TC4627COE [MICROCHIP]
Power CMOS Drivers With Voltage Tripler; 与电压三倍功率CMOS驱动器
| 型号： | TC4627COE |
| 厂家： | 
MICROCHIP |
| 描述： | Power CMOS Drivers With Voltage Tripler |
| 文件： | 总14页 (文件大小：463K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC4626/TC4627
Power CMOS Drivers With Voltage Tripler
Features
Package Type
8-Pin PDIP/CERDIP
• Power Driver With On Board Voltage Booster
–
• Low I – <4mA
C1
C1
V
1
2
3
4
DD
8
7
6
5
DD
+
• Small Package – 8-Pin PDIP
• Under-Voltage Circuitry
IN
V
TC4626
TC4627
C2
BOOST
GND
OUT
• Fast Rise-Fall Time – <40nsec @1000pF
• Below-Rail Input Protection
16-Pin SOIC (Wide)
Applications
–
V
1
2
3
4
5
6
7
8
16
C1
DD
• Raises 5V to drive higher – Vgs (ON) MOSFETs
• Eliminates one system power supply
NC
15 NC
14 NC
+
C1
IN
13
NC
C2
TC4626
TC4627 12 NC
Device Selection Table
V
11
NC
BOOST
Part
10 NC
OUT
NC
Package
Temp. Range
Number
TC4626COE 16-Pin SOIC (Wide) -55°C to +125°C
GND
9
TC4626CPA
8-Pin PDIP
-40°C to +85°C
-40°C to +85°C
0°C to +70°C
0°C to +70°C
General Description
TC4626EOE 16-Pin SOIC (Wide)
The TC4626/TC4627 are single CMOS high speed
drivers with an on-board voltage boost circuit. These
parts work with an input supply voltage from 4 to 6 volts.
TC4626EPA
TC4626MJA
8-Pin PDIP
8-Pin CERDIP
TC4627COE 16-Pin SOIC (Wide) -55°C to +125°C
The internal voltage booster will produce a V
BOOST
potential up to 12 volts above V . This V
regulated, so its voltage is dependent on the input V
voltage and output drive loading requirements. An
internal undervoltage lockout circuit keeps the output in
is not
BOOST
IN
TC4627CPA
8-Pin PDIP
-40°C to +85°C
-40°C to +85°C
0°C to +70°C
0°C to +70°C
DD
TC4627EOE 16-Pin SOIC (Wide)
TC4627EPA
TC4627MJA
8-Pin PDIP
8-Pin CERDIP
a low state when V
is enabled when V
drops below 7.8 volts. Output
is above 11.3 volts.
BOOST
BOOST
Functional Block Diagram
2
V
(Unregulated 3 x V
UV LOCK
)
BOOST
6
C1+
DD
+
EXT
1
C
1
EXT
C
+
C1-
C2
3
3
Voltage
Booster
+
EXT
V = 2 x V
DD
C
2
Noninverting
TC4627
5
Output
8
7
4
V
Clock
DD
In
Inverting
TC4626
GND
NOTE: Pin numbers correspond to 8-pin package.
2002 Microchip Technology Inc.
DS21426B-page 1
TC4626/TC4627
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................6.2V
Input Voltage, Any Terminal
.....................................V + 0.3V to GND – 0.3V
S
Package Power Dissipation (T ≤ 70°C)
A
PDIP.........................................................730mW
CERDIP....................................................800mW
SOIC ........................................................760mW
Derating Factor
PDIP .......5.6 mW/°C Above 36°C
CERDIP................................................6.0mW/°C
Operating Temperature Range (Ambient)
C Version......................................... 0°C to +70°C
E Version......................................-40°C to +85°C
M Version ...................................-55°C to +125°C
Storage Temperature Range ..............-65°C to +150°C
TC4626/TC4627 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, VDD = 5V, C1 = C2 = C3 10µF unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
