TC7129CJL [MICROCHIP]
1-CH DUAL-SLOPE ADC, CDIP40, CERAMIC, DIP-40;型号: | TC7129CJL |
厂家: | MICROCHIP |
描述: | 1-CH DUAL-SLOPE ADC, CDIP40, CERAMIC, DIP-40 CD 转换器 |
文件: | 总28页 (文件大小:544K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC7129
4-1/2 Digit Analog-to-Digital Converters with
On-Chip LCD Drivers
Features:
General Description:
• Count Resolution: ±19,999
The TC7129 is a 4-1/2 digit Analog-to-Digital Converter
(ADC) that directly drives a multiplexed Liquid Crystal
Display (LCD). Fabricated in high-performance, low-
power CMOS, the TC7129 ADC is designed specifi-
cally for high-resolution, battery-powered digital multi-
meter applications. The traditional dual-slope method
of A/D conversion has been enhanced with a succes-
sive integration technique to produce readings accu-
rate to better than 0.005% of full-scale and resolution
down to 10 μV per count.
• Resolution on 200 mV Scale: 10 μV
• True Differential Input and Reference
• Low Power Consumption: 500 μA at 9V
• Direct LCD Driver for 4-1/2 Digits, Decimal Points,
Low Battery Indicator, and Continuity Indicator
• Overrange and Underrange Outputs
• Range Select Input: 10:1
• High Common Mode Rejection Ratio: 110 dB
• External Phase Compensation Not Required
The TC7129 includes features important to multimeter
applications. It detects and indicates low battery condi-
tion. A continuity output drives an annunciator on the
display and can be used with an external driver to sound
an audible alarm. Overrange and underrange outputs,
along with a range-change input, provide the ability to
create auto-ranging instruments. For snapshot read-
ings, the TC7129 includes a latch-and-hold input to
freeze the present reading. This combination of features
makes the TC7129 the ideal choice for full-featured
multimeter and digital measurement applications.
Applications:
• Full-Featured Multimeters
• Digital Measurement Devices
Device Selection Table
Package
Code
Pin
Layout
Temperature
Range
Package
TC7129CPL
Normal
40-Pin PDIP
44-PinPQFP
44-PinPLCC
0°C to +70°C
0°C to +70°C
0°C to +70°C
TC7129CKW Formed
TC7129CLW
–
Typical Application
Low Battery
Continuity
V+
5 pF
20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
120 kHz
TC7129
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
330 kΩ
*
0.1 µF
10 pF
V+
0.1
+
µF
20
kΩ
0.1 µF
1 µF
150 kΩ
10 kΩ
+
100 kΩ
9V
+
–
V
IN
*Note: RC network between pins 26 and 28 is not required.
© 2006 Microchip Technology Inc.
DS21459D-page 1
TC7129
Package Types
40-Pin PDIP
OSC1
OSC3
40 OSC2
1
2
39 DP
1
38 DP
2
ANNUNICATOR
B , C , CONT
3
37
4
RANGE
1
1
A , G , D
5
36 DGND
1
1
1
1
F , E , DP
6
REF LO
REF HI
IN HI
1
1
35
34
33
32
B , C , LO BATT
7
2
2
A , G , D
8
2
2
2
2
F , E , DP
9
2
2
IN LO
31 BUFF
10
11
12
13
14
15
16
17
18
19
20
B , C MINUS
TC7129CPL
3
3
,
Display
Output
Lines
A , G , D
C
C
-
30
29
28
3
3
3
3
5
4
4
REF
F , E , DP
+
3
3
REF
B , C BC
COMMON
4
4
,
A , G , D
27 CONTINUITY
26 INT OUT
25 INT IN
24 V+
4
4
F , E , DP
4
4
BP
BP
BP
3
2
1
23 V-
V
22
LATCH/HOLD
DISP
DP /OR
21 DP /UR
3
4
44-Pin QFP
44-Pin PLCC
6
5
4
3
2
1
44 43 42 41 40
44 43 42 41 40 39 38 37 36 35 34
F , E , DP
F , E , DP
1
REF LO
33
32
31
30
29
28
27
26
25
24
23
7
39
38 REF HI
IN HI
1
2
3
4
REF LO
REF HI
1
1
1
1
1
8
B , C , BATT
B , C , BATT
2 2
2
2
A , G , D
A , G , D
2 2 2
9
37
36 IN LO
IN HI
IN LO
BUFF
NC
2
2
2
F , E , DP
F , E , DP
2 2 2
10
11
12
13
14
15
16
2
2
2
B , C MINUS
B , C MINUS
35
34
33
32
31
30
29
BUFF
NC
5
6
3
3
,
3
3
,
NC
NC
TC7129CKW
TC7129CLW
A , G , D
A , G , D
C
-
7
C
-
3
3
3
3
3
3
3
3
REF
REF
REF
REF
F , E , DP
F , E , DP
3 3
C
+
8
C
+
3
3
B , C BC
B , C BC
4 4 5
,
9
COMMON
CONTINUITY
INT OUT
4
4
5
COMMON
CONTINUITY
INT OUT
,
A , G , D
A , G , D
4 4 4
10
11
4
4
4
F , E , DP
F , E , DP 17
4 4 4
4
4
4
18 19 20 21 22 23 24 25 26 27 28
12 13 14 15 16 17 18 19 20 21 22
DS21459D-page 2
© 2006 Microchip Technology Inc.
