip Technology Inc.  
TC962  
internal to the TC962. Grounding pin 6 will turn on a  
current source and double the frequency. This will  
double the charge current going into the internal  
capacitor, as well as any capacitor added to pin 7.  
3.0  
3.1  
APPLICATIONS INFORMATION  
Theory of Operation  
The TC962 is a capacitive pump (sometimes called a  
switched capacitor circuit), where four MOSFET  
switches control the charge and discharge of a  
capacitor.  
A zener diode has been added to the TC962 for use as  
a reference in building external regulators. This zener  
runs from pin 1 to ground.  
The functional block diagram shows how the switching  
action works. SW1 and SW2 are turned on simulta-  
neously, charging CP to the supply voltage, VIN. This  
assumes that the on resistance of the MOSFETs in  
series with the capacitor results in a charging time  
(3 time constants) that is less than the on time provided  
by the oscillator frequency as shown:  
3.2  
Latch Up  
All CMOS structures contain a parasitic SCR. Care  
must be taken to prevent any input from going above or  
below the supply rail, or latch up will occur. The result  
of latch up is an effective short between VDD and VSS  
.
Unless the power supply input has a current limit, this  
latch up phenomena will result in damage to the device.  
(See AN763 Latch-up Protection of CMOS ICs.)  
3 (RDS(ON) CP) < CP/(0.5 fOSC  
)
In the next cycle, SW1 and SW2 are turned off and after  
a very short interval of all switches being off (this  
prevents large currents from occurring due to cross  
conduction), SW3 and SW4 are turned on. The charge  
in CP is then transferred to CR, but with the polarity  
inverted. In this way, a negative voltage is now derived.  
FIGURE 3-1:  
TEST CIRCUIT  
690  
I
S
+
V
1
8
7
NC  
(+5V)  
I
L
2
An oscillator supplies pulses to a flip-flop that is then  
fed to a set of level shifters. These level shifters then  
drive each set of switches at one-half the oscillator  
frequency.  
+
10µF  
C
3
4
TC962  
R
OSC  
L
C
P
V
5
OUT  
(5V)  
The oscillator has two pins that control the frequency of  
oscillation. Pin 7 can have a capacitor added that is  
returned to ground. This will lower the frequency of the  
oscillator by adding capacitance to the timing capacitor  
C
10µF  
R
+
FIGURE 3-2:  
TYPICAL APPLICATIONS  
Combined Negative Converter and Positive Multiplier  
+
Split V In Half  
+
+
V
V
1
2
8
7
1
2
8
7
V
D1  
10µF  
V
+
D2  
+
10µF  
V
=
TC962  
OUT  
+
C
P
3
4
6
3
4
6
5
C
TC962  
P2  
+
= V  
V
OUT  
2V 2V  
D
5
+
C
10µF  
R1  
+
10µF  
V
2
+
V
OUT  
C
P1  
+
+
C
R
10µF  
Lowering Output Resistance by Paralleling Devices  
Positive Voltage Multiplier  
+
V
+
V
1
2
8
8
1
2
1
2
8
7
V
D1  
7
6
5
7
V
D2  
+
+
10µF  
10µF  
V
=
TC962  
OUT  
+
3
4
TC962  
C
3
4
TC962  
6
5
3
4
6
5
C
P2  
P1  
2V 2V  
D
+
+
10µF  
C
C
P
P
10µF  
V
OUT  
C
R
10µF  
+
2002 Microchip Technology Inc.  
DS21484B-page 5  
TC962  
4.0  
TYPICAL CHARACTERISTICS  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein are  
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
Circuit of Figure 3-1, CP = CR = 10µF, CPESR CRESR 1.  
Frequency vs. Temperature  
Oscillator Frequency vs. C  
Supply Current vs. Temperature  
OSC  
20  
18  
16  
700  
600  
T
= +25°C  
C
= FREQ x 2 = OPEN  
A
OSC  
10k  
500  
400  
300  
200  
+
1k  
14  
12  
10  
V
= 15V  
100  
+
V
= 15V  
8
6
100  
0
10  
1
10  
100  
1000  
10,000  
-60 -40 -20  
0
20 40 60 80 100 120 140  
-60 -40 -20  
0
20 40 60 80 100 120 140  
CAPACITANCE (pF)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Output Resistance vs. Temperature  
Current vs. Zener Voltage  
Power Conversion Efficiency vs. I LOAD  
80  
70  
T
= +25°C  
T
= +25°C  
A
150  
50  
100  
90  
A
135  
120  
EFFICIENCY  
60  
50  
40  
40  
30  
20  
80  
70  
60  
+
105  
90  
V
= 5V I = 3mA  
L
SUPPLY  
CURRENT  
50  
75  
40  
30  
20  
10  
0
60  
45  
30  
15  
0
+
30  
20  
10  
V
= 15V I = 20mA  
L
10  
0
4.5  
4.0  
ZENER VOLTAGE (V)  
5.5  
6.0  
6.5  
7.0  
8
16 24 32 40 48 56 64 72 80  
LOAD CURRENT (mA)  
-60 -40 -20  
0
20 40 60 80 100 120 140  
TEMPERATURE (°C)  
Output Resistance vs. Input Voltage  
110  
100  
90  
T
= +25°C  
A
80  
70  
60  
50  
40  
30  
20  
3mA  
20mA  
10  
0
2
4
6
8
10 12 14 16 18 20  
INPUT VOLTAGE (V)  
DS21484B-page 6  
2002 Microchip Technology Inc.  
TC962  
5.0  
5.1  
PACKAGING INFORMATION  
Package Marking Information  
Package marking data not available at this time.  