VIL
Logic 1, High Input Voltage
Logic 0, Low Input Voltage
Input Current
2.4
—
-1
—
—
—
—
0.8
1
V
V
IIN
µA
0V ≤ VIN ≤ VDRIVE
Output
VOH
High Output Voltage
Low Output Voltage
VBOOST – 0.025
—
—
10
8
—
0.025
15
V
V
Ω
Ω
A
VOL
—
—
—
—
RO
Output Resistance, High
Output Resistance, Low
Peak Output Current
IOUT = 10mA, VDD = 5V
IOUT = 10mA, VDD = 5V
RO
10
IPK
1.5
—
Switching Time
tR
Rise Time
—
—
33
27
35
45
—
40
35
45
55
—
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
tF
Fall Time
tD1
tD2
FMAX
Delay Time
—
Delay Time
—
Maximum Switching Frequency
1.0
MHz VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
R3
Voltage Tripler Output
Source Resistance
—
—
300
120
400
200
Ω
Ω
IL = 10mA, VDD = 5V
R2
Voltage Doubler Output
Source Resistance
FOSC
VOSC
Oscillator Frequency
12
—
—
28
10
kHz
V
Oscillator Amplitude Measured
at C1-
4.5
RLOAD = 10kΩ
UV @VBOOST
Undervoltage Threshold
7.0
10.5
14.6
7.8
11.3
—
8.5
12
—
V
V
V
VSTART @VBOOST Start Up Voltage
VBOOST
@VDD = 5V
No Load
DS21426B-page 2
2002 Microchip Technology Inc.
TC4626/TC4627
TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED)
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Power Supply
IDD
Power Supply Current
Supply Voltage
—
—
—
2.5
6.0
mA VIN = LOW or HIGH
V
VDD
4.0
Electrical Characteristics: Over operating temperature range, VDD = 5V, C1 = C2 = C3 10µF unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
VIL
Logic 1, High Input Voltage
Logic 0, Low Input Voltage
Input Current
2.4
—
—
—
—
—
0.8
1
V
V
IIN
-10
µA
0V ≤ VIN ≤ VBOOST
Output
VOH
High Output Voltage
Low Output Voltage
Output Resistance, High
VDRIVE – 0.025
—
—
—
V
V
Ω
VOL
—
—
0.025
RO
IOUT = 10mA, VDD = 5V
15
15
20
25
C & E Version (TA = 70°C or 85°C)
M Version (TA = 125°C)
RO
Output Resistance, Low
Peak Output Current
—
—
Ω
IOUT = 10mA, VDD = 5V
C & E Version (TA = 70°C or 85°C)
M Version (TA = 125°C)
10
10
13
15
IPK
1.5
—
A
Switching Time
tR
Rise Time
—
—
—
—
—
—
—
55
50
60
70
—
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
nsec Figure 3-1, Figure 3-2
tF
Fall Time
tD1
tD2
FMAX
Delay Time
—
Delay Time
—
Maximum Switching Frequency
750
kHz VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
R3
Voltage Boost Output
Source Resistance
—
—
400
170
500
300
Ω
Ω
IL = 10mA, VDD = 5V
R2
Voltage Doubler Output
Source Resistance
FOSC
VOSC
Oscillator Frequency
5
—
—
50
10
kHz
V
Oscillator Amplitude
Measured at C1-
4.5
RLOAD = 10kΩ
UV @VBOOST
Undervoltage Threshold
7.0
7.8
11.3
—
8.5
12
—
V
V
V
VSTART @VBOOST Start Up Voltage
10.5
14.6
VBOOST
Power Supply
IDD
@VDD = 5V
No Load
Power Supply Current
Supply Voltage
—
—
—
4
mA VIN = LOW or HIGH
V
VDD
4.0
6.0
2002 Microchip Technology Inc.
DS21426B-page 3
TC4626/TC4627
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin PDIP,
CERDIP)
Symbol
Description
1
2
3
4
5
6
7
8
C1-
C1+
C2
GND
OUT
VBOOST
IN
Ground.
VDD
Pin No.
(16-Pin SOIC
Wide)
Symbol
Description
1
2
C1-
NC
No connect.
No connect.
3
C1+
NC
4
5
C2
6
NC
No connect.
No connect.
Ground.
7
NC
8
GND
OUT
NC
9
10
11
12
13
14
15
16
No connect.
No connect.
VBOOST
NC
IN
NC
No connect.
No connect.
NC
VDD
DS21426B-page 4
2002 Microchip Technology Inc.
TC4626/TC4627
3.0
APPLICATIONS INFORMATION
FIGURE 3-1:
INVERTING DRIVER
SWITCHING TIME
FIGURE 3-2:
NONINVERTING DRIVER
SWITCHING TIME
V
BOOST
V
BOOST
0.1µF Ceramic
C
10µF
3
0.1µF Ceramic
C
10µF
3
6
6
7
2
5
7
2
5
Input
Output
Input
Output
C
= 1000pF
L
C
= 1000pF
L
C1+
C1-
C1+
C1-
C
1
C
1
10µF
10µF
1
3
1
3
TC4626
8
TC4627
8
V
= 5V
C
2
DD
V
= 5V
C
2
DD
C
2
C
2
4
10µF
4
10µF
+5V
+5V
90%
90%
Input
Input
10%
10%
0V
t
0V
D1
t
D2
t
t
R
F
V
BOOST
V
90%
10%
90%
BOOST
Output
t
t
90%
D1
90%
D2
t
t
F
R
Output
0V
10%
10%
10%
0V
Input: 100kHz,
square wave,
RISE
Input: 100kHz,
square wave,
RISE
t
= t ≤ 10nsec
FALL
t
= t
≤ 10nsec
FALL
2002 Microchip Technology Inc.
DS21426B-page 5
TC4626/TC4627
C1 potential to V input to charge C2 to 2 x V . S3a
3.1
BOOSTER FUNCTION
DD
DD
and S3b add C1 potential to C2 to charge C3 to 3 x
. The position of the switches is controlled by the
The voltage booster is an unregulated voltage tripler
circuit. The tripler consists of three sets of internal
switches and three external capacitors. S1a and S1b
V
DD
internal 4 phase clock.