TC7129
*Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (V+ to V-).......................................15V
Reference Voltage (REF HI or REF LO) ........ V+ to V–
Input Voltage (IN HI or IN LO) (Note 1).......... V+ to V–
VDISP.......................................... V+ to (DGND – 0.3V)
Digital Input (Pins 1, 2, 19, 20,
21, 22, 27, 37, 39, 40).......................... DGND to V+
Analog Input (Pins 25, 29, 30) ....................... V+ to V–
Package Power Dissipation (TA ≤ 70°C)
Plastic DIP .....................................................1.23W
PLCC .............................................................1.23W
Plastic QFP ....................................................1.00W
Operating Temperature Range ............... 0°C to +70°C
Storage Temperature Range..............-65°C to +150°C
TC7129 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V+ to V– = 9V, VREF = 1V, TA = +25°C, fCLK = 120 kHz, unless otherwise indicated.
Pin numbers refer to 40-pin DIP.
Symbol
Input
Parameter
Min
Typ
Max
Unit
Test Conditions
Zero Input Reading
–0000
—
0000
±0.5
—
+0000 Counts VIN = 0V, 200 mV scale
μV/°C VIN = 0V, 0°C < TA < +70°C
Zero Reading Drift
—
Ratiometric Reading
9996
10000 Counts VIN = VREF = 1000 mV,
Range = 2V
Range Change Accuracy
0.9999
1.0000 1.0001
Ratio VIN = 1V on High Range,
VIN = 0.1V on Low Range
RE
NL
Rollover Error
Linearity Error
—
—
—
1
1
2
Counts VIN– = VIN+ = 199 mV
Counts 200mV Scale
—
—
CMRR Common Mode Rejection Ratio
110
dB
VCM = 1V, VIN = 0V,
200 mV scale
CMVR Common Mode Voltage Range
—
(V-) +
1.5
—
V
VIN = 0V
—
—
(V+) – 1
14
—
—
V
200 mV scale
eN
IIN
Noise (Peak-to-Peak Value not
Exceeded 95% of Time)
μVP-P VIN = 0V
200 mV scale
VIN = 0V, pins 32, 33
Input Leakage Current
—
—
1
2
10
7
pA
Scale Factor Temperature
Coefficient
ppm/°C VIN = 199 mV,
0°C < TA < +70°C
External VREF = 0 ppm/°C
Note 1: Input voltages may exceed supply voltages, provided input current is limited to ±400 μA. Currents above
this value may result in invalid display readings, but will not destroy the device if limited to ±1 mA.
Dissipation ratings assume device is mounted with all leads soldered to printed circuit board.
© 2006 Microchip Technology Inc.
DS21459D-page 3
TC7129
TC7129 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: V+ to V– = 9V, VREF = 1V, TA = +25°C, fCLK = 120 kHz, unless otherwise indicated.
Pin numbers refer to 40-pin DIP.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
Power
VCOM
Common Voltage
2.8
—
—
4.5
—
6
3.2
0.6
10
3.5
—
V
mA
μA
V
V+ to pin 28
Common Sink Current
ΔCommon = +0.1V
ΔCommon = -0.1V
V+ to pin 36, V+ to V– = 9V
ΔDGND = +0.5V
V+ to V–
Common Source Current
—
DGND Digital Ground Voltage
Sink Current
5.3
1.2
9
5.8
—
mA
V
Supply Voltage Range
12
1.3
IS
Supply Current Excluding
Common Current
—
0.8
mA
V+ to V– = 9V
fCLK
Clock Frequency
VDISP Resistance
—
—
120
50
360
—
kHz
kΩ
V
VDISP to V+
V+ to V–
Low Battery Flag Activation
Voltage
6.3
7.2
7.7
Digital
Continuity Comparator Threshold
Voltages
100
—
—
—
—
—
—
200
200
2
—
400
10
—
mV
mV
μA
μA
μA
μA
μA
VOUT pin 27 = High
VOUT pin 27 = Low
Pins 37, 38, 39
Pull-down Current
“Weak Output” Current
Sink/Source
3/3
3/9
40
3
Pins 20, 21 sink/source
Pin 27 sink/source
—
Pin 22 Source Current
Pin 22 Sink Current
—
—
Note 1: Input voltages may exceed supply voltages, provided input current is limited to ±400 μA. Currents above
this value may result in invalid display readings, but will not destroy the device if limited to ±1 mA.
Dissipation ratings assume device is mounted with all leads soldered to printed circuit board.
DS21459D-page 4
© 2006 Microchip Technology Inc.
TC7129
2.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
Pin No.
Pin No.
Symbol
Function
40-Pin PDIP 44-Pin PQFP 44-Pin PLCC
1
2
3
4
5
6
7
40
41
42
43
44
1
2
3
4
5
6
7
8
OSC1
OSC3
Input to first clock inverter.
Output of second clock inverter.
ANNUNCIATOR Backplane square wave output for driving annunciators.