5.2  
Package Dimensions  
8-Pin CDIP (Narrow)  
.110 (2.79)  
.090 (2.29)  
PIN 1  
.300 (7.62)  
.230 (5.84)  
.020 (0.51) MIN.  
.055 (1.40) MAX.  
.320 (8.13)  
.290 (7.37)  
.400 (10.16)  
.370 (9.40)  
.040 (1.02)  
.020 (0.51)  
.200 (5.08)  
.160 (4.06)  
.015 (0.38)  
.008 (0.20)  
3
°
MIN.  
.150 (3.81)  
MIN.  
.200 (5.08)  
.125 (3.18)  
.400 (10.16)  
.320 (8.13)  
.065 (1.65)  
.045 (1.14)  
.020 (0.51)  
.016 (0.41)  
Dimensions: inches (mm)  
8-Pin Plastic DIP  
PIN 1  
.260 (6.60)  
.240 (6.10)  
.045 (1.14)  
.030 (0.76)  
.070 (1.78)  
.040 (1.02)  
.310 (7.87)  
.290 (7.37)  
.400 (10.16)  
.348 (8.84)  
.200 (5.08)  
.140 (3.56)  
.040 (1.02)  
.020 (0.51)  
.015 (0.38)  
.008 (0.20)  
3
°
MIN.  
.150 (3.81)  
.115 (2.92)  
.400 (10.16)  
.310 (7.87)  
.110 (2.79)  
.090 (2.29)  
.022 (0.56)  
.015 (0.38)  
Dimensions: inches (mm)  
2002 Microchip Technology Inc.  
DS21484B-page 7  
TC962  
Package Dimensions (Continued)  
16-Pin SOIC (Wide)  
PIN 1  
.299 (7.59) .419 (10.65)  
.291 (7.40) .398 (10.10)  
.413 (10.49)  
.398 (10.10)  
.104 (2.64)  
.097 (2.46)  
8°  
MAX.  
.013 (0.33)  
.009 (0.23)  
.012 (0.30)  
.019 (0.48)  
.014 (0.36)  
.004 (0.10)  
.050 (1.27) TYP.  
.050 (1.27)  
.016 (0.40)  
Dimensions: inches (mm)  
DS21484B-page 8  
2002 Microchip Technology Inc.  
TC962  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277  
3. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
2002 Microchip Technology Inc.  
DS21484B-page9  
TC962  
NOTES:  
DS21484B-page10  
2002 Microchip Technology Inc.  
TC962  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchips products as critical com-  
ponents in life support systems is not authorized except with  
express written approval by Microchip. No licenses are con-  
veyed, implicitly or otherwise, under any intellectual property  
rights.  
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Serialized Quick Turn Programming (SQTP) is a service mark  
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All other trademarks mentioned herein are property of their  
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© 2002, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
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The Company’s quality system processes and  
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2002 Microchip Technology Inc.  
DS21484B-page 11  
M
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Rm. 1315, 13/F, Shenzhen Kerry Centre,  
Renminnan Lu  
Shenzhen 518001, China  
Tel: 86-755-2350361 Fax: 86-755-2366086  
2 Lan Drive, Suite 120  
Westford, MA 01886  
Tel: 978-692-3848 Fax: 978-692-3821  
Chicago  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Tel: 630-285-0071 Fax: 630-285-0075  
Dallas  
4570 Westgrove Drive, Suite 160  
Addison, TX 75001  
Tel: 972-818-7423 Fax: 972-818-2924  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
EUROPE  
Denmark  
Microchip Technology Nordic ApS  
Regus Business Centre  
Lautrup hoj 1-3  
Ballerup DK-2750 Denmark  
Tel: 45 4420 9895 Fax: 45 4420 9910  
Detroit  
Tri-Atria Office Building  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250 Fax: 248-538-2260  
Kokomo  
France  
2767 S. Albright Road  
Kokomo, Indiana 46902  
Tel: 765-864-8360 Fax: 765-864-8387  
Los Angeles  
Microchip Technology SARL  
Parc dActivite du Moulin de Massy  
43 Rue du Saule Trapu  
Batiment A - ler Etage  
91300 Massy, France  
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
Tel: 949-263-1888 Fax: 949-263-1338  
Germany  
New York  
150 Motor Parkway, Suite 202  
Hauppauge, NY 11788  
Microchip Technology GmbH  
Gustav-Heinemann Ring 125  
D-81739 Munich, Germany  
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44  
Tel: 631-273-5305 Fax: 631-273-5335  
San Jose  
Hong Kong  
Italy  
Microchip Technology Inc.  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Microchip Technology Hongkong Ltd.  
Unit 901-6, Tower 2, Metroplaza  
223 Hing Fong Road  
Kwai Fong, N.T., Hong Kong  
Tel: 852-2401-1200 Fax: 852-2401-3431  
Microchip Technology SRL  
Centro Direzionale Colleoni  
Palazzo Taurus 1 V. Le Colleoni 1  
20041 Agrate Brianza  
Tel: 408-436-7950 Fax: 408-436-7955  
Toronto  
Milan, Italy  
Tel: 39-039-65791-1 Fax: 39-039-6899883  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699 Fax: 905-673-6509  
India  
Microchip Technology Inc.  
India Liaison Office  
United Kingdom  
Arizona Microchip Technology Ltd.  
505 Eskdale Road  
Winnersh Triangle  
Wokingham  
Divyasree Chambers  
1 Floor, Wing A (A3/A4)  
No. 11, OShaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-2290061 Fax: 91-80-2290062  
Berkshire, England RG41 5TU  
Tel: 44 118 921 5869 Fax: 44-118 921-5820  
03/01/02  
'ꢀꢁꢂꢃ!%!ꢄ'  
DS21484B-page 12  
2002 Microchip Technology Inc.  

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