charge capacitor C1 to V potential. S2a and S2b add
DD
FIGURE 3-3:
VOLTAGE BOOSTER
3 x V , V
DD BOOST
6
6
+
+
C3
C2
S3a
S3b
2 x V
DD
3
S2a
S2b
8
2
(4 to 6V)
V
DD
S1a
S1b
+
C1
1
4
GND
FIGURE 3-4:
POSITION OF SWITCHES
Pin 1 & 2 Waveforms
3 x V
DD
2 x V
V
DD
Pin 2
Voltage
DD
2 x V
DD
Pin 1
Voltage
V
DD
0
On
S1
S2
Off
On
Off
On
Off
S3
DS21426B-page 6
2002 Microchip Technology Inc.
TC4626/TC4627
4.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
TC4626 V
vs. Frequency
TC4626 V
vs. Frequency
OH
OH
16
14
14
12
10
V
= 5V
S
A
470pF
V
T
= 5V
= 25°C
S
A
T
= -55°C
470pF
12
10
8
8
6
2200pF
1000pF
6
2200pF
1000pF
4
2
0
4
2
0
5
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
10
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
TC4626 V
OH
vs. Frequency
Delay Time vs. Temperature
14
12
10
100
80
Input = 0-5V;
& T <10nsec;
V
C
= 4V
V
T
= 5V
= 125°C
S
S
A
T
R
F
= 1000pF
LOAD
@ <20kHz
470pF
t
D2
60
40
8
6
t
t
D1
2200pF
1000pF
4
2
RISE
20
0
t
FALL
0
5
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
100 120
40 60 80
TEMPERATURE (°C)
-40 -20
0
20
Delay Time vs. Temperature
Delay Time vs. Temperature
60
50
40
V
C
= 6V
S
V
C
= 5V
S
= 1000pF
LOAD
= 1000pF
50
40
LOAD
t
D2
t
D2
30
20
10
t
t
D1
D1
30
20
t
RISE
t
FALL
t
FALL
t
RISE
Input = 0-5V;
Input = 0-5V;
10
0
T
& T <10nsec;
T
& T <10nsec;
R
F
R
F
@ <20kHz
@ <20kHz
0
120
120
40 60 80 100
40 60 80 100
-40 -20
0
20
-40 -20
0
20
TEMPERATURE (°C)
TEMPERATURE (°C)
2002 Microchip Technology Inc.
DS21426B-page 7
TC4626/TC4627
TYPICAL CHARACTERISTICS (CONTINUED)
TC4626 V
OH
vs. Frequency
TC4626 V
OH
vs. Frequency
16
15
16
15
V
T
= 5V
= 25°C
S
A
V
T
= 5V
= -55°C
S
A
14
13
12
14
13
12
470pF
1,000pF
2,200pF
470pF
1,000pF
11
10
11
10
9
8
9
8
2,200pF
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY x 100 kHz
FREQUENCY x 100 kHz
TC4626 V
OH
vs. Frequency
16
V
T
= 5V
= 125°C
S
A
15
14
13
12
11
10
470pF
1,000pF
9
8
2,200pF
0
1
3
4
5
6
7
8
9
10
2
FREQUENCY x 100 kHz
DS21426B-page 8
2002 Microchip Technology Inc.
TC4626/TC4627
5.0
PACKAGING INFORMATION
Package marking data not available at this time.
5.1
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
3MIN.
.150 (3.81)
.115 (2.92)
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
.110 (2.79)
.090 (2.29)
8-Pin CDIP (Narrow)
PIN 1
.300 (7.62)
.230 (5.84)
.020 (0.51) MIN.
.055 (1.40) MAX.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.040 (1.02)
.020 (0.51)
.200 (5.08)
.160 (4.06)
.015 (0.38)
.008 (0.20)
3MIN.
.150 (3.81)
MIN.
.200 (5.08)
.125 (3.18)
.400 (10.16)
.320 (8.13)
.065 (1.65)
.045 (1.14)
.020 (0.51)
.016 (0.41)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21426B-page 9
TC4626/TC4627
Package Dimensions (Continued)
16-Pin SOIC (Wide)
°
Dimensions: inches (mm)
DS21426B-page 10
2002 Microchip Technology Inc.
TC4626/TC4627
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21426B-page11
TC4626/TC4627
NOTES:
DS21426B-page12
2002 Microchip Technology Inc.
TC4626/TC4627
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
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design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21426B-page 13
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32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
France
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
China - Hong Kong SAR
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Inc.
India Liaison Office
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21426B-page 14
2002 Microchip Technology Inc.
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