B , C , CONT
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
1
1
A , G , D
1
1
1
F , E , DP
1
1
1
2
B , C ,
2 2
LO BATT
8
3
4
9
A , G , D
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
Output to display segments.
Backplane #3 output to display.
Backplane #2 output to display.
Backplane #1 output to display.
Negative rail for display drivers.
2
2
2
9
10
11
13
14
15
16
17
18
19
20
21
22
F , E , DP
2 2
2
10
11
12
13
14
15
16
17
18
19
20
5
B , C , MINUS
3 3
7
A , G , D
3 3 3
8
F , E , DP
3 3 3
9
B , C , BC
4 4
5
10
11
12
13
14
15
16
A , D , G
4
4
4
F , E , DP
4
4
4
BP
3
2
1
BP
BP
V
DISP
DP /OR
Input: When high, turns on most significant decimal point.
Output: Pulled high when result count exceeds ±19,999.
4
21
22
18
19
24
25
DP /UR
Input: Second-most significant decimal point on when high.
Output: Pulled high when result count is less than ±1000.
3
LATCH/HOLD
Input: When floating, ADC operates in Free Run mode. When
pulled high, the last displayed reading is held. When pulled low,
the result counter contents are shown incrementing during the
de-integrate phase of cycle.
Output: Negative going edge occurs when the data latches are
updated. Can be used for converter status signal.
23
24
20
21
26
27
V–
V+
Negative power supply terminal.
Positive power supply terminal and positive rail for display
drivers.
25
26
27
22
23
24
28
29
30
INT IN
INT OUT
Input to integrator amplifier.
Output of integrator amplifier.
CONTINUITY
Input: When low, continuity flag on the display is off. When high,
continuity flag is on.
Output: High when voltage between inputs is less than +200 mV.
Low when voltage between inputs is more than +200 mV.
28
25
31
COMMON
Sets common mode voltage of 3.2V below V+ for DE, 10X, etc.
Can be used as pre-regulator for external reference.
29
30
31
32
33
34
35
26
27
29
30
31
32
33
32
33
35
36
37
38
39
C
C
+
–
Positive side of external reference capacitor.
Negative side of external reference capacitor.
Output of buffer amplifier.
REF
REF
BUFFER
IN LO
Negative input voltage terminal.
Positive input voltage terminal.
Positive reference voltage.
IN HI
REF HI
REF LO
Negative reference voltage
© 2006 Microchip Technology Inc.
DS21459D-page 5
TC7129
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin No.
Pin No.
Pin No.
Symbol
Function
40-Pin PDIP 44-Pin PQFP 44-Pin PLCC
36
34
40
DGND
Internal ground reference for digital section. See Section 4.2.1
“±5V Power Supply”.
37
35
41
RANGE
3 μA pull-down for 200 mV scale. Pulled high externally for 2V
scale.
38
39
40
—
36
37
38
42
43
44
DP
Internal 3 μA pull-down. When high, decimal point 2 will be on.
Internal 3 μA pull-down. When high, decimal point 1 will be on.
Output of first clock inverter. Input of second clock inverter.
No connection.
2
DP
1
OSC2
NC
6,17, 28, 39 12, 23, 34, 1
DS21459D-page 6
© 2006 Microchip Technology Inc.
TC7129
The resistor and capacitor values are not critical; those
shown work for most applications. In some situations,
the capacitor values may have to be adjusted to
compensate for parasitic capacitance in the circuit. The
capacitors can be low-cost ceramic devices.
3.0
DETAILED DESCRIPTION
(All pin designations refer to 40-pin PDIP.)
The TC7129 is designed to be the heart of a high-
resolution analog measurement instrument. The only
additional components required are a few passive
elements: a voltage reference, a LCD and a power
source. Most component values are not critical;
substitutes can be chosen based on the information
given below.
Some applications can use a simple RC network
instead of a crystal oscillator. The RC oscillator has
more potential for jitter, especially in the least
significant digit. See Section 4.5 “RC Oscillator”.
The basic circuit for a digital multimeter application is
shown in Figure 3-1. See Section 4.0 “Typical Appli-
cations”, for variations. Typical values for each
component are shown. The sections below give
component selection criteria.
3.2
Integrating Resistor (RINT)
The integrating resistor sets the charging current for
the integrating capacitor. Choose a value that provides
a current between 5 μA and 20 μA at 2V, the maximum
full-scale input. The typical value chosen gives a
charging current of 13.3 μA:
3.1
Oscillator (X
, C , C , R )
OSC O1 O2 O
EQUATION 3-1:
The primary criterion for selecting the crystal oscillator
is to choose a frequency that achieves maximum rejec-
tion of line frequency noise. To do this, the integration
phase should last an integral number of line cycles.
The integration phase of the TC7129 is 10,000 clock
cycles on the 200 mV range and 1000 clock cycles on
the 2V range. One clock cycle is equal to two oscillator
cycles. For 60 Hz rejection, the oscillator frequency
should be chosen so that the period of one line cycle
equals the integration time for the 2V range.
2V
150 kΩ
ICHARGE
=
13.3 µA
Too high a value for RINT increases the sensitivity to
noise pickup and increases errors due to leakage
current. Too low a value degrades the linearity of the
integration, leading to inaccurate readings.
EQUATION 3-1:
1/60 second = 16.7 msec =
1000 clock cycles *2 OSC cycles/clock cycle
OSC Frequency
This equation gives an oscillator frequency of 120 kHz.
A similar calculation gives an optimum frequency of
100 kHz for 50 Hz rejection.
© 2006 Microchip Technology Inc.
DS21459D-page 7
TC7129
Low Battery
Continuity
V+
C
5 pF
O1
20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
Display Drive Outputs
TC7129
120
kHz
Crystal
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
330 kΩ
R
O
C
INT
0.1 µF
C
10 pF
O2
R
D
REF
C
+
0.1
µF
REF
20
kΩ
REF
1 µF
C
RF
0.1 µF
V+
150 kΩ
R
C
IF
INT
10 kΩ
BIAS
+
R
IF
100 kΩ
R
9V
–
+
V
IN
Figure 3-1:
Standard Circuit.
The capacitor should have low dielectric absorption to
ensure good integration linearity. Polypropylene and
Teflon® capacitors are usually suitable. A good
measurement of the dielectric absorption is to connect
the reference capacitor across the inputs by
connecting:
3.3 Integrating Capacitor (C
)
INT
The charge stored in the integrating capacitor during
the integrate phase is directly proportional to the input
voltage. The primary selection criterion for CINT is to
choose a value that gives the highest voltage swing
while remaining within the high-linearity portion of the
integrator output range. An integrator swing of 2V is the
recommended value. The capacitor value can be
calculated using the following equation:
Pin-to-Pin:
20 → 33 (CREF+ to IN HI)
30 → 32 (CREF– to IN LO)
EQUATION 3-1:
A reading between 10,000 and 9998 is acceptable;
anything lower indicates unacceptably high dielectric
absorption.
tINT x IINT
CINT
=
VSWING
Where tINT is the integration time.
3.4
Reference Capacitor (C
)
REF
The reference capacitor stores the reference voltage
during several phases of the measurement cycle. Low
leakage is the primary selection criterion for this com-
ponent. The value must be high enough to offset the
effect of stray capacitance at the capacitor terminals. A
value of at least 1 μF is recommended.
Using the values derived above (assuming 60 Hz
operation), the equation becomes:
EQUATION 3-2:
16.7 msec x 13.3 μA
CINT
=
= 0.1 μA
2V
DS21459D-page 8
© 2006 Microchip Technology Inc.
TC7129
3.5
Voltage Reference
(D , R , R , C
+5V
)
RF
REF REF BIAS
TC7129
The reference potentiometer (RREF) provides an
adjustment for adjusting the reference voltage; any
value above 20 kΩ is adequate. The bias resistor
(RBIAS) limits the current through DREF to less than
150 μA. The reference filter capacitor (CRF) forms an
RC filter with RBIAS to help eliminate noise.
24
V+
34
REF HI
0.1 µF
35
REF LO
36
DGND
3.6
Input Filter (R , C )
IF IF
28
33
COMMON
0.1 µF
For added stability, an RC input noise filter is usually
included in the circuit. The input filter resistor value
should not exceed 100 kΩ. A typical RC time constant
value is 16.7 msec to help reject line frequency noise.
The input filter capacitor should have low leakage for a
high-impedance input.
+
–
IN HI
V
IN
32
0.1 µF
IN LO
V–
23
3.7
Battery
-5V
The typical circuit uses a 9V battery as a power source.
However, any value between 6V and 12V can be used.
For operation from batteries with voltages lower than
6V and for operation from power supplies, see
Section 4.2 “Powering the TC7129”.
Figure 4-1:
a ±5V Power Supply.
Powering the TC7129 From
4.2.2
Low Voltage Battery Source
A battery with voltage between 3.8V and 6V can be
used to power the TC7129 when used with a voltage
doubler circuit, as shown in Figure 4-2. The voltage
doubler uses the TC7660 DC-to-DC voltage converter
and two external capacitors.
4.0
4.1
TYPICAL APPLICATIONS
TC7129 as a Replacement Part
The TC7129 is a direct pin-for-pin replacement part for
the ICL7129. Note, however, that the ICL7129 requires
a capacitor and resistor between pins 26 and 28 for
phase compensation. Since the TC7129 uses internal
phase compensation, these parts are not required and,
in fact, must be removed from the circuit for stable
operation.
24
V+
34
REF HI
36
DGND
+
3.8V
to
6V
35
REF LO
28
33
32
COMMON
4.2
Powering the TC7129
TC7129
+
IN HI
While the most common power source for the TC7129
is a 9V battery, there are other possibilities. Some of
the more common ones are explained below.
V
IN
8
IN LO
V–
–
2
+
23
10 µF
4.2.1
±5V Power Supply
TC7660
4
5
Measurements are made with respect to power supply
ground. DGND (pin 36) is set internally to about 5V less
than V+ (pin 24); it is not intended to be a power supply
input and must not be tied directly to power supply
ground. It can be used as a reference for external logic,
as explained in Section 4.3 “Connecting to External
Logic”, (see Figure 4-1).
10 µF
+
3
Figure 4-2:
Powering the TC7129 From
a Low-Voltage Battery.
© 2006 Microchip Technology Inc.
DS21459D-page 9
TC7129
4.2.3
+5V Power Supply
+
V
Measurements are made with respect to power supply
ground. COMMON (pin 28) is connected to REF LO
(pin 35). A voltage doubler is needed, since the supply
voltage is less than the 6V minimum needed by the
TC7129. DGND (pin 36) must be isolated from power
supply ground (see Figure 4-3).
24
External
Logic
TC7129
+5V
36
DGND
I
LOGIC
24
V+
34
23
V-
0.1 µF
TC7129
35
Figure 4-4:
Directly to DGND.
External Logic Referenced
36
DGND
28
33
32
0.1 µF
+
V
IN
V+
24
8
–
V+
2
V–
23
+
10 µF
TC7660
4
5
External
Logic
GND
3
10 µF
+
TC7129
–
Figure 4-3:
a +5V Power Supply.
Powering the TC7129 From
36
+
DGND
I
LOGIC
23
4.3
Connecting to External Logic
External logic can be directly referenced to DGND
(pin 36), provided that the supply current of the external
logic does not exceed the sink current of DGND
(Figure 4-4). A safe value for DGND sink current is
1.2 mA. If the sink current is expected to exceed this
value, a buffer is recommended (see Figure 4-5).
V–
Figure 4-5:
to DGND with Buffer.
External Logic Referenced
4.4
Temperature Compensation
For most applications, VDISP (pin 19) can be connected
directly to DGND (pin 36). For applications with a wide
temperature range, some LCDs require that the drive
levels vary with temperature to maintain good viewing
angle and display contrast. Figure 4-6 shows two
circuits that can be adjusted to give temperature com-
pensation of about 10 mV/°C between V+ (pin 24) and
VDISP. The diode between DGND and VDISP should
have a low turn-on voltage because VDISP cannot
exceed 0.3V below DGND.
DS21459D-page 10
© 2006 Microchip Technology Inc.
TC7129
V+
V+
1N4148
39 kΩ
39 kΩ
24
24
200 kΩ
TC7129
20 kΩ
2N2222
19
TC7129
–
+
19
36
V
DISP
V
DISP
5 kΩ
36
DGND
DGND
75 kΩ
18 kΩ
23
23
V–
V–
Figure 4-6:
Temperature Compensating Circuits.
4.5 RC Oscillator
4.6
Measuring Techniques
For applications in which 3-1/2 digit (100 μV) resolution
is sufficient, an RC oscillator is adequate. A recom-
mended value for the capacitor is 51 pF. Other values
can be used as long as they are sufficiently larger than
the circuit parasitic capacitance. The resistor value is
calculated as:
Two important techniques are used in the TC7129:
successive integration and digital auto-zeroing.
Successive integration is a refinement to the traditional
dual-slope conversion technique.
4.7
Dual-Slope Conversion
EQUATION 4-1:
A dual-slope conversion has two basic phases: inte-
grate and de-integrate. During the integrate phase, the
input signal is integrated for a fixed period of time; the
integrated voltage level is thus proportional to the input
voltage. During the de-integrate phase, the integrated
voltage is ramped down at a fixed slope, and a counter
counts the clock cycles until the integrator voltage
crosses zero. The count is a measurement of the time
to ramp the integrated voltage to zero and is, therefore,
proportional to the input voltage being measured. This
count can then be scaled and displayed as a measure-
ment of the input voltage. Figure 4-8 shows the phases
of the dual-slope conversion.
0.45
R =
Freq * C
For 120 kHz frequency and C = 51 pF, the calculated
value of R is 75 kΩ. The RC oscillator and the crystal
oscillator circuits are shown in Figure 4-7.
TC7129
1
40
2
270 kΩ
10 pF
De-integrate
Integrate
5 pF
120 kHz
V+
V+
Zero
Crossing
TC7129
Time
1
40
2
Figure 4-8:
Dual-Slope Conversion.
75 kΩ
51 pF
The dual-slope method has a fundamental limitation.
The count can only stop on a clock cycle, so that mea-
surement accuracy is limited to the clock frequency. In
addition, a delay in the zero-crossing comparator can
add to the inaccuracy. Figure 4-9 shows these errors in
an actual measurement.
Figure 4-7:
Oscillator Circuits.
© 2006 Microchip Technology Inc.
DS21459D-page 11
TC7129
De-integrate
Integrate
Overshoot due to zero-crossing between
clock pulses
Time
Integrator Residue Voltage
Overshoot caused by comparator
delay of 1 clock pulse
Clock Pulses
Figure 4-9:
Accuracy Errors in Dual-Slope Conversion.
Zero Integrate
and Latch
INT
DE
1
De-integrate
1
REST X10
DE
REST X10
DE
Zero Integrate
Integrate
2
3
TC7129
Integrator
Note: Shaded area greatly expanded in time and amplitude.
Residual Voltage
Figure 4-10:
Integration Waveform.
DS21459D-page 12
© 2006 Microchip Technology Inc.
TC7129
4.8
Successive Integration
4.9
Digital Auto-Zeroing
The successive integration technique picks up where
dual-slope conversion ends. The overshoot voltage
shown in Figure 4-9 (called the “integrator residue
voltage”) is measured to obtain a correction to the initial
count. Figure 4-10 shows the cycles in a successive
integration measurement.
To eliminate the effect of amplifier offset errors, the
TC7129 uses a digital auto-zeroing technique. After the
input voltage is measured as described above, the
measurement is repeated with the inputs shorted
internally. The reading with inputs shorted is a
measurement of the internal errors and is subtracted
from the previous reading to obtain a corrected
measurement. Digital auto-zeroing eliminates the need
for an external auto-zeroing capacitor used in other
ADCs.
The waveform shown is for a negative input signal. The
sequence of events during the measurement cycle is
shown in Table 4-1.
TABLE 4-1:
MEASUREMENT CYCLE
SEQUENCE
4.10 Inside the TC7129
Figure 4-11 shows a simplified block diagram of the
TC7129.
Phase
Description
INT
Input signal is integrated for fixed time (1000 clock
cycles on 2V scale, 10,000 on 200 mV).
1
DE
Integrator voltage is ramped to zero. Counter
counts up until zero-crossing to produce reading
accurate to 3-1/2 digits. Residue represents an
overshoot of the actual input voltage.
1
REST Rest; circuit settles.
X10 Residue voltage is amplified 10 times and
inverted.
DE
Integrator voltage is ramped to zero. Counter
counts down until zero-crossing to correct reading
to 4-1/2 digits. Residue represents an undershoot
of the actual input voltage.
2
REST Rest; circuit settles.
X10 Residue voltage is amplified 10 times and
inverted.
DE
Integrator voltage is ramped to zero. Counter
counts up until zero-crossing to correct reading to
5-1/2 digits. Residue is discarded.
3
© 2006 Microchip Technology Inc.
DS21459D-page 13
TC7129
Low Battery
Continuity
Backplane
Drives
Segment Drives
Annunciator
Drive
TC7129
OSC1
OSC2
OSC3
V
Latch, Decode Display Multiplexer
DISP
Up/Down Results Counter
Sequence Counter/Decoder
Control Logic
RANGE
DP
DP
1
2
L/H
CONT
UR/DP
3
OR/DP
4
V+
V–
Analog Section
REF HI
DGND
REF LO
INT OUT
INT IN
BUFF
COMMON
IN IN
HI LO
Figure 4-11:
TC7129 Functional Block Diagram.
C
C
REF
R
INT
INT
REF HI
REF LO
DE
DE
X10
Integrator
–
–
+
10
pF
Comparator 1
INT
1
IN HI
+
To Digital
Section
Buffer
DE-
DE+
DE–
+
–
100 pF
Comparator 2
DE+
ZI, X10
Common
IN LO
INT
REST
INT INT
1
,
2
–
500 kΩ
TC7129
+
–
+
V
Continuity
Comparator
200 mV
Continuity
To Display Driver
Figure 4-12:
Integrator Block Diagram.
DS21459D-page 14
© 2006 Microchip Technology Inc.
TC7129
4.11 Integrator Section
The integrator section includes the integrator, compar-
ator, input buffer amplifier and analog switches (see
Table 4-2) used to change the circuit configuration
during the separate measurement phases described
earlier. (See Figure 4-12).
–
+
IN HI
COM
Buffer
TABLE 4-2:
SWITCH LEGENDS
Label
Description
Label
DE
Meaning.
TC7129
Open during all de-integrate phases.
IN LO
DE–
Closed during all de-integrate phases when
input voltage is negative.
–
+
500 kΩ
200 mV
V
To Display Driver
(Not Latched)
DE+
Closed during all de-integrate phases when
input voltage is positive.
CONT
INT
INT
Closed during the first integrate phase
(measurement of the input voltage).
1
2
Closed during the second integrate phase
(measurement of the amplifier offset).
Figure 4-13:
Continuity Indicator Circuit.
INT
REST
ZI
Open during both integrate phases.
Closed during the rest phase.
TC7129
Closed during the zero integrate phase.
Closed during the X10 phase.
Open during the X10 phase.
X10
X10
500 kΩ
DP /OR, Pin 20
4
The buffer amplifier has a common mode input voltage
range from 1.5V above V– to 1V below V+. The integra-
tor amplifier can swing to within 0.3V of the rails.
However, for best linearity, the swing is usually limited
to within 1V. Both amplifiers can supply up to 80 μA of
output current, but should be limited to 20 μA for good
linearity.
DP /UR, Pin 21
3
LATCH/HOLD Pin 22
CONTINUITY, Pin 27
Figure 4-14:
Input/Output Pin Schematic.
4.13 Common and Digital Ground
4.12 Continuity Indicator
The common and digital ground (DGND) outputs are
generated from internal Zener diodes. The voltage
between V+ and DGND is the internal supply voltage
for the digital section of the TC7129. Common can
source approximately 12 μA; DGND has essentially no
source capability (see Figure 4-15).
A comparator with a 200 mV threshold is connected
between IN HI (pin 33) and IN LO (pin 32). Whenever
the voltage between inputs is less than 200 mV, the
CONTINUITY output (pin 27) will be pulled high,
activating the continuity annunciator on the display.
The continuity pin can also be used as an input to drive
the continuity annunciator directly from an external
source (see Figure 4-13).
A schematic of the input/output nature of this pin is also
shown in Figure 4-14.
© 2006 Microchip Technology Inc.
DS21459D-page 15
TC7129
4.17 LATCH/Hold
24
3.2V
28
V+
The L/H output goes low during the last 100 cycles of
each conversion. This pulse latches the conversion
data into the display driver section of the TC7129. This
pin can also be used as an input. When driven high, the
display will not be updated; the previous reading is
displayed. When driven low, the display reading is not
latched; the sequence counter reading will be
displayed. Since the counter is counting much faster
than the backplanes are being updated, the reading
shown in this mode is somewhat erratic.
12 µA
COM
–
N
5V
+
Logic
Section
36
23
DGND
P
TC7129
N
4.18 Display Driver
The TC7129 drives a triplexed LCD with three back-
planes. The LCD can include decimal points, polarity
sign and annunciators for continuity and low battery.
Figure 4-16 shows the assignment of the display
segments to the backplanes and segment drive lines.
The backplane drive frequency is obtained by dividing
the oscillator frequency by 1200. This results in a back-
plane drive frequency of 100 Hz for 60 Hz operation
(120 kHz crystal) and 83.3 Hz for 50 Hz operation
(100 kHz crystal).
V–
Figure 4-15:
Common Outputs.
Digital Ground (DGND) and
4.14 Low Battery
The low battery annunciator turns on when supply volt-
age between V– and V+ drops below 6.8V. The internal
zener diode has a threshold of 6.3V. When the supply
voltage drops below 6.8V, the transistor tied to V– turns
off pulling the “Low Battery” point high.
Backplane waveforms are shown in Figure 4-17.
These appear on outputs BP1, BP2, BP3 (pins 16, 17
and 18). They remain the same, regardless of the
segments being driven.
4.15 Sequence and Results Counter
Other display output lines (pins 4 through 15) have
waveforms that vary depending on the displayed
values. Figure 4-18 shows a set of waveforms for the
A, G, D outputs (pins 5, 8, 11 and 14) for several
combinations of “ON” segments.
A sequence counter and associated control logic pro-
vide signals that operate the analog switches in the
integrator section. The comparator output from the inte-
grator gates the results counter. The results counter is
a six-section up/down decade counter that holds the
intermediate results from each successive integration.
The ANNUNCIATOR DRIVE output (pin 3) is a square
wave, running at the backplane frequency (100 Hz or
83.3 Hz) with a peak-to-peak voltage equal to DGND
voltage. Connecting an annunciator to pin 3 turns it on;
connecting it to its backplane turns it off.
4.16 Overrange and Underrange
Outputs
When the results counter holds a value greater than
±19,999, the DP4/OR output (Pin 20) is driven high.
When the results counter value is less than ±1000, the
DP3/UR output (Pin 21) is driven high. Both signals are
valid on the falling edge of LATCH/HOLD (L/H) and do
not change until the end of the next conversion cycle.
The signals are updated at the end of each conversion,
unless the L/H input (Pin 22) is held high. Pins 20 and
21 can also be used as inputs for external control of
decimal points 3 and 4. Figure 4-14 shows a schematic
of the input/output nature of these pins.
DS21459D-page 16
© 2006 Microchip Technology Inc.
TC7129
Low Battery
Continuity
BP
BP
1
2
Backplane
Connections
BP
3
Low Battery
Continuity
F
E
DP
D
4
4
4
4
4
3
3
B
1
,
C
Continuity
,
,
1
,
A
G
4
4
A
1
,
F
1
,
B
2
,
A
2
,
G
D
,
,
1
1
,
B
C
BC
4
4
3
E
DP
1
,
,
,
1
,
F
E
DP
D
3
C
Low Battery
,
2
,
A
G
3
G
E
D
2
3
,
,
2
,
B
C
MINUS
3
F
2
,
DP
2
3
2
,
,
,
Figure 4-16:
Display Segment Assignments.
V
V
DD
H
b Segment
Line
All Off
BP
1
V
V
L
DISP
V
V
DD
H
a Segment
On
d, g Off
BP
2
V
V
L
DISP
V
V
DD
H
a, g On
d Off
BP
3
V
V
L
DISP
V
V
DD
H
Figure 4-17:
Backplane Waveforms.
All On
V
V
L
DISP
Figure 4-18:
Typical Display Output
Waveforms.
© 2006 Microchip Technology Inc.
DS21459D-page 17
TC7129
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available a this time.
5.2
Taping Forms
User Direction of Feed
W, Width
of C arrier
Tape
P in 1
P in 1
P , P itch
R everse R eel C omponent Orientation
S tandard R eel C omponent Orientation
Component Taping Orientation for 44-Pin PQFP Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
44-Pin PQFP
24 mm
16 mm
500
13 in
Note: Drawing does not represent total number of pins.
DS21459D-page 18
© 2006 Microchip Technology Inc.
TC7129
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
E1
D
2
α
n
1
E
A2
A
L
c
B1
B
β
A1
p
eB
Units
INCHES*
NOM
40
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
40
MAX
n
p
Number of Pins
Pitch
.100
2.54
Top to Seating Plane
A
.160
.175
.190
.160
4.06
3.56
4.45
3.81
4.83
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.140
.015
.595
.530
2.045
.120
.008
.030
.014
.620
5
.150
4.06
0.38
15.11
13.46
51.94
3.05
0.20
0.76
0.36
15.75
5
.600
.545
2.058
.130
.012
.050
.018
.650
10
.625
.560
2.065
.135
.015
.070
.022
.680
15
15.24
13.84
52.26
3.30
0.29
1.27
0.46
16.51
10
15.88
14.22
52.45
3.43
0.38
1.78
0.56
17.27
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
§
eB
α
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
5
10
15
5
10
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
© 2006 Microchip Technology Inc.
DS21459D-page 19
TC7129
44-Lead Plastic Leaded Chip Carrier (LW) – Square (PLCC)
E
E1
#leads=n1
D
D1
n 1 2
CH2 x 45°
CH1 x 45°
α
A3
A2
A
35°
B1
B
c
A1
β
p
E2
D2
Units
INCHES*
NOM
44
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
44
MAX
n
p
Number of Pins
Pitch
.050
1.27
11
Pins per Side
Overall Height
n1
A
11
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.011
.029
.020
5
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
0
.180
4.19
3.68
0.51
0.61
1.02
0.00
17.40
17.40
16.51
16.51
14.99
14.99
0.20
0.66
0.33
0
4.39
3.87
0.71
0.74
1.14
0.13
17.53
17.53
16.59
16.59
15.75
15.75
0.27
0.74
0.51
5
4.57
Molded Package Thickness
A2
A1
A3
CH1
CH2
E
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
4.06
0.89
0.86
1.27
0.25
17.65
17.65
16.66
16.66
16.00
16.00
0.33
0.81
0.53
10
Standoff
§
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
D
Molded Package Width
Molded Package Length
Footprint Width
E1
D1
E2
D2
c
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B1
B
α
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
DS21459D-page 20
© 2006 Microchip Technology Inc.
TC7129
44-Lead Plastic Quad Flatpack (KW) 10x10x2.0 mm Body, 1.95/0.25 mm Lead Form (PQFP)
E
E1
p
D1
D
2
1
B
n
CHAMFER VARIES
α
c
φ
A2
A
β
L
F
A1
Units
INCHES
NOM
MILLIMETERS
*
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
44
44
.031 BSC
0.80 BSC
Overall Height
A
A2
A1
L
-
-
.096
.083
-
-
2.45
2.10
Molded Package Thickness
Standoff
.077
.010
.029
.079
1.95
2.00
§
-
-
0.25
0.73
-
-
Foot Length
.035
.077 REF.
3.5°
.547 BSC
.041
0.88
1.95 REF.
3.5°
13.90 BSC
1.03
Footprint
F
φ
Foot Angle
0°
7°
0°
7°
Overall Width
E
D
Overall Length
.547 BSC
.394 BSC
.394 BSC
13.90 BSC
10.00 BSC
10.00 BSC
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
E1
D1
c
.004
.012
-
-
-
-
.009
.018
16°
0.11
0.30
-
-
-
-
0.23
0.45
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
5°
5°
5°
5°
16°
16°
16°
*
Controlling Parameter
§
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-112 AA-1
Drawing No. C04-119
Revised 07-21-05
© 2006 Microchip Technology Inc.
DS21459D-page 21
TC7129
NOTES:
DS21459D-page 22
© 2006 Microchip Technology Inc.
TC7129
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
XX
XX
Examples:
a) TC7129CPL:
40-Pin PDIP
44-Pin PQFP
Tape and Reel
44-Pin PLCC
Device
Temp.
Pkg
Taping
Direction
b) TC7129CKW713:
c) TC7129CLW:
Device:
TC7129: 4-1/2 Digit Analog-to-Digital Converter
Temperature:
C
I
=
=
0°C to +70°C
-25°C to +85°C
Package:
PL
KW
LW
JL
=
=
=
=
40-Pin PDIP
40-Pin PQFP
44-Pin PLCC
40-Pin CDIP
Taping Direction:
713 = Standard Taping
© 2006 Microchip Technology Inc.
DS21459D-page 23
TC7129
NOTES:
DS21459D-page 24
© 2006 Microchip Technology Inc.
TC7129
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
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software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
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listing of seminars and events, listings of
Microchip sales offices, distributors and factory
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CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
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will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2006 Microchip Technology Inc.
DS21459D-page 25
TC7129
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
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TC7129
DS21459D
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
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7. How would you improve this document?
DS21459D-page 26
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi,
MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21459D-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
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Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
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Tel: 33-1-69-53-63-20
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Tel: 91-20-2566-1512
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Tel: 49-89-627-144-0
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Tel: 81-45-471- 6166
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Taiwan - Hsin Chu
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Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
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Tel: 949-462-9523
Fax: 949-462-9608
China - Xian
Tel: 86-29-8833-7250
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Taiwan - Taipei
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Fax: 886-2-2508-0102
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Fax: 650-961-0286
Thailand - Bangkok
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Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
02/16/06
DS21459D-page 28
© 2006 Microchip Technology Inc.